CX65002
700 – 1000 MHz Linear Power Amplifier Driver
Conexant’s CX65002 Microwave Monolithic Integrated Circuit (MMIC) power
amplifier driver offers a desirable combination of features that provide superb
performance and ease of use in a low-cost Surface-Mounted Technology (SMT)
package. The Gallium Arsenide (GaAs) Heterojunction Bipolar Transistor (HBT)
power amplifer driver was developed and optimized for extreme linear performance
in a variety of applications. It is ideal as a driver or output stage for transceivers
and repeaters in AMPS/CDMA/TDMA/GSM paging base stations, mobile radios,
telematics, and many other applications.
Features
Figure 1 shows a functional block diagram for the CX65002. The device package
and pinout are shown in Figure 2.
Applications
•
•
•
•
•
•
5 V single supply operation
Excellent linearity
Wide dynamic range
Broad frequency coverage
Internal bias circuits
Surface mounted Small Outline Integrated Circuit
(SOIC) 8-pin package with downset paddle
• AMPS/CDMA/TDMA/GSM
• Wireless Local Loop (WLL) and Industrial,
Scientific, Medical (ISM) bands
• Repeaters
• Paging
• Mobile radios
• Telematics
• VHF/UHF TV broadcast
VCC1
VCC2
VB
RFIN
8
5
2
3
Driver Bias
4
Y
Input Bias
DA
6, 7
RFOUT
NC
1
8
VCC1
VB
2
7
RFOUT
RFIN
3
6
RFOUT
Y
4
5
VCC2
C1216
C1215
Figure 1. CX65002 Functional Block Diagram
Data Sheet
Figure 2. CX65002 Pinout – 8-Pin SOIC Package
Top View
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Proprietary Information and Specifications Are Subject to Change
Doc. No. 101467B
October 26, 2001
CX65002
PA Driver
Electrical and Mechanical Specifications
Electro-Static Discharge (ESD) Sensitivity
The signal pin assignments and functions are described in
Table 1. The absolute maximum ratings of the CX65002 are
provided in Table 2. The recommended operating conditions are
specified in Table 3 and electrical specifications are provided in
Table 4.
The CX65002 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper
ESD precautions.
Typical performance characteristics of the CX65002 are
illustrated in Figures 3, 4, 5, and 6. Figure 7 shows an
application schematic diagram. The package PCB mounting
footprint dimensions for the 8-pin CX65002 SOIC are shown in
Figure 8 and the package dimensions are provided in Figure 9.
Figure 10 provides the tape and reel dimensions.
Table1. CX65002 Signal Descriptions
Pin #
Name
1
NC
2
VB
3
RFIN
Description
No connection
Input bias for driver amplifier
RF input
4
Y
5
VCC2
Output of internal bias circuit
6
RFOUT
RF output
7
RFOUT
RF output
8
VCC1
Supply voltage
Supply voltage
Table 2. CX65002 Absolute Maximum Ratings
Parameter
Symbol
RF input power
PIN
Supply voltage
VCC
Min
Typical
Max
Units
10
dBm
5.5
V
Case operating temperature
TC
–30
+100
°C
Storage temperature
TST
–55
+125
°C
Note: No damage to device if only one parameter is applied at a time with other parameters at nominal conditions.
Table 3. CX65002 Recommended Operating Conditions
Parameter
Supply voltage
2
Symbol
Min
Typical
VCC
Max
Units
5
V
Operating frequency
FO
700
900
1000
MHz
Case operating temperature
TC
–30
+25
+85
°C
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101467B
October 26, 2001
PA Driver
CX65002
Table 4. CX65002 Electrical Characteristics
(VCC = 5 V, Frequency = 900 MHz, TC = 25 °C)
Parameter
Symbol
Test
Conditions
Min
Typical
Max
Units
700
900
1000
MHz
180
190
mA
Analog Inputs
Frequency range
Quiescent current
Iq
Gain
G
PIN = –15
dBm
17.5
dB
Output power
POUT
PIN = +7 dBm
24
dBm
Efficiency
PAE
PIN = +7 dBm
33
%
6
dB
Two tones
with 100 kHz
spacing
PIN = –10
dBm per tone
44
dBm
Noise Figure (NF)
NF
Output IP3
OIP3
Note: The above specifications apply only to the 900 MHz operating frequency.
26
24
Pout (dBm)
22
20
18
16
14
12
10
-6
-4
-2
0
2
4
6
8
Pin (dBm)
Figure 3. Typical Output Power vs Input Power @ 900 MHz
101467B
October 26, 2001
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3
CX65002
PA Driver
40
35
PAE (%)
30
25
20
15
10
5
0
-6
-4
-2
0
2
4
6
8
Pin (dBm)
Figure 4. Typical Efficiency vs Input Power @ 900 MHz
10
9
8
NF (dB)
7
6
5
4
3
2
1
0
800
850
900
950
1000
Freq (MHz)
Figure 5. Typical Noise Figure vs Frequency
4
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Proprietary Information and Specifications Are Subject to Change
101467B
October 26, 2001
PA Driver
CX65002
50
OIP3 (dBm)
40
30
20
10
0
700
750
800
850
900
950
1000
Freq (MHz)
Figure 6. Typical OIP3 vs Frequency
Power Supply
1
2
+5 V
39 pF
1 F
39 pF
T_LINE
x
1
CX65002
8
200
33 nH
2
7
3
6
4
5
3.3 pF
18 pF
SMA
SMA
DNI
DNI
4.7 pF
4.7 nH
1000 pF
39pF
DNI -- Do Not Install
C1239
Figure 7. CX65002 Application Schematic
101467B
October 26, 2001
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Proprietary Information and Specifications Are Subject to Change
5
CX65002
PA Driver
6.985
0.381
1.524
Minimum
1.626
1.270
2.540
0.635
Minimum
0.254 diameter plated-through via
(minimum 11 recommended)
C1218
Dimensions are in millimeters
Figure 8. PCB Mounting Footprint
4.902 ± 0.051
DETAIL A
5.994 ± 0.102
3.912 ± 0.051
0.381 ± 0.051 x 45o
3.912 ± 0.051
5.994 ± 0.102
Pin 1
1.473 ± 0.051
4.902 ± 0.051
DETAIL A
0.203 Max
1.270 typ
0.033 ± 0.0305
0.457 ± 0.076
0.051 ± 0.051
0.6095 ± 0.0505
2.083 ± 0.051
C300
All measurements are in millimeters
Figure 9. CX65002 8-Pin SOIC Package Dimension Drawing
6
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101467B
October 26, 2001
PA Driver
CX65002
1.55 ± 0.05
2.00 ± 0.05
B
A
1.75 ± 0.10
A
12.00 + 0.30/–0.10
4.00 ± 0.10
5.50 ± 0.05
8.00 ± 0.10
B
1.50 ± 0.25
0.292 ± 0.13
o
8 Max
6.88 ± 0.10
5o Max
1.68 ± 0.10
A
5.49 ± 0.10
B
1. Carrier tape: black conductive polycarbonate.
2. Cover tape material: transparent conductive PSA.
3. Cover tape size: 9.3 mm wide.
4. All dimensions are in millimeters.
C1242
Figure 10. CX65002 8-Pin SOIC Tape and Reel Dimensions
101467B
October 26, 2001
Conexant - Preliminary
Proprietary Information and Specifications Are Subject to Change
7
CX65002
PA Driver
Ordering Information
Model Name
Ordering Part Number
Evaluation Kit Part
Number
CX65002 700-1000 MHz Linear Power
Amplifier Driver
CX65002-12
TW10-D252
© 2001, Conexant Systems, Inc. All Rights Reserved.
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