ETC BC847BTT1/D

BC847BTT1, BC847CTT1
Advance Information
General Purpose
Transistors
NPN Silicon
http://onsemi.com
These transistors are designed for general purpose amplifier
applications. They are housed in the SOT–416/SC–75 package which
is designed for low power surface mount applications.
COLLECTOR
3
• Device Marking:
BC847BTT1 = 1F
BC847CTT1 = 1G
1
BASE
2
EMITTER
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Max
Unit
Collector–Emitter Voltage
VCEO
45
V
Collector–Base Voltage
VCBO
50
V
Emitter–Base Voltage
VEBO
6.0
V
IC
100
mAdc
Symbol
Max
Unit
200
mW
1.6
mW/°C
600
°C/W
Collector Current – Continuous
3
2
1
CASE 463
SOT–416/SC–75
STYLE 1
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation,
FR–4 Board (1)
TA = 25°C
Derated above 25°C
PD
Thermal Resistance,
Junction to Ambient (1)
RθJA
Total Device Dissipation,
FR–4 Board (2)
TA = 25°C
Derated above 25°C
PD
Thermal Resistance,
Junction to Ambient (2)
Junction and Storage
Temperature Range
DEVICE MARKING
See Table
300
mW
2.4
mW/°C
RθJA
400
°C/W
TJ, Tstg
–55 to
+150
°C
ORDERING INFORMATION
Device
(1) FR–4 @ Minimum Pad
(2) FR–4 @ 1.0 × 1.0 Inch Pad
Package
Shipping
BC847BTT1
SOT–416
3000 / Tape & Reel
BC847CTT1
SOT–416
3000 / Tape & Reel
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
 Semiconductor Components Industries, LLC, 2000
May, 2000 – Rev. 1
1
Publication Order Number:
BC847BTT1/D
BC847BTT1, BC847CTT1
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
45
—
—
50
—
—
50
—
—
6.0
—
—
—
—
—
—
15
5.0
BC847B
BC847C
—
—
150
270
—
—
BC847B
BC847C
200
420
290
520
450
800
Characteristic
Unit
OFF CHARACTERISTICS
Collector – Emitter Breakdown Voltage
(IC = 10 mA)
BC847 Series
V(BR)CEO
Collector – Emitter Breakdown Voltage
(IC = 10 µA, VEB = 0)
BC847 Series
Collector – Base Breakdown Voltage
(IC = 10 mA)
BC847 Series
Emitter – Base Breakdown Voltage
(IE = 1.0 mA)
BC847 Series
V
V(BR)CES
V
V(BR)CBO
V
V(BR)EBO
Collector Cutoff Current (VCB = 30 V)
(VCB = 30 V, TA = 150°C)
ICBO
V
nA
µA
ON CHARACTERISTICS
DC Current Gain
(IC = 10 µA, VCE = 5.0 V)
(IC = 2.0 mA, VCE = 5.0 V)
hFE
—
Collector – Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA)
Collector – Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA)
VCE(sat)
—
—
—
—
0.25
0.6
V
Base – Emitter Saturation Voltage (IC = 10 mA, IB = 0.5 mA)
Base – Emitter Saturation Voltage (IC = 100 mA, IB = 5.0 mA)
VBE(sat)
—
—
0.7
0.9
—
—
V
Base – Emitter Voltage (IC = 2.0 mA, VCE = 5.0 V)
Base – Emitter Voltage (IC = 10 mA, VCE = 5.0 V)
VBE(on)
580
—
660
—
700
770
mV
fT
100
—
—
MHz
Cobo
—
—
4.5
SMALL– SIGNAL CHARACTERISTICS
Current – Gain — Bandwidth Product
(IC = 10 mA, VCE = 5.0 Vdc, f = 100 MHz)
Output Capacitance (VCB = 10 V, f = 1.0 MHz)
Noise Figure (IC = 0.2 mA,
VCE = 5.0 Vdc, RS = 2.0 kΩ,
f = 1.0 kHz, BW = 200 Hz)
NF
BC847B
BC847C
—
—
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2
pF
dB
—
—
10
4.0
BC847BTT1, BC847CTT1
1.0
VCE = 10 V
TA = 25°C
1.5
TA = 25°C
0.9
0.8
V, VOLTAGE (VOLTS)
hFE , NORMALIZED DC CURRENT GAIN
2.0
1.0
0.8
0.6
0.4
VBE(sat) @ IC/IB = 10
0.7
VBE(on) @ VCE = 10 V
0.6
0.5
0.4
0.3
0.2
0.3
VCE(sat) @ IC/IB = 10
0.1
0.2
0.2
0.5
50
1.0
20
2.0
5.0 10
IC, COLLECTOR CURRENT (mAdc)
100
0
0.1
200
Figure 1. Normalized DC Current Gain
1.0
θVB, TEMPERATURE COEFFICIENT (mV/ °C)
VCE , COLLECTOR–EMITTER VOLTAGE (V)
TA = 25°C
1.6
IC = 200 mA
1.2
IC = IC = IC = 50 mA
10 mA 20 mA
IC = 100 mA
0.8
0.4
0.02
10
0.1
1.0
IB, BASE CURRENT (mA)
–55°C to +125°C
1.2
1.6
2.0
2.4
2.8
20
10
1.0
IC, COLLECTOR CURRENT (mA)
0.2
Figure 3. Collector Saturation Region
r(t), NORMALIZED TRANSIENT THERMAL RESISTANCE
50 70 100
Figure 2. “Saturation” and “On” Voltages
2.0
0
0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30
IC, COLLECTOR CURRENT (mAdc)
100
Figure 4. Base–Emitter Temperature Coefficient
1.0
D = 0.5
0.1
0.2
0.1
0.05
0.02
0.01
0.01
SINGLE PULSE
0.001
0.00001
0.0001
0.001
0.01
0.1
1.0
t, TIME (s)
Figure 5. Normalized Thermal Response
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3
10
100
1000
BC847BTT1, BC847CTT1
f T, CURRENT–GAIN – BANDWIDTH PRODUCT (MHz)
BC847
10
C, CAPACITANCE (pF)
7.0
TA = 25°C
5.0
Cib
3.0
Cob
2.0
1.0
0.4 0.6 0.8 1.0
4.0 6.0 8.0 10
2.0
VR, REVERSE VOLTAGE (VOLTS)
40
20
400
300
200
VCE = 10 V
TA = 25°C
100
80
60
40
30
20
0.5 0.7
Figure 6. Capacitances
1.0
2.0 3.0
5.0 7.0 10
20
IC, COLLECTOR CURRENT (mAdc)
30
50
Figure 7. Current–Gain – Bandwidth Product
TA = 25°C
VCE = 5 V
TA = 25°C
0.8
V, VOLTAGE (VOLTS)
hFE , DC CURRENT GAIN (NORMALIZED)
1.0
2.0
1.0
0.5
VBE(sat) @ IC/IB = 10
0.6
VBE @ VCE = 5.0 V
0.4
0.2
0.2
VCE(sat) @ IC/IB = 10
0
10
100
1.0
IC, COLLECTOR CURRENT (mA)
0.1 0.2
0.2
0.5
2.0
50
100
200
50
100
200
–1.0
TA = 25°C
1.6
20 mA
50 mA
100 mA
200 mA
1.2
IC =
10 mA
0.8
0.4
0
10 20
2.0
5.0
IC, COLLECTOR CURRENT (mA)
Figure 9. “On” Voltage
θVB, TEMPERATURE COEFFICIENT (mV/ °C)
VCE , COLLECTOR–EMITTER VOLTAGE (VOLTS)
Figure 8. DC Current Gain
1.0
0.02
0.05
0.1
0.2
0.5
1.0 2.0
IB, BASE CURRENT (mA)
5.0
10
20
–1.4
–1.8
θVB for VBE
–55°C to 125°C
–2.2
–2.6
–3.0
0.2
Figure 10. Collector Saturation Region
0.5
10 20
5.0
1.0 2.0
IC, COLLECTOR CURRENT (mA)
Figure 11. Base–Emitter Temperature Coefficient
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4
BC847BTT1, BC847CTT1
INFORMATION FOR USING THE SOT-416 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
ÉÉÉ
ÉÉÉ ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ ÉÉÉ
ÉÉÉ
ÉÉÉ
Unit: mm
0.5 min. (3x)
1
TYPICAL
SOLDERING PATTERN
0.5
0.5 min. (3x)
1.4
SOT–416/SC–75 POWER DISSIPATION
The power dissipation of the SOT–416/SC–75 is a
function of the pad size. This can vary from the minimum
pad size for soldering to the pad size given for maximum
power dissipation. Power dissipation for a surface mount
device is determined by TJ(max), the maximum rated
junction temperature of the die, RθJA, the thermal
resistance from the device junction to ambient; and the
operating temperature, TA. Using the values provided on
the data sheet, PD can be calculated as follows.
PD =
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 200 milliwatts.
PD =
150°C – 25°C
600°C/W
= 200 milliwatts
The 600°C/W assumes the use of the recommended
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 200 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad. Using a board material such
as Thermal Clad, a higher power dissipation can be
achieved using the same footprint.
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
SOLDERING PRECAUTIONS
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10°C.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
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5
BC847BTT1, BC847CTT1
SOLDER STENCIL GUIDELINES
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
TYPICAL SOLDER HEATING PROFILE
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure NO TAG shows a typical heating
profile for use when soldering a surface mount device to a
printed circuit board. This profile will vary among
soldering systems but it is a good starting point. Factors that
can affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
STEP 1
PREHEAT
ZONE 1
“RAMP”
200°C
STEP 2
STEP 3
VENT
HEATING
“SOAK” ZONES 2 & 5
“RAMP”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
STEP 5
STEP 4
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
“SPIKE”
“SOAK”
STEP 6 STEP 7
VENT COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
170°C
160°C
150°C
150°C
140°C
100°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TMAX
TIME (3 TO 7 MINUTES TOTAL)
Figure 12. Typical Solder Heating Profile
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BC847BTT1, BC847CTT1
PACKAGE DIMENSIONS
SC–75 (SC–90, SOT–416)
CASE 463–01
ISSUE B
–A–
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
2
3
D 3 PL
0.20 (0.008)
G –B–
1
M
B
K
J
DIM
A
B
C
D
G
H
J
K
L
S
0.20 (0.008) A
C
L
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
MILLIMETERS
MIN
MAX
0.70
0.80
1.40
1.80
0.60
0.90
0.15
0.30
1.00 BSC
–––
0.10
0.10
0.25
1.45
1.75
0.10
0.20
0.50 BSC
H
STYLE 2:
PIN 1. ANODE
2. N/C
3. CATHODE
STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE
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7
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. ANODE
INCHES
MIN
MAX
0.028
0.031
0.055
0.071
0.024
0.035
0.006
0.012
0.039 BSC
–––
0.004
0.004
0.010
0.057
0.069
0.004
0.008
0.020 BSC
BC847BTT1, BC847CTT1
Thermal Clad is a trademark of the Bergquist Company.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
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attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
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BC847BTT1/D