ETC CY7C341-25JC

CY7C341
192-Macrocell MAX® EPLD
Features
•
•
•
•
•
•
192 macrocells in 12 LABs
8 dedicated inputs, 64 bidirectional I/O pin
0.8-micron double-metal CMOS EPROM technology
Programmable interconnect array
384 expander product terms
Available in 84-pin HLCC, PLCC, and PGA packages
Functional Description
The CY7C341 is an Erasable Programmable Logic Device
(EPLD) in which CMOS EPROM cells are used to configure
logic functions within the device. The MAX architecture is
100% user-configurable, allowing the devices to accommodate a variety of independent logic functions.
The 192 macrocells in the CY7C341 are divided into 12 Logic
Array Blocks (LABs), 16 per LAB. There are 384 expander
product terms, 32 per LAB, to be used and shared by the macrocells within each LAB. Each LAB is interconnected with a
programmable interconnect array, allowing all signals to be
routed throughout the chip.
The speed and density of the CY7C341 allows them to be
used in a wide range of applications, from replacement of large
amounts of 7400-series TTL logic, to complex controllers and
multifunction chips. With greater than 37 times the functionality
of 20-pin PLDs, the CY7C341 allows the replacement of over
75 TTL devices. By replacing large amounts of logic, the
CY7C341 reduces board space and part count, and increases
system reliability.
Each LAB contains 16 macrocells. In LABs A, F, G, and L, 8
macrocells are connected to I/O pins and 8 are buried, while
for LABs B, C, D, E, H, I, J, and K, 4 macrocells are connected
to I/O pins and 12 are buried. Moreover, in addition to the I/O
and buried macrocells, there are 32 single product term logic
expanders in each LAB. Their use greatly enhances the capability of the macrocells without increasing the number of product terms in each macrocell.
Logic Array Blocks
There are 12 logic array blocks in the CY7C341. Each LAB
consists of a macrocell array containing 16 macrocells, an expander product term array containing 32 expanders, and an
I/O block. The LAB is fed by the programmable interconnect
array and the dedicated input bus. All macrocell feedbacks go
to the macrocell array, the expander array, and the programmable interconnect array. Expanders feed themselves and the
macrocell array. All I/O feedbacks go to the programmable interconnect array so that they may be accessed by macrocells
in other LABs as well as the macrocells in the LAB in which
they are situated.
Externally, the CY7C341 provides 8 dedicated inputs, one of
which may be used as a system clock. There are 64 I/O pins
that may be individually configured for input, output, or bidirectional data flow.
Programmable Interconnect Array
The Programmable Interconnect Array (PIA) solves interconnect limitations by routing only the signals needed by each
logic array block. The inputs to the PIA are the outputs of every
macrocell within the device and the I/O pin feedback of every
pin on the device.
Unlike masked or programmable gate arrays, which induce
variable delay dependent on routing, the PIA has a fixed delay.
This eliminates undesired skews among logic signals, which
may cause glitches in internal or external logic. The fixed delay,
regardless of programmable interconnect array configuration,
simplifies design by assuring that internal signal skews or races are avoided. The result is ease of design implementation,
often in a single pass, without the multiple internal logic placement and routing iterations required for a programmable gate
array to achieve design timing objectives.
Timing Delays
Timing delays within the CY7C341 may be easily determined
using Warp™, Warp Professional™, or Warp Enterprise™
software. The CY7C341 has fixed internal delays, allowing the
user to determine the worst case timing delays for any design.
Design Recommendations
For proper operation, input and output pins must be constrained to the range GND < (VIN or VOUT) < V CC. Unused
inputs must always be tied to an appropriate logic level (either
VCC or GND). Each set of V CC and GND pins must be connected together directly at the device. Power supply decoupling
capacitors of at least 0.2 µF must be connected between VCC
and GND. For the most effective decoupling, each VCC pin
should be separately decoupled to GND, directly at the device.
Decoupling capacitors should have good frequency response,
such as monolithic ceramic types.
Design Security
The CY7C341 contains a programmable design security feature that controls the access to the data programmed into the
device. If this programmable feature is used, a proprietary design implemented in the device cannot be copied or retrieved.
This enables a high level of design control to be obtained since
programmed data within EPROM cells is invisible. The bit that
controls this function, along with all other program data, may
be reset simply by erasing the device.
MAX is a registered trademark of Altera Corporation.
Warp, Warp Professional, and Warp Enterprise are trademarks of Cypress Semiconductor Corporation.
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
July 19, 2000
CY7C341
Selection Guide
7C341-25
7C341-30
7C341-35
Maximum Access Time (ns)
25
30
35
Maximum Operating
Current (mA)
Commercial
380
380
380
Industrial
480
480
480
Military
480
480
480
Commercial
360
360
360
Industrial
435
435
435
Military
435
435
435
Maximum Standby
Current (mA)
2
CY7C341
Logic Block Diagram
1 (A6)
INPUT/CLK
INPUT
(C6) 84
2 (A5)
INPUT
INPUT
(C7) 83
41 (K6)
INPUT
INPUT
(L7) 44
42 (J6)
INPUT
INPUT
(J7) 43
SYSTEMCLOCK
4
(C5)
5
(A4)
6
(B4)
7
(A3)
8
(A2)
9
(B3)
10 (A1)
11 (B2)
LAB G
MACROCELL 97
MACROCELL 98
MACROCELL 99
MACROCELL 100
MACROCELL 101
MACROCELL 102
MACROCELL 103
MACROCELL 104
LAB A
MACROCELL 1
MACROCELL 2
MACROCELL 3
MACROCELL 4
MACROCELL 5
MACROCELL 6
MACROCELL 7
MACROCELL 8
MACROCELL 9–16
(C2)
(B1)
(C1)
(D2)
22 (G3)
23 (G1)
25 (F1)
26 (H1)
27 (H2)
28 (J1)
29 (K1)
30 (J2)
31
32
33
34
35
36
37
38
(L1)
(K2)
(K3)
(L2)
(L3)
(K4)
(L4)
(J5)
LAB C
MACROCELL 33
MACROCELL 34
MACROCELL 35
MACROCELL 36
MACROCELL 113
MACROCELL 114
MACROCELL 115
MACROCELL 116
(J10)
(K11)
(J11)
(H10)
58
59
62
63
(H11)
(F10)
(G9)
(F9)
64
65
67
68
(F11)
(E11)
(E9)
(D11)
69
70
71
72
(D10)
(C11)
(B11)
(C10)
73
74
75
76
77
78
79
80
(A11)
(B10)
(B9)
(A10)
(A9)
(B8)
(A8)
(B6)
MACROCELL 117–128
P
I
A
LAB I
MACROCELL 129
MACROCELL 130
MACROCELL 131
MACROCELL 132
MACROCELL 37–48
MACROCELL 133–144
LAB D
MACROCELL 49
MACROCELL 50
MACROCELL 51
MACROCELL 52
LAB J
MACROCELL 145
MACROCELL 146
MACROCELL 147
MACROCELL 148
MACROCELL 53–64
MACROCELL 149–160
LAB K
MACROCELL 161
MACROCELL 162
MACROCELL 163
MACROCELL 164
LAB E
MACROCELL 65
MACROCELL 66
MACROCELL 67
MACROCELL 68
MACROCELL 69–80
MACROCELL 165–176
LAB F
MACROCELL 81
MACROCELL 82
MACROCELL 83
MACROCELL 84
MACROCELL 85
MACROCELL 86
MACROCELL 87
MACROCELL 88
LAB L
MACROCELL 177
MACROCELL 178
MACROCELL 179
MACROCELL 180
MACROCELL 181
MACROCELL 182
MACROCELL 183
MACROCELL 184
MACROCELL 89–96
MACROCELL 185–192
3, 24, 45, 66 (B5, G2, K7, E10)
18, 19, 39, 40, 60, 61, 81, 82 (E1, E2, K5, L5, G10, G11, A7, B7)
54
55
56
57
LAB H
MACROCELL 17
MACROCELL 18
MACROCELL 19
MACROCELL 20
MACROCELL 21–32
16 (D1)
17 (E3)
20 (F2)
21 (F3)
(L6)
(L8)
(K8)
(L9)
(L10)
(K9)
(L11)
(K10)
MACROCELL 105–112
LAB B
12
13
14
15
46
47
48
49
50
51
52
53
VCC
GND
3
() – PERTAIN TO 84-PIN PGA PACKAGE
C341-1
CY7C341
Pin Configurations
PGA
Bottom View
L
I/O
I/O
I/O
I/O
GND
I/O
INPUT
I/O
I/O
I/O
I/O
K
I/O
I/O
I/O
I/O
GND
INPUT
VCC
I/O
I/O
I/O
I/O
J
I/O
I/O
I/O
I/O
H
I/O
I/O
I/O
I/O
G
I/O
VCC
I/O
I/O
GND
GND
F
I/O
I/O
I/O
I/O
I/O
I/O
E
GND
GND
I/O
I/O
VCC
I/O
D
I/O
I/O
I/O
I/O
C
I/O
I/O
I/O
I/O
B
I/O
I/O
I/O
I/O
A
I/O
I/O
I/O
I/O
1
2
3
4
I/O
I/O
I/O
I/O
I/O
GND
I/O
GND
INPUT
INPUT/CLK
INPUT
INPUT
I/O
I/O
VCC
I/O
I/O
I/O
I/O
I/O
I/O
PLCC/HLCC
Top View
11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCC
I/O
I/O
I/O
I/O
GND
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
INPUT
INPUT
INPUT
INPUT
VCC
I/O
I/O
I/O
I/O
GND
GND
I/O
74
12
73
13
72
14
71
15
70
16
69
17
68
18
67
19
66
20
65
21
64
7C341
22
63
23
62
24
61
25
60
26
59
27
58
28
57
29
56
30
55
31
54
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
GND
I/O
I/O
I/O
I/O
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
C341-2
I/O
INPUT INPUT
7C341
I/O
VCC
INPUT INPUT
GND
I/O
I/O
I/O
I/O
INPUT/
INPUT CLK
GND
I/O
I/O
I/O
I/O
8
9
10
11
5
I/O
6
7
C341-3
Design Security (continued)
The erasable nature of these devices allows test programs to
be used and erased during early stages of the production flow.
The devices also contain on-board logic test circuitry to allow
verification of function and AC specification once encapsulated in non-windowed packages.
The CY7C341 is fully functionally tested and guaranteed through
complete testing of each programmable EPROM bit and all internal
logic elements thus ensuring 100% programming yield.
EXPANDER
DELAY
tEXP
INPUT
INPUT
DELAY
tIN
REGISTER
LOGIC ARRAY
CONTROL DELAY
tLAC
OUTPUT
DELAY
tCLR
tPRE
LOGIC ARRAY
DELAY
tLAD
tRSU
tRH
tRD
tCOMB
tLATCH
INPUT/
OUTPUT
tOD
tXZ
tZX
SYSTEM CLOCK DELAY tICS
PIA
DELAY
tPIA
CLOCK
DELAY
tIC
LOGIC ARRAY
DELAY
tFD
I/O DELAY
tIO
C341-4
Figure 1. CY7C341 Internal Timing Model
4
CY7C341
DC Input Voltage[1] ................................................−3.0V to +7.0V
Maximum Ratings
DC Program Voltage..................................................... 13.0V
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature .......................................−65°C to +150°C
Static Discharge Voltage................................................. >1100V
(per MIL-STD-883, method 3015)
Ambient Temperature with
Power Applied .................................................... 0°C to +70°C
Operating Range
Maximum Junction Temperature
(Under Bias)................................................................. 150°C
Range
Ambient
Temperature
VCC
0°C to +70°C
5V ± 5%
–40°C to +85°C
5V ± 10%
–55°C to +125°C (Case)
5V ± 10%
Commercial
Supply Voltage to Ground Potential..................−2.0V to +7.0V
Industrial
Maximum Power Dissipation................................... 2500 mW
Military
DC VCC or GND Current......................................................500 mA
DC Output Current, per Pin ........................ −25 mA to +25 mA
Electrical Characteristics Over the Operating Range[2]
Parameter
Description
Test Conditions
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
VOL
Output LOW Voltage
VCC = Min., IOL = 8 mA
VIH
Input HIGH Level
VIL
Input LOW Level
IIX
Input Current
IOZ
Output Leakage Current
ICC1
Power Supply
Current (Standby)
VI = VCC or GND
(No Load)
Power Supply
Current[5]
VI = VCC or GND (No Load)
f = 1.0 MHz[3, 5]
V
0.45
V
VCC+0.3
V
0.8
V
−10
+10
µA
−40
+40
µA
−30
−90
mA
Com’l
360
mA
Mil/Ind
435
mA
[3, 4]
VCC = Max., VOUT = GND
Unit
−0.3
GND ≤ VIN ≤ VCC
VO = VCC or GND
Output Short
Circuit Current
Max.
2.4
2.2
IOS
ICC2
Min.
Com’l
380
mA
Mil/Ind
480
mA
tR (Recommended)
Input Rise Time
100
ns
tF (Recommended)
Input Fall Time
100
ns
Capacitance[6]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 5.0V
Max.
Unit
10
pF
20
pF
Notes:
1. Minimum DC input is –0.3V. During transitions, the inputs may undershoot to –2.0V for periods less than 20 ns.
2. Typical values are for TA = 25°C and VCC = 5V.
3. Guaranteed but not 100% tested.
4. Not more than one output should be tested at a time. Duration of the short circuit should not be more than one second. VOUT = 0.5V has been chosen to avoid
test problems caused by tester ground degradation.
5. This parameter is measured with device programmed as a 16-bit counter in each LAB and is tested periodically by sampling production material.
6. Part (a) in AC Test Load and Waveforms is used for all parameters except tER and tXZ, which is used for part (b) in AC Test Load and Waveforms. All external timing
parameters are measured referenced to external pins of the device.
5
CY7C341
AC Test Loads and Waveforms
R1 464Ω
5V
OUTPUT
R1 464Ω
5V
ALL INPUT PULSES
OUTPUT
R2
250Ω
50 pF
3.0V
5 pF
INCLUDING
JIG AND
SCOPE (a)
Equivalent to:
R2
250Ω
90%
10%
90%
10%
GND
< 6 ns
< 6 ns
tF
tR
(b)
C341-5
C341-6
THÉVENIN EQUIVALENT (commercial/military)
163Ω
OUTPUT
1.75V
External Synchronous Switching Characteristics Over the Operating Range[6]
7C341-25
Parameter
tPD1
tPD2
Description
Dedicated Input to Combinatorial
Output Delay[7]
I/O Input to Combinatorial
Output Delay[8]
Min.
Max
7C341-30
Min.
Max
7C341-35
Max
Unit
Com’l
25
30
Min.
35
ns
Mil
25
30
35
Com’l
40
45
55
Mil
40
45
55
tPD3
Dedicated Input to Combinatorial
Com’l
Output Delay with Expander Delay[9]
Mil
37
44
55
37
44
55
tPD4
I/O Input to Combinatorial Output
Delay with Expander Delay[3, 10]
Com’l
52
59
75
Mil
52
59
75
tEA
[3, 7]
Input to Output Enable Delay
tER
Input to Output Disable Delay[6]
tCO1
Synchronous Clock Input to
Output Delay
tCO2
tS1
tS2
Synchronous Clock to Local
Feedback to Combinatorial
Output[3, 11]
Com’l
25
30
35
Mil
25
30
35
Com’l
25
30
35
Mil
25
30
35
Com’l
14
16
20
Mil
14
16
20
Com’l
30
35
42
Mil
30
35
42
Dedicated Input or Feedback Set-up Com’l
Time to Synchronous Clock
Mil
Output[6, 12]
15
20
25
15
20
25
I/O Input Set-up Time to
Synchronous Clock Input[8]
Com’l
30
39
45
Mil
30
39
45
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes:
7. This specification is a measure of the delay from input signal applied to a dedicated input to combinatorial output on any output pin. This delay assumes no
expander terms are used to form the logic function. When this note is applied to any parameter specification it indicates that the signal (data, asynchronous
clock, asynchronous clear, and/or asynchronous preset) is applied to a dedicated input only and no signal path (either clock or data) employs expander logic.
If an input signal is applied to an I/O pin an additional delay equal to tPIA should be added to the comparable delay for a dedicated input. If expanders are used, add the
maximum expander delay tEXP to the overall delay for the comparable delay without expanders.
8. This specification is a measure of the delay from input signal applied to an I/O macrocell pin to any output. This delay assumes no expander terms are used
to form the logic function.
9. This specification is a measure of the delay from an input signal applied to a dedicated input to combinatorial output on any output pin. This delay assumes
expander terms are used to form the logic functions and includes the worst-case expander logic delay for one pass through the expander logic.
10. This specification is a measure of the delay from an input signal applied to an I/O macrocell pin to any output. This delay assumes expander terms are used
to form the logic function and includes the worst-case expander logic delay for one pass through the expander logic. This parameter is tested periodically by
sampling production material.
11. This specification is a measure of the delay from synchronous register clock to internal feedback of the register output signal to the input of the LAB logic array
and then to a combinatorial output. This delay assumes no expanders are used, register is synchronously clocked and all feedback is within the same LAB.
This parameter is tested periodically by sampling production material.
12. If data is applied to an I/O input for capture by a macrocell register, the I/O pin set-up time minimums should be observed. These parameters are tS2 for
synchronous operation and tAS2 for asynchronous operation.
6
CY7C341
External Synchronous Switching Characteristics Over the Operating Range[6] (continued)
7C341-25
Parameter
tH
tWH
tWL
tRW
tRO
Description
Input Hold Time from
Synchronous Clock Input[6]
Synchronous Clock Input
High Time
Synchronous Clock Input
Low Time
Asynchronous Clear Width[3, 6]
Asynchronous Clear to
Registered Output Delay[5]
tRR
Asynchronous Clear Recovery[3, 7]
tPW
Asynchronous Preset Width [3, 6]
tPR
Asynchronous Preset Recovery
Time[3, 6]
tPO
Asynchronous Preset to
Registered Output Delay[6]
tCF
Synchronous Clock to Local
Feedback Input[3, 13]
tP
External Synchronous Clock Period
(1/fMAX3)[3]
fMAX1
External Feedback Maximum
Frequency (1/(tCO1 + tS1))[3, 14]
fMAX2
Internal Local Feedback Maximum
Frequency, lesser of (1/(tS1 + tCF))
or (1/tCO1)[3, 15]
fMAX3
fMAX4
tOH
Min.
Max
7C341-30
Min.
Max
7C341-35
Min.
Com’l
0
0
0
Mil
0
0
0
Com’l
8
10
12.5
Mil
8
10
12.5
Com’l
8
10
12.5
Mil
8
10
12.5
Com’l
25
30
35
Mil
25
30
35
ns
ns
ns
Com’l
25
30
35
25
30
35
Com’l
25
30
35
Mil
25
30
35
Com’l
25
30
35
Mil
25
30
35
Com’l
25
30
35
Mil
25
30
35
ns
ns
25
30
35
Mil
25
30
35
Com’l
3
3
5
Mil
3
3
5
Com’l
16
20
25
16
20
25
Com’l
34.5
27.7
22.2
Mil
34.5
27.7
22.2
Com’l
55.5
43
33
Mil
55.5
43
33
62.5
50
40.0
62.5
50
40.0
Maximum Register Toggle Frequency Com’l
(1/(tWL + tWH))[3, 17]
Mil
62.5
50
40.0
62.5
50
40.0
Com’l
3
3
3
Mil
3
3
3
ns
ns
Com’l
Mil
Unit
ns
Mil
Data Path Maximum Frequency, least Com’l
of 1/(tWL + tWH), 1/(tS1 + tH), or (1/tCO1)[3,
Mil
16]
Output Data Stable Time from Synchronous Clock Input[3, 18]
Max
ns
ns
ns
MHz
MHz
MHz
MHz
ns
Notes:
13. This specification is a measure of the delay associated with the internal register feedback path. This is the delay from synchronous clock to LAB logic array
input. This delay plus the register set-up time, tS1, is the minimum internal period for an internal synchronous state machine configuration. This delay is for feedback within
the same LAB. This parameter is tested periodically by sampling production material.
14. This specification indicates the guaranteed maximum frequency, in synchronous mode, at which a state machine configuration with external feedback can
operate. It is assumed that all data inputs and feedback signals are applied to dedicated inputs. All feedback is assumed to be local originating within the same
LAB.
15. This specification indicates the guaranteed maximum frequency at which a state machine, with internal-only feedback, can operate. If register output states
must also control external points, this frequency can still be observed as long as this frequency is less than 1/tCO1.
16. This frequency indicates the maximum frequency at which the device may operate in data path mode (dedicated input pin to output pin). This assumes data
input signals are applied to dedicated input pins and no expander logic is used. If any of the data inputs are I/O pins, tS2 is the appropriate tS for calculation.
17. This specification indicates the guaranteed maximum frequency, in synchronous mode, at which an individual output or buried register can be cycle by a clock
signal applied to the dedicated clock input pin.
18. This parameter indicates the minimum time after a synchronous register clock input that the previous register output data is maintained on the output pin.
7
CY7C341
External Synchronous Switching Characteristics Over the Operating Range[6] (continued)
7C341-25
Parameter
tACO1
tACO2
tAS1
tAS2
tAH
Description
Max
7C341-35
Min.
Max
Unit
ns
30
35
25
30
35
Asynchronous Clock Input to Local
Com’l
Feedback to Combinatorial Output[19]
Mil
40
46
55
40
46
55
Dedicated Input or Feedback Set-up Com’l
Time to Asynchronous Clock Input[6]
Mil
5
6
8
5
6
8
I/O Input Set-Up Time to
Asynchronous Clock Input[6]
Com’l
20
27
30
Mil
20
27
30
Input Hold Time from
Asynchronous Clock Input[6]
tAWL
Asynchronous Clock Input
LOW Time[6, 20]
Asynchronous Clock to
Local Feedback Input[21]
tAP
External Asynchronous
Clock Period (1/fMAX4)
fMAXA1
External Feedback Maximum Frequency in Asynchronous Mode
1/(tACO1 + tAS1)[22]
fMAXA2
Maximum Internal
Asynchronous Frequency[23]
fMAXA3
Data Path Maximum Frequency in
Asynchronous Mode[24]
tAOH
7C341-30
Min.
25
Asynchronous Clock Input
HIGH Time[6]
fMAXA4
Max
Dedicated Asynchronous Clock Input Com’l
to Output Delay[6]
Mil
tAWH
tACF
Min.
Com’l
6
8
10
Mil
6
8
10
Com’l
11
14
16
Mil
11
14
16
Com’l
9
11
14
Mil
9
11
14
ns
ns
ns
ns
ns
Com’l
15
18
22
Mil
15
18
22
Com’l
20
Mil
25
30
20
25
30
Com’l
33.3
27
23
Mil
33.3
27
23
50
40
33.3
Com’l
Mil
50
40
33.3
Com’l
40
33.3
28.5
Mil
40
33.3
28.5
Maximum Asynchronous Register
Com’l
Toggle Frequency 1/(tAWH + tAWL)[25]
Mil
50
40
33.3
50
40
33.3
Output Data Stable Time from Asyn- Com’l
chronous Clock Input[26]
Mil
15
15
15
15
15
15
ns
ns
ns
MHz
MHz
MHz
MHz
ns
Notes:
19. This specification is a measure of the delay from an asynchronous register clock input to internal feedback of the register output signal to the input of the LAB
logic array and then to a combinatorial output. This delay assumes no expanders are used in the logic of combinatorial output or the asynchronous clock input.
The clock signal is applied to the dedicated clock input pin and all feedback is within a single LAB. This parameter is tested periodically by sampling production
material.
20. This parameter is measured with a positive-edge-triggered clock at the register. For negative-edge triggering, the tAWH and tAWL parameters must be swapped. If
a given input is used to clock multiple registers with both positive and negative polarity, tAWH should be used for both tAWH and tAWL.
21. This specification is a measure of the delay associated with the internal register feedback path for an asynchronous clock to LAB logic array input. This delay
plus the asynchronous register set-up time, tAS1, is the minimum internal period for an internal asynchronously clocked state machine configuration. This delay is for
feedback within the same LAB, and assumes there is no expander logic in the clock path and the clock input signal is applied to a dedicated input pin. This parameter is tested
periodically by sampling production material.
22. This specification indicates the guaranteed maximum frequency at which an asynchronously clocked state machine configuration with external feedback can
operate. It is assumed that all data inputs, clock inputs, and feedback signals are applied to dedicated inputs, and that no expander logic is employed in the
clock signal path or data path.
23. This specification indicates the guaranteed maximum frequency at which an asynchronously clocked state machine with internal-only feedback can operate.
This parameter is determined by the lesser of (1/tACF + tAS1)) or (1/(tAWH +tAWL)). If register output states must also control external points, this frequency can still be
observed as long as this frequency is less than 1/tACO1.
24. This frequency is the maximum frequency at which the device may operate in the asynchronously clocked data path mode. This specification is determined
by the least of 1/(tAWH + tAWL), 1/(tAS1 + tAH) or 1/tACO1. It assumes data and clock input signals are applied to dedicated input pins and no expander logic is used.
25. This specification indicates the guaranteed maximum frequency at which an individual output or buried register can be cycled in asynchronously clocked mode
by a clock signal applied to an external dedicated input pin.
26. This parameter indicates the minimum time that the previous register output data is maintained on the output after an asynchronous register clock input applied
to an external dedicated input pin.
8
CY7C341
Internal Switching Characteristics Over the Operating Range[2]
7C341-25
Parameter
tIN
tIO
tEXP
tLAD
tLAC
tOD
tZX
tXZ
tRSU
tRH
tLATCH
tRD
tCOMB
tCH
tCL
tIC
Description
Dedicated Input Pad and
Buffer Delay
I/O Input Pad and Buffer Delay
Expander Array Delay
Logic Array Data Delay
Logic Array Control Delay
Output Buffer and Pad Delay
Output Buffer Enable Delay
[27]
Output Buffer Disable Delay
Register Set-Up Time Relative to
Clock Signal at Register
Register Hold Time Relative to
Clock Signal at Register
Flow-Through Latch Delay
Register Delay
Transparent Mode Delay
[28]
Clock High Time
Clock Low Time
Min.
tFD
tPRE
tCLR
Feedback Delay
Asynchronous Register Preset
Time
Asynchronous Register Clear
Time
Max
Min.
Max
Unit
ns
Com’l
5
7
9
5
7
9
Com’l
6
6
9
Mil
6
6
9
Com’l
12
14
20
Mil
12
14
20
Com’l
12
14
16
Mil
12
14
16
Com’l
10
12
13
Mil
10
12
13
Com’l
5
5
6
Mil
5
5
6
Com’l
10
11
13
Mil
10
11
13
Com’l
10
11
13
Mil
10
11
13
Com’l
6
8
10
Mil
6
8
10
Com’l
6
8
10
Mil
6
8
10
3
4
4
3
4
4
Com’l
1
2
2
Mil
1
2
2
Com’l
3
4
4
Mil
3
4
4
8
10
12.5
Mil
8
10
12.5
Com’l
8
10
12.5
Mil
8
10
12.5
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
14
16
18
14
16
18
Com’l
2
2
3
Mil
2
2
3
Com’l
1
1
2
Mil
1
1
2
Com’l
5
6
7
Mil
5
6
7
Com’l
5
6
7
Mil
5
6
7
9
ns
ns
Com’l
Com’l
ns
ns
Mil
Asynchronous Clock Logic Delay Com’l
Synchronous Clock Delay
Min.
7C341-35
Mil
Mil
tICS
Max
7C341-30
ns
ns
ns
ns
ns
CY7C341
Internal Switching Characteristics Over the Operating Range[2] (continued)
7C341-25
Parameter
tPCW
tPCR
tPIA
Description
Asynchronous Preset and Clear
Pulse Width
Asynchronous Preset and Clear
Recovery Time
Programmable Interconnect
Array Delay
Min.
7C341-30
Max
Min.
Max
7C341-35
Min.
Com’l
5
6
7
Mil
5
6
7
Com’l
5
6
7
Mil
5
6
7
Com’l
14
Mil
Max
Unit
ns
ns
16
20
16
20
ns
Notes:
27. Sample tested only for an output change of 500 mV.
28. This specification guarantees the maximum combinatorial delay associated with the macrocell register bypass when the macrocell is configured for combinatorial operation.
Switching Waveforms
External Combinatorial
DEDICATED INPUT/
I/O INPUT
tPD1/tPD2
COMBINATORIAL
OUTPUT
tER
COMBINATORIAL
REGISTERED OUTPUT
HIGH-IMPEDANCE
3-ST ATE
tEA
HIGH IMPEDANCE
3-STATE
VALID OUTPUT
C341-7
External Synchronous
DEDICATED INPUT/
I/O INPUT [7]
tS1
tH
tWH
tWL
SYNCHRONOUS
CLOCK
tCO1
ASYNCHRONOUS
CLEAR/PRESET [7]
tRW/tPW
tRR/tPR
tOH
tRO/tPO
REGISTERED
OUTPUTS
tCO2
COMBINATORIAL OUTPUT FROM
REGISTERED FEEDBACK[10]
C341-8
10
CY7C341
Switching Waveforms (continued)
External Asynchronous
DEDICATEDINPUT/
I/OINPUT[7]
tAH
tAS1
tAWH
tAWL
ASYNCHRONOUS
CLOCK INPUT
tACO1
ASYNCHRONOUS
CLEAR/PRESET [7]
tRW/tPW
tRR/tPR
tAOH
tRO/tPO
ASYNCHRONOUS REGISTERED
OUTPUTS
tACO2
COMBINATORIAL OUTPUT
FROM ASYNCH. REGISTERED
FEEDBACK
C341-9
Internal Combinatorial
tIN
INPUT PIN
tIO
tPIA
I/O PIN
tEXP
EXPANDER
ARRAY DELAY
tLAC, tLAD
LOGIC ARRAY
INPUT
LOGIC ARRAY
OUTPUT
C341-10
11
CY7C341
Switching Waveforms (continued)
Internal Asynchronous
tAWH
tIOtR
tAWL
tF
CLOCK PIN
tIN
CLOCK INTO
LOGIC ARRAY
tIC
CLOCK FROM
LOGIC ARRAY
tRSU
tRH
DATA FROM
LOGIC ARRAY
tRD,tLATCH
tFD
tCLR,tPRE
tFD
REGISTER OUTPUT
TO LOCAL LAB
LOGIC ARRAY
tPIA
REGISTER OUTPUT
TO ANOTHER LAB
C341-11
Internal Synchronous
tCH
tCL
SYSTEM CLOCK PIN
SYSTEM CLOCK
AT REGISTER
tIH
tICS
tRSU
tRH
DATA FROM
LOGIC ARRAY
C341-12
Internal Synchronous
CLOCK FROM
LOGIC ARRAY
tRD
tOD
DATA FROM
LOGIC ARRAY
tXZ
OUTPUT PIN
tXZ
tZX
HIGH IMPEDANCE
STATE
C341-13
12
CY7C341
Ordering Information
Speed
(ns)
25
30
35
Ordering Code
CY7C341-25HC/HI
Package
Name
Operating
Range
Package Type
H84
84-Lead Windowed Leaded Chip Carrier
CY7C341-25JC/JI
J83
84-Lead Plastic Leaded Chip Carrier
CY7C341-25RC/RI
R84
84-Lead Windowed Pin Grid Array
CY7C341-30HC/HI
H84
84-Lead Windowed Leaded Chip Carrier
CY7C341-30JC/JI
J83
84-Lead Plastic Leaded Chip Carrier
CY7C341-30RC/RI
R84
84-Lead Windowed Pin Grid Array
CY7C341-30HMB
H84
84-Lead Windowed Leaded Chip Carrier
CY7C341-30RMB
R84
84-Lead Windowed Pin Grid Array
CY7C341-35HC/HI
H84
84-Lead Windowed Leaded Chip Carrier
CY7C341-35JC/JI
J83
84-Lead Plastic Leaded Chip Carrier
CY7C341-35RC/RI
R84
84-Lead Windowed Pin Grid Array
CY7C341-35HMB
H84
84-Lead Windowed Leaded Chip Carrier
CY7C341-35RMB
R84
84-Lead Windowed Pin Grid Array
Commercial/Industrial
Commercial/Industrial
Military
Commercial/Industrial
Military
MILITARY SPECIFICATIONS
Group A Subgroup Testing
DC Characteristics
Parameter
Switching Characteristics
Subgroups
Parameter
Subgroups
VOH
1, 2, 3
tPD1
7, 8, 9, 10, 11
VOL
1, 2, 3
tPD2
7, 8, 9, 10, 11
VIH
1, 2, 3
tPD3
7, 8, 9, 10, 11
VIL
1, 2, 3
tCO1
7, 8, 9, 10, 11
IIX
1, 2, 3
tS1
7, 8, 9, 10, 11
IOZ
1, 2, 3
tH
7, 8, 9, 10, 11
ICC1
1, 2, 3
tACO1
7, 8, 9, 10, 11
tACO2
7, 8, 9, 10, 11
tAS1
7, 8, 9, 10, 11
tAH
7, 8, 9, 10, 11
Document #: 38-00499-B
13
CY7C341
Package Diagrams
84-Leaded Windowed Leaded Chip Carrier H84
51-80081
14
CY7C341
Package Diagrams (continued)
84-Lead Plastic Leaded Chip Carrier J83
51-85006-A
84-Lead Windowed Pin Grid Array R84
51-80026-A
© Cypress Semiconductor Corporation, 2000. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.