ETC XP04683|XP4683

Composite Transistors
XP04683 (XP4683)
Silicon NPN epitaxial planar type (Tr1)
Silicon PNP epitaxial planar type (Tr2)
0.2±0.05
5
0.12+0.05
–0.02
■ Features
5˚
• Two elements incorporated into one package
• Reduction of the mounting area and assembly cost by one half
1
3
2
0.2±0.1
4
1.25±0.10
2.1±0.1
6
Unit: mm
(0.425)
For high-frequency amplification (Tr1)
For general amplification (Tr2)
(0.65) (0.65)
1.3±0.1
2.0±0.1
■ Basic Part Number
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Tr1
Symbol
Rating
Unit
Collector-base voltage
(Emitter open)
VCBO
30
V
Collector-emitter voltage
(Base open)
VCEO
20
V
Emitter-base voltage
(Collector open)
VEBO
3
V
IC
15
mA
Collector-base voltage
(Emitter open)
VCBO
−60
V
Collector-emitter voltage
(Base open)
VCEO
−50
V
Emitter-base voltage
(Collector open)
VEBO
−7
V
Collector current
IC
−100
mA
Peak collector current
ICP
−200
mA
Total power dissipation
PT
150
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
Collector current
Tr2
Overall
1: Emitter (Tr1)
2: Base (Tr1)
3: Collector (Tr2)
EIAJ: SC-88
0 to 0.1
0.9±0.1
• 2SC2404 + 2SB0709A (2SB709A)
0.9+0.2
–0.1
10˚
4: Emitter (Tr2)
5: Base (Tr2)
6: Collector (Tr1)
SMini6-G1 Package
Marking Symbol: ER
Internal Connection
6
5
Tr1
1
4
Tr2
2
3
Note) The part number in the parenthesis shows conventional part number.
Publication date: February 2004
SJJ00189BED
1
XP04683
■ Electrical Characteristics Ta = 25°C ± 3°C
• Tr1
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
Conditions
Min
30
Typ
Max
Unit
Emitter-base voltage (Collector open)
VEBO
IE = 10 µA, IC = 0
3
Base-emitter voltage
VBE
VCB = 6 V, IE = −1 mA
Forward current transfer ratio
hFE
VCB = 6 V, IE = −1 mA
40
Transition frequency
fT
VCB = 6 V, IE = −1 mA, f = 200 MHz
450
Reverse transfer capacitance
(Common emitter)
Cre
VCB = 6 V, IE = −1 mA, f = 10.7 MHz
Power gain
GP
VCB = 6 V, IE = −1 mA, f = 100 MHz
24
dB
Noise figure
NF
VCB = 6 V, IE = −1 mA, f = 100 MHz
3.3
dB
V
V
720
mV
260
650
0.8

MHz
1.0
pF
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
• Tr2
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = −10 µA, IE = 0
−60
V
Collector-emitter voltage (Base open)
VCEO
IC = −2 mA, IB = 0
−50
V
Emitter-base voltage (Collector open)
VEBO
IE = −10 µA, IC = 0
−7
Collector-base cutoff current (Emitter open)
ICBO
VCB = −20 V, IE = 0
Collector-emitter cutoff current (Base open)
ICEO
VCE = −10 V, IB = 0
Forward current transfer ratio
hFE
VCE = −10 V, IC = −2 mA
Collector-emitter saturation voltage
VCE(sat)
Transition frequency
fT
Collector output capacitance
(Common base, input open circuited)
Cob
Conditions
IC = −100 mA, IB = −10 mA
Min
Typ
Max
Unit
V
160
− 0.3
− 0.1
µA
−100
µA
460

− 0.5
V
VCB = −10 V, IE = 1 mA, f = 200 MHz
80
MHz
VCB = −10 V, IE = 0, f = 1 MHz
2.7
pF
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Common characteristics chart
PT  Ta
Total power dissipation PT (mW)
250
200
150
100
50
0
0
40
80
120
160
Ambient temperature Ta (°C)
2
SJJ00189BED
XP04683
Characteristics charts of Tr1
IC  VCE
IC  I B
Ta = 25°C
40 µA
20 µA
8
6
4
0
6
12
18
1
25°C
Ta = 75°C
−25°C
1
0.4
VCB = 6 V
f = 2 MHz
Ta = 25°C
60
40
20
Emitter current IE (mA)
−10
1.2
1.6
2.0
fT  I E
VCB = 6 V
Ta = 25°C
240
Ta = 75°C
180
25°C
−25°C
120
60
1
10
800
600
400
200
0
−10−1
102
−1
1.6
1.2
0.8
0.4
0
10−1
1
10
Collector-emitter voltage VCE
SJJ00189BED
−102
Cob  VCB
IC = 1 mA
f = 10.7 MHz
Ta = 25°C
2.0
−10
Emitter current IE (mA)
Cre  VCE
−1
0.8
Base-emitter voltage VBE (V)
1 000
2.4
Reverse transfer capacitance
Cre (pF)
(Common emitter)
Reverse transfer impedance Zrb (Ω)
0
Collector current IC (mA)
80
0
−10−1
160
300
Zrb  IE
100
120
VCE = 6 V
Collector current IC (mA)
120
80
1 200
0
10−1
102
10
10
hFE  IC
10
10−2
10−1
40
360
IC / IB = 10
Forward current transfer ratio hFE
Collector-emitter saturation voltage VCE(sat) (V)
VCE(sat)  IC
10−1
15
Base current IB (µA)
Collector-emitter voltage VCE (V)
102
20
0
0
102
(V)
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
0
−25°C
Ta = 75°C
5
2
2
0
25
Collector current IC (mA)
Collector current IC (mA)
Collector current IC (mA)
60 µA
6
4
25°C
10
80 µA
8
VCE = 6 V
VCE = 6 V
Ta = 25°C
IB = 100 µA
10
IC  VBE
30
12
Transition frequency fT (MHz)
12
1.2
f = 1 MHz
IE = 0
Ta = 25°C
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
30
Collector-base voltage VCB (V)
3
XP04683
GP  I E
NF  IE
40
f = 100 MHz
Rg = 50 Ω
Ta = 25°C
30
VCE = 10 V
25
6V
20
15
f = 100 MHz
Rg = 50 Ω
Ta = 25°C
10
Noise figure NF (dB)
35
Power gain GP (dB)
12
8
6
VCE = 6 V, 10 V
4
10
2
5
0
−10−1
−1
−10
0
−10−1
−102
Emitter current IE (mA)
−1
−10
−102
Emitter current IE (mA)
Characteristics charts of Tr2
IC  VCE
IC  I B
Ta = 25°C
−150 µA
−20
−100 µA
−10
0
−4
−8
−12
−250
−30
−200
−150
−20
−100
−10
−50 µA
0
−300
−40
0
−16
−50
0
Collector-emitter voltage VCE (V)
Collector current IC (mA)
−25°C
−160
−120
−80
0
− 0.4
− 0.8
−1.2
− 0.4
0
−10
−1.6
Base-emitter voltage VBE (V)
−2.0
−10−3
−1
Ta = 75°C
25°C
−25°C
−10
−102
Collector current IC (mA)
SJJ00189BED
−1.2
−1.6
hFE  IC
600
IC / IB = 10
−1
− 0.8
Base-emitter voltage VBE (V)
−10−2
0
0
−400
−10−1
−40
4
Collector-emitter saturation voltage VCE(sat) (V)
25°C
Ta = 75°C
−300
VCE(sat)  IC
VCE = −5 V
−200
−200
Base current IB (µA)
IC  VBE
−240
−100
−103
Forward current transfer ratio hFE
−30
Collector current IC (mA)
Collector current IC (mA)
−200 µA
VCE = −5 V
Ta = 25°C
−350
−50
−250 µA
−40
−400
VCE = −5 V
Ta = 25°C
IB = −300 µA
−50
IB  VBE
−60
Base current IB (µA)
−60
VCE = –10 V
500
400
300
Ta = 75°C
25°C
−25°C
200
100
0
−1
−10
−102
Collector current IC (mA)
−1 03
XP04683
Transition frequency fT (MHz)
140
Cob  VCB
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
fT  I E
160
VCB = −10 V
Ta = 25°C
120
100
80
60
40
20
0
10−1
1
10
Emitter current IE (mA)
102
8
f = 1 MHz
IE = 0
Ta = 25°C
7
6
5
4
3
2
1
0
−1
−10
−102
Collector-base voltage VCB (V)
SJJ00189BED
5
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP