TI SN74AVCA406EZXYR

SN74AVCA406E
www.ti.com..................................................................................................................................................... SCES659E – OCTOBER 2007 – REVISED JUNE 2009
MMC AND SD CARD VOLTAGE-TRANSLATION TRANSCEIVER
FEATURES
1
• Transceiver for Memory Card Interface
[MultiMediaCard (MMC) and Secure Digital
(SD) Compliant Products]
• Configurable I/O Switching Levels With
Dual-Supply Pins Operating Over Full 1.2-V to
3.6-V Power-Supply Range
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
2
•
•
•
•
ESD Protection
– ±8-kV Contact Discharge
– ±15-kV Air-Gap Discharge
EMI Filtering
Integrated Pullup and Pulldown Resistors on
Card-Side I/Os per SD Specification
ZQS Package Has 100-kΩ Pullup Resistors Via
WP and CD Pins
DESCRIPTION/ORDERING INFORMATION
The SN74AVCA406E is a transceiver for interfacing microprocessors with MultiMediaCards (MMCs) and secure
digital (SD) cards.
Two supply-voltage pins allow the A-port and B-port input switching thresholds to be configured separately. The
A port is designed to track VCCA, while the B port is designed to track VCCB. VCCA and VCCB can accept any
supply voltage from 1.2 V to 3.6 V.
If either VCC is switched off (VCCA = 0 V and/or VCCB = 0 V), all outputs are placed in the high-impedance state to
conserve power.
The SN74AVCA406E enables system designers to easily interface low-voltage microprocessors to different
memory cards operating at higher voltages.
Memory card standards recommend high ESD protection for devices that connect directly to the external memory
card. To meet this need, the SN74AVCA406E incorporates ±15-kV Air-Gap Discharge and ±8-kV Contact
Discharge protection on the card side.
The SN74AVCA406E is available in two 0.5-mm-pitch ball grid array (BGA) packages. The 20-ball package has
dimensions of 3 mm × 2.5 mm, and the 24-ball package measures 3 mm × 3 mm. Memory cards are widely used
in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static
power consumption and small package size make the SN74AVCA406E an ideal choice for these applications.
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE
(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
UFBGA – ZXY (Pb-Free)
Reel of 2500
SN74AVCA406EZXYR
WM406E
MicroStar Junior™ BGA – ZQS
(Pb-Free)
Reel of 2500
SN74AVCA406EZQSR
WM406E
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroStar Junior is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2009, Texas Instruments Incorporated
SN74AVCA406E
SCES659E – OCTOBER 2007 – REVISED JUNE 2009..................................................................................................................................................... www.ti.com
TERMINAL ASSIGNMENTS
(20-Ball ZXY Package)
ZXY PACKAGE
(TOP VIEW)
A
B
C
D
5
4
3
2
A
B
C
D
5
VCCA
CMD-dir
DAT0-dir
VCCB
4
DAT3A
DAT2A
DAT2B
DAT3B
3
CLKA
GND
GND
CLKB
2
DAT1A
DAT0A
CMDB
DAT0B
1
CLK-f
CMDA
DAT123-dir
DAT1B
1
ZQS PACKAGE
(TOP VIEW)
1
2
3
4
TERMINAL ASSIGNMENTS
(24-Ball ZQS Package)
5
1
2
3
A
DAT2A
CMD-dir
B
DAT3A
C
C
CLKA
RSV
D
D
DAT0A
E
DAT1A
A
B
E
4
5
DAT0-dir
RSV
DAT2B
VCCA
VCCB
DAT3B
GND
GND
CLKB
CMDA
CD
CMDB
DAT0B
CLK-f
DAT123-dir
WP
DAT1B
REFERENCE DESIGN
VCCA
VCCA
VCCB
C3
0.1 μA
C4
0.1 μA
C1
0.1 μA
100 kΩ
U1A
VCCB
100 kΩ
J1
U2
VDDA
DAT0-dir
DAT0
DAT123-dir
DAT1
DAT2
DAT3
CMD-dir
CMD
CLK
CLKin
GND
WP
CD
A5
C5
B2
C1
A2
B4
A4
B5
B1
A3
A1
C3
B3
Processor
SD/SDIO MMC
VCCA
DAT0-dir
DAT0A
DAT123-dir
DAT1A
DAT2A
DAT3A
CMD-dir
CMDA
CLKA
CLK-f
GND
GND
VCCB
DAT2B
DAT3B
CMDB
D5
D2 DAT0B
DAT0B
DAT1B D1 DAT1B
DAT2B C4 DAT2B
DAT3B D4 DAT3B
C2 CMDB
CMDB
D3 CLKB
CLKB
CLKB
DAT0B
DAT1B
CD
WP
0
1
2
3
4
5
6
7
8
9
10
11
12
13
DAT2
DAT3
CMD
VSS1
VDD
CLK
VSS2
DAT0
DAT1
WP/CD (Physical)
CD (Physical)
GND
GND
WP (Physical)
54794-0978
SD/SDIO Card
Connector
SN74AVCA406EZXYR
WP
CD
Figure 1. Interfacing With SD/SDIO Card
2
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PIN DESCRIPTION
ZQS
BALL NO.
ZXY
BALL NO.
A1
B4
DAT2A
Data bit 3 connected to host. Referenced to VCCA.
I/O
A2
B5
CMD-dir
Direction control for command bit (CMDA/CMDB)
Input
A3
C5
DAT0-dir
Direction control for DAT0A/DAT0B
Input
NAME
FUNCTION
TYPE
A4, C2
–
RSV
A5
C5
DAT2B
Reserved (for possible future functionality). Leave unconnected.
Data bit 3 connected to memory card. Includes a 70-kΩ pullup resistor to VCCB.
I/O
B1
A4
DAT3A
Data bit 4 connected to host. Referenced to VCCA.
I/O
B2
–
–
B3
A5
VCCA
A-port supply voltage. VCCA powers all A-port I/Os and control inputs.
Power
B4
D5
VCCB
B-port supply voltage. VCCB powers all B-port I/Os.
Power
B5
D4
DAT3B
Data bit 4 connected to memory card. Includes a 470-kΩ pulldown resistor to VCCB.
C1
A3
CLKA
Clock signal connected to host. Referenced to VCCA.
C3
B3
GND
Ground
C4
C3
GND
Ground
C5
D3
CLKB
Clock signal connected to memory card. Referenced to VCCB.
D1
B2
DAT0A
Data bit 1 connected to host. Referenced to VCCA.
I/O
D2
B1
CMDA
Command bit connected to host. Referenced to VCCA.
I/O
D3
–
CD
Connected to card detect on the mechanical connector.
CD has an internal 100-kΩ pullup resistor to VCCA and this pin has ±10-kV Air-Gap
Discharge and ±8-kV Contact Discharge ESD protection.
Output
D4
C2
CMDB
Command bit connected to memory card. Includes a 15-kΩ pullup resistor to VCCB.
I/O
D5
D2
DAT0B
Data bit 1 connected to memory card. Includes a 70-kΩ pullup resistor to VCCB.
I/O
E1
A2
DAT1A
Data bit 2 connected to host. Referenced to VCCA.
I/O
E2
A1
CLK-f
E3
C1
DAT123-dir
E4
–
WP
E5
D1
DAT1B
Depopulated ball
Input
Clock feedback to host for resynchronizing data. Used in OMAP processors. Leave
unconnected if not used.
Direction control for DAT1A/B, DAT2A/B, and DAT3A/B
Connected to write protect on the mechanical connector.
WP has an internal 100-kΩ pullup resistor to VCCA and this pin has ±10-kV Air-Gap
Discharge and ±8-kV Contact Discharge ESD protection.
Data bit 2 connected to memory card. Includes a 70-kΩ pullup resistor to VCCB.
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I/O
Output
Output
Input
Output
I/O
3
SN74AVCA406E
SCES659E – OCTOBER 2007 – REVISED JUNE 2009..................................................................................................................................................... www.ti.com
FUNCTION TABLES
OUTPUT CIRCUITS
CONTROL INPUT
CMD-dir
CMDA
CMDB
High
Hi-Z
Enabled
CMDA to CMDB
Low
Enabled
Hi-Z
CMDB to CMDA
CONTROL INPUT
DAT0-dir
OUTPUT CIRCUITS
OPERATION
FUNCTION
DAT0A
DAT0B
High
Hi-Z
Enabled
DAT0A to DAT0B
Low
Enabled
Hi-Z
DAT0B to DAT0A
CONTROL INPUT
DAT123-dir
DAT1A,
DAT2A,
DAT3A
DAT1B,
DAT2B,
DAT3B
FUNCTION
OUTPUT CIRCUITS
DAT1A to DAT1B
High
Hi-Z
Enabled
DAT2A to DAT2B
DAT3A to DAT3B
DAT1B to DAT1A
Low
Enabled
Hi-Z
DAT2B to DAT2A
DAT3B to DAT3A
4
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www.ti.com..................................................................................................................................................... SCES659E – OCTOBER 2007 – REVISED JUNE 2009
LOGIC DIAGRAM (POSITIVE LOGIC)
CMD-dir
CMDA
CMDB
DAT0-dir
DAT0A
DAT0B
ASIP
DAT123-dir
DAT1A
DAT1B
DAT2A
DAT2B
DAT3A
DAT3B
CLKA
CLKB
CLK-f
VCCA
100 kΩ
(A)
100 kΩ
WP
CD
VCCB
VCCA
A.
(A)
WP and CD pullup resistors are for the ZQS package only.
Figure 2. Logic Diagram
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SN74AVCA406E
SCES659E – OCTOBER 2007 – REVISED JUNE 2009..................................................................................................................................................... www.ti.com
BLOCK DIAGRAM
VCCB
R9 R10 R11 R12
Card
R1
CLKB
R2
CMDB
R3
DAT0B
R4
DAT1B
R5
DAT2B
R6
DAT3B
R7
GND
GND
Figure 3. ASIP Block Diagram
RESISTORS
BIDIRECTIONAL ZENER DIODES
R1, R2, R3, R4, R5, R6 40 Ω
Tolerance
±20%
R10, R11, R12
70 kΩ
R9
15 kΩ
R7
470 kΩ
Tolerance
Vbr min.
14 V at 1 mA
Line capacitance
<20 pF
±30%
VCCA
RCD
RWP
WP
CD
Resistors
RWP, RCD
100 kΩ
Tolerance
±30%
Figure 4. WP, CD Pullup Resistors (for ZQS Package Only)
6
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ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCCA
VCCB
Supply voltage range
VI
Input voltage range (2)
MIN
MAX
–0.5
4.6
I/O ports (A port)
–0.5
4.6
I/O ports (B port)
–0.5
4.6
Control inputs
–0.5
4.6
A port
–0.5
4.6
B port
–0.5
4.6
A port
–0.5 VCCA + 0.5
B port
–0.5 VCCB + 0.5
UNIT
V
V
VO
Voltage range applied to any output
in the high-impedance or power-off state (2)
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
150
°C
Continuous current through VCCA, VCCB, or GND
Tstg
(1)
(2)
(3)
Storage temperature range
–65
V
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed.
PACKAGE THERMAL IMPEDANCE
UNIT
θJA
(1)
Package thermal impedance (1)
ZQS package
171.6
ZXY package
193
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7.
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RECOMMENDED OPERATING CONDITIONS (1) (2) (3)
VCCI
VCCO
MIN
MAX
UNIT
VCCA
Supply voltage
1.2
3.6
V
VCCB
Supply voltage
1.2
3.6
V
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VI/O
Input/output voltage
IOH
All inputs (4)
All inputs
1.2 V to 1.95 V
VCCI x 0.35
1.95 V to 2.7 V
0.7
2.7 V to 3.6 V
0.8
3.6
3-state
0
3.6
Low-level output current (B port)
TA
Operating free-air temperature
8
V
VCCO
Input transition rise or fall rate
(4)
2
0
Δt/Δv
(1)
(2)
(3)
1.7
2.7 V to 3.6 V
0
High-level output current (B port)
IOL
1.95 V to 2.7 V
Active state
Low-level output current (A port)
IOH
VCCI x 0.65
Control inputs
High-level output current (A port)
IOL
(4)
1.2 V to 1.95 V
1.2 V
–1
1.4 V to 1.6 V
–1
1.65 V to 1.95 V
–2
2.3 V to 2.7 V
–4
3 V to 3.6 V
–8
1.2 V
1
1.4 V to 1.6 V
1
1.65 V to 1.95 V
2
2.3 V to 2.7 V
4
3 V to 3.6 V
8
1.2 V
–1
1.4 V to 1.6 V
–2
1.65 V to 1.95 V
–4
2.3 V to 2.7 V
–8
3 V to 3.6 V
–16
1.2 V
1
1.4 V to 1.6 V
2
1.65 V to 1.95 V
4
2.3 V to 2.7 V
8
3 V to 3.6 V
16
–40
V
V
V
mA
mA
mA
mA
5
ns/V
85
°C
VCCI is the VCC associated with the input port.
VCCO is the VCC associated with the output port.
All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
CMD-dir, DAT0-dir, and DAT123-dir are referenced to VCCA.
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ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (1) (2)
PARAMETER
TEST CONDITIONS
IOH = –100 µA
IOH = –1 mA
VOH
A port
IOH = –1 mA
IOH = –2 mA
VI = VIH
IOH = –4 mA
A port
B port
B port
1.2
2.3 V
2.3 V
1.75
2.3
0.35
0.45
IOL = 4 mA
2.3 V
2.3 V
0.55
IOL = 8 mA
3V
3V
0.7
1.2 V to 3.6 V
1.2 V to 3.6 V
IOH = –1 mA
1.2 V
1.2 V
IOH = –2 mA
1.4 V
1.4 V
1.05
1.65 V
1.65 V
1.2
IOH = –8 mA
2.3 V
2.3 V
1.75
IOH = –16 mA
3V
3V
2.1
IOL = 100 µA
1.2 V to 3.6 V
1.2 V to 3.6 V
1.2 V
1.2 V
IOH = –4 mA
VI = VIH
IOL = 2 mA
V
VCCO – 0.2
1.1
V
0.2
0.07
1.4 V
1.4 V
0.35
1.65 V
1.65 V
0.45
IOL = 8 mA
2.3 V
2.3 V
0.55
IOL = 16 mA
3V
3V
0.79
1.2 V to 3.6 V
1.2 V to 3.6 V
±1
µA
3.6 V
3.6 V
±5
µA
1.2 V to 3.6 V
1.2 V to 3.6 V
10
3.6 V
0V
10
IOL = 4 mA
VI = VIL
VI = VCCI or GND,
VI = VCCI or GND,
VI = VCCI or GND,
IO = 0
IO = 0
IO = 0
VI = VCCA or GND
0V
3.6 V
–1
1.2 V to 3.6 V
1.2 V to 3.6 V
10
3.6 V
0V
–1
0V
3.6 V
10
1.2 V to 3.6 V
1.2 V to 3.6 V
15
1.8 V
3V
Clock input
(1)
(2)
(3)
(4)
0.2
0.1
1.4 V
See function
VO = VCCO or GND, table for input
VI = VCCI or GND
states when
outputs are Hi Z
Cio
V
1.65 V
A or B port
Ci
1.05
1.4 V
VI = VIL
IOZ (4)
Control
inputs
1.4 V
1.65 V
IOL = 2 mA
UNIT
0.9
1.65 V
1.2 V
MAX
VCCO – 0.2
1.4 V
1.2 V
IOL = 1 mA
MIN TYP (3)
1.65 V
3V
VI = VCCA or GND
ICCA + ICCB
1.2 V
1.2 V to 3.6 V
II
ICCB
1.2 V
3V
Control
inputs
ICCA
1.2 V to 3.6 V
1.2 V to 3.6 V
IOL = 1 mA
VOL
1.2 V to 3.6 V
IOL = 100 µA
IOH = –100 µA
VOH
VCCB
IOH = –8 mA
IOL = 1 mA
VOL
VCCA
A port
VO = VCCA or GND
B port
VO = VCCB or GND
1.8 V
3V
1.5
2
1.5
2
2.5
3.5
12
14
V
µA
µA
µA
pF
pF
VCCO is the VCC associated with the output port.
VCCI is the VCC associated with the data input port.
All typical values are at TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
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OUTPUT SLEW RATES
over recommended operating free-air temperature range (unless otherwise noted) (1)
PARAMETER
FROM
VCCA = 1.8 V ± 0.15 V,
VCCB = 3 V ± 0.3 V
TO
MIN
(1)
(2)
UNIT
MAX
tr
20%
80%
2.7 (2)
ns
tf
80%
20%
2.5 (2)
ns
Values are characterized, but not production tested.
Using CL = 30 pF on the B side and CL = 7 pF on the A side
TYPICAL SWITCHING CHARACTERISTICS
TA = 25°C, VCCA = 1.2 V (see Figure 6)
VCCB =
1.2 V
VCCB =
1.5 V
VCCB =
1.8 V
VCCB =
2.5 V
VCCB =
3V
TYP
TYP
TYP
TYP
TYP
4.9
4
3.5
3.2
3.2
5.3
4.3
4.1
3.9
3.9
CLKB
5.1
4
3.5
3.1
3.1
CLK-f
10.3
8.9
7.7
7.7
7.7
CMDA
CMDB
4.9
4
3.5
3.2
3.2
CMDB
CMDA
4.8
4.4
4.2
4
4
(1)
DIR
A
5.3
5.4
5.2
6
5.9
ns
tdis (1)
DIR
A
5.5
5.4
5.5
5.6
5.5
ns
PARAMETER
tpd
ten
(1)
FROM
(INPUT)
TO
(OUTPUT)
A
B
B
A
CLKA
UNIT
ns
DIR refers to CMD-dir, DAT0-dir, and DAT123-dir.
SWITCHING CHARACTERISTICS
VCCA = 1.5 V ± 0.1 V
over recommended operating free-air temperature range (see Figure 6)
PARAMETER
tpd
(1)
10
FROM
(INPUT)
TO
(OUTPUT)
A
B
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
MIN
MAX
MIN
MAX
B
1.2
7.2
0.8
A
1.1
6.2
1
CLKB
1.4
7.1
CLK-f
1.1
12.7
CMDA
CMDB
1.1
CLKA
VCCB = 2.5 V
± 0.2 V
MIN
MAX
6.3
0.8
7.2
0.93
1.1
6.2
1.3
13.3
6
0.9
VCCB = 3 V
± 0.3 V
VCCB = 3.3 V
± 0.3 V
MIN
MAX
MIN
MAX
5.4
0.9
6.6
0.45
5.1
0.9
5.1
7
0.45
7
0.8
5.3
1.3
10.6
0.7
5.1
0.7
5.1
1.9
10.9
1.9
10.9
5.6
0.7
4.7
0.6
4.1
0.6
4.1
6.7
UNIT
ns
CMDB
CMDA
0.8
5.9
0.8
6.8
0.8
6.4
0.1
6.7
0.1
ten (1)
DIR
A
1.0
9.1
1.1
10.3
1.1
8.7
1.1
11
1.1
11
ns
tdis (1)
DIR
A
1.1
8.1
1.1
8.3
1.1
8.3
1.1
8.3
1.1
8.3
ns
DIR refers to CMD-dir, DAT0-dir, and DAT123-dir.
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SWITCHING CHARACTERISTICS
VCCA = 1.8 V ± 0.15 V
over recommended operating free-air temperature range (see Figure 6)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
B
VCCB = 2.5 V
± 0.2 V
VCCB = 3 V
± 0.3 V
VCCB = 3.3 V
± 0.3 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
0.7
5.8
0.6
4.9
0.5
4.7
0.5
4.7
A
0.7
4.9
0.7
4.5
0.2
5.2
0.2
5.2
CLKB
0.9
5.8
0.6
4.9
0.6
4.7
0.6
4.7
CLK-f
0.9
11
0.9
9.2
0.8
8.8
0.8
8.8
CMDA
CMDB
0.7
4.3
0.5
4.1
0.5
3.4
0.5
3.4
CMDB
CMDA
0.7
4.6
0.8
4.2
0.1
5
0.1
5
ten (1)
DIR
A
0.7
7.2
0.7
6.6
0.7
7.8
0.7
7.8
ns
(1)
DIR
A
1.0
7.9
1
7.7
1
8.2
1
8.2
ns
tpd
tdis
(1)
VCCB = 1.8 V
± 0.15 V
CLKA
ns
DIR refers to CMD-dir, DAT0-dir, and DAT123-dir.
SWITCHING CHARACTERISTICS
VCCA = 2.5 V ± 0.2 V
over recommended operating free-air temperature range(see Figure 6)
PARAMETER
TO
(OUTPUT)
A
B
VCCB = 2.5 V
± 0.2 V
VCCB = 3 V
± 0.3 V
VCCB = 3.3 V
± 0.3 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
B
0.5
4.3
0.4
4.1
0.4
4.1
A
0.5
3.5
0.2
3.7
0.2
3.7
CLKB
0.5
4.3
0.4
4.1
0.4
4.1
CLK-f
0.4
7.8
0.3
7.3
0.3
7.3
CMDA
CMDB
0.3
3
0.3
2.7
0.3
2.7
CMDB
CMDA
0.7
3
0.2
3.4
0.2
3.4
(1)
DIR
A
0.5
5.1
0.5
5.6
0.5
5.6
ns
tdis (1)
DIR
A
0.7
5.7
0.7
6.7
0.7
6.7
ns
tpd
ten
(1)
FROM
(INPUT)
CLKA
ns
DIR refers to CMD-dir, DAT0-dir, and DAT123-dir.
SWITCHING CHARACTERISTICS
VCCA = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (see Figure 6)
PARAMETER
tpd
(1)
FROM
(INPUT)
TO
(OUTPUT)
A
B
VCCB = 3 V
± 0.3 V
VCCB = 3.3 V
± 0.3 V
UNIT
MIN
MAX
MIN
MAX
B
0.3
3.8
0.3
3.8
A
0.3
3
0.3
3
CLKB
0.3
3.8
0.3
3.8
CLK-f
0.1
6.7
0.1
6.7
CMDA
CMDB
0.2
2.5
0.2
2.5
CLKA
ns
CMDB
CMDA
0.4
2.6
0.4
2.6
ten (1)
DIR
A
0.3
4.5
0.3
4.5
ns
tdis (1)
DIR
A
0.9
7.9
0.9
7.9
ns
DIR refers to CMD-dir, DAT0-dir, and DAT123-dir.
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SN74AVCA406E
SCES659E – OCTOBER 2007 – REVISED JUNE 2009..................................................................................................................................................... www.ti.com
TYPICAL FREQUENCY AND OUTPUT SKEW
TA = 25°C, VCCA = 1.2 V (see Figure 6)
PARAMETER
Clock
tmax
Data
tsk(o)
Channel-tochannel
TO
(OUTPUT)
VCCB = 1.2 V
VCCB = 1.5
V
VCCB = 1.8 V
VCCB = 2.5
V
VCCB = 3 V
VCCB = 3.3
V
TYP
TYP
TYP
TYP
TYP
TYP
CLKB
95
95
95
95
95
95
CLK-f
95
95
95
95
95
95
A
B
95
95
95
95
95
95
B
A
95
95
95
95
95
95
A
B
0.1
0.1
0.1
0.3
0.2
FROM
(INPUT
)
CLKA
UNIT
MHz
ns
MAXIMUM FREQUENCY AND OUTPUT SKEW
VCCA = 1.5 V ± 0.1 V
over recommended operating free-air temperature range (see Figure 6)
PARAMETER
Clock
fmax
Data
tsk(o)
Channel-tochannel
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 1.5 V
± 0.1 V
MIN
VCCB = 1.8 V
± 0.15 V
MAX
MIN
MAX
VCCB = 2.5 V
± 0.2 V
MIN
VCCB = 3 V
± 0.3 V
MAX
MIN
MAX
VCCB = 3.3 V
± 0.3 V
MIN
CLKB
95
95
95
95
95
CLK-f
95
95
95
95
95
A
B
95
95
95
95
95
B
A
95
95
95
95
95
A
B
CLKA
0.1
0.1
0.1
UNIT
MAX
MHz
0.1
ns
MAXIMUM FREQUENCY AND OUTPUT SKEW
VCCA = 1.8 V ± 0.15 V
over recommended operating free-air temperature range (see Figure 6)
PARAMETER
Clock
fmax
Data
tsk(o)
12
Channel-tochannel
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 1.8 V
± 0.15 V
MIN
MAX
VCCB = 2.5 V
± 0.2 V
MIN
MAX
VCCB = 3 V
± 0.3 V
MIN
VCCB = 3.3 V
± 0.3 V
MAX
MIN
CLKB
95
95
95
95
CLK-f
95
95
95
95
A
B
95
95
95
95
B
A
95
95
95
95
A
B
CLKA
0.1
0.2
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0.2
UNIT
MAX
MHz
ns
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74AVCA406E
SN74AVCA406E
www.ti.com..................................................................................................................................................... SCES659E – OCTOBER 2007 – REVISED JUNE 2009
MAXIMUM FREQUENCY AND OUTPUT SKEW
VCCA = 2.5 V ± 0.2 V
over recommended operating free-air temperature range (see Figure 6)
FROM
(INPUT)
PARAMETER
Clock
CLKA
fmax
Data
tsk(o)
Channel-tochannel
VCCB = 2.5 V
± 0.2 V
TO
(OUTPUT)
MIN
VCCB = 3 V
± 0.3 V
MAX
MIN
VCCB = 3.3 V
± 0.3 V
MAX
MIN
CLKB
95
95
95
CLK-f
95
95
95
A
B
95
95
95
B
A
95
95
95
A
B
0.1
UNIT
MAX
MHz
0.3
0.3
ns
MAXIMUM FREQUENCY AND OUTPUT SKEW
VCCA = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (see Figure 6)
FROM
(INPUT)
PARAMETER
Clock
Data
Channel-tochannel
tsk(o)
MIN
VCCB = 3.3 V
± 0.3 V
MAX
MIN
CLKB
95
95
CLK-f
95
95
A
B
95
95
B
A
95
95
A
B
CLKA
fmax
VCCB = 3 V
± 0.3 V
TO
(OUTPUT)
UNIT
MAX
MHz
0.3
ns
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
CpdA (1)
CpdB (1)
(1)
A-port
input,
B-port
output
B-port
input,
A-port
output
A-port
input,
B-port
output
B-port
input,
A-port
output
TEST
CONDITIONS
VCCA =
VCCB = 1.2 V
VCCA =
VCCB = 1.5 V
VCCA =
VCCB = 1.8 V
VCCA =
VCCB = 2.5 V
VCCA =
VCCB = 3 V
VCCA =
VCCB = 3.3 V
TYP
TYP
TYP
TYP
TYP
TYP
4.5
4.7
4.9
5.5
6
6.4
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
UNIT
pF
8
8.3
8.5
9.1
9.5
9.7
27.9
27.8
27.7
27.6
27.6
27.5
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
pF
2.6
2.5
2.4
2.3
1.8
1.8
Power dissipation capacitance per transceiver
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13
SN74AVCA406E
SCES659E – OCTOBER 2007 – REVISED JUNE 2009..................................................................................................................................................... www.ti.com
10
0
Attenuation (dB)
-10
-20
-30
-40
-50
1.E+05
105
6
1.E+06
10
1.E+07
107
8
1.E+08
10
9
1.E+09
10
Frequency (Hz)
Figure 5. Typical ASIP EMI Filter Frequency Response
14
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Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): SN74AVCA406E
SN74AVCA406E
www.ti.com..................................................................................................................................................... SCES659E – OCTOBER 2007 – REVISED JUNE 2009
PARAMETER MEASUREMENT INFORMATION
2 × VCCO
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCCO
GND
RL
LOAD CIRCUIT
VCCO
CL
RL
VTP
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
15 pF
15 pF
15 pF
15 pF
2 kΩ
2 kΩ
2 kΩ
2 kΩ
0.1 V
0.15 V
0.15 V
0.3 V
VCCA
Output
Control
(low-level
enabling)
VCCA/2
VCCA/2
0V
tPZL
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
VOH
VCCO/2
VOL
VCCO/2
tPLZ
VCCO
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
VCCO/2
VOL + VTP
VOL
tPZH
tPHZ
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCCO/2
VOH – VTP
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
Figure 6. Load Circuit and Voltage Waveforms
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Product Folder Link(s): SN74AVCA406E
15
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jun-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
SN74AVCA406EZQSR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQS
24
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SN74AVCA406EZXYR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZXY
20
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jun-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74AVCA406EZQSR
BGA MI
CROSTA
R JUNI
OR
ZQS
24
2500
330.0
12.4
3.3
3.3
1.6
8.0
12.0
Q1
SN74AVCA406EZXYR
BGA MI
CROSTA
R JUNI
OR
ZXY
20
2500
330.0
12.4
2.8
3.3
1.0
4.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jun-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AVCA406EZQSR
BGA MICROSTAR
JUNIOR
ZQS
24
2500
340.5
338.1
20.6
SN74AVCA406EZXYR
BGA MICROSTAR
JUNIOR
ZXY
20
2500
340.5
338.1
20.6
Pack Materials-Page 2
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