AD TMP35FS

a
Low Voltage Temperature Sensors
TMP35/TMP36/TMP37
FEATURES
Low Voltage Operation (2.7 V to 5.5 V)
Calibrated Directly in ⴗC
10 mV/ⴗC Scale Factor (20 mV/ⴗC on TMP37)
ⴞ2ⴗC Accuracy over Temperature (Typ)
ⴞ0.5ⴗC Linearity (Typ)
Stable with Large Capacitive Loads
Specified –40ⴗC to +125ⴗC, Operation to +150ⴗC
Less than 50 ␮A Quiescent Current
Shutdown Current 0.5 ␮A Max
Low Self-Heating
APPLICATIONS
Environmental Control Systems
Thermal Protection
Industrial Process Control
Fire Alarms
Power System Monitors
CPU Thermal Management
FUNCTIONAL BLOCK DIAGRAM
+Vs (2.7V to 5.5V)
TMP35/
TMP36/
TMP37
SHUTDOWN
VOUT
PACKAGE TYPES AVAILABLE
RT-5 (SOT-23)
5 GND
VOUT 1
+VS 2
TOP VIEW
(Not to Scale)
4 SHUTDOWN
NC 3
NC = NO CONNECT
PRODUCT DESCRIPTION
The TMP35, TMP36, and TMP37 are low voltage, precision
centigrade temperature sensors. They provide a voltage output
that is linearly proportional to the Celsius (Centigrade) temperature. The TMP35/TMP36/TMP37 do not require any
external calibration to provide typical accuracies of ± 1°C at
+25°C and ± 2°C over the –40°C to +125°C temperature range.
The low output impedance of the TMP35/TMP36/TMP37 and
its linear output and precise calibration simplify interfacing to
temperature control circuitry and A/D converters. All three
devices are intended for single-supply operation from 2.7 V to
5.5 V maximum. Supply current runs well below 50 µA, providing
very low self-heating—less than 0.1°C in still air. In addition, a
shutdown function is provided to cut supply current to less
than 0.5 µA.
The TMP35 is functionally compatible with the LM35/LM45 and
provides a 250 mV output at 25°C. The TMP35 reads temperatures
from 10°C to 125°C. The TMP36 is specified from –40°C to
+125°C, provides a 750 mV output at 25°C, and operates to
+125°C from a single 2.7 V supply. The TMP36 is functionally
compatible with the LM50. Both the TMP35 and TMP36 have
an output scale factor of 10 mV/°C. The TMP37 is intended for
applications over the range 5°C to 100°C and provides an output
scale factor of 20 mV/°C. The TMP37 provides a 500 mV output
at 25°C. Operation extends to 150°C with reduced accuracy for all
devices when operating from a 5 V supply.
RN-8 (SOIC)
8 +VS
VOUT 1
7 NC
TOP VIEW
(Not
to
Scale)
6 NC
NC 3
NC 2
5 SHUTDOWN
GND 4
NC = NO CONNECT
TO-92
1
2
3
BOTTOM VIEW
(Not to Scale)
PIN 1, +Vs; PIN 2, VOUT; PIN 3, GND
The TMP35/TMP36/TMP37 are all available in low cost 3-lead
TO-92, SOIC-8, and 5-lead SOT-23 surface-mount packages.
REV. C
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 2002
(VS = 2.7 V to 5.5 V, –40C ≤ TA ≤ +125C, unless
TMP35/TMP36/TMP37–SPECIFICATIONS1 otherwise noted.)
Parameter
Symbol
Conditions
ACCURACY
TMP35/TMP36/TMP37F
TMP35/TMP36/TMP37G
TMP35/TMP36/TMP37F
TMP35/TMP36/TMP37G
Scale Factor, TMP35
Scale Factor, TMP36
Scale Factor, TMP37
TA = 25°C
TA = 25°C
Over Rated Temperature
Over Rated Temperature
10°C ≤ TA ≤ 125°C
–40°C ≤ TA ≤ +125°C
5°C ≤ TA ≤ 85°C
5°C ≤ TA ≤ 100°C
3.0 V ≤ +VS ≤ 5.5 V
0 µA ≤ IL ≤ 50 µA
–40°C ≤ TA ≤ +105°C
–105°C ≤ TA ≤ +125°C
TA = 25°C
3.0 V ≤ +VS ≤ 5.5 V
Load Regulation
Power Supply Rejection Ratio
Min
PSRR
Linearity
Long-Term Stability
TA = 150°C for 1 kHrs
SHUTDOWN
Logic High Input Voltage
Logic Low Input Voltage
VIH
VIL
OUTPUT
TMP35 Output Voltage
TMP36 Output Voltage
TMP37 Output Voltage
Output Voltage Range
Output Load Current
Short-Circuit Current
Capacitive Load Driving
Device Turn-On Time
VS = 2.7 V
VS = 5.5 V
Max
Unit
±1
±1
±2
±2
10
10
20
20
±2
±3
±3
±4
9.8/10.2
9.8/10.2
19.6/20.4
19.6/20.4
°C
°C
°C
°C
mV/°C
mV/°C
mV/°C
mV/°C
6
25
30
50
0.5
0.4
20
60
100
m°C/µA
m°C/µA
m°C/V
m°C/V
°C
°C
1.8
400
TA = 25°C
TA = 25°C
TA = 25°C
250
750
500
Note 2
No Oscillations2
Output within ± 1°C
100 kΩ100 pF Load2
1000
10000
0.5
1
0.01
5.5
50
0.5
V
µA
µA
2000
50
250
2.7
+VS
ISY (ON)
ISY (OFF)
Unloaded
Unloaded
V
mV
mV
mV
mV
mV
µA
µA
pF
ms
100
0
IL
ISC
CL
POWER SUPPLY
Supply Range
Supply Current
Supply Current (Shutdown)
Typ
NOTES
1
Does not consider errors caused by self-heating.
2
Guaranteed but not tested.
Specifications subject to change without notice.
50
LOAD REG – mC/A
40
30
20
10
0
–50
0
50
TEMPERATURE – C
100
150
Figure 1. Load Reg vs. Temperature (m°C/µ A)
–2–
REV. C
TMP35/TMP36/TMP37
ABSOLUTE MAXIMUM RATINGS 1, 2, 3
FUNCTIONAL DESCRIPTION
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Shutdown Pin . . . . . . . . . . . . . . GND ≤ SHUTDOWN ≤ +VS
Output Pin . . . . . . . . . . . . . . . . . . . . . . GND ⱕ VOUT ⱕ +VS
Operating Temperature Range . . . . . . . . . . –55°C to +150°C
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 175°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +160°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . 300°C
An equivalent circuit for the TMP3x family of micropower,
centigrade temperature sensors is shown in Figure 2. At the
heart of the temperature sensor is a band gap core, which is
comprised of transistors Q1 and Q2, biased by Q3 to approximately 8 µA. The band gap core operates both Q1 and Q2 at the
same collector current level; however, since the emitter area of
Q1 is 10 times that of Q2, Q1’s VBE and Q2’s VBE are not equal
by the following relationship:
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation at or
above this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2
Digital inputs are protected; however, permanent damage may occur on unprotected units from high energy electrostatic fields. Keep units in conductive foam
or packaging at all times until ready to use. Use proper antistatic handling
procedures.
3
Remove power before inserting or removing units from their sockets.
A

∆VBE =VT × ln  E ,Q1 
A
 E ,Q2 
+VS
SHDN
25A
Package Type
JA
JC
Unit
TO-92 (T9 Suffix)
SOIC-8 (S Suffix)
SOT-23 (RT Suffix)
162
158
300
120
43
180
°C/W
°C/W
°C/W
3X
2X
θJA is specified for device in socket (worst-case conditions).
Q2
1X
Q4
R1
ORDERING GUIDE
Q1
10X
Model
Accuracy
at 25C
(C max)
Linear
Operating
Temperature Range
Package
Options1
TMP35FT9
TMP35GT9
TMP35FS
TMP35GS
TMP35GRT2
± 2.0
± 3.0
± 2.0
± 3.0
± 3.0
10°C to 125°C
10°C to 125°C
10°C to 125°C
10°C to 125°C
10°C to 125°C
TO-92
TO-92
RN-8
RN-8
RT-5
TMP36FT9
TMP36GT9
TMP36FS
TMP36GS
TMP36GRT2
± 2.0
± 3.0
± 2.0
± 3.0
± 3.0
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
TO-92
TO-92
RN-8
RN-8
RT-5
TMP37FT9
TMP37GT9
TMP37FS
TMP37GS
TMP37GRT2
± 2.0
± 3.0
± 2.0
± 3.0
± 3.0
5°C to 100°C
5°C to 100°C
5°C to 100°C
5°C to 100°C
5°C to 100°C
TO-92
TO-92
RN-8
RN-8
RT-5
R3
NOTES
1
SOIC = Small Outline Integrated Circuit; RT = Plastic Surface Mount;
TO = Plastic.
2
Consult factory for availability.
R2
+VOUT
7.5A
Q3
2X
6X
GND
Figure 2. Temperature Sensor Simplified
Equivalent Circuit
Resistors R1 and R2 are used to scale this result to produce the
output voltage transfer characteristic of each temperature sensor
and, simultaneously, R2 and R3 are used to scale Q1’s VBE as
an offset term in VOUT. Table I summarizes the differences
between the three temperature sensors’ output characteristics.
Table I. TMP3x Output Characteristics
Sensor
Offset
Voltage (V)
Output Voltage
Scaling (mV/C)
Output Voltage
@ 25C (mV)
TMP35
TMP36
TMP37
0
0.5
0
10
10
20
250
750
500
The output voltage of the temperature sensor is available at the
emitter of Q4, which buffers the band gap core and provides
load current drive. Q4’s current gain, working with the available
base current drive from the previous stage, sets the short-circuit
current limit of these devices to 250 µA.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the TMP35/TMP36/TMP37 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. C
–3–
WARNING!
ESD SENSITIVE DEVICE
TMP35/TMP36/TMP37 – Typical Performance Characteristics
2.0
1.8
OUTPUT VOLTAGE – V
1.6
POWER SUPPLY REJECTION – C/V
100
a. TMP35
b. TMP36
c. TMP37
VS = 3V
c
1.4
b
1.2
1.0
0.8
a
0.6
0.4
31.6
10
3.16
1
0.32
0.1
0.032
0.2
0
50
25
0
25
50
75
TEMPERATURE – C
100
0.01
20
125
TPC 1. Output Voltage vs. Temperature
100
1k
FREQUENCY – Hz
10k
100k
TPC 4. Power Supply Rejection vs. Frequency
5
5
MINIMUM SUPPLY VOLTAGE – V
4
ACCURACY ERROR – C
3
a. MAXIMUM LIMIT (G GRADE)
b. TYPICAL ACCURACY ERROR
c. MINIMUM LIMIT (G GRADE)
a
2
1
0
1
b
2
3
4
5
4
NO LOAD
3
b
2
a
1
a. TMP35/TMP36
b. TMP37
c
0
20
40
60
80
100
TEMPERATURE – C
120
0
50
140
TPC 2. Accuracy Error vs. Temperature
25
0
25
50
75
TEMPERATURE – C
100
125
TPC 5. Minimum Supply Voltage vs. Temperature
60
0.4
a. V+ = 5V
b. V+ = 3V
V+ = 3V to 5.5V, NO LOAD
50
0.3
SUPPLY CURRENT – A
POWER SUPPLY REJECTION – C/V
MINIMUM SUPPLY VOLTAGE REQUIRED TO MEET
DATA SHEET SPECIFICATION
0.2
0.1
NO LOAD
40
a
30
b
20
0
50
25
0
25
50
75
TEMPERATURE – C
100
10
50
125
TPC 3. Power Supply Rejection vs. Temperature
25
0
25
50
75
TEMPERATURE – C
100
125
TPC 6. Supply Current vs. Temperature
–4–
REV. C
TMP35/TMP36/TMP37
400
50
= SHUTDOWN PIN
HIGH TO LOW (3V TO 0V)
TA = 25°C, NO LOAD
300
RESPONSE TIME – s
SUPPLY CURRENT – A
40
30
20
200
100
= SHUTDOWN PIN
LOW TO HIGH (0V TO 3V)
VOUT SETTLES WITHIN ±1°C
10
0
0
1
2
3
4
5
SUPPLY VOLTAGE – V
6
0
50
8
7
TPC 7. Supply Current vs. Supply Voltage
100
125
0.8
a. V+ = 5V
b. V+ = 3V
30
20
a
10
0
25
50
75
TEMPERATURE – C
100
0.4
0.2
0
1.0
0.8
0.6
TA = 25 C
0.4
V+ AND SHUTDOWN =
SIGNAL
0.2
b
25
TA = 25 C
V+ = 3V
SHUTDOWN =
SIGNAL
0.6
OUTPUT VOLTAGE – V
SUPPLY CURRENT – nA
25
50
75
TEMPERATURE – C
1.0
NO LOAD
0
50
0
TPC 10. VOUT Response Time for Shutdown Pin vs.
Temperature
50
40
25
0
50
125
TPC 8. Supply Current vs. Temperature (Shutdown = 0 V)
0
50
100
150 200 250
TIME – µs
300
350
400
450
TPC 11. VOUT Response Time to Shutdown and V+
Pins vs. Time
400
110
a
100
90
PERCENT OF CHANGE – %
RESPONSE TIME – s
300
= V+ AND SHUTDOWN PINS
HIGH TO LOW (3V TO 0V)
200
= V+ AND SHUTDOWN PINS
LOW TO HIGH (0V TO 3V)
VOUT SETTLES WITHIN ±1°C
100
c
b
80
VIN = 3V, 5V
70
60
50
40
a. TMP35 SOIC SOLDERED TO 0.5" x 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" x 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" x 0.4" Cu PCB
30
20
10
0
50
25
0
25
50
75
TEMPERATURE – C
100
0
125
0
TPC 9. VOUT Response Time for V+ Power-Up/PowerDown vs. Temperature
REV. C
100
200
300
TIME – sec
400
500
600
TPC 12. Thermal Response Time in Still Air
–5–
TMP35/TMP36/TMP37
140
a. TMP35 SOIC SOLDERED TO 0.5" x 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" x 0.4" Cu PC
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" x 0.4" Cu PCB
10mV
1ms
100
90
100
VOLT/DIVISION
TIME CONSTANT – sec
120
80
VIN = 3V, 5V
60
b
40
10
c
0%
20
a
0
0
100
200
300
400
500
AIR VELOCITY – FPM
600
TIME/DIVISION
700
TPC 15. Temperature Sensor Wideband Output
Noise Voltage. Gain = 100, BW = 157 kHz
TPC 13. Thermal Response Time Constant in Forced Air
110
2400
a
2200
VOLTAGE NOISE DENSITY – nV/ Hz
100
90
c
CHANGE – %
80
70
VIN = 3V, 5V
b
60
50
40
30
20
a. TMP35 SOIC SOLDERED TO 0.5" x 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" x 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" x 0.4" Cu PCB
10
20
30
TIME – sec
40
50
1600
1400
1200
1000
800
600
a
400
0
10
60
b
1800
200
10
0
0
2000
a. TMP35/36
b. TMP37
100
1k
FREQUENCY – Hz
10k
TPC 16. Voltage Noise Spectral Density vs. Frequency
TPC 14. Thermal Response Time in Stirred Oil Bath
–6–
REV. C
TMP35/TMP36/TMP37
APPLICATIONS SECTION
Shutdown Operation
All TMP3x devices include a shutdown capability that reduces the
power supply drain to less than 0.5 µA maximum. This feature,
available only in the SOIC-8 and the SOT-23 packages, is TTL/
CMOS level compatible, provided that the temperature sensor
supply voltage is equal in magnitude to the logic supply voltage.
Internal to the TMP3x at the SHUTDOWN pin, a pull-up current
source to VIN is connected. This permits the SHUTDOWN pin to
be driven from an open-collector/drain driver. A logic LOW, or
zero-volt condition on the SHUTDOWN pin, is required to turn
the output stage OFF. During shutdown, the output of the
temperature sensors becomes a high impedance state where the
potential of the output pin would then be determined by external
circuitry. If the shutdown feature is not used, it is recommended
that the SHUTDOWN pin be connected to VIN (Pin 8 on the
SOIC-8, Pin 2 on the SOT-23).
The shutdown response time of these temperature sensors is
illustrated in TPCs 9, 10, and 11.
Mounting Considerations
If the TMP3x temperature sensors are thermally attached and
protected, they can be used in any temperature measurement
application where the maximum temperature range of the
medium is between –40°C to +125°C. Properly cemented or
glued to the surface of the medium, these sensors will be within
0.01°C of the surface temperature. Caution should be exercised,
especially with TO-92 packages, because the leads and any
wiring to the device can act as heat pipes, introducing errors if
the surrounding air-surface interface is not isothermal. Avoiding
this condition is easily achieved by dabbing the leads of the
temperature sensor and the hookup wires with a bead of
thermally conductive epoxy. This will ensure that the TMP3x
die temperature is not affected by the surrounding air temperature.
Because plastic IC packaging technology is used, excessive
mechanical stress should be avoided when fastening the device
with a clamp or a screw-on heat tab. Thermally conductive epoxy
or glue, which must be electrically nonconductive, is recommended
under typical mounting conditions.
These temperature sensors, as well as any associated circuitry,
should be kept insulated and dry to avoid leakage and corrosion.
In wet or corrosive environments, any electrically isolated metal
or ceramic well can be used to shield the temperature sensors.
Condensation at very cold temperatures can cause errors and
should be avoided by sealing the device, using electrically nonconductive epoxy paints or dip or any one of many printed circuit
board coatings and varnishes.
In the TO-92 package, the thermal resistance junction-to-case,
θJC, is 120°C/W. The thermal resistance case-to-ambient, θCA, is
the difference between θJA and θJC, and is determined by the
characteristics of the thermal connection. The temperature
sensor’s power dissipation, represented by PD, is the product of
the total voltage across the device and its total supply current
(including any current delivered to the load). The rise in die
temperature above the medium’s ambient temperature is given by:
TJ = PD × (θJC + θ CA ) + TA
Thus, the die temperature rise of a TMP35 “RT” package
mounted into a socket in still air at 25°C and driven from a 5 V
supply is less than 0.04°C.
The transient response of the TMP3x sensors to a step change
in the temperature is determined by the thermal resistances and
the thermal capacities of the die, CCH, and the case, CC. The
thermal capacity of the case, CC, varies with the measurement
medium since it includes anything in direct contact with the
package. In all practical cases, the thermal capacity of the case is
the limiting factor in the thermal response time of the sensor
and can be represented by a single-pole RC time constant
response. TPCs 12 and 14 illustrate the thermal response time
of the TMP3x sensors under various conditions. The thermal
time constant of a temperature sensor is defined as the time
required for the sensor to reach 63.2% of the final value for a
step change in the temperature. For example, the thermal time
constant of a TMP35 “S” package sensor mounted onto a 0.5"
by 0.3" PCB is less than 50 sec in air, whereas in a stirred oil
bath, the time constant is less than 3 seconds.
Basic Temperature Sensor Connections
Figure 4 illustrates the basic circuit configuration for the
TMP3x family of temperature sensors. The table shown in the
figure illustrates the pin assignments of the temperature sensors
for the three package types. For the SOT-23, Pin 3 is labeled as
“NC” as are Pins 2, 3, 6, and 7 on the SOIC-8 package. It is
recommended that no electrical connections be made to
these pins. If the shutdown feature is not needed on the
SOT-23 or the SOIC-8 package, the SHUTDOWN pin
should be connected to VS.
2.7V < Vs < 5.5V
0.1F
Vs
TMP3x
SHDN
GND
Thermal Environment Effects
The thermal environment in which the TMP3x sensors are used
determines two important characteristics: self-heating effects
and thermal response time. Illustrated in Figure 3 is a thermal
model of the TMP3x temperature sensors that is useful in
understanding these characteristics.
TJ
PD
CCH
JC
TC
PIN ASSIGNMENTS
CA
CC
TA
PACKAGE
VS
SOIC-8
SOT-23-5
TO-92
8
2
1
GND
4
5
3
VOUT
SHDN
1
1
2
5
4
NA
Figure 4. Basic Temperature Sensor Circuit Configuration
Figure 3. Thermal Circuit Model
REV. C
VOUT
–7–
TMP35/TMP36/TMP37
Note the 0.1 µF bypass capacitor on the input. This capacitor
should be a ceramic type, have very short leads (surface mount
would be preferable), and be located as close a physical proximity to the temperature sensor supply pin as practical. Since these
temperature sensors operate on very little supply current and
could be exposed to very hostile electrical environments, it is
important to minimize the effects of RFI (radio frequency
interference) on these devices. The effect of RFI on these
temperature sensors in specific and analog ICs in general is
manifested as abnormal dc shifts in the output voltage due to
the rectification of the high frequency ambient noise by the IC.
In those cases where the devices are operated in the presence of
high frequency radiated or conducted noise, a large value tantalum capacitor (⬎2.2 µF) placed across the 0.1 µF ceramic may
offer additional noise immunity.
The same circuit principles can be applied to the TMP36, but
because of the TMP36’s inherent offset, the circuit uses two less
resistors as shown in Figure 5b. In this circuit, the output
voltage transfer characteristic is 1 mV/°F but is referenced to
the circuit’s common; however, there is a 58 mV (58°F) offset
in the output voltage. For example, the output voltage of the
circuit would read 18 mV were the TMP36 placed in –40°F
ambient environment and 315 mV at 257°F.
VS
VS
0.1F
TMP36
VOUT
Fahrenheit Thermometers
Although the TMP3x temperature sensors are centigrade temperature sensors, a few components can be used to convert the
output voltage and transfer characteristics to directly read Fahrenheit temperatures. Shown in Figure 5a is an example of a
simple Fahrenheit thermometer using either the TMP35 or the
TMP37. This circuit can be used to sense temperatures from
41°F to 257°F, with an output transfer characteristic of 1 mV/°F
using the TMP35 and from 41°F to 212°F using the TMP37
with an output characteristic of 2 mV/°F. This particular
approach does not lend itself well to the TMP36 because of its
inherent 0.5 V output offset. The circuit is constructed with an
AD589, a 1.23 V voltage reference, and four resistors whose values
for each sensor are shown in the figure table. The scaling of the
output resistance levels was to ensure minimum output loading
on the temperature sensors. A generalized expression for the
circuit’s transfer equation is given by:
 R1 
 R3 
VOUT = 
 TMP 35 +  R3 + R4 AD589
R1+
R2




(
)
(
R1
45.3k
GND
R2
10k
VOUT @ 1mV/F – 58F
VOUT @ –40F = 18mV
VOUT @ +257F = 315mV
Figure 5b. TMP36 Fahrenheit Thermometer Version 1
At the expense of additional circuitry, the offset produced by the
circuit in Figure 5b can be avoided by using the circuit in Figure 5c. In
this circuit, the output of the TMP36 is conditioned by a singlesupply, micropower op amp, the OP193. Although the entire
circuit operates from a single 3 V supply, the output voltage of the
circuit reads the temperature directly, with a transfer characteristic of 1 mV/°F, without offset. This is accomplished through
the use of an ADM660, a supply voltage inverter. The 3 V
supply is inverted and applied to the P193’s V– terminal. Thus,
for a temperature range between –40°F and +257°F, the
output of the circuit reads –40 mV to +257 mV. A general
expression for the circuit’s transfer equation is given by:
)
where: TMP35 = Output voltage of the TMP35, or the TMP37,
at the measurement temperature, TM, and
AD589 = Output voltage of the reference = 1.23 V.
Note that the output voltage of this circuit is not referenced to
the circuit’s common. If this output voltage were to be applied
directly to the input of an ADC, the ADC’s common should be
adjusted accordingly.
 R6   R4
 R4 VS 
VOUT = 
 1+ R3 TMP 36 −  R3  2 
R5
+
R6



  
(
)
Average and Differential Temperature Measurement
VS
In many commercial and industrial environments, temperature
sensors are often used to measure the average temperature in a
building, or the difference in temperature between two locations
on a factory floor or in an industrial process. The circuits in
Figures 6a and 6b demonstrate an inexpensive approach
to average and differential temperature measurement.
In Figure 6a, an OP193 is used to sum the outputs of three
temperature sensors to produce an output voltage scaled by
10 mV/°C that represents the average temperature at three locations. The circuit can be extended to as many temperature
sensors as required as long as the circuit’s transfer equation
is maintained. In this application, it is recommended that one
temperature sensor type be used throughout the circuit; otherwise, the output voltage of the circuit will not produce an
accurate reading of the various ambient conditions.
0.1F
VS
R1
TMP35/37
VOUT
R2
GND
VOUT
AD589
1.23V
R3
R4
PIN ASSIGNMENTS
SENSOR
TCVOUT R1 (k) R2 (k) R3 (k) R4 (k)
TMP35
TMP37
1mV/F
2mV/F
45.3
45.3
10
10
10
10
374
182
Figure 5a. TMP35/TMP37 Fahrenheit Thermometers
–8–
REV. C
TMP35/TMP36/TMP37
+3V
R1
50k
R3
R4
0.1F
C1
10F
R2
50k
8
2
VS
VOUT
TMP36
10F/0.1F
R5
3
–40F ⱕ TA ⱕ +257 F
6
4
R6
GND
VOUT @ 1mV/ F
OP193
8
5
1
–3V
NC
ELEMENT
TMP36
R2
R4
R5
R6
2
258.6k
10k
47.7k
10k
10F
10F
ADM660
6
4
NC
3
7
Figure 5c. TMP36 Fahrenheit Thermometer Version 2
The circuit in Figure 6b illustrates how a pair of TMP3x sensors
can be used with an OP193 configured as a difference amplifier
to read the difference in temperature between two locations. In
these applications, it is always possible that one temperature
sensor would be reading a temperature below that of the other
sensor. To accommodate this condition, the output of the OP193
is offset to a voltage at one-half the supply via R5 and R6. Thus,
the output voltage of the circuit is measured relative to this point,
as shown in the figure. Using the TMP36, the output voltage of
the circuit is scaled by 10 mV/°C. To minimize error in the difference between the two measured temperatures, a common, readily
available thin-film resistor network is used for R1–R4.
2.7V < VS < 5.5V
2.7V < +VS < 5.5V
0.1F
2
0.1F
VTEMP( AVG)
@ 10mV/ C FOR TMP35/36
@ 20mV/ C FOR TMP35/36
7
TMP36
@ T1
1
3
R1*
R2*
R8
25k
OP193
4
0.1F
R5
100k
7
R1
300k
2
TMP3x
0.1F
R6
7.5k
R2
300k
TMP36
@ T2
R3*
OP193
6
3
4
R7
100k
R9
25k
TMP3x
VOUT
CENTERED AT
FOR R1 = R2 = R3 = R;
R3
300k
TMP3x
R4
7.5k
R4*
VTEMP( AVG) = 1 (TMP3x1 + TMP3x2 + TMP3x3)
3
R5 = R1
3
0 ⱕ TA ⱕ 125 C
R4 = R6
R5
100k
1F
R6
100k
VOUT = T2 – T1 @ 10mV/ C
V
CENTERED AT S
2
*R1–R4, CADDOCK T914–100k–100, OR EQUIVALENT
Figure 6a. Configuring Multiple Sensors for Average
Temperature Measurements
REV. C
Figure 6b. Configuring Multiple Sensors for Differential
Temperature Measurements
–9–
TMP35/TMP36/TMP37
Microprocessor Interrupt Generator
Thermocouple Signal Conditioning with Cold-Junction
Compensation
These inexpensive temperature sensors can be used with a
voltage reference and an analog comparator to configure an
interrupt generator useful in microprocessor applications. With
the popularity of fast 486 and Pentium® laptop computers, the
need to indicate a microprocessor overtemperature condition
has grown tremendously. The circuit illustrated in Figure 7
demonstrates one way to generate an interrupt using a TMP35,
a CMP402 analog comparator, and a REF191, a 2 V precision
voltage reference.
The circuit in Figure 8 conditions the output of a Type K
thermocouple, while providing cold-junction compensation for
temperatures between 0°C and 250°C. The circuit operates
from single 3.3 V to 5.5 V supplies and has been designed to
produce an output voltage transfer characteristic of 10 mV/°C.
The circuit has been designed to produce a logic HIGH interrupt
signal if the microprocessor temperature exceeds 80°C. This
80°C trip point was arbitrarily chosen (final value set by the
microprocessor thermal reference design) and is set using an
R3–R4 voltage divider of the REF191’s output voltage. Since
the output of the TMP35 is scaled by 10 mV/°C, the voltage at
the CMP402’s inverting terminal is set to 0.8 V.
Since temperature is a slowly moving quantity, the possibility
for comparator chatter exists. To avoid this condition, hysteresis
is used around the comparator. In this application, a hysteresis
of 5°C about the trip point was arbitrarily chosen; the ultimate
value for hysteresis should be determined by the end application.
The output logic voltage swing of the comparator with R1 and
R2 determine the amount of comparator hysteresis. Using a 3.3 V
supply, the output logic voltage swing of the CMP402 is 2.6 V;
thus, for a hysteresis of 5°C (50 mV @ 10 mV/°C), R1 is set to
20 kΩ and R2 is set to 1 MΩ. An expression for this circuit’s
hysteresis is given by:
 R1
VHYS =   VLOGIC SWING, CMP402
 R2
(
A Type K thermocouple exhibits a Seebeck coefficient of
approximately 41 µV/°C; therefore, at the cold junction, the
TMP35, with a temperature coefficient of 10 mV/°C, is
used with R1 and R2 to introduce an opposing cold-junction
temperature coefficient of –41 µV/°C. This prevents the
isothermal, cold-junction connection between the circuit’s PCB
tracks and the thermocouple’s wires from introducing an error
in the measured temperature. This compensation works extremely
well for circuit ambient temperatures in the range of 20°C to
50°C. Over a 250°C measurement temperature range, the
thermocouple produces an output voltage change of 10.151 mV.
Since the required circuit’s output full-scale voltage is 2.5 V, the
gain of the circuit is set to 246.3. Choosing R4 equal to 4.99 kΩ
sets R5 equal to 1.22 MΩ. Since the closest 1% value for R5 is
1.21 MΩ, a 50 kΩ potentiometer is used with R5 for fine trim of
the full-scale output voltage. Although the OP193 is a superior
single-supply, micropower operational amplifier, its output stage
is not rail-to-rail; as such, the 0°C output voltage level is 0.1 V.
If this circuit were to be digitized by a single-supply ADC, the
ADC’s common should be adjusted to 0.1 V accordingly.
Using TMP3x Sensors in Remote Locations
In many industrial environments, sensors are required to operate in the presence of high ambient noise. These noise sources
take on many forms; for example, SCR transients, relays, radio
transmitters, arc welders, ac motors, and so on. They may also
be used at considerable distances from the signal conditioning
circuitry. These high noise environments are very typically in the
form of electric fields, so the voltage output of the temperature sensor can be susceptible to contamination from these
noise sources.
)
Because of the likelihood that this circuit would be used in
close proximity to high speed digital circuits, R1 is split into
equal values and a 1000 pF is used to form a low-pass filter
on the output of the TMP35. Furthermore, to prevent high
frequency noise from contaminating the comparator trip point,
a 0.1 µF capacitor is used across R4.
3.3V
R2
1M
VS
0.1F
R1A
10k
VOUT
0.1F
3
R1B
10k
6
TMP35
R5
100k
4
2
C1
CL
1000pF
INTERRUPT
14
5
GND
0.1F
13
2
3
REF191
4
6
R3
16k
VREF
R4
10k
1F
>80C
<80C
0.1F
C1 = 1 CMP402
4
Figure 7. Pentium Overtemperature Interrupt Generator
Pentium is a registered trademark of Intel Corporation.
–10–
REV. C
TMP35/TMP36/TMP37
3.3V < VS < 5.5V
VS
0.1F
TMP35
P1
50k
R3
R4
10M
4.99k
5%
VOUT
R5*
1.21M
0.1F
GND
R1*
24.9k
7
2
6
OP193
CU
CHROMEL
3
4
TYPE K
THERMOCOUPLE
COLD
JUNCTION
CU
ALUMEL
0C ⱕ T ⱕ 250C
NOTE:
R6
100k
5%
VOUT
0V – 2.5V
ALL RESISTORS 1%
UNLESS OTHERWISE NOTED
R2*
102
ISOTHERMAL
BLOCK
Figure 8. A Single-Supply, Type K Thermocouple Signal Conditioning Circuit with Cold-Junction Compensation
Illustrated in Figure 9 is a way to convert the output voltage of a
TMP3x sensor into a current to be transmitted down a long
twisted-pair shielded cable to a ground referenced receiver. The
temperature sensors do not possess the capability of high output
current operation; thus, a garden variety PNP transistor is used
to boost the output current drive of the circuit. As shown in the
table, the values of R2 and R3 were chosen to produce an arbitrary full-scale output current of 2 mA. Lower values for the
full-scale current are not recommended. The minimum-scale
output current produced by the circuit could be contaminated
by nearby ambient magnetic fields operating in the vicinity of
the circuit/cable pair. Because of the use of an external transistor, the minimum recommended operating voltage for this
circuit is 5 V. Note, to minimize the effects of EMI (or RFI),
both the circuit’s and the temperature sensor’s supply pins are
bypassed with good quality, ceramic capacitors.
R1
4.7k
A Temperature to 4–20 mA Loop Transmitter
In many process control applications, 2-wire transmitters are
used to convey analog signals through noisy ambient environments. These current transmitters use a “zero-scale” signal
current of 4 mA that can be used to power the transmitter’s
signal conditioning circuitry. The “full-scale” output signal in
these transmitters is 20 mA.
A circuit that transmits temperature information in this fashion
is illustrated in Figure 10. Using a TMP3x as the temperature
sensor, the output current is linearly proportional to the temperature of the medium. The entire circuit operates from the
3 V output of the REF193. The REF193 requires no external
trimming for two reasons: (1) the REF193’s tight initial output
voltage tolerance and (2) the low supply current of TMP3x, the
OP193 and the REF193. The entire circuit consumes less than
3 mA from a total budget of 4 mA. The OP193 regulates the
output current to satisfy the current summation at the noninverting
node of the OP193. A generalized expression for the KCL
equation at the OP193’s Pin 3 is given by:
5V
2N2907
 1   TMP 3x × R3 VREF × R3
IOUT =   × 
+
R1
R2 
 R 7 
VOUT
VS
0.1F
R3
0.01F
TMP3x
GND
VOUT
Table II. Circuit Element Values for Loop Transmitter
R2
TWISTED PAIR
BELDEN TYPE 9502
OR EQUIVALENT
SENSOR
R2
R3
TMP35
634
634
TMP36
887
887
TMP37
1k
1k
For each of the three temperature sensors, the table below illustrates the values for each of the components, P1, P2, and R1–R4:
Sensor
R1()
P1() R2()
P2() R3() R4()
TMP35
TMP36
TMP37
97.6 k
97.6 k
97.6 k
5k
5k
5k
100 k
50 k
500
Figure 9. A Remote, 2-Wire Boosted Output Current Temperature Sensor
REV. C
–11–
1.58 M
931 k
10.5 k
140 k
97.6 k
84.5 k
56.2 k
47 k
8.45 k
TMP35/TMP36/TMP37
The 4 mA offset trim is provided by P2, and P1 provides the
circuit’s full-scale gain trim at 20 mA. These two trims do not
interact because the noninverting input of the OP193 is held at
a virtual ground. The zero-scale and full-scale output currents of
the circuit are adjusted according to the operating temperature
range of each temperature sensor. The Schottky diode, D1, is
required in this circuit to prevent loop supply power-on transients from pulling the noninverting input of the OP193 more
than 300 mV below its inverting input. Without this diode, such
transients could cause phase reversal of the operational amplifier
and possible latchup of the transmitter. The loop supply voltage
compliance of the circuit is limited by the maximum applied
input voltage to the REF193 and is from 9 V to 18 V.
5V
8
6
7
4
AD654
3
1
fOUT
GND
5
2
R1
RT*
NB: ATTA (min), fOUT = 0Hz
5V
P1
fOUT
P2
100k
ROFF1
470
SENSOR
TMP35
TMP36
TMP37
*RT AND CT – SEE TABLE
OFFSET
ROFF2
10
RT (R1 + P1)
CT
11.8k + 500 1.7nF
16.2k + 500 1.8nF
18.2k + 1k 2.1nF
Figure 11. A Temperature-to-Frequency Converter
An offset trim network (fOUT OFFSET ) is included with this
circuit to set fOUT at 0 Hz when the temperature sensor’s minimum output voltage is reached. Potentiometer P1 is required to
calibrate the absolute accuracy of the AD654. The table in
Figure 11 illustrates the circuit element values for each of the
three sensors. The nominal offset voltage required for 0 Hz
output from the TMP35 is 50 mV; for the TMP36 and
TMP37, the offset voltage required is 100 mV. In all cases
for the circuit values shown, the output frequency transfer
characteristic of the circuit was set at 50 Hz/°C. At the receiving
end, a frequency-to-voltage converter (FVC) can be used to
convert the frequency back to a dc voltage for further processing. One such FVC is the AD650.
The circuit in Figure 11 illustrates a method by which the
outputs of these temperature sensors can be converted to a
frequency using the AD654. The output signal of the AD654 is
a square wave that is proportional to the dc input voltage across
Pins 4 and 3. The transfer equation of the circuit is given by:
)
VOUT
TMP3x
10F/0.1F
Another common method of transmitting analog information
from a remote location is to convert a voltage to an equivalent in
the frequency domain. This is readily done with any of the
low cost, monolithic voltage-to-frequency converters (VFCs)
available. These VFCs feature a robust, open-collector output
transistor for easy interfacing to digital circuitry. The digital
signal produced by the VFC is less susceptible to contamination
from external noise sources and line voltage drops because the
only important information is the frequency of the digital signal.
As long as the conversions between temperature and frequency
are done accurately, the temperature data from the sensors can
be reliably transmitted.
(
RPU
5k
VS
A Temperature to Frequency Converter
V
− VOFFSET
f OUT =  TMP
 10 × RT × CT

CT*
0.1F



For complete information on the AD650 and AD654, please
consult the individual data sheets for those devices.
3V
2
6
REF193
VS
R2*
1F
P2*
4mA
ADJUST
0.1F
R1*
3
TMP3x
VOUT
GND
P1*
20mA
ADJUST
7
4
VLOOP
9V TO 18V
R6
100k
2
Q1
2N1711
VOUT
4
D1
R3*
R5
100k
R4*
*SEE TEXT
FOR VALUES
RL
250
R7
100
D1: HP5082–2810
A1: OP193
IL
Figure 10. A Temperature to 4-to-20 mA Loop Transmitter
–12–
REV. C
TMP35/TMP36/TMP37
Driving Long Cables or Heavy Capacitive Loads
Commentary on Long-Term Stability
Although the TMP3x family of temperature sensors is capable
of driving capacitive loads up to 10,000 pF without oscillation,
output voltage transient response times can be improved with
the use of a small resistor in series with the output of the temperature
sensor, as shown in Figure 12. As an added benefit, this resistor
forms a low-pass filter with the cable’s capacitance, which helps
to reduce bandwidth noise. Since the temperature sensor is
likely to be used in environments where the ambient noise level
can be very high, this resistor helps to prevent rectification by the
devices of the high frequency noise. The combination of this
resistor and the supply bypass capacitor offers the best protection.
The concept of long-term stability has been used for many years
to describe by what amount an IC’s parameter would shift during its lifetime. This is a concept that has been typically applied
to both voltage references and monolithic temperature sensors.
Unfortunately, integrated circuits cannot be evaluated at room
temperature (25°C) for 10 years or so to determine this shift. As
a result, manufacturers very typically perform accelerated lifetime testing of integrated circuits by operating ICs at elevated
temperatures (between 125°C and 150°C) over a shorter period
of time (typically, between 500 and 1000 hours).
+VS
0.1F
TMP3x
As a result of this operation, the lifetime of an integrated circuit
is significantly accelerated due to the increase in rates of reaction within the semiconductor material.
VOUT 750
LONG CABLE OR
HEAVY CAPACITIVE
LOADS
GND
Figure 12. Driving Long Cables or Heavy Capacitive Loads
REV. C
–13–
TMP35/TMP36/TMP37
OUTLINE DIMENSIONS
3-Pin Plastic Header-Style Package [TO-92]
(TO-92)
8-Lead Standard Small Outline Package [SOIC]
Narrow Body
(RN-8)
Dimensions shown in inches and (millimeters)
Dimensions shown in millimeters and (inches)
0.205 (5.21)
0.175 (4.45)
0.135
(3.43)
MIN
5.00 (0.1968)
4.80 (0.1890)
0.210 (5.33)
0.170 (4.32)
4.00 (0.1574)
3.80 (0.1497)
0.050
(1.27)
MAX
SEATING
PLANE
5
1
4
0.50 (0.0196)
ⴛ 45ⴗ
0.25 (0.0099)
1.75 (0.0688)
1.35 (0.0532)
0.25 (0.0098)
0.10 (0.0040)
0.51 (0.0201)
0.33 (0.0130)
COPLANARITY
SEATING
0.10
PLANE
8ⴗ
0.25 (0.0098) 0ⴗ 1.27 (0.0500)
0.41 (0.0160)
0.19 (0.0075)
COMPLIANT TO JEDEC STANDARDS MS-012AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.055 (1.40)
0.045 (1.15)
0.105 (2.66)
0.095 (2.42)
6.20 (0.2440)
5.80 (0.2284)
1.27 (0.0500)
BSC
0.019 (0.482)
SQ
0.016 (0.407)
0.500
(12.70)
MIN
8
0.115 (2.92)
0.080 (2.03)
1
0.115 (2.92)
0.080 (2.03)
2
3
0.165 (4.19)
0.125 (3.18)
5-Lead Plastic Surface-Mount Package [SOT-23]
(RT-5)
BOTTOM VIEW
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS TO-226AA
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
2.90 BSC
5
4
2.80 BSC
1.60 BSC
1
2
3
PIN 1
0.95 BSC
1.30
1.15
0.90
1.90
BSC
1.45 MAX
0.15 MAX
0.50
0.30
SEATING
PLANE
0.22
0.08
10ⴗ
0ⴗ
0.60
0.45
0.30
COMPLIANT TO JEDEC STANDARDS MO-178AA
Revision History
Location
Page
10/02—Data Sheet changed from REV. B to REV. C.
Deleted text from Commentary on Long-Term Stability section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Update OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
–14–
REV. C
–15–
–16–
PRINTED IN U.S.A.
C00337–0–10/02(C)