ETC CS8101/D

CS8101
Micropower 5.0 V, 100 mA
Low Dropout Linear
Regulator with RESET
and ENABLE
The CS8101 is a precision 5.0 V micropower voltage regulator with
very low quiescent current (70 µA typ at 100 µA load). The 5.0 V
output is accurate within ±2.0% and supplies 100 mA of load current
with a typical dropout voltage of only 400 mV. Microprocessor control
logic includes an ENABLE input and an active RESET. This
combination of low quiescent current, outstanding regulator
performance and control logic makes the CS8101 ideal for any battery
operated, microprocessor controlled equipment.
The active RESET circuit includes hysteresis, and operates
correctly at an output voltage as low as 1.0 V. The RESET function is
activated during the power up sequence or during normal operation if
the output voltage drops outside the regulation limits by more than
200 mV typ. The logic level compatible ENABLE input allows the user
to put the regulator into a shutdown mode where it draws only 20 µA
typical of quiescent current.
The regulator is protected against reverse battery, short circuit, over
voltage, and thermal overload conditions. The device can withstand
load dump transients making it suitable for use in automotive
environments.
The CS8101 is functionally equivalent to the National
Semiconductor LP2951 series low current regulators.
Features
• 5.0 V ±2.0% Output
• Low 70 µA Quiescent Current
• Active RESET
• ENABLE Input for ON/OFF and Active/Sleep Mode Control
• 100 mA Output Current Capability
• Fault Protection
– +60 V Peak Transient Voltage
– –15 V Reverse Voltage Short Circuit Thermal Overload
• Low Reverse Current (Output to Input)
• Internally Fused Leads Available in SO–20L Package
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TO–220
FIVE LEAD
T SUFFIX
CASE 314D
1
5
TO–220
FIVE LEAD
TVA SUFFIX
CASE 314K
1
TO–220
FIVE LEAD
THA SUFFIX
CASE 314A
1
5
SO–20L
DWF SUFFIX
CASE 751D
20
1
8
1
SO–8
D SUFFIX
CASE 751
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 9 of this data sheet.
 Semiconductor Components Industries, LLC, 2001
April, 2001 – Rev. 13
1
Publication Order Number:
CS8101/D
CS8101
PIN CONNECTIONS
TO–220 5 LEAD
Pin 1. VOUT
2. ENABLE
3. GND
4. RESET
5. VIN
Tab = GND
VOUT
1
SO–8
VOUTSense
ENABLE
8
ENABLE
NC
NC
GND
GND
GND
GND
NC
NC
RESET
VIN
NC
NC
GND
RESET
1
1 SO–20L 20
VOUT
VIN
NC
GND
GND
GND
GND
NC
NC
NC
VOUT
VIN
Current Source
(Circuit Bias)
Over Voltage
Shutdown
Internally
connected
on 5 lead
TO–220
ENABLE
Current Limit
Sense
+
–
Error
Amplifier
VOUT
Sense
Thermal
Protection
Bandgap
Reference
RESET
+
–
Reset
Comparator
GND
Figure 1. Block Diagram
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CS8101
ABSOLUTE MAXIMUM RATINGS*
Rating
Value
Unit
Internally Limited
–
–15, 60
V
Internally Limited
–
2.0
kV
Operating Temperature
–40 to +125
°C
Junction Temperature Range
–40 to +150
°C
Storage Temperature Range
–55 to +150
°C
260 peak
230 peak
°C
°C
Power Dissipation
Peak Transient Voltage (46 V Load Dump @ VIN = 14 V)
Output Current
ESD Susceptibility (Human Body Model)
Lead Temperature Soldering:
Wave Solder (through hole styles only) (Note 1.)
Reflow (SMD styles only) (Note 2.)
1. 10 second maximum.
2. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
ELECTRICAL CHARACTERISTICS (6.0 V ≤ VIN ≤ 26 V; IOUT = 1.0 mA; –40 ≤ TA ≤ 125, –40°C ≤ TJ ≤ 150°C,
unless otherwise noted.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
Output Voltage, VOUT
9.0 V < VIN < 16 V, 100 µA ≤ IOUT ≤ 100 mA
6.0 V < VIN < 26 V, 100 µA ≤ IOUT ≤ 100 mA
4.90
4.85
5.00
5.00
5.10
5.15
V
V
Dropout Voltage (VIN – VOUT)
IOUT = 100 mA
IOUT = 100 µA
–
–
400
100
600
150
mV
mV
Load Regulation
VIN = 14 V, 100 µA ≤ IOUT ≤ 100 mA
–
5.0
50
mV
Line Regulation
6.0 < V < 26 V, IOUT = 1.0 mA
–
5.0
50
mV
Quiescent Current, (IQ) Active Mode
IOUT = 100 µA, VIN = 6.0 V
IOUT = 50 mA
IOUT = 100 mA
–
–
–
70
4.0
12
140
6.0
20
µA
mA
mA
Quiescent Current, (IQ) Sleep Mode
VOUT = OFF, VIN = 6.0 V, VENABLE = 2.0 V
–
20
50
µA
Ripple Rejection
7.0 ≤ VIN ≤ 17 V, IOUT = 100 mA, f = 120 Hz
60
75
–
dB
–
105
200
–
mA
25
125
–
mA
150
180
–
°C
Output Stage
Current Limit
Short Circuit Output Current
VOUT = 0 V
Thermal Shutdown
–
Overvoltage Shutdown
VOUT ≤ 1.0 V
30
34
38
V
Reverse Current
VOUT = 5.0 V, VIN = 0 V
–
100
200
µA
–
0.6
1.4
1.4
2.0
–
V
V
–
30
100
µA
ENABLE Input (ENABLE)
Threshold
HIGH
LOW
(VOUT OFF)
(VOUT ON)
Input Current
VENABLE = 2.4 V
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CS8101
ELECTRICAL CHARACTERISTICS (continued) (6.0 V ≤ VIN ≤ 26 V; IOUT = 1.0 mA; –40 ≤ TA ≤ 125, –40°C ≤ TJ ≤ 150°C,
unless otherwise noted.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
4.525
4.500
4.75
4.70
VOUT – 0.05
VOUT – 0.075
V
V
Reset Functions (RESET)
RESET Threshold
HIGH (VRH)
LOW (VRL)
VOUT Increasing
VOUT Decreasing
RESET Hysteresis
(HIGH – LOW)
25
50
100
mV
Reset Output Leakage
RESET = HIGH
VOUT ≥ VRH
–
–
25
µA
1.0 V ≤ VOUT ≤ VRL, RRESET = 10 k
VOUT, Power up, Power down, RRESET = 10 k
–
–
0.1
0.6
0.4
1.0
V
V
Output Voltage
Low (VRLO)
Low (VRPEAK)
PACKAGE LEAD DESCRIPTION
PACKAGE LEAD #
TO–220
5 LEAD
SO–20L
SO–8
LEAD SYMBOL
1
20
1
VOUT
–
–
2
VOUTSENSE
2
1
3
ENABLE
3
4, 5, 6, 7
14, 15, 16, 17
4
GND
4
10
5
RESET
–
2, 3, 8, 9, 11,
12, 13, 18
6,7
NC
No Connection.
5
19
8
VIN
Input voltage.
FUNCTION
5.0 V, ±2.0%, 100 mA output.
Kelvin connection which allows remote sensing of output voltage
for improved regulation. If remote sensing is not required, connect to VOUT.
Logic level switches output off when toggled HIGH.
Ground. All GND leads must be connected to Ground.
Active reset (accurate to VOUT ≥ 1.0 V)
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CS8101
TYPICAL PERFORMANCE CHARACTERISTICS
0.6
0.5
Dropout Voltage
125C
0.4
25°C
0.3
–40°C
0.2
0.1
0
0
10
20
30
40
50
60
70
80
90
100
Load (mA)
Figure 2. CS8101 Dropout Voltage vs. Load Over Temperature
CIRCUIT DESCRIPTION
VOLTAGE REFERENCE AND OUTPUT CIRCUITRY
For 7.0 V < VIN < 26 V
Output Stage Protection
The output stage is protected against overvoltage, short
circuit and thermal runaway conditions (Figure 3).
VIN
ENABLE
VIN(H)
> 30 V
VRH
VIN
VOUT
VOUT
VRL
(1)
VRPEAK
(2)
VRPEAK
VRLO
RESET
IOUT
(1) = No Reset Delay Capacitor
(2) = With Reset Delay Capacitor
Load
Dump
Current
Limit
Short
Circuit
Figure 4. Circuit Waveform
Figure 3. Typical Circuit Waveforms for Output
Stage Protection
ENABLE Function
The ENABLE function switches the output transistor ON
and OFF. When the voltage on the ENABLE lead exceeds
1.4 V typ, the output pass transistor turns off, leaving a high
impedance facing the load. The IC will remain in Sleep
mode, drawing only 50 µA, until the voltage on this input
drops below the ENABLE threshold.
If the input voltage rises above 30 V (e.g. load dump), the
output shuts down. This response protects the internal
circuitry and enables the IC to survive unexpected voltage
transients.
Should the junction temperature of the power device
exceed 180°C (typ) the load current capability is reduced
thereby preventing thermal overload. This thermal
management function is an effective means to prevent die
overheating since the load current is the principle heat
source in the IC.
RESET Function
A RESET signal (low voltage) is generated as the IC
powers up until VOUT is within 250 mV of the regulated
output voltage, or when VOUT drops out of regulation, and
is lower than 300 mV below the regulated output voltage. A
hysteresis of 50 mV is included in the function to minimize
oscillations.
REGULATOR CONTROL FUNCTIONS
The CS8101 contains two microprocessor compatible
control functions: ENABLE and RESET (Figure 4).
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5
CS8101
VT = RESET threshold.
The circuit depicted in Figure 6 lets the microprocessor
control its power source, the CS8101 regulator. An I/O port
on the µP and the SWITCH port are used to drive the base
of Q1. When Q1 is driven into saturation, the voltage on the
ENABLE lead falls below its lower threshold. The
regulator’s output is enabled. When the drive current is
removed, the voltage on the ENABLE lead rises, the output
is switched off and the IC moves into Sleep mode where it
draws 50 µA (max).
By coupling these two controls with the ENABLE lead,
the system has added flexibility. Once the system is running,
the state of the SWITCH is irrelevant as long as the I/O port
continues to drive Q1. The microprocessor can turn off its
own power by withdrawing drive current, once the
SWITCH is open. This software control at the I/O port
allows the microprocessor to finish key housekeeping
functions before power is removed.
The logic options are summarized in Table 1.
The RESET output is an open collector NPN transistor,
controlled by a low voltage detection circuit. The circuit is
functionally independent of the rest of the IC thereby
guaranteeing that the RESET signal is valid for VOUT as low
as 1.0 V.
5.0 V to µP
and System
Power
VOUT
COUT
RRST
CS8101
to µP
RESET
Port
RESET
CRST
Figure 5. RC Network for RESET Delay
An external RC network on the lead (Figure 5) provides
a sufficiently long delay for most microprocessor based
applications. RC values can be chosen using the following
formula:
RTOTCRST –tDelay
lnV
VTVOUT
RSTVOUT
Table 1. Logic Control of CS8101 Output
where:
RRST = RESET Delay resistor
RIN = µP port impedance
RTOT = RRST in parallel with RIN
CRST = RESET Delay capacitor
tDelay = desired delay time
VRST = VSAT of RESET lead (0.7 V @ turn – ON)
Microprocessor
I/O Drive
Switch
ENABLE
Output
ON
Closed
LOW
ON
Open
LOW
ON
OFF
Closed
LOW
ON
Open
HIGH
OFF
The I/O port of the microprocessor typically provides
50 µA to Q1. In automotive applications the SWITCH is
connected to the ignition switch.
APPLICATION NOTES
VIN
VBAT
VOUT
VCC
0.1 µF
CS8101
500 kΩ
ENABLE
GND
COUT
RRST
RESET
µP
RESET
CRST
Q1
100 kΩ
500 kΩ
100 kΩ
SWITCH
Figure 6. Microprocessor Control of CS8101 Using External Switching Transistor Q1
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I/O Port
CS8101
STABILITY CONSIDERATIONS
the greatest oscillation. This represents the worst case load
conditions for the regulator at low temperature.
Step 4: Maintain the worst case load conditions set in
step 3 and vary the input voltage until the oscillations
increase. This point represents the worst case input voltage
conditions.
Step 5: If the capacitor is adequate, repeat steps 3 and 4
with the next smaller valued capacitor. A smaller capacitor
will usually cost less and occupy less board space. If the
output oscillates within the range of expected operating
conditions, repeat steps 3 and 4 with the next larger standard
capacitor value.
Step 6: Test the load transient response by switching in
various loads at several frequencies to simulate its real
working environment. Vary the ESR to reduce ringing.
Step 7: Raise the temperature to the highest specified
operating temperature. Vary the load current as instructed in
step 5 to test for any oscillations.
The output or compensation capacitor helps determine
three main characteristics of a linear regulator: start–up
delay, load transient response and loop stability.
VIN
VOUT
CIN*
0.1 µF
CS8101
RRST
COUT**
10 µF
RESET
ENABLE
*CIN required if regulator is located far from the power supply filter.
*COUT required for stability. Capacitor must operate at
minimum temperature expected.
Figure 7. Test and Application Circuit Showing
Output Compensation
Once the minimum capacitor value with the maximum
ESR is found, a safety factor should be added to allow for the
tolerance of the capacitor and any variations in regulator
performance. Most good quality aluminum electrolytic
capacitors have a tolerance of ± 20% so the minimum value
found should be increased by at least 50% to allow for this
tolerance plus the variation which will occur at low
temperatures. The ESR of the capacitor should be less than
50% of the maximum allowable ESR found in step 3 above.
The capacitor value and type should be based on cost,
availability, size and temperature constraints. A tantalum or
aluminum electrolytic capacitor is best, since a film or
ceramic capacitor with almost zero ESR can cause
instability. The aluminum electrolytic capacitor is the least
expensive solution, but, if the circuit operates at low
temperatures (–25°C to –40°C), both the value and ESR of
the capacitor will vary considerably. The capacitor
manufacturers data sheet usually provides this information.
The value for the output capacitor COUT shown in Figure
7 should work for most applications, however it is not
necessarily the optimized solution.
To determine an acceptable value for COUT for a particular
application, start with a tantalum capacitor of the
recommended value and work towards a less expensive
alternative part.
Step 1: Place the completed circuit with a tantalum
capacitor of the recommended value in an environmental
chamber at the lowest specified operating temperature and
monitor the outputs with an oscilloscope. A decade box
connected in series with the capacitor will simulate the
higher ESR of an aluminum capacitor. Leave the decade box
outside the chamber, the small resistance added by the
longer leads is negligible.
Step 2: With the input voltage at its maximum value,
increase the load current slowly from zero to full load while
observing the output for any oscillations. If no oscillations
are observed, the capacitor is large enough to ensure a stable
design under steady state conditions.
Step 3: Increase the ESR of the capacitor from zero using
the decade box and vary the load current until oscillations
appear. Record the values of load current and ESR that cause
CALCULATING POWER DISSIPATION IN A SINGLE
OUTPUT LINEAR REGULATOR
The maximum power dissipation for a single output
regulator (Figure 8) is:
PD(max) VIN(max) VOUT(min)IOUT(max) VIN(max)IQ
(1)
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current for the
application, and
IQ is the quiescent current the regulator consumes at
IOUT(max).
Once the value of PD(max) is known, the maximum
permissible value of RΘJA can be calculated:
RJA 150°C TA
PD
(2)
The value of RΘJA can then be compared with those in the
package section of the data sheet. Those packages with
RΘJA’s less than the calculated value in equation 2 will keep
the die temperature below 150°C.
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CS8101
HEAT SINKS
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
IIN
VIN
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RΘJA.
IOUT
VOUT
SMART
REGULATOR
Control
Features
RJA RJC RCS RSA
(3)
where:
RΘJC = the junction–to–case thermal resistance,
RΘCS = the case–to–heatsink thermal resistance, and
RΘSA = the heatsink–to–ambient thermal resistance.
RΘJC appears in the package section of the data sheet. Like
RΘJA, it is a function of package type. RΘCS and RΘSA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
IQ
Figure 8. Single Output Regulator With Key
Performance Parameters Labeled
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CS8101
ORDERING INFORMATION†
Device
CS8101YD8
CS8101YDR8
CS8101YDWF20
CS8101YDWFR20
Description
Shipping
SO–8
95 Units/Rail
SO–8
2500 Tape & Reel
SO–20L
37 Units/Rail
SO–20L
1000 Tape & Reel
CS8101YT5
TO–220 FIVE LEAD STRAIGHT
50 Units/Rail
CS8101YTVA5
TO–220 FIVE LEAD VERTICAL
50 Units/Rail
CS8101YTHA5
TO–220 FIVE LEAD HORIZONTAL
50 Units/Rail
†Contact your local sales representative for D2PAK package option.
MARKING DIAGRAMS
TO–220
FIVE LEAD
T SUFFIX
CASE 314D
TO–220
FIVE LEAD
TVA SUFFIX
CASE 314K
TO–220
FIVE LEAD
THA SUFFIX
CASE 314A
SO–20L
DWF SUFFIX
CASE 751D
SO–8
D SUFFIX
CASE 751
8
20
8101
ALYW
CS8101
AWLYYWW
CS8101
AWLYWW
CS8101
AWLYWW
CS8101
AWLYWW
1
1
1
A
WL, L
YY, Y
WW, W
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
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1
CS8101
PACKAGE DIMENSIONS
TO–220
FIVE LEAD
T SUFFIX
CASE 314D–04
ISSUE E
–T–
–Q–
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
C
B
E
A
U
L
K
J
H
G
D
DIM
A
B
C
D
E
G
H
J
K
L
Q
U
1234 5
5 PL
0.356 (0.014)
M
T Q
M
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.067 BSC
0.087
0.112
0.015
0.025
0.990
1.045
0.320
0.365
0.140
0.153
0.105
0.117
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
1.702 BSC
2.210
2.845
0.381
0.635
25.146 26.543
8.128
9.271
3.556
3.886
2.667
2.972
TO–220
FIVE LEAD
TVA SUFFIX
CASE 314K–01
ISSUE O
–T–
SEATING
PLANE
C
B
–Q–
E
W
A
U
F
L
1
2
3
4
K
5
M
D
0.356 (0.014)
M
J
5 PL
T Q
M
G
S
R
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10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
DIM
A
B
C
D
E
F
G
J
K
L
M
Q
R
S
U
W
INCHES
MIN
MAX
0.560
0.590
0.385
0.415
0.160
0.190
0.027
0.037
0.045
0.055
0.530
0.545
0.067 BSC
0.014
0.022
0.785
0.800
0.321
0.337
0.063
0.078
0.146
0.156
0.271
0.321
0.146
0.196
0.460
0.475
5°
MILLIMETERS
MIN
MAX
14.22
14.99
9.78
10.54
4.06
4.83
0.69
0.94
1.14
1.40
13.46
13.84
1.70 BSC
0.36
0.56
19.94
20.32
8.15
8.56
1.60
1.98
3.71
3.96
6.88
8.15
3.71
4.98
11.68
12.07
5°
CS8101
TO–220
FIVE LEAD
THA SUFFIX
CASE 314A–03
ISSUE E
–T–
B
–P–
Q
C
E
OPTIONAL
CHAMFER
A
U
F
L
G
5X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
SEATING
PLANE
DIM
A
B
C
D
E
F
G
J
K
L
Q
S
U
K
5X
J
S
D
0.014 (0.356)
T P
M
M
SO–8
D SUFFIX
CASE 751–07
ISSUE W
A
5
0.25 (0.010)
S
B
1
M
Y
M
4
K
–Y–
G
C
N
X 45 SEATING
PLANE
–Z–
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
S
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MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
14.478 14.859
1.702 BSC
0.381
0.635
18.542 18.923
8.128
9.271
3.556
3.886
5.334
6.604
11.888 12.827
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–X–
8
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.570
0.585
0.067 BSC
0.015
0.025
0.730
0.745
0.320
0.365
0.140
0.153
0.210
0.260
0.468
0.505
J
DIM
A
B
C
D
G
H
J
K
M
N
S
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0
8
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0
8
0.010
0.020
0.228
0.244
CS8101
SO–20L
DWF SUFFIX
CASE 751D–05
ISSUE F
A
20
X 45 h
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
11
B
M
D
1
10
20X
B
0.25
DIM
A
A1
B
C
D
E
e
H
h
L
B
M
T A
S
B
S
L
A
18X
e
A1
SEATING
PLANE
C
T
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0
7
PACKAGE THERMAL DATA
Parameter
TO–220
FIVE LEAD
SO–8
SO–20L
Unit
RΘJC
Typical
3.3
45
9.0
°C/W
RΘJA
Typical
50
165
55
°C/W
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12
CS8101/D