ETC STB10NK60ZT4

STP10NK60Z/FP, STB10NK60Z/-1
STH10NK60ZFI, STW10NK60Z
N-CHANNEL600V-0.65Ω-10ATO-220/FP/D 2PAK/I2PAK/TO-247/ISOWATT218
Zener-Protected SuperMESH Power MOSFET
TYPE
STB10NK60Z
STB10NK60Z-1
STH10NK60ZFI
STP10NK60Z
STP10NK60ZFP
STW10NK60Z
■
■
■
■
■
■
VDSS
R DS(on)
600
600
600
600
600
600
< 0.75
< 0.75
< 0.75
< 0.75
< 0.75
< 0.75
V
V
V
V
V
V
Ω
Ω
Ω
Ω
Ω
Ω
ID
10
10
10
10
10
10
A
A
A
A
A
A
Pw
115 W
115 W
35 W
115 W
35 W
156 W
TYPICAL RDS(on) = 0.65 Ω
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
GATE CHARGE MINIMIZED
VERY LOW INTRINSIC CAPACITANCES
VERY GOOD MANUFACTURING
REPEATIBILITY
DESCRIPTION
The SuperMESH series is obtained through an
extreme optimization of ST’s well established stripbased PowerMESH layout. In addition to pushing
on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the
most demanding applications. Such series complements ST full range of high voltage MOSFETs including revolutionary MDmesh products.
3
3
2
2
1
1
TO-220
TO-220FP
ISOWATT218
3
1
1
I2PAK
2
3
3
2
1
D2PAK
TO-247
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ IDEAL FOR OFF-LINE POWER SUPPLIES,
ADAPTORS AND PFC
■ LIGHTING
ORDERING INFORMATION
SALES TYPE
MARKING
PACKAGE
PACKAGING
STP10NK60Z
P10NK60Z
TO-220
TUBE
STP10NK60ZFP
P10NK60ZFP
TO-220FP
TUBE
STB10NK60ZT4
B10NK60Z
D2PAK
TAPE & REEL
STB10NK60Z
B10NK60Z
D 2PAK
TUBE
(ONLY UNDER REQUEST)
STB10NK60Z-1
B10NK60Z
I2PAK
TUBE
STH10NK60ZFI
H10NK60FI
ISOWATT218
TUBE
STW10NK60Z
W10NK60Z
TO-247
TUBE
April 2002
1/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
TO-220/
D2PAK/I2PAK
VDS
VDGR
VGS
TO-220FP
Unit
ISOWATT218
TO-247
Drain-source Voltage (VGS = 0)
600
V
Drain-gate Voltage (RGS = 20 kΩ)
600
V
Gate- source Voltage
± 30
V
ID
Drain Current (continuos) at TC = 25°C
10
10 (*)
10 (*)
10
A
ID
Drain Current (continuos) at TC = 100°C
5.7
5.7 (*)
5.7 (*)
5.7
A
IDM (l )
Drain Current (pulsed)
36
36 (*)
36 (*)
36
A
PTOT
Total Dissipation at TC = 25°C
115
35
35
156
W
Derating Factor
0.92
0.28
0.28
1.25
W/°C
VESD(G-S)
Gate source ESD
(HBM-C=100pF, R=1.5KΩ)
dv/dt (1)
Peak Diode Recovery voltage slope
4000
VISO
Insulation Withstand Voltage (DC)
Tj
Tstg
Operating Junction Temperature
Storage Temperature
V
4.5
-
V/ns
2500
2000
-
°C
-55 to 150
( l ) Pulse width limi ted by safe operating area
(1) ISD ≤10A, di/dt ≤200A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX.
V
(*) Limited only by maximum temperature allowed
THERMAL DATA
TO-220
I2PAK
Rthj-case
Thermal Resistance Junction-case
Max
Rthj-pcb
Thermal Resistance Junction-pcb Max
D 2PAK
TO-220FP
1.09
ISOWATT
218
3.6
TO-247
Unit
0.8
°C/W
°C/W
60
(When mounted on minimum Footprint)
Rthj-amb
Tl
Thermal Resistance Junction-ambient
Max
62.5
Maximum Lead Temperature For
Soldering Purpose
°C/W
50
°C
300
AVALANCHE CHARACTERISTICS
Symbol
Parameter
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
EAS
Single Pulse Avalanche Energy
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
Max Value
Unit
9
A
300
mJ
GATE-SOURCE ZENER DIODE
Symbol
BVGSO
Parameter
Gate-Source Breakdown
Voltage
Test Conditions
Igs=± 1mA (Open Drain)
Min.
30
Typ.
Max.
Unit
V
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to souce. In this respect the Zener voltage is appropriate to achieve an efficient and costeffective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage
of external components.
2/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED)
ON/OFF
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
IDSS
Zero Gate Voltage
Drain Current (V GS = 0)
VDS = Max Rating
VDS = Max Rating, TC = 125 °C
1
50
µA
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 20V
±10
µA
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 100µA
R DS(on)
Static Drain-source On
Resistance
VGS = 10V, ID = 4.5 A
V(BR)DSS
600
3
V
3.75
4.5
V
0.65
0.75
Ω
Typ.
Max.
Unit
DYNAMIC
Symbol
gfs (1)
C iss
Coss
Crss
C oss eq. (3)
Parameter
Test Conditions
Forward Transconductance
VDS = 15 V, ID = 4.5 A
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
VDS = 25V, f = 1 MHz, VGS = 0
Equivalent Output
Capacitance
VGS = 0V, V DS = 0V to 480V
Min.
7.8
S
1370
156
37
pF
pF
pF
90
pF
SWITCHING ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
td(on)
tr
Turn-on Delay Time
Rise Time
VDD = 300 V, ID = 4 A
RG = 4.7Ω VGS = 10 V
(Resistive Load see, Figure 3)
20
20
Qg
Qgs
Q gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD = 480V, I D = 8 A,
VGS = 10V
50
10
25
70
nC
nC
nC
Typ.
Max.
Unit
ns
ns
SWITCHING OFF
Symbol
Parameter
Test Condition s
Min.
td(off)
tf
Turn-off Delay Time
Fall Time
VDD = 300 V, I D = 4 A
R G = 4.7Ω VGS = 10 V
(Resistive Load see, Figure 3)
55
30
ns
ns
tr(Voff)
tf
tc
Off-voltage Rise Time
Fall Time
Cross-over Time
VDD = 480V, ID = 8 A,
R G = 4.7Ω, VGS = 10V
(Inductive Load see, Figure 5)
18
18
36
ns
ns
ns
SOURCE DRAIN DIODE
Symbol
Parameter
ISD
ISDM (2)
Source-drain Current
Source-drain Current (pulsed)
VSD (1)
Forward On Voltage
ISD = 10 A, V GS = 0
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
ISD = 8 A, di/dt = 100A/µs
VDD = 40V, Tj = 150°C
(see test circuit, Figure 5)
trr
Qrr
IRRM
Test Conditions
Min.
Typ.
570
4.3
15
Max.
Unit
10
36
A
A
1.6
V
ns
µC
A
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
3. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80%
VDSS.
3/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
Safe Operating Area For TO-220/D2PAK/I2PAK
Thermal Impedance For TO-220/D2PAK/I2PAK
Safe Operating Area For TO-220FP
Thermal Impedance For TO-220FP
Safe Operating Area For TO-247
Thermal Impedance For TO-247
4/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
Safe Operating Area For ISOWATT218
Thermal Impedance For ISOWATT218
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
5/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized Gate Threshold Voltage vs Temp.
Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
Normalized BVDSS vs Temperature
6/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
Maximum Avalanche Energy vs Temperature
7/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
8/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
TO-220 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
D1
0.107
1.27
0.050
E
0.49
0.70
0.019
F
0.61
0.88
0.024
0.027
0.034
F1
1.14
1.70
0.044
0.067
F2
1.14
1.70
0.044
0.067
G
4.95
5.15
0.194
0.203
0.106
G1
2.4
2.7
0.094
H2
10.0
10.40
0.393
L2
0.409
16.4
0.645
13.0
14.0
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.2
6.6
0.244
0.260
L9
3.5
3.93
0.137
0.154
DIA.
3.75
3.85
0.147
0.151
D1
C
D
A
E
L4
H2
G
G1
F1
L2
F2
F
Dia.
L5
L9
L7
L6
L4
P011C
9/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
TO-220FP MECHANICAL DATA
mm.
DIM.
MIN.
A
4.4
inch
TYP
MAX.
MIN.
4.6
0.173
TYP.
MAX.
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.7
0.017
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.5
0.045
0.067
F2
1.15
1.5
0.045
0.067
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
L2
0.409
16
0.630
28.6
30.6
1.126
1.204
L4
9.8
10.6
.0385
0.417
L5
2.9
3.6
0.114
0.141
L6
15.9
16.4
0.626
0.645
L7
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
B
D
A
E
L3
L3
L6
F
F1
L7
F2
H
G
G1
¯
1 2 3
L5
L2
10/16
L4
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
ISOWATT218 MECHANICAL DATA
DIM.
A
C
D
D1
E
F
F2
F3
G
H
L
L1
L2
L3
L4
L5
L6
N
R
DIA
MIN.
5.35
3.30
2.90
1.88
0.75
1.05
1.50
1.90
10.80
15.80
mm
TYP.
MAX.
5.65
3.80
3.10
2.08
0.95
1.25
1.70
2.10
11.20
16.20
MIN.
0.211
0.130
0.114
0.074
0.030
0.041
0.059
0.075
0.425
0.622
21.20
19.90
23.60
42.50
5.25
20.75
2.3
0.819
0.752
0.898
1.594
0.191
0.797
0.083
3.7
0.138
9
20.80
19.10
22.80
40.50
4.85
20.25
2.1
MAX.
0.222
0.150
0.122
0.082
0.037
0.049
0.067
0.083
0.441
0.638
0.354
4.6
3.5
inch
TYP.
0.835
0.783
0.929
1.673
0.207
0.817
0.091
0.181
- Weight : 4.9 g (typ.)
- Maximum Torque (applied to mounting flange) Recommended: 0.8 Nm; Maximum: 1 Nm
- The side of the dissipator must be flat within 80 µm
0.146
P025C/A
11/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
D2PAK MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.7
0.93
0.027
0.036
B2
1.14
1.7
0.044
0.067
C
0.45
0.6
0.017
0.023
C2
1.23
1.36
0.048
0.053
D
8.95
9.35
0.352
0.368
D1
E
8
0.315
10
E1
10.4
0.393
8.5
0.334
G
4.88
5.28
0.192
0.208
L
15
15.85
0.590
0.625
L2
1.27
1.4
0.050
0.055
L3
1.4
1.75
0.055
0.068
M
2.4
3.2
0.094
0.126
R
0.015
0º
8º
3
V2
0.4
12/16
1
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
TO-262 (I2PAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
B
0.7
0.93
0.027
0.036
B2
1.14
1.7
0.044
0.067
C
0.45
0.6
0.017
0.023
C2
1.23
1.36
0.048
0.053
D
8.95
9.35
0.352
0.368
e
2.4
2.7
0.094
0.106
E
10
10.4
0.393
0.409
L
13.1
13.6
0.515
0.531
L1
3.48
3.78
0.137
0.149
L2
1.27
1.4
0.050
0.055
E
e
B
B2
C2
A1
A
C
A
L1
L2
D
L
P011P5/E
13/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
TO-247 MECHANICAL DATA
DIM.
mm.
MIN.
MAX.
MIN.
A
4.85
5.15
0.19
0.20
D
2.20
2.60
0.08
0.10
E
0.40
0.80
0.015
0.03
F
1
1.40
0.04
0.05
TYP.
F1
3
0.11
F2
2
0.07
MAX.
F3
2
2.40
0.07
0.09
F4
3
3.40
0.11
0.13
G
10.90
0.43
H
15.45
15.75
0.60
0.62
L
19.85
20.15
0.78
0.79
L1
3.70
4.30
0.14
L2
L3
18.50
14.20
0.17
0.72
14.80
0.56
0.58
L4
34.60
1.36
L5
5.50
0.21
M
2
3
0.07
0.11
V
5º
5º
V2
60º
60º
Dia
14/16
TYP
inch
3.55
3.65
0.14
0.143
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
D2PAK FOOTPRINT
TUBE SHIPMENT (no suffix)*
TAPE AND REEL SHIPMENT (suffix ”T4”)*
REEL MECHANICAL DATA
DIM.
mm
MIN.
A
TAPE MECHANICAL DATA
mm
MIN. MAX.
inch
MIN. MAX.
A0
10.5
10.7
0.413 0.421
B0
15.7
15.9
0.618 0.626
D
D1
1.5
1.59
1.6
1.61
0.059 0.063
0.062 0.063
E
F
1.65
11.4
1.85
11.6
0.065 0.073
0.449 0.456
K0
4.8
5.0
0.189 0.197
P0
3.9
4.1
0.153 0.161
P1
P2
11.9
1.9
12.1
2.1
0.468 0.476
0.075 0.082
R
T
50
0.25
1.574
0.35 0.0098 0.0137
W
23.7
24.3
DIM.
* on sales type
B
C
1.5
12.8
D
20.2
G
24.4
N
T
100
MAX.
330
13.2
inch
MIN.
MAX.
12.992
0.059
0.504 0.520
0795
26.4
0.960 1.039
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
1000
0.933 0.956
15/16
STP10NK60Z/FP, STB10NK60Z, STB10NK60Z-1, STW10NK60Z, STH10NK60ZFI
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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