ETC BAV70TT1/D

BAV70TT1
Preferred Device
Advance Information
Dual Switching Diode
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MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Max
Unit
Reverse Voltage
VR
70
Vdc
Forward Current
IF
200
mAdc
IFM(surge)
500
mAdc
Symbol
Max
Unit
225
mW
Peak Forward Surge Current
ANODE
1
3
CATHODE
2
ANODE
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation,
FR–4 Board (1)
TA = 25°C
Derated above 25°C
PD
Thermal Resistance,
Junction to Ambient (1)
RθJA
Total Device Dissipation,
FR–4 Board (2)
TA = 25°C
Derated above 25°C
PD
Thermal Resistance,
Junction to Ambient (2)
Junction and Storage
Temperature Range
1.8
mW/°C
555
°C/W
360
mW
2.9
mW/°C
RθJA
345
°C/W
TJ, Tstg
–55 to
+150
°C
3
2
1
CASE 463
SOT–416/SC–75
STYLE 3
DEVICE MARKING
A4
(1) FR–4 @ Minimum Pad
(2) FR–4 @ 1.0 × 1.0 Inch Pad
ORDERING INFORMATION
Device
Package
Shipping
BAV70TT1
SOT–416
3000 / Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
 Semiconductor Components Industries, LLC, 2000
May, 2000 – Rev. 1
1
Publication Order Number:
BAV70TT1/D
BAV70TT1
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Min
Max
Unit
V(BR)
70
—
Vdc
IR1
IR2
—
—
5.0
100
µAdc
nAdc
Diode Capacitance
(VR = 0, f = 1.0 MHz)
CD
—
1.5
pF
Forward Voltage
(IF = 1.0 mAdc)
(IF = 10 mAdc)
(IF = 50 mAdc)
(IF = 150 mAdc)
VF
—
—
—
—
715
855
1000
1250
Reverse Recovery Time
(IF = IR = 10 mAdc, RL = 100 Ω, IR(REC) = 1.0 mAdc) (Figure 1)
trr
—
6.0
ns
VRF
—
1.75
V
Characteristic
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(I(BR) = 100 µAdc)
Reverse Voltage Leakage Current
(VR = 70 Vdc)
(VR = 50 Vdc)
Forward Recovery Voltage
(IF = 10 mAdc, tr = 20 ns) (Figure 2)
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2
mVdc
BAV70TT1
BAV70
RS = 50 Ω
SAMPLING
OSCILLOSCOPE
RL = 50 Ω
IF
tr
tp
I
10%
+IF
trr
10% OF
90%
VR
OUTPUT PULSE
INPUT PULSE
Figure 1. Recovery Time Equivalent Test Circuit
450 Ω
1 KΩ
RS = 50 Ω
SAMPLING
OSCILLOSCOPE
RL = 50 Ω
BAV70
I
V
90%
VFR
10%
t
tr
tp
INPUT PULSE
Figure 2.
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3
OUTPUT PULSE
t
VR
100 W
BAV70TT1
10
100
IR , REVERSE CURRENT (µA)
IF, FORWARD CURRENT (mA)
TA = 150°C
10
TA = 85°C
TA = 25°C
1.0
TA = – 40°C
TA = 125°C
1.0
TA = 85°C
0.1
TA = 55°C
0.01
TA = 25°C
0.001
0.1
0.2
0.4
0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)
0
1.2
10
Figure 3. Forward Voltage
20
30
40
VR, REVERSE VOLTAGE (VOLTS)
50
Figure 4. Leakage Current
CD, DIODE CAPACITANCE (pF)
1.0
0.9
0.8
0.7
0.6
0
2
4
6
8
VR, REVERSE VOLTAGE (VOLTS)
r(t), NORMALIZED TRANSIENT THERMAL RESISTANCE
Figure 5. Capacitance
1.0
D = 0.5
0.1
0.2
0.1
0.05
0.02
0.01
0.01
SINGLE PULSE
0.001
0.00001
0.0001
0.001
0.01
0.1
1.0
t, TIME (s)
Figure 6. Normalized Thermal Response
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4
10
100
1000
BAV70TT1
INFORMATION FOR USING THE SOT-416 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
ÉÉÉ
ÉÉÉ ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ ÉÉÉ
ÉÉÉ
ÉÉÉ
Unit: mm
0.5 min. (3x)
1
TYPICAL
SOLDERING PATTERN
0.5
0.5 min. (3x)
1.4
SOT–416/SC–75 POWER DISSIPATION
The power dissipation of the SOT–416/SC–75 is a
function of the pad size. This can vary from the minimum
pad size for soldering to the pad size given for maximum
power dissipation. Power dissipation for a surface mount
device is determined by TJ(max), the maximum rated
junction temperature of the die, RθJA, the thermal
resistance from the device junction to ambient; and the
operating temperature, TA. Using the values provided on
the data sheet, PD can be calculated as follows.
PD =
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 225 milliwatts.
PD =
150°C – 25°C
555°C/W
= 225 milliwatts
The 555°C/W assumes the use of the recommended
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 225 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad. Using a board material such
as Thermal Clad, a higher power dissipation can be
achieved using the same footprint.
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
SOLDERING PRECAUTIONS
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10°C.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
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BAV70TT1
SOLDER STENCIL GUIDELINES
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
TYPICAL SOLDER HEATING PROFILE
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure NO TAG shows a typical heating
profile for use when soldering a surface mount device to a
printed circuit board. This profile will vary among
soldering systems but it is a good starting point. Factors that
can affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
STEP 1
PREHEAT
ZONE 1
“RAMP”
200°C
STEP 2
STEP 3
VENT
HEATING
“SOAK” ZONES 2 & 5
“RAMP”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
STEP 5
STEP 4
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
“SPIKE”
“SOAK”
STEP 6 STEP 7
VENT COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
170°C
160°C
150°C
150°C
140°C
100°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TMAX
TIME (3 TO 7 MINUTES TOTAL)
Figure 7. Typical Solder Heating Profile
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BAV70TT1
PACKAGE DIMENSIONS
SC–75 (SC–90, SOT–416)
CASE 463–01
ISSUE B
–A–
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
2
3
D 3 PL
0.20 (0.008)
G –B–
1
M
B
K
J
DIM
A
B
C
D
G
H
J
K
L
S
0.20 (0.008) A
C
L
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
MILLIMETERS
MIN
MAX
0.70
0.80
1.40
1.80
0.60
0.90
0.15
0.30
1.00 BSC
–––
0.10
0.10
0.25
1.45
1.75
0.10
0.20
0.50 BSC
H
STYLE 2:
PIN 1. ANODE
2. N/C
3. CATHODE
STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE
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7
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
INCHES
MIN
MAX
0.028
0.031
0.055
0.071
0.024
0.035
0.006
0.012
0.039 BSC
–––
0.004
0.004
0.010
0.057
0.069
0.004
0.008
0.020 BSC
BAV70TT1
Thermal Clad is a trademark of the Bergquist Company.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
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Sales Representative.
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BAV70TT1/D