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B3B Mechanical Key Switch (Ultra-low Profile)
B3B
Ultra-low Profile Mechanical Key Switch
with a Thickness of Only 0.47 mm
Surface-mounting model with dimensions of 4.7 x
4.7 x 0.47 mm allows high-density mounting.
Contributes to making devices with this Mechanical
Key Switch more compact, slim, and lightweight.
Available on embossed tape that enables automatic mounting.
Dust-sealed construction provides high reliability.
Available for reflow soldering.
Ordering Information
Model Number Legend:
B3B-jjjjj
1
2
3
4
5
1.
Size
1: 4.7 mm x 4.7 mm
4.
Operating Force (OF)
2: 1.58 N
2.
Ground Terminal
0: None
5.
Shipment Package
P: Embossed tape
3.
Plunger
0: None
List of Models
Item
Model
Embossed tape packing (unit: 10,000 pcs.)
Note:
B3B-1002P
The Switches are available in units of 10,000 pieces. Orders must be made in units of 10,000 pieces; no partial units can be shipped.
Specifications
Ratings/Characteristics
Switching capacity
1 to 20 mA, 5 to 15 VDC, (resistive load)
Insulation voltage
30 VDC
Contact configuration
SPST-NO
Contact material
Silver plating
Contact resistance
10 Ω max. (initial value) (rated: 1 mA, 5 VDC)
Insulation resistance
100 MΩ min. (at 100 VDC)
Dielectric strength
250 VAC, 50/60 Hz for 1 min
Bounce time
10 ms max.
Vibration resistance
Malfunction: 10 to 55 Hz, 1.5-mm double amplitude
Shock resistance
Destruction: 735 m/s2 min. {approx. 75G min.}
Life expectancy
50,000 operations min.
Ambient temperature
Operating: –25°C to 70°C (with no icing)
Ambient humidity
Operating: 25% to 85%
Weight
Approx. 0.1 g max.
1
B3B
B3B
Dimensions
Note:
All units are in millimeters unless otherwise indicated.
+0.15
4.7 +0.15
–0.20
4.7
–0.20
3.5
3.5
+0.15
4.7 –0.20
R0.6
0.47 +0.15
–0.10
Terminal Arrangement
/Internal Connections
(Top View)
PCB Mounting
(Top View)
4.8
3
3
4.8
Operating Characteristics
Item
Standard value
Operating force (OF)
1.58±0.49 N {160±50 gf}
Releasing force (RF)
0.29 N {30 gf} min.
Pretravel (PT)
0.2±0.1 mm
2
B3B
B3B
Precautions
Soldering Conditions for Manual Soldering
Soldering temperature: 300±5_C at the soldering iron tip
Soldering time:
3 seconds max.
Soldering operations must be performed no more than twice including touch-up soldering. Allow at least 5 minutes between the first
and second soldering.
Do not apply flow soldering.
Soldering
Soldering Conditions for Reflow Soldering
Carry out soldering within the temperature curve shown in the following illustration.
Temperature ( C)
Washing
°
No washing is allowed after soldering to prevent detergent or flux
from entering into the Switch. Doing so may cause malfunction.
1 to 4°C/s
1 to 5°C/s
Normal
temperature
60 to 90 s
20 s
30 s
max.
Time (s)
Note:
The above heating curve will apply if the
thickness of the circuit board is 1.6 mm.
Since the peak value may vary depending on the reflow soldering
device, be sure to conduct a verification test in advance.
Tape Packing Specifications
Standard
Conforms to EIAJ Standard
Quantity
10,000 pieces
(18)
8±0.1
4±0.1
2±0.1
0.65±0.2 dia.
1.5 +0.1
–0 dia.
1.75±0.1 dia.
A
9
12±0.3
370±2 dia.
13±0.2 dia.
Reel
+0.2
5.1 –0
A
Unreeling direction
5.5±0.1
Section A-A
3
B3B
B3B
ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.
To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.
Cat. No. A110-E1-1
In the interest of product improvement, specifications are subject to change without notice.
OMRON Corporation
C&C Components Division H.Q.
Mechanical-Components Division
28th Fl., Crystal Tower Bldg.,
1-2-27, Shiromi, Chuo-ku,
Osaka 540-6028 Japan
Phone: (81)6-949-6017 Fax: (81)6-949-6134
4
Printed in Japan
0998-1M (0998) a