New ASIC Solution Platform ISSP Series (ISSP1-STD Family) I --> S L m r m o yste Platf S C x I e l S omp ew A c n r o d f n ach o < Bra r p p isk a r w o New --- L Products FEATURES (1/2) Introduced by NEC Electronics, an ISSP represents a new class of ASIC devices based on a cost effective, high-function and easy to design ASIC architecture. ISSP devices are easily customizable using upper metal layers to meet individual design requirements. An ISSP is ideal for mid-volume designers engaged in complex designs with high system clock speeds. However, the platforms are generally very easy to design, consume much lower power than a comparable FPGA based solution and offer up to an order of magnitude lower NRE than cell-based designs. NEC Electronics offers a breadth of ASIC solutions using Cell-Based and Gate Array products. An ISSP complements these approaches by serving the growing number of mid-volume applications which cannot bear the development costs associated with leading-edge cell-based designs but which require higher complexity than a Gate Array or FPGA solution. ASIC Roadmap CB-130 CB-12 CB-11 CBIC CB-10VX ISSP Performance CB-9VX CB-8 System LSI G/A SoCLite SoCLite+ ISSP1 System LSI & High Performance SoC G/A EA-9HD CMOS-9HD ISSP2 ce rforman High pe CMOS-10HD CMOS-N5 0.5 µ m : Planning 0.35 µ m 0.25 µ m 0.18 µ m 0.13 µ m 0.10 µ m Process technology Advantages of ISSP (1) System LSI with low overall development cost (engineering resources/mask NRE) (2) New “Built-in” features (DFT, clocks, signal integrity) drastically provide “easy to design” . (3) Includes many other benefits associated with Gate Array, Cell-Based and even FPGA (4) Ability to leverage Cell-Based IP – allows quick migration to Cell-Based designs (5) Small/Middle production volume capabilities with very quick turn around time 2 Pamphlet A16092EJ2V0PF FEATURES (2/2) Design turn around time (RTL to Prototypes) Design Time Advantage RTL design ISSP DFT Verification Design cycle times for complex ASICs Manufacturing are on the rise due to the need to insert FPGA and verify DFT(Design For Test) and to address deep sub-micron design GateArray issues such as signal integrity (SI). Even in the FPGA world, it is not CBIC unusual to spend weeks to converge on timing especially for higher utilized 0 4 8 12 16 20 24 large gate-count designs exceeding Turn around time (week) 100 MHz clock speeds. Users designing with ISSPs do not have to worry about a DFT impact to their design cycle because an ISSP comes pre-configured with all testing technologies like SCAN, BSCAN etc. The clock domains are also built into the ISSP, which results in additional design time savings due to predictable timing and lower clock skew. The use of a high performance process technology also enables the designer to achieve high clock speeds. The Low Risk Advantage The rising development and mask NRE costs of deep sub-micron ASICs make it more difficult for mid-volume designers to target multiple re-spins of their prototypes. For early stage products, there is also an additional risk involved in predicting the production volumes necessary to amortize these development costs. By providing a high performance solution, an easy design flow and an NRE typically associated with Gate Arrays, an ISSP allows quick re-spins of prototypes and enables products to reach mid-volume production at very reasonable costs. If the volumes increase, ISSP users can migrate to NEC Electronics’s Cell Based products which are built on the same process technology and based on same IP and design flow. Total volume vs Total cost Most cost effective device zone FPGA CBIC CBIC Zone 10K-100K Total volume Total cost ISSP ISSP Zone 100-1K FPGA Zone 100-1K Total volume 10K-100K Life cycle Total cost = Engineering cost + Mask NRE + Total volume x Unit cost Pamphlet A16092EJ2V0PF 3 PRODUCT OUTLINE (ISSP1-STD Family) NEC Electronics’s first generation of ISSP platforms known as the ISSP1-STD family includes embedded high density SRAM, Analog PLLs (APLL), and Delay-Locked Loops (DLL). ISSP1-STD family is based on NEC Electronics’s production-proven UX4 CMOS process technology with 5 metal layer (aluminum) technology. It features advanced 0.13 µ m (drawn) transistors, which enables up to 300 MHz system clock speeds and a 1.5 V core voltage, which results in low-power dissipation. This product applies a complex multi gates architecture to the user-defined logic area. The lower 3 metal layers are predefined for the interconnection related to the embedded IP cores, the built-in testing (DFT) circuits, clock domains and power lines. The upper 2 metal layers are used for customization of the users design. The ISSP1-STD is a versatile platform and is targeted to support several major applications such as high performance broadband communication and networking equipments, computer peripherals, instrumentation and digital consumer products. In the future NEC Electronics is planning to introduce ISSP platforms with embedded processor cores and high speed interface macros. Chip Structure of ISSP1-STD Family Embedded APLL Embedded DLL APLL APLL DLL Embedded clock Complex Multi Gates DLL eRAM eRAM eRAM eRAM eRAM Embedded SRAM eRAM CLK Test circuit BSCAN Multi-SCAN BIST TESTBUS eRAM eRAM eRAM eRAM eRAM eRAM DLL DLL APLL APLL Planned ISSP1-STD Family Master Offering Master 4 Usable gates Embedded SRAM size (bit) Embedded SRAM block (16 K bit) µPD65701 227 K 16 µPD65702 530 K 48 µPD65703 1,109 K 64 262,144 li e r P r a n mi y Package (TBGA) 352 420 786,432 352 500 696 1,048,576 500 576 696 Pamphlet A16092EJ2V0PF Specification for ISSP1-STD Family Process 0.13 µ m (drawn) Si gate CMOS, 5 metal layers Maximum usable gates 1 M gates (Usable) Packages Note 352 / 420 / 500 / 576 / 696 TBGA Supply voltage Internal : 1.5V Interface : 2.5V / 3.3V, other high speed interfaces Power dissipation 0.014 µ W/MHz/gate (@Operating ratio: 0.3) Maximum frequency 300 MHz Interface 3.3V / 2.5V LVTTL 3.3V PCI, PCI-X LVDS, HSTL, SSTL, PECL, others Embedded cores li e r P m y r a in SRAM : 1/2 port compile type synchronous (Max: 1M bit) APLL : High / Middle speed type DLL : for High speed DRAM interface Soft cores SRAM : Distributed compiled type synchronous SRAM UART, EthernetTM MAC, Memory interface, others Embedded clocks Main clock : 2 Local clock : 8 Embedded testing SCAN, BSCAN, BIST, TESTBUS Note The number of usable signal pins depend on each package. Pamphlet A16092EJ2V0PF 5 MEMO 6 Pamphlet A16092EJ2V0PF Ethernet is a trademark of XEROX Corporation USA. These commodities, technology or software, must be exported in accordance with the export administration regulations of the exporting country. Diversion contrary to the law of that country is prohibited. • The information in this document is current as of November, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such NEC Electronics products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact NEC Electronics sales representative in advance to determine NEC Electronics's willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11 Pamphlet A16092EJ2V0PF 7 For further information, please contact: NEC Electronics Corporation 1753, Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa 211-8668, Japan Tel: 044-435-5111 http://www.necel.com/ [North & South America] [Europe] [Asia & Oceania] NEC Electronics America, Inc. 2880 Scott Blvd. Santa Clara, CA 95050-2554, U.S.A. Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288 http://www.necelam.com/ NEC Electronics (Europe) GmbH Oberrather Str. 4 40472 Düsseldorf, Germany Tel: 0211-6503-01 Fax: 0211-6503-327 http://www.ee.nec.de/ NEC Electronics Hong Kong Limited 12/F., Cityplaza 4, 12 Taikoo Wan Road, Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044 Sucursal en España Juan Esplandiu, 15 28007 Madrid, Spain Tel: 091-504-2787 Fax: 091-504-2860 Succursale Française 9, rue Paul Dautier, B.P. 52 78142 Velizy-Villacoublay Cédex France Tel: 01-3067-5800 Fax: 01-3067-5899 Filiale Italiana Via Fabio Filzi, 25/A 20124 Milano, Italy Tel: 02-667541 Fax: 02-66754299 Branch The Netherlands Boschdijk 187a 5612 HB Eindhoven The Netherlands Tel: 040-2445845 Fax: 040-2444580 Seoul Branch 10F, ILSONG Bldg., 157-37, Samsung-Dong, Kangnam-Ku Seoul, the Republic of Korea Tel: 02-528-0303 Fax: 02-528-4411 NEC Electronics Shanghai, Ltd. 7th Floor, HSBC Tower, 101Yin Cheng Road, Pudong New Area, Shanghai P.R. China Tel: 021-6841-1138 Fax: 021-6841-1137 NEC Electronics Taiwan Ltd. 7F, No. 363 Fu Shing North Road Taipei, Taiwan, R. O. C. Tel: 02-2719-2377 Fax: 02-2719-5951 NEC Electronics Singapore Pte. Ltd. 238A Thomson Road, Novena Square, #12-08 Singapore 307684 Tel: 6253-8311 Fax: 6250-3583 Tyskland Filial P.O. Box 134 18322 Taeby, Sweden Tel: 08-6380820 Fax: 08-6380388 United Kingdom Branch Cygnus House, Sunrise Parkway Linford Wood, Milton Keynes MK14 6NP, U.K. Tel: 01908-691-133 Fax: 01908-670-290 G02.11 Document No. A16092EJ2V0PF00 (2nd edition) Date Published November 2002 NS CP(K) C 2002 Printed in Japan