NSC LM4889

LM4889
1 Watt Audio Power Amplifier
General Description
Key Specifications
The LM4889 is an audio power amplifier primarily designed
for demanding applications in mobile phones and other portable communication device applications. It is capable of
delivering 1 watt of continuous average power to an 8Ω BTL
load with less than 2% distortion (THD+N) from a 5VDC
power supply.
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components. The LM4889 does not require output
coupling capacitors or bootstrap capacitors, and therefore is
ideally suited for mobile phone and other low voltage applications where minimal power consumption is a primary requirement.
The LM4889 features a low-power consumption shutdown
mode, which is achieved by driving the shutdown pin with a
logic low. Additionally, the LM4889 features an internal thermal shutdown protection mechanism.
The LM4889 contains advanced pop & click circuitry to
eliminate noise which would otherwise occur during turn-on
and turn-off transitions.
The LM4889 is unity-gain stable and can be configured by
external gain-setting resistors.
j Improved PSRR at 217Hz, 5 - 3.3V
75dB
j Power Output at 5.0V & 2% THD
1.0W(typ.)
j Power Output at 3.3V & 1% THD
400mW(typ.)
j Shutdown Current at 3.3 & 2.6V
0.01µA(typ.)
Features
n Available in space-saving MSOP, SOIC, LLP, and micro
SMD packages
n Ultra low current shutdown mode (3.3 to 2.6V - 0.01µA)
n Can drive capacitive loads up to 500 pF
n Improved pop & click circuitry eliminates noises during
turn-on and turn-off transitions
n 2.2 - 5.5V operation
n No output coupling capacitors, snubber networks or
bootstrap capacitors required
n Unity-gain stable
n External gain configuration capability
Applications
n Mobile Phones
n PDAs
n Portable electronic devices
Typical Application
20035801
FIGURE 1. Typical Audio Amplifier Application Circuit
Boomer ® is a registered trademark of National Semiconductor Corporation.
© 2003 National Semiconductor Corporation
DS200358
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LM4889 1 Watt Audio Power Amplifier
June 2003
LM4889
Connection Diagrams
Small Outline (SO) Package
SO Marking
20035872
Top View
Order Number LM4889MA
See NS Package Number M08A
Top View
XY - Date Code
TT - Die Traceability
Bottom 2 lines - Part Number
Mini Small Outline (MSOP) Package
MSOP Marking
20035835
20035871
Top View
G - Boomer Family
A2 - LM4889MM
20035836
Top View
Order Number LM4889MM
See NS Package Number MUA08A
8 Bump micro SMD
8 Bump micro SMD Marking
20035879
Top View
X - Date Code
T - Die Traceability
G - Boomer Family
A3 - LM4889ITL
20035887
Top View
Order Number LM4889ITL, LM4889ITLX
See NS Package Number TLA08AAA
LLP Package
10 Pin LLP Marking
20035831
Top View
Z - Assembly Plant Date Code (M for Malacca)
XY - 2 Digit Date Code
TT - Die Traceability
L4889 - LM4889LD
20035830
Top View
Order Number LM4889LD
See NS Package Number LDA10B
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2
θJA (8 Bump micro SMD) (Note 10)
(Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
6.0V
Storage Temperature
−65˚C to +150˚C
Power Dissipation (Note 3)
Internally Limited
ESD Susceptibility (Note 4)
2000V
ESD Susceptibility (Note 5)
200V
Junction Temperature
θJC (MSOP)
56˚C/W
θJA (MSOP)
190˚C/W
θJA (LLP)
220˚C/W
Soldering Information
See AN-1112 "microSMD Wafers Level Chip Scale
Package".
−0.3V to VDD +0.3V
Input Voltage
210˚C/W
Operating Ratings
150˚C
Temperature Range
Thermal Resistance
θJC (SOP)
35˚C/W
θJA (SOP)
150˚C/W
TMIN ≤ TA ≤ TMAX
−40˚C ≤ TA ≤ 85˚C
2.2V ≤ VDD ≤ 5.5V
Supply Voltage
Electrical Characteristics VDD = 5V (Notes 1, 2)
The following specifications apply for VDD = 5V, AV = 2, and 8Ω load unless otherwise specified. Limits apply for TA = 25˚C.
LM4889
Symbol
Parameter
Conditions
Units
(Limits)
Typical
Limit
(Note 6)
(Notes 7, 9)
VIN = 0V, Io = 0A, no Load
4
8
mA (max)
VIN = 0V, Io = 0A, with BTL Load
5
8
mA (max)
0.1
1
µA (max)
IDD
Quiescent Power Supply Current
ISD
Shutdown Current
VSDIH
Shutdown Voltage Input High
1.2
V (min)
VSDIL
Shutdown Voltage Input Low
0.4
V (max)
Po
Output Power
THD = 2% (max); f = 1 kHz
THD+N
Total Harmonic Distortion+Noise
Power Supply Rejection Ratio
PSRR
Vshutdown = GND (Note 8)
1
W
Po = 0.4 Wrms; f = 1kHz
0.1
%
Vripple = 200mV sine p-p
fripple = 217Hz
fripple = 1kHz
62
66
dB
dB
Vripple = 200mV sine p-p
Input Floating
75
68
dB
Electrical Characteristics VDD = 3.3V (Notes 1, 2)
The following specifications apply for VDD = 3.3V, AV = 2, and 8Ω load unless otherwise specified. Limits apply for TA = 25˚C.
LM4889
Symbol
Parameter
Conditions
Typical
Limit
(Note 6)
(Notes 7, 9)
Units
(Limits)
VIN = 0V, Io = 0A, no Load
3.5
7
mA (max)
VIN = 0V, Io = 0A, with BTL Load
4.5
7
mA (max)
Vshutdown = GND (Note 8)
0.01
1
µA (max)
1.2
V (min)
0.4
V (max)
IDD
Quiescent Power Supply Current
ISD
Shutdown Current
VSDIH
Shutdown Voltage Input High
VSDIL
Shutdown Voltage Input Low
Po
Output Power
THD = 1% (max); f = 1kHz
0.4
W
THD+N
Total Harmonic Distortion+Noise
Po = 0.25Wrms; f = 1kHz
0.1
%
PSRR
Power Supply Rejection Ratio
Vripple = 200mV sine p-p
fripple = 217Hz
fripple =1kHz
60
62
dB
dB
3
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LM4889
Absolute Maximum Ratings
LM4889
Electrical Characteristics VDD = 2.6V (Notes 1, 2)
The following specifications apply for VDD = 2.6V, AV = 2, and 8Ω load unless otherwise specified. Limits apply for TA = 25˚C.
LM4889
Symbol
IDD
Parameter
Quiescent Power Supply Current
Conditions
Typical
Limit
Units
(Limits)
(Note 6)
(Notes 7, 9)
VIN = 0V, Io = 0A, no Load
2.6
6
mA (max)
VIN = 0V, Io = 0A, with BTL Load
3.0
6
mA (max)
1
µA (max)
ISD
Shutdown Current
Vshutdown = GND (Note 8)
0.01
P0
Output Power ( 8Ω )
Output Power ( 4Ω )
THD = 1% (max); f = 1 kHz
THD = 1% (max); f = 1 kHz
0.2
0.22
W
W
THD+N
Total Harmonic Distortion+Noise
Po = 0.1Wrms; f = 1kHz
0.08
%
Power Supply Rejection Ratio
Vripple = 200mV sine p-p
fripple = 217Hz
fripple = 1kHz
44
44
dB
dB
PSRR
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum
allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4889, see power derating
currents for additional information.
Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 5: Machine Model, 220 pF–240 pF discharged through all pins.
Note 6: Typicals are measured at 25˚C and represent the parametric norm.
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: For micro SMD only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a maximum of 2µA.
Note 9: Datasheet min/max specification limits are guaranteed by design, test or statistical analysis.
Note 10: All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance. The LM4889ITL demo board (views featured
in the Application Information section) has two inner layers, one for VDD and one for GND. The planes each measure 600mils x 600mils (15.24mm x 15.24mm)
and aid in spreading heat due to power dissipation within the IC.
External Components Description
(Figure 1)
Components
Functional Description
1.
Ri
Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a
high pass filter with Ci at fC= 1/(2π RiCi).
2.
Ci
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a
highpass filter with Ri at fc = 1/(2π RiCi). Refer to the section, Proper Selection of External Components,
for an explanation of how to determine the value of Ci.
3.
Rf
Feedback resistance which sets the closed-loop gain in conjunction with Ri. AVD = 2*(Rf/Ri).
4.
CS
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing
section for information concerning proper placement and selection of the supply bypass capacitor.
5.
CB
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External
Components, for information concerning proper placement and selection of CB.
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4
THD+N vs Frequency
at VDD = 3.3V, 8Ω RL, and PWR = 150mW
THD+N vs Frequency
at VDD = 5V, 8Ω RL, and PWR = 250mW
20035837
20035838
THD+N vs Frequency
at VDD = 2.6V, 4Ω RL, and PWR = 100mW
THD+N vs Frequency
at VDD = 2.6V, 8Ω RL, and PWR = 100mW
20035839
20035840
THD+N vs Power Out
at VDD = 3.3V, 8Ω RL, 1kHz
THD+N vs Power Out
at VDD = 5V, 8Ω RL, 1kHz
20035875
20035842
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LM4889
Typical Performance Characteristics
LM4889
Typical Performance Characteristics
(Continued)
THD+N vs Power Out
at VDD = 2.6V, 8Ω RL, 1kHz
THD+N vs Power Out
at VDD = 2.6V, 4Ω RL, 1kHz
20035843
20035844
Power Supply Rejection Ratio (PSRR) at VDD = 5V
Power Supply Rejection Ratio (PSRR) at VDD = 5V
20035845
20035873
Input terminated with 10Ω R
Input Floating
Power Supply Rejection Ratio (PSRR) at VDD = 2.6V
Power Supply Rejection Ratio (PSRR) at VDD = 3.3V
20035847
20035846
Input terminated with 10Ω R
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Input terminated with 10Ω R
6
LM4889
Typical Performance Characteristics
(Continued)
Power Dissipation vs
Output Power
VDD = 5V
Power Dissipation vs
Output Power
VDD = 3.3V
20035849
20035848
Power Dissipation vs
Output Power
VDD = 2.6V
Output Power vs
Load Resistance
20035874
20035850
Supply Current vs
Shutdown Voltage
Clipping (Dropout) Voltage vs
Supply Voltage
20035852
20035853
7
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LM4889
Typical Performance Characteristics
(Continued)
Open Loop Frequency Response
Frequency Response vs
Input Capacitor Size
20035855
20035854
Noise Floor
Power Derating Curves
(PDMAX = 670mW)
20035832
20035856
Power Derating Curves - 10 Pin LD pkg
(PDMAX = 670mW)
Power Derating Curves - 8 bump µSMD
(PDMAX = 670mW)
20035833
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20035834
8
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4889 has two operational
amplifiers internally, allowing for a few different amplifier
configurations. The first amplifier’s gain is externally configurable, while the second amplifier is internally fixed in a
unity-gain, inverting configuration. The closed-loop gain of
the first amplifier is set by selecting the ratio of Rf to Ri while
the second amplifier’s gain is fixed by the two internal 20kΩ
resistors. Figure 1 shows that the output of amplifier one
serves as the input to amplifier two which results in both
amplifiers producing signals identical in magnitude, but out
of phase by 180˚. Consequently, the differential gain for the
IC is
AVD= 2 *(Rf/Ri)
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for
low noise performance and high power supply rejection. The
capacitor location on both the bypass and power supply pins
should be as close to the device as possible. Typical applications employ a 5V regulator with 10 µF tantalum or electrolytic capacitor and a ceramic bypass capacitor which aid
in supply stability. This does not eliminate the need for
bypassing the supply nodes of the LM4889. The selection of
a bypass capacitor, especially CB, is dependent upon PSRR
requirements, click and pop performance (as explained in
the section, Proper Selection of External Components),
system cost, and size constraints.
By driving the load differentially through outputs Vo1 and
Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is
different from the classical single-ended amplifier configuration where one side of the load is connected to ground.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4889 contains a shutdown pin to externally turn off the
amplifier’s bias circuitry. This shutdown feature turns the
amplifier off when a logic low is placed on the shutdown pin.
By switching the shutdown pin to ground, the LM4889 supply
current draw will be minimized in idle mode. While the device
will be disabled with shutdown pin voltages less than
0.5VDC, the idle current may be greater than the typical
value of 0.1µA. (Idle current is measured with the shutdown
pin grounded).
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry to provide a
quick, smooth transition into shutdown. Another solution is to
use a single-pole, single-throw switch in conjunction with an
external pull-up resistor. When the switch is closed, the
shutdown pin is connected to ground and disables the amplifier. If the switch is open, then the external pull-up resistor
will enable the LM4889. This scheme guarantees that the
shutdown pin will not float thus preventing unwanted state
changes.
A bridge amplifier design has an advantage over the singleended configuration, as it provides differential drive to the
load, thus doubling output swing for a specified supply voltage. Four times the output power is possible as compared to
a single-ended amplifier under the same conditions. This
increase in attainable output power assumes that the amplifier is not current limited or clipped. In order to choose an
amplifier’s closed-loop gain without causing excessive clipping, please refer to the Audio Power Amplifier Design
section.
A bridge configuration, such as the one used in LM4889,
also creates a second advantage over single-ended amplifiers. Since the differential outputs, Vo1 and Vo2, are biased
at half-supply, no net DC voltage exists across the load. This
eliminates the need for an output coupling capacitor which is
required in a single supply, single-ended amplifier configuration. Without an output coupling capacitor, the half-supply
bias across the load would result in both increased internal
IC power dissipation and also possible loudspeaker damage.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using integrated power amplifiers is critical to optimize device
and system performance. While the LM4889 is tolerant of
external component combinations, consideration to component values must be used to maximize overall system quality.
The LM4889 is unity-gain stable which gives the designer
maximum system flexibility. The LM4889 should be used in
low gain configurations to minimize THD+N values, and
maximize the signal to noise ratio. Low gain configurations
require large input signals to obtain a given output power.
Input signals equal to or greater than 1 Vrms are available
from sources such as audio codecs. Please refer to the
section, Audio Power Amplifier Design, for a more complete explanation of proper gain selection.
Besides gain, one of the major considerations is the closedloop bandwidth of the amplifier. To a large extent, the bandwidth is dictated by the choice of external components
shown in Figure 1. The input coupling capacitor, Ci, forms a
first order high pass filter which limits low frequency response. This value should be chosen based on needed
frequency response for a few reasons.
POWER DISSIPATION
Power dissipation is a major concern when designing a
successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power
delivered to the load by a bridge amplifier is an increase in
internal power dissipation. Since the LM4889 has two operational amplifiers in one package, the maximum internal
power dissipation is 4 times that of a single-ended amplifier.
The maximum power dissipation for a given application can
be derived from the power dissipation graphs or from Equation 1.
(1)
PDMAX = 4*(VDD)2/(2π2RL)
It is critical that the maximum junction temperature TJMAX of
150˚C is not exceeded. TJMAX can be determined from the
power derating curves by using PDMAX and the PC board foil
area. By adding additional copper foil, the thermal resistance
of the application can be reduced from a free air value of
150˚C/W, resulting in higher PDMAX. Additional copper foil
can be added to any of the leads connected to the LM4889.
It is especially effective when connected to VDD, GND, and
the output pins. Refer to the application information on the
LM4889 reference design board for an example of good heat
sinking. If TJMAX still exceeds 150˚C, then additional
changes must be made. These changes can include re9
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LM4889
duced supply voltage, higher load impedance, or reduced
ambient temperature. Internal power dissipation is a function
of output power. Refer to the Typical Performance Characteristics curves for power dissipation information for different output powers and output loading.
Application Information
LM4889
Application Information
supply voltage would be (Vopeak + (VODTOP + VODBOT)), where
VODBOT and VODTOP are extrapolated from the Dropout Voltage vs Supply Voltage curve in the Typical Performance
Characteristics section.
(Continued)
SELECTION OF INPUT CAPACITOR SIZE
Large input capacitors are both expensive and space hungry
for portable designs. Clearly, a certain sized capacitor is
needed to couple in low frequencies without severe attenuation. But in many cases the speakers used in portable
systems, whether internal or external, have little ability to
reproduce signals below 100 Hz to 150 Hz. Thus, using a
large input capacitor may not increase actual system performance.
(2)
5V is a standard voltage in most applications, it is chosen for
the supply rail. Extra supply voltage creates headroom that
allows the LM4889 to reproduce peaks in excess of 1W
without producing audible distortion. At this time, the designer must make sure that the power supply choice along
with the output impedance does not violate the conditions
explained in the Power Dissipation section.
Once the power dissipation equations have been addressed,
the required differential gain can be determined from Equation 3.
In addition to system cost and size, click and pop performance is effected by the size of the input coupling capacitor,
Ci. A larger input coupling capacitor requires more charge to
reach its quiescent DC voltage (nominally 1/2 VDD). This
charge comes from the output via the feedback and is apt to
create pops upon device enable. Thus, by minimizing the
capacitor size based on necessary low frequency response,
turn-on pops can be minimized.
Besides minimizing the input capacitor size, careful consideration should be paid to the bypass capacitor value. Bypass
capacitor, CB, is the most critical component to minimize
turn-on pops since it determines how fast the LM4889 turns
on. The slower the LM4889’s outputs ramp to their quiescent
DC voltage (nominally 1/2 VDD), the smaller the turn-on pop.
Choosing CB equal to 1.0 µF along with a small value of Ci
(in the range of 0.1 µF to 0.39 µF), should produce a virtually
clickless and popless shutdown function. While the device
will function properly, (no oscillations or motorboating), with
CB equal to 0.1 µF, the device will be much more susceptible
to turn-on clicks and pops. Thus, a value of CB equal to
1.0 µF is recommended in all but the most cost sensitive
designs.
(3)
Rf/Ri = AVD/2
From Equation 3, the minimum AVD is 2.83; use AVD = 3.
Since the desired input impedance was 20 kΩ, and with a
AVD impedance of 2, a ratio of 1.5:1 of Rf to Ri results in an
allocation of Ri = 20 kΩ and Rf = 30 kΩ. The final design step
is to address the bandwidth requirements which must be
stated as a pair of −3 dB frequency points. Five times away
from a −3 dB point is 0.17 dB down from passband response
which is better than the required ± 0.25 dB specified.
AUDIO POWER AMPLIFIER DESIGN
fL = 100 Hz/5 = 20 Hz
A 1W/8Ω AUDIO AMPLIFIER
fH = 20 kHz * 5 = 100 kHz
Given:
Power Output
Load Impedance
Input Level
Input Impedance
Bandwidth
As stated in the External Components section, Ri in conjunction with Ci create a highpass filter.
1 Wrms
8Ω
1 Vrms
Ci ≥ 1/(2π*20 kΩ*20 Hz) = 0.397 µF; use 0.39 µF
20 kΩ
100 Hz–20 kHz ± 0.25 dB
The high frequency pole is determined by the product of the
desired frequency pole, fH, and the differential gain, AVD.
With a AVD = 3 and fH = 100 kHz, the resulting GBWP =
300kHz which is much smaller than the LM4889 GBWP of
2.5MHz. This calculation shows that if a designer has a need
to design an amplifier with a higher differential gain, the
LM4889 can still be used without running into bandwidth
limitations.
A designer must first determine the minimum supply rail to
obtain the specified output power. By extrapolating from the
Output Power vs Supply Voltage graphs in the Typical Performance Characteristics section, the supply rail can be
easily found. A second way to determine the minimum supply rail is to calculate the required Vopeak using Equation 2
and add the output voltage. Using this method, the minimum
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LM4889
Application Information
(Continued)
20035824
FIGURE 2. Higher Gain Audio Amplifier
The LM4889 is unity-gain stable and requires no external
components besides gain-setting resistors, an input coupling
capacitor, and proper supply bypassing in the typical application. However, if a closed-loop differential gain of greater
than 10 is required, a feedback capacitor (C4) may be
needed as shown in Figure 2 to bandwidth limit the amplifier.
This feedback capacitor creates a low pass filter that elimi-
nates possible high frequency oscillations. Care should be
taken when calculating the -3dB frequency in that an incorrect combination of R3 and C4 will cause rolloff before
20kHz. A typical combination of feedback resistor and capacitor that will not produce audio band high frequency rolloff
is R3 = 20kΩ and C4 = 25pf. These components result in a
-3dB point of approximately 320kHz.
11
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LM4889
Application Information
(Continued)
20035829
FIGURE 3. Differential Amplifier Configuration for LM4889
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LM4889
Application Information
(Continued)
20035880
FIGURE 4. Reference Design Board and Layout - micro SMD
13
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LM4889
Application Information
LM4889 micro SMD DEMO BOARD ARTWORK
(Continued)
Composite View
Silk Screen
20035886
20035881
Top Layer
Bottom Layer
20035882
20035883
Inner Layer Ground
Inner Layer VDD
20035885
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20035884
14
LM4889
Application Information
(Continued)
REFERENCE DESIGN BOARD and PCB LAYOUT GUIDELINES - MSOP & SO Boards
20035868
FIGURE 5. Reference Design Board
15
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LM4889
Application Information
(Continued)
LM4889 MSOP DEMO BOARD ARTWORK
LM4889 SO DEMO BOARD ARTWORK
Silk Screen
Silk Screen
20035877
20035876
Top Layer
Top Layer
20035866
20035863
Bottom Layer
Bottom Layer
20035867
20035864
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LM4889
Physical Dimensions
inches (millimeters) unless otherwise noted
8-Bump micro SMD
Order Number LM4889ITL, LM4889ITLX
NS Package Number TLA08AAA
X1 = 1.514 ± 0.03 X2 = 1.514 ± 0.03 X3 = 0.600 ± 0.075
MSOP
Order Number LM4889MM
NS Package Number MUA08A
17
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LM4889
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
LLP
Order Number LM4889LD
NS Package Number LDA10B
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18
LM4889 1 Watt Audio Power Amplifier
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
SO
Order Number LM4889MA
NS Package Number M08A
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