ETC CS5207-3/D

CS5207-3
7.0 A, 3.3 V Fixed Linear
Regulator
The CS5207–3 linear regulator provides 7.0 A @ 3.3 V with an
accuracy of ±2.0 %.
The regulator is intended for use as post regulator and
microprocessor supply. The fast loop response and low dropout
voltage make these regulators ideal for applications where low voltage
operation and good transient response are important.
The circuit is designed to operate with dropout voltages as low as 1.0 V
depending on the output current level. The maximum quiescent current is
only 10 mA at full load.
The regulator is fully protected against overload conditions with
protection circuitry for Safe Operating Area (SOA), overcurrent and
thermal shutdown.
The CS5207–3 is available in TO–220 and surface mount D2 packages.
Features
• Output Current to 7.0 A
• Output Voltage Trimmed to ±2.0%
• Dropout Voltage 1.4 V @ 7.0 A
• Fast Transient Response
• Fault Protection Circuitry
– Thermal Shutdown
– Overcurrent Protection
– Safe Area Protection
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TO–220
THREE LEAD
T SUFFIX
CASE 221A
1
12
2
Tab = VOUT
Pin 1. GND
2. VOUT
3. VIN
3
D2PAK
3–PIN
D2T SUFFIX
CASE 418E
3
MARKING DIAGRAMS
D2PAK
TO–220
CS5207–3
AWLYWW
CS5207–3
AWLYWW
VOUT
1
VIN
1
A
WL, L
YY, Y
WW, W
Output
Current
Limit
Thermal
Shutdown
ORDERING INFORMATION
– + Error
Amplifier
Device
Bandgap
GND
Figure 1. Block Diagram
 Semiconductor Components Industries, LLC, 2001
March, 2001 – Rev. 3
= Assembly Location
= Wafer Lot
= Year
= Work Week
Package
Shipping
CS5207–3GT3
TO–220*
50 Units/Rail
CS5207–3GDP3
D2PAK*
50 Units/Rail
CS5207–3GDPR3
D2PAK*
750 Tape & Reel
*TO–220 are all 3–pin, straight leaded. D2PAK are all
3–pin.
1
Publication Order Number:
CS5207–3/D
CS5207–3
ABSOLUTE MAXIMUM RATINGS*
Parameter
Supply Voltage, VCC
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature Soldering:
Wave Solder (through hole styles only) Note 1.
Reflow (SMD styles only) Note 2.
Value
Unit
17
V
–40 to +70
°C
150
°C
–60 to +150
°C
260 Peak
230 Peak
°C
°C
1. 10 second maximum.
2. 60 second maximum above 183°C
*The maximum package power dissipation must be observed.
ELECTRICAL CHARACTERISTICS (CIN = 10 µF, COUT = 22 µF Tantalum, VIN – VOUT = 3.0 V, VIN ≤ 15 V, 0°C ≤ TA ≤ 70°C,
TJ ≤ +150°C, unless otherwise specified, Ifull load = 7.0 A)
Characteristic
Test Conditions
Min
Typ
Max
Unit
3.234
(–2.0%)
3.300
3.366
(+2.0%)
V
3.3 V Fixed Output Voltage
Output Voltage (Notes 3. and 4.)
VIN – VOUT = 1.6 V;
10 mA ≤ IOUT ≤ 7.0 A
Line Regulation
1.6 V ≤ VIN – VOUT ≤ 6.0 V; IOUT = 10 mA
–
0.04
0.20
%
Load Regulation (Notes 3. and 4.)
VIN – VOUT = 1.6 V; 10 mA ≤ IOUT ≤ 7.0 A
–
0.13
0.5
%
Dropout Voltage (Note 5.)
IOUT = 7.0 A
–
1.4
1.55
V
Current Limit
VIN – VOUT = 3.0 V; TJ ≥ 25°C
VIN – VOUT = 9.0 V
7.1
–
8.5
1.0
–
–
A
A
Quiescent Current
VIN ≤ 9.0 V; IOUT = 10 mA
–
5.0
10
mA
Thermal Regulation
30 ms Pulse, TA = 25°C
–
0.003
–
%W
Ripple Rejection
f = 120 Hz; IOUT = 7.0 A
–
80
–
dB
–
–
0.5
–
%
–
0.003
–
%VOUT
Temperature Stability
RMS Output Noise (%VOUT)
10 Hz ≤ f ≤ 10 kHz; TA = 25°C
Thermal Shutdown
–
150
180
–
°C
Thermal Shutdown Hysteresis
–
–
25
–
°C
3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output
voltage due to thermal gradients or temperature changes must be taken into account seperately.
4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package.
5. Dropout voltage is a measurement of the minimum input/output differential at full load.
PACKAGE PIN DESCRIPTION
Package Pin Number
TO–220
D2PAK
Pin Symbol
1
1
GND
Ground connection.
2
2
VOUT
Regulated output voltage (case).
3
3
VIN
Function
Input voltage.
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2
CS5207–3
0.10
1.55
1.50
1.45
1.40
1.35
1.30
1.25
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
0.70
0.08
Output Voltage Deviation (%)
Dropout Voltage (V)
TYPICAL PERFORMANCE CHARACTERISTICS
TCASE = 0°C
TCASE = 25°C
TCASE = 125°C
0.06
0.04
0.02
0.00
–0.02
–0.04
–0.06
–0.08
–0.10
–0.12
0
1
2
3
4
5
6
7
0
TJ (°C)
Figure 2. Dropout Voltage vs. Output
Current
Figure 3. Output Voltage vs. Temperature
100
0.200
90
0.175
TCASE = 125°C
80
0.150
Ripple Rejection (dB)
Output Voltage Deviation (%)
10 20 30 40 50 60 70 80 90 100 110 120 130
Output Current (A)
0.125
TCASE = 25°C
0.100
0.075
0.050
70
60
50
40
30
20
TCASE = 0°C
0.025
TCASE = 25°C
IOUT = 7.0 A
(VIN – VOUT) = 3.0 V
VRIPPLE = 1.6 VPP
10
0.000
0
1
2
3
4
5
6
0
101
7
102
103
104
Frequency (Hz)
Output Current (A)
Figure 4. Load Regulation vs.
Output Current
Figure 5. Ripple Rejection vs. Frequency
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3
105
CS5207–3
APPLICATIONS INFORMATION
Protection Diodes
The CS5207–3 linear regulator provides a fixed 3.3 V
output currents up to 7.0 A. The regulator is protected
against short circuit, and includes thermal shutdown and
safe area protection (SOA) circuitry. The SOA protection
circuitry decreases the maximum available output current as
the input–output differential voltage increase.
The CS5207–3 has a composite PNP–NPN output
transistor and requires an output capacitor for stability. A
detailed procedure for selecting this capacitor is included in
the Stability Considerations section.
When large external capacitors are used with a linear
regulator it is sometimes necessary to add protection diodes.
If the input voltage of the regulator gets shorted, the output
capacitor will discharge into the output of the regulator. The
discharge current depends on the value of the capacitor, the
output voltage and the rate at which VIN drops. In the
CS5207–3 regulator, the discharge path is through a large
junction and protection diodes are not usually needed. If the
regulator is used with large values of output capacitance and
the input voltage is instantaneously shorted to ground,
damage can occur. In this case, a diode connected as shown
in Figure 6 is recommended.
Stability Considerations
The output or compensation capacitor helps determine
three main characteristics of a linear regulator: start–up
delay, load transient response, and loop stability.
The capacitor value and type is based on cost, availability,
size and temperature constraints. A tantalum or aluminum
electrolytic capacitor is best, since a film or ceramic
capacitor with almost zero ESR can cause instability. The
aluminum electrolytic capacitor is the least expensive
solution. However, when the circuit operates at low
temperatures, both the value and ESR of the capacitor will
vary considerably. The capacitor manufacturer’s data sheet
provides this information.
A 22 µF tantalum capacitor will work for most
applications, but with high current regulators such as the
CS5207–3 the transient response and stability improve with
higher values of capacitance. The majority of applications
for this regulator involve large changes in load current so the
output capacitor must supply the instantaneous load current.
The ESR of the output capacitor causes an immediate drop
in output voltage given by:
IN4002 (Optional)
VIN
VOUT
VIN
VOUT
CS5207–3
C1
C2
GND
Figure 6. Protection Diode Scheme for Fixed
Output Regulator
Output Voltage Sensing
Since the CS5207–3 is a three terminal regulator, it is not
possible to provide true remote load sensing. Load
regulation is limited by the resistance of the conductors
connecting the regulator to the load.
Best load regulation occurs when the regulator is
connected to the load as shown in Figure 7.
V I ESR
For microprocessor applications it is customary to use an
output capacitor network consisting of several tantalum and
ceramic capacitors in parallel. This reduces the overall ESR
and reduces the instantaneous output voltage drop under
transient load conditions. The output capacitor network
should be as close to the load as possible for the best results.
VIN
VIN
VOUT
RC
Conductor Parasitic
Resistance
CS5207–3
RLOAD
Figure 7. Grounding Scheme for the Output
Regulator to Minimize Parasitics
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4
CS5207–3
Calculating Power Dissipation and Heat Sink
Requirements
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment has a thermal resistance. Like series
electrical resistances, these resistances are summed to
determine RΘJA, the total thermal resistance between the
junction and the surrounding air.
1. Thermal Resistance of the junction to case, RΘJC
(°C/W)
2. Thermal Resistance of the case to Heat Sink, RΘCS
(°C/W)
3. Thermal Resistance of the Heat Sink to the ambient
air, RΘSA (°C/W)
These are connected by the equation:
The CS5207–3 linear regulator includes thermal
shutdown and safe operating area circuitry to protect the
device. High power regulators such as these usually operate
at high junction temperatures so it is important to calculate
the power dissipation and junction temperatures accurately
to ensure that an adequate heat sink is used.
The case is connected to VOUT on the CS5207–3,
electrical isolation may be required for some applications.
Thermal compound should always be used with high current
regulators such as these.
The thermal characteristics of an IC depend on the
following four factors:
1.
2.
3.
4.
Maximum Ambient Temperature TA (°C)
Power dissipation PD (Watts)
Maximum junction temperature TJ (°C)
Thermal resistance junction to ambient RΘJA (°C/W)
RJA RJC RCS RSA
The value for RΘJA is calculated using equation (3) and
the result can be substituted in equation (1).
RΘJC is 1.6°C/Watt for the CS5207–3. For a high current
regulator such as the CS5207–3 the majority of the heat is
generated in the power transistor section. The value for
RΘSA depends on the heat sink type, while RΘCS depends on
factors such as package type, heat sink interface (is an
insulator and thermal grease used?), and the contact area
between the heat sink and the package. Once these
calculations are complete, the maximum permissible value
of RΘJA can be calculated and the proper heat sink selected.
For further discussion on heat sink selection, see application
note “Thermal Management for Linear Regulators,”
document number SR006AN/D, available through the
Literature Distribution Center or via our website at
http://onsemi.com.
These four are related by the equation
TJ TA PD RJA
(3)
(1)
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type.
The maximum power dissipation for a regulator is:
PD(max) {VIN(max) VOUT(min)}IOUT(max) VIN(max)IQ
(2)
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current, for the
application
IQ is the maximum quiescent current at IOUT(max).
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5
CS5207–3
PACKAGE DIMENSIONS
TO–220
THREE LEAD
T SUFFIX
CASE 221A–09
ISSUE AA
SEATING
PLANE
–T–
B
C
F
T
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
1 2 3
U
H
K
Z
L
R
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
J
G
D
N
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.147
0.095
0.105
0.110
0.155
0.018
0.025
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
----0.080
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
3.73
2.42
2.66
2.80
3.93
0.46
0.64
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
----2.04
D2PAK
3–PIN
DP SUFFIX
CASE 418E–01
ISSUE O
–T– SEATING
PLANE
B
M
C
E
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
A
1
2
3
K
F
H
G
D
0.13 (0.005)
M
3 PL
T B
J
L
M
N
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6
INCHES
MIN
MAX
0.326
0.336
0.396
0.406
0.170
0.180
0.026
0.036
0.045
0.055
0.090
0.110
0.100 BSC
0.098
0.108
0.018
0.025
0.204
0.214
0.045
0.055
0.055
0.066
0.000
0.004
MILLIMETERS
MIN
MAX
8.28
8.53
10.05
10.31
4.31
4.57
0.66
0.91
1.14
1.40
2.29
2.79
2.54 BSC
2.49
2.74
0.46
0.64
5.18
5.44
1.14
1.40
1.40
1.68
0.00
0.10
CS5207–3
PACKAGE THERMAL DATA
Parameter
TO–220
THREE LEAD
D2PAK
3–PIN
Unit
RΘJC
Typical
1.6
1.6
°C/W
RΘJA
Typical
50
10–50*
°C/W
* Depending on thermal properties of substrate. RΘJA = RΘJC + RΘCA
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7
CS5207–3
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are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without
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CS5207–3/D