ETC STB80NF55-06-1

STP80NF55-06 - STP80NF55-06FP
STB80NF55-06-1
N-CHANNEL 55V - 0.005Ω - 80A TO-220/TO-220FP/I2PAK
STripFET POWER MOSFET
TYPE
■
■
■
■
■
VDSS
R DS(on)
ID
STP80NF55-06/-1
55 V
<0.0065Ω
80 A
STP80NF55-06FP
55 V
<0.0065Ω
60 A
TYPICAL RDS(on) = 0.005Ω
EXCEPTIONAL dv/dt CAPABILITY
100% AVALANCHE TESTED
APPLICATION ORIENTED
CHARACTERIZATION
ADD SUFFIX “T4” FOR ORDERING IN TAPE &
REEL
DESCRIPTION
This Power Mosfet is the latest development of
STMicroelectronics unique “Single Feature
Size ” strip-based process. The resulting transistor shows extremely high packing density for
low on-resistance, rugged avalance characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
3
2
1
TO-220
TO-220FP
1
2
3
I2PAK
(Tabless TO-220)
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ SOLENOID AND RELAY DRIVERS
■ MOTOR CONTROL, AUDIO AMPLIFIERS
■ DC-DC CONVERTERS
■ AUTOMOTIVE ENVIRONMENT
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
STP(B)80NF-06-1
VDS
VDGR
Unit
STP80NF55-06FP
Drain-source Voltage (VGS = 0)
55
V
Drain-gate Voltage (RGS = 20 kΩ)
55
V
±20
VGS
Gate- source Voltage
ID (1)
Drain Current (continuous) at TC = 25°C
80
60
A
ID
Drain Current (continuous) at TC = 100°C
80
42
A
Drain Current (pulsed)
320
240
A
Total Dissipation at TC = 25°C
IDM (l )
PTOT
VISO
dv/dt (2)
Tstg
Tj
300
45
W
Derating Factor
2
0.30
W/°C
Insulation Winthstand Voltage (DC)
--
2500
V
Peak Diode Recovery voltage slope
Storage Temperature
Operating Junction Temperature
( ●) Pulse width limi ted by safe operating area
April 2002
V
10
V/ns
– 55 to 175
°C
(1) Current Limited by Package
(2) ISD ≤80A, di/dt ≤400 µA, VDD ≤ V(BR)DSS, Tj ≤ TJMAX.
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STP80NF55-06/FP/STB80NF55-06-1
THERMAL DATA
TO-220 / I2PAK
TO-220FP
0.5
3.33
°C/W
Rthj-case
Thermal Resistance Junction-case Max
Rthj-amb
Thermal Resistance Junction-ambient Max
62.5
°C/W
Maximum Lead Temperature For Soldering Purpose
300
°C
Tl
AVALANCHE CHARACTERISTICS
Symbol
Parameter
Max Value
Unit
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
80
A
EAS
Single Pulse Avalanche Energy
(starting Tj = 25 °C, ID = IAR, VDD = 35 V)
650
mJ
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
V(BR)DSS
IDSS
IGSS
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
Zero Gate Voltage
Drain Current (V GS = 0)
VDS = Max Rating
1
µA
VDS = Max Rating, TC = 125 °C
10
µA
Gate-body Leakage
Current (VDS = 0)
VGS = ±20V
±100
nA
Max.
Unit
55
V
ON (1)
Symbol
Parameter
Test Conditions
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250µA
R DS(on)
Static Drain-source On
Resistance
VGS = 10 V, I D = 40 A
Min.
2
Typ.
3
4
V
0.005
0.0065
Ω
Typ.
Max.
Unit
DYNAMIC
Symbol
gfs (1)
2/10
Parameter
Test Conditions
Forward Transconductance
VDS =15 V , ID =40 A
C iss
Input Capacitance
VDS = 25V, f = 1 MHz, VGS = 0
Coss
Crss
Min.
50
S
7300
pF
Output Capacitance
980
pF
Reverse Transfer
Capacitance
250
pF
STP80NF55-06/FP/STB80NF55-06-1
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol
td(on)
tr
Qg
Qgs
Q gd
Parameter
Turn-on Delay Time
Rise Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Test Conditions
Min.
VDD = 27V, ID = 40A
RG = 4.7Ω VGS = 10V
(see test circuit, Figure 3)
VDD = 44V, ID = 80A,
VGS = 10V
Typ.
Max.
Unit
40
ns
240
ns
190
38
66
256
nC
nC
nC
Typ.
Max.
Unit
SWITCHING OFF
Symbol
td(off)
tf
Parameter
Turn-off-Delay Time
Fall Time
Test Condit ions
Min.
260
75
VDD = 27V, ID = 40A,
R G = 4.7Ω, VGS = 4.5V
(see test circuit, Figure 3)
ns
ns
SOURCE DRAIN DIODE
Symbol
Max.
Unit
Source-drain Current
80
A
ISDM (1)
Source-drain Current (pulsed)
320
A
VSD (2)
Forward On Voltage
ISD = 80A, VGS = 0
1.5
V
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
ISD = 80A, di/dt = 100A/µs,
VDD = 20V, Tj = 150°C
(see test circuit, Figure 5)
ISD
trr
Qrr
IRRM
Parameter
Test Conditions
Min.
Typ.
80
0.24
6
ns
µC
A
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Safe Operating Area for TO-220 / I2PAK
Safe Operating Area for TO-220FP
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STP80NF55-06/FP/STB80NF55-06-1
Thermal Impedance For TO-220 / I PAK
Thermal Impedance For TO-220FP
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
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STP80NF55-06/FP/STB80NF55-06-1
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
Normalized Drain-Source Breakdown vs
Temperature
5/10
STP80NF55-06/FP/STB80NF55-06-1
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
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STP80NF55-06/FP/STB80NF55-06-1
TO-220 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
D1
0.107
1.27
E
0.050
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.067
F2
1.14
1.70
0.044
0.067
G
4.95
5.15
0.194
0.203
G1
2.4
2.7
0.094
0.106
H2
10.0
10.40
0.393
L2
0.409
16.4
0.645
13.0
14.0
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.2
6.6
0.244
0.260
L9
3.5
3.93
0.137
0.154
DIA.
3.75
3.85
0.147
0.151
D1
C
D
A
E
L4
H2
G
G1
F1
L2
F2
F
Dia.
L5
L9
L7
L6
L4
P011C
7/10
STP80NF55-06/FP/STB80NF55-06-1
TO-220FP MECHANICAL DATA
mm
DIM.
MIN.
inch
MAX.
MIN.
A
4.4
TYP.
4.6
0.173
TYP.
MAX.
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.7
0.017
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.7
0.045
0.067
F2
1.15
1.7
0.045
0.067
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
L2
16
0.630
28.6
30.6
1.126
1.204
L4
9.8
10.6
0.385
0.417
L6
15.9
16.4
0.626
0.645
L7
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
B
D
A
E
L3
L3
L6
F
F1
L7
F2
H
G
G1
¯
1 2 3
L2
8/10
L4
STP80NF55-06/FP/STB80NF55-06-1
TO-262 (I2PAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
B
0.7
0.93
0.027
0.036
B2
1.14
1.7
0.044
0.067
C
0.45
0.6
0.017
0.023
C2
1.23
1.36
0.048
0.053
D
8.95
9.35
0.352
0.368
e
2.4
2.7
0.094
0.106
E
10
10.4
0.393
0.409
L
13.1
13.6
0.515
0.531
L1
3.48
3.78
0.137
0.149
L2
1.27
1.4
0.050
0.055
E
e
B
B2
C2
A1
A
C
A
L1
L2
D
L
P011P5/E
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STP80NF55-06/FP/STB80NF55-06-1
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consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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