ETC HFBR

Fiber Optic Transmitter
and Receiver Data Links
for 266 MBd
Technical Data
HFBR-1119T Transmitter
HFBR-2119T Receiver
Features
• Full Compliance with the
Optical Performance
Requirements of the Fibre
Channel Physical Layer
• Other Versions Available for:
- FDDI
- ATM
• Compact 16-pin DIP Package
with Plastic ST* Connector
• Wave Solder and Aqueous
Wash Process Compatible
Package
• Manufactured in an ISO
9001 Certified Facility
applications specified at 266 MBd
for Fibre Channel applications or
for general-purpose fiber optic
data link transmission.
These modules are designed for
50 or 62.5 µm core multimode
optical fiber and operate at a
nominal wavelength of 1300 nm.
They incorporate our highperformance, reliable, longwavelength, optical devices and
proven circuit technology to give
long life and consistent
performance.
Transmitter
Applications
• Fibre Channel Interfaces
• Multimode Fiber Optic Links
up to 266 MBd at 1500 m
• General Purpose, Point-toPoint Data Communications
• Replaces DLT/R1040-ST2
Model Transmitters and
Receivers
Description
The HFBR-1119/-2119 series of
data links are high-performance,
cost-efficient, transmitter and
receiver modules for serial
optical data communication
The transmitter utilizes a 1300 nm
surface-emitting InGaAsP LED,
packaged in an optical subassembly. The LED is dc-coupled to a
custom IC which converts
differential-input, PECL logic
signals, ECL-referenced (shifted)
to a +5 V power supply, into an
analog LED drive current.
Receiver
The receiver utilizes an InGaAs
PIN photodiode coupled to a
custom silicon transimpedance
preamplifier IC. The PINpreamplifier combination is ac-
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
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coupled to a custom quantizer IC
which provides the final pulse
shaping for the logic output and
the Signal Detect function. Both
the Data and Signal Detect
Outputs are differential. Also,
both Data and Signal Detect
Outputs are PECL compatible,
ECL-referenced (shifted) to a
+5 V power supply.
Package
The overall package concept for
the Data Links consists of the
following basic elements: two
optical subassemblies, two
electrical subassemblies, and the
outer housings as illustrated in
Figure 1.
2
RECEIVER
DATA IN
DIFFERENTIAL
The package outline drawing and
pinout are shown in Figures 2
and 3. The details of this package
outline and pinout are compatible
with other data-link modules from
other vendors.
PIN PHOTODIODE
DIFFERENTIAL
QUANTIZER
IC
SIGNAL
DETECT OUT
PREAMP IC
OPTICAL
SUBASSEMBLIES
ELECTRICAL
SUBASSEMBLIES
SIMPLEX ST®
RECEPTACLE
The optical subassemblies consist
of a transmitter subassembly in
which the LED resides and a
receiver subassembly housing the
PIN-preamplifier combination.
TRANSMITTER
DIFFERENTIAL
DATA IN
VBB
DRIVER IC
LED
The electrical subassemblies consist of a multi-layer printed circuit
board on which the IC chips and
various surface-mounted, passive
circuit elements are attached.
TOP VIEW
Figure 1. Transmitter and Receiver Block Diagram.
THREADS
3/8 – 32 UNEF-2A
HFBR-111X/211XT
DATE CODE (YYWW)
SINGAPORE
12.19
MAX.
8.31
41 MAX.
5.05
0.9
7.01
9.8 MAX.
5.0
2.45
19.72
NOTES:
12
1. MATERIAL ALLOY 194 1/2H – 0.38 THK
FINISH MATTE TIN PLATE 7.6 µm MIN.
2. MATERIAL PHOSPHOR BRONZE WITH
120 MICROINCHES TIN LEAD (90/10)
OVER 50 MICROINCHES NICKEL.
17.78
(7 x 2.54)
8 x 7.62
3. UNITS = mm
HOUSING PINS 0.38 x 0.5 mm
NOTE 1
PCB PINS
DIA. 0.46 mm
NOTE 2
Figure 2. Package Outline Drawing.
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3
3
OPTICAL PORT
NC
OPTICAL PORT
9
8
NC
GND
10
7
NO PIN
VCC
11
6
GND
9
8
NC
NO PIN
NC
10
7
GND
GND
11
6
VCC
VCC
12
5
GND
GND
12
5
VCC
GND
13
4
GND
GND
13
4
VCC
DATA
14
3
GND
SD
14
3
DATA
SD
15
2
DATA
NO PIN
16
1
NC
DATA
15
2
VBB
NC
16
1
NC
TRANSMITTER
OPTICAL POWER BUDGET – dB
8
7
6
5
62.5/125 µm
4
3
2
50/125 µm
1
0
0
0.5
1
1.5
2
FIBER OPTIC CABLE LENGTH – km
Figure 4. Optical Power Budget at
BOL vs. Fiber Optic Cable Length.
RECEIVER
Figure 3. Pinout Drawing.
Each transmitter and receiver
package includes an internal shield
for the electrical subassembly to
ensure low EMI emissions and high
immunity to external EMI fields.
The outer housing, including the
ST* port, is molded of filled, nonconductive plastic to provide
mechanical strength and electrical
isolation. For other port styles,
please contact your Agilent Sales
Representative.
Each data-link module is attached
to a printed circuit board via the
16-pin DIP interface. Pins 8 and 9
provide mechanical strength for
these plastic-port devices and will
provide port-ground for forthcoming metal-port modules.
Application Information
The Applications Engineering
group of the Optical Communication Division is available to assist
you with the technical understanding and design tradeoffs associated
with these transmitter and receiver
modules. You can contact them
through your Agilent sales
representative.
The following information is
provided to answer some of the
most common questions about the
use of these parts.
Transmitter and Receiver
Optical Power Budget
versus Link Length
The Optical Power Budget (OPB)
is the available optical power for a
fiber-optic link to accommodate
fiber cable losses plus losses due to
in-line connectors, splices, optical
switches, and to provide margin for
link aging and unplanned losses
due to cable plant reconfiguration
or repair.
Figure 4 illustrates the predicted
OPB associated with the transmitter and receiver specified in this
data sheet at the Beginning of Life
(BOL). This curve represents the
attenuation and chromatic plus
modal dispersion losses associated
with 62.5/125 µm and 50/125 µm
fiber cables only. The area under
the curve represents the remaining
OPB at any link length, which is
available for overcoming non-fiber
cable related losses.
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
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Agilent LED technology has
produced 1300 nm LED devices
with lower aging characteristics
than normally associated with
these technologies in the industry.
The industry convention is 1.5 dB
aging for 1300 nm LEDs; however,
HP 1300 nm LEDs will experience
less than 1 dB of aging over
normal commercial equipment
mission-life periods. Contact your
Agilent sales representative for
additional details.
Figure 4 was generated with an
Agilent fiber-optic link model
containing the current industry
conventions for fiber cable
specifications and Fibre Channel
optical parameters. These
parameters are reflected in the
guaranteed performance of the
transmitter and receiver specifications in this data sheet. This same
model has been used extensively in
the ANSI and IEEE committees,
including the ANSI X3T9.5
committee, to establish the optical
performance requirements for
various fiber-optic interface
standards. The cable parameters
used come from the ISO/IEC JTC1/
4
Transmitter and Receiver
Signaling Rate Range and
BER Performance
For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to encode
the data (symbols/bit).
The specifications in this data
sheet have all been measured using
the standard Fibre Channel symbol
rate of 266 MBd.
The data link modules can be used
for other applications at signaling
rates different than specified in this
data sheet. Depending on the
actual signaling rate, there may be
some differences in optical power
budget. This is primarily caused by
a change in receiver sensitivity.
These data link modules can also
be used for applications which
require different bit-error-ratio
(BER) performance. Figure 5
illustrates the typical trade-off
between link BER and the receiver
input optical power level.
Data Link Jitter
Performance
The Agilent 1300 nm data link
modules are designed to operate
per the system jitter allocations
stated in FC-PH Annex A.4.3 and
A.4.4.
The 1300 nm transmitter will
tolerate the worst-case input
electrical jitter allowed, without
violating the worst-case output
optical jitter requirements.
1 x 10-2
Care should be taken to avoid
shorting the receiver Data or
Signal Detect Outputs directly to
ground without proper currentlimiting impedance.
1 x 10-3
BIT ERROR RATIO
SC 25/WG3 Generic Cabling for
Customer Premises per DIS 11801
document and the EIA/TIA-568-A
Commercial Building Telecommunications Cabling Standard per
SP-2840.
1 x 10-4
CENTER OF SYMBOL
1 x 10-5
10-6
1x
1 x 10-7
1 x 10-8
1 x 10-9
1 x 10-10
1 x 10-11
1 x 10-12
-6
Solder and Wash Process
Compatibility
-4
-2
0
2
RELATIVE INPUT OPTICAL POWER – dB
CONDITIONS:
1. 266 MBd
2. PRBS 27-1
3. TA = 25 °C
4. VCC = 5 Vdc
5. INPUT OPTICAL RISE/FALL TIMES =
1.0/1.9 ns
Figure 5. HFBR-1119T/2119T BitError-Ratio vs. Relative Receiver
Input Optical Power.
The 1300 nm receiver will tolerate
the worst-case input optical jitter
allowed without violating the
worst-case output electrical jitter
allowed.
The jitter specifications stated in
the following transmitter and
receiver specification tables are
derived from the values in FC-PH
Annex A.4.3 and A.4.4. They
represent the worst-case jitter
contribution that the transmitter
and receiver are allowed to make
to the overall system jitter without
violating the allowed allocation. In
practice, the typical jitter contribution of the Agilent data link
modules is well below the
maximum allowed amounts.
Recommended Handling
Precautions
It is advised that normal static precautions be taken in the handling
and assembly of these data link
modules to prevent damage which
may be induced by electrostatic
discharge (ESD). The HFBR-1119/
-2119 series meets MIL-STD-883C
Method 3015.4 Class 2.
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The transmitter and receiver are
delivered with protective process
caps covering the individual ST*
ports. These process caps protect
the optical subassemblies during
wave solder and aqueous wash
processing and act as dust covers
during shipping.
These data link modules are
compatible with either industry
standard wave- or hand-solder
processes.
Shipping Container
The data link modules are
packaged in a shipping container
designed to protect it from
mechanical and ESD damage
during shipment or storage.
Board Layout–Interface
Circuit and Layout
Guidelines
It is important to take care in the
layout of your circuit board to
achieve optimum performance
from these data link modules.
Figure 6 provides a good example
of a power supply filter circuit that
works well with these parts. Also,
suggested signal terminations for
the Data, Data-bar, Signal Detect
and Signal Detect-bar lines are
shown. Use of a multilayer,
ground-plane printed circuit board
will provide good high-frequency
circuit performance with a low
inductance ground return path. See
additional recommendations noted
in the interface schematic shown in
Figure 6.
5
Rx
Tx
*
A
L2
1
+5 Vdc
C2
0.1
GND
9 NC
NC 8
10 GND
NO 7
PIN
11 VCC
*
*
9 NC
NC 8
GND 7
GND 6
10 NO
PIN
11 GND
12 VCC
GND 5
12 GND
VCC 5
VCC 4
13 GND
GND 4
13 GND
14 D
GND 3
14 SD
D 3
DATA
15 D
VBB 2
15 SD
D 2
NC 1
NO
16 PIN
NC 1
R2
82
R4
130
R1
130
16 NC
L1
1
VCC 6
DATA
R3
82
*
C1
0.1
C7
10
(OPTIONAL)
C3
0.1
A
C4
10
DATA
DATA
R7
82
C6
0.1
R5
82
R8
130
R6
130
R9
82
C5
0.1
R11
82
SD
SD
TERMINATE D, D
AT Tx INPUTS
TOP VIEWS
R10
130
R12
130
TERMINATE D, D, SD, SD AT
INPUTS OF FOLLOW-ON DEVICES
NOTES:
1. RESISTANCE IS IN OHMS. CAPACITANCE IS IN MICROFARADS. INDUCTANCE IS IN MICROHENRIES.
2. TERMINATE TRANSMITTER INPUT DATA AND DATA-BAR AT THE TRANSMITTER INPUT PINS. TERMINATE THE RECEIVER OUTPUT DATA, DATA-BAR, AND SIGNAL DETECTBAR AT THE FOLLOW-ON DEVICE INPUT PINS. FOR LOWER POWER DISSIPATION IN THE SIGNAL DETECT TERMINATION CIRCUITRY WITH SMALL COMPROMISE TO THE
SIGNAL QUALITY, EACH SIGNAL DETECT OUTPUT CAN BE LOADED WITH 510 OHMS TO GROUND INSTEAD OF THE TWO RESISTOR, SPLIT-LOAD PECL TERMINATION
SHOWN IN THIS SCHEMATIC.
3. MAKE DIFFERENTIAL SIGNAL PATHS SHORT AND OF SAME LENGTH WITH EQUAL TERMINATION IMPEDANCE.
4. SIGNAL TRACES SHOULD BE 50 OHMS MICROSTRIP OR STRIPLINE TRANSMISSION LINES. USE MULTILAYER, GROUND-PLANE PRINTED CIRCUIT BOARD FOR BEST HIGHFREQUENCY PERFORMANCE.
5. USE HIGH-FREQUENCY, MONOLITHIC CERAMIC BYPASS CAPACITORS AND LOW SERIES DC RESISTANCE INDUCTORS. RECOMMEND USE OF SURFACE-MOUNT COIL
INDUCTORS AND CAPACITORS. IN LOW NOISE POWER SUPPLY SYSTEMS, FERRITE BEAD INDUCTORS CAN BE SUBSTITUTED FOR COIL INDUCTORS. LOCATE POWER
SUPPLY FILTER COMPONENTS CLOSE TO THEIR RESPECTIVE POWER SUPPLY PINS. C7 IS AN OPTIONAL BYPASS CAPACITOR FOR IMPROVED, LOW-FREQUENCY NOISE
POWER SUPPLY FILTER PERFORMANCE.
6. DEVICE GROUND PINS SHOULD BE DIRECTLY AND INDIVIDUALLY CONNECTED TO GROUND.
7. CAUTION: DO NOT DIRECTLY CONNECT THE FIBER-OPTIC MODULE PECL OUTPUTS (DATA, DATA-BAR, SIGNAL DETECT, SIGNAL DETECT-BAR, V BB) TO GROUND WITHOUT
PROPER CURRENT LIMITING IMPEDANCE.
8. (*) OPTIONAL METAL ST OPTICAL PORT TRANSMITTER AND RECEIVER MODULES WILL HAVE PINS 8 AND 9 ELECTRICALLY CONNECTED TO THE METAL PORT ONLY AND
NOT CONNECTED TO THE INTERNAL SIGNAL GROUND.
Figure 6. Recommended Interface Circuitry and Power Supply Filter Circuits.
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6
Board Layout–Hole
Pattern
The Agilent transmitter and
receiver hole pattern is compatible
with other data link modules from
other vendors. The drawing shown
in Figure 7 can be used as a guide
in the mechanical layout of your
circuit board.
(16X) ø 0.8 ± 0.1
.032 ± .004
–A–
Ø 0.000 M A
17.78
.700
(7X) 2.54
.100
7.62
.300
TOP VIEW
UNITS = mm/INCH
Figure 7. Recommended Board Layout Hole Pattern.
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7
∆λc – TRANSMITTER OUTPUT OPTICAL
SPECTRAL WIDTH (FWHM) – nm
Regulatory Compliance
These data link modules are
intended to enable commercial
system designers to develop
equipment that complies with the
various international regulations
governing certification of Information Technology Equipment.
Additional information is available
from your Agilent sales
representative.
The material used for the housing
in the HFBR-1119/-2119 series is
Ultem 2100 (GE). Ultem 2100 is
recognized for a UL flammability
rating of 94V-0 (UL File Number
E121562) and the CSA (Canadian
Standards Association) equivalent
(File Number LS88480).
200
180
tr = 1.8 ns
tr = 1.9 ns
160
tr = 2.0 ns
140
tr = 2.1 ns
120
tr = 2.2 ns
TRANSMITTER
OUTPUT OPTICAL
RISE TIMES – ns
100
80
60
1280
1300
1320
1340
1360
1380
λc – TRANSMITTER OUTPUT OPTICAL
CENTER WAVELENGTH – nm
HFBR-1119T TYPICAL TRANSMITTER TEST
RESULTS OF λc, ∆λ AND tr ARE CORRELATED
AND COMPLY WITH THE ALLOWED SPECTRAL
WIDTH AS A FUNCTION OF CENTER WAVELENGTH
FOR VARIOUS RISE AND FALL TIMES.
Figure 8. Typical Transmitter Output Optical Spectral Width (FWHM) vs.
Transmitter Output Optical Center Wavelength and Rise/Fall Times.
RELATIVE INPUT OPTICAL POWER – dB
All HFBR-1119T LED transmitters
are classified as IEC-825-1
Accessible Emission Limit (AEL)
Class 1 based upon the current
proposed draft scheduled to go
into effect on January 1, 1997. AEL
Class 1 LED devices are considered eye safe. See Application Note
1094, LED Device Classifications
with Respect to AEL Values as
Defined in the IEC 825-1
Standard and the European
EN60825-1 Directive.
220
5
4
3
2
1
0
-1.5
-1
-0.5
0
0.5
1
1.5
EYE SAMPLING TIME POSITION – ns
CONDITIONS:
1. TA = 25 °C
2. VCC = 5 Vdc
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/1.9 ns
4. INPUT OPTICAL POWER IS NORMALIZED
TO CENTER OF DATA SYMBOL
5. NOTES 11 AND 12 APPLY
Figure 9. HFBR-2119T Receiver
Relative Input Optical Power vs. Eye
Sampling Time Position.
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8
HFBR-1119T Transmitter Pin-Out Table
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Symbol
NC
VBB
GND
GND
GND
GND
OMIT
NC
NC
GND
VCC
VCC
GND
DATA
DATA
NC
Functional Description
No internal connect, used for mechanical strength only
VBB Bias output
Ground
Ground
Ground
Ground
No pin
No internal connect, used for mechanical strength only
No internal connect, used for mechanical strength only
Ground
Common supply voltage
Common supply voltage
Ground
Data input
Inverted Data input
No internal connect, used for mechanical strength only
Reference
Note 3
Note 3
Note 3
Note 3
Note 5
Note 5
Note 3
Note 1
Note 1
Note 3
Note 4
Note 4
HFBR-2119T Receiver Pin-Out Table
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Symbol
NC
DATA
DATA
VCC
VCC
VCC
GND
NC
NC
OMIT
GND
GND
GND
SD
SD
OMIT
Functional Description
No internal connect, used for mechanical strength only
Inverted Data input
Data input
Common supply voltage
Common supply voltage
Common supply voltage
Ground
No internal connect, used for mechanical strength only
No internal connect, used for mechanical strength only
No pin
Ground
Ground
Ground
Signal Detect
Inverted Signal Detect
No pin
Reference
Note 4
Note 4
Note 1
Note 1
Note 1
Note 3
Note 5
Note 5
Note 3
Note 3
Note 3
Note 2, 4
Note 2, 4
Notes:
1. Voltages on VCC must be from the same power supply (they are connected together internally).
2. Signal Detect is a logic signal that indicates the presence or absence of an input optical signal. A logic-high, VOH, on Signal Detect
indicates presence of an input optical signal. A logic-low, VOL, on Signal Detect indicates an absence of input optical signal.
3. All GNDs are connected together internally and to the internal shield.
4. DATA, DATA, SD, SD are open-emitter output circuits.
5. On metal-port modules, these pins are redefined as “Port Connection.”
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9
Specifications–Absolute Maximum Ratings
Parameter
Storage Temperature
Lead Soldering Temperature
Lead Soldering Time
Supply Voltage
Data Input Voltage
Differential Input Voltage
Output Current
Symbol
TS
TSOLD
tSOLD
VCC
VI
VD
IO
Min.
-40
Typ.
-0.5
-0.5
Max.
100
260
10
7.0
VCC
1.4
50
Unit
°C
°C
sec.
V
V
V
mA
Reference
Max.
70
5.5
-1.475
-0.880
Unit
°C
V
V
V
Ω
Reference
Reference
Note 4
Note 16
Note 21
Note 1
Note 2
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltage
Data Input Voltage–Low
Data Input Voltage–High
Data and Signal Detect Output Load
Symbol
TA
VCC
VIL - VCC
VIH - VCC
RL
Min.
0
4.5
-1.810
-1.165
Typ.
50
Note 3
HFBR-1119T Transmitter Electrical Characteristics
(TA = 0°C to 70°C, VCC 4.5 V to 5.5 V)
Parameter
Supply Current
Power Dissipation
Threshold Voltage
Data Input Current–Low
Data Input Current–High
Symbol
ICC
P DISS
VBB - VCC
IIL
IIH
Min.
-1.42
-350
Typ.
165
0.86
-1.3
0
14
Max.
185
1.1
-1.24
350
Unit
mA
W
V
µA
µA
Typ.
100
0.3
Unit
mA
W
V
V
ns
ns
V
Reference
Note 15
Note 16
Note 17
Note 17
Note 18
Note 18
Note 17
HFBR-2119T Receiver Electrical Characteristics
(TA = 0°C to 70°C, VCC = 4.5 V to 5.5 V)
Parameter
Supply Current
Power Dissipation
Data Output Voltage–Low
Data Output Voltage–High
Data Output Rise Time
Data Output Fall Time
Signal Detect Output
Voltage–Low (De-asserted)
Signal Detect Output
Voltage–High (Asserted)
Signal Detect Output Rise Time
Signal Detect Output Fall Time
Signal Detect Assert Time (off to on)
Sighal Detect De-assert Time (on to off)
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Symbol
ICC
PDISS
VOL - VCC
VOH - VCC
tr
tf
VOL - VCC
-1.840
-1.045
0.35
0.35
-1.840
Max.
165
0.5
-1.620
-0.880
2.2
2.2
-1.620
VOH - VCC
-1.045
-0.880
V
Note 17
tr
tf
0.35
0.35
0
0
2.2
2.2
100
350
ns
ns
µs
µs
Note 18
Note 18
Note 19
Note 20
tSDA
tSDD
Min.
55
110
10
HFBR-1119T Transmitter Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.5 V to 5.5 V)
Parameter
Output Optical Power
62.5/125 µm, NA = 0.275 Fiber
Output Optical Power
50/125 µm, NA = 0.20 Fiber
Optical Extinction Ratio
Symbol
PO, BOL
PO, EOL
PO, BOL
Min.
-19
-20
-22.5
Typ.
Max.
-14
-14
-14
0.03
-35
1380
Unit
dBm
avg.
dBm
avg.
% dB
Reference
Note 5
nm
Note 7
Figure 8
Note 7
Figure 8
Note 8
Figure 8
Note 8
Figure 8
Note 9
Note 5
Note 6
Center Wavelength
λC
Spectral Width–FWHM
∆λ
Optical Rise Time
tr
0.6
2.0
ns
Optical Fall Time
tf
0.6
2.2
ns
0.08
0.30
0.03
0.11
ns rms
ns p-p
ns p-p
ns p-p
Max
-26
Unit
dBm
avg.
Reference
Note 11
Figure 9
-28
dBm
avg.
Note 12
Figure 9
dBm
avg.
Note 11
Deterministic Jitter Contributed by
the Transmitter
Random Jitter Contributed by the
Transmitter
1280
1308
137
DJC
RJC
nm
Note 10
HFBR-2119T Receiver Optical Characteristics
(TA = 0°C to 70°C, VCC = 4.5 V to 5.5 V)
Parameter
Symbol
Input Optical Power
PIN Min. (W)
Minimum at Window Edge
Input Optical Power
Minimum at Eye Center
Min.
Typ.
PIN Min. (C)
Input Optical Power Maximum
PIN Max.
-14
Operating Wavelength
λ
1270
1380
nm
Signal Detect–Asserted
PA
PD+1.5 dB
-27
dBm
avg.
Note 13, 19
Signal Detect–De-asserted
PD
-45
dBm
avg.
Note 14, 20
PA-P D
1.5
Signal Detect–Hysteresis
2.4
dB
Deterministic Jitter Contributed
by the Receiver
DJC
0.24
0.90
ns rms
ns p-p
Note 9, 11
Random Jitter Contributed by
the Receiver
RJC
0.26
0.97
ns rms
ns p-p
Note 10, 11
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11
Notes:
1. This is the maximum voltage that can
be applied across the Differential
Transmitter Data Inputs to prevent
damage to the input ESD protection
circuit.
2. When component testing these
products, do not short the receiver
Data or Signal Detect outputs directly
to ground to avoid damage to the
part.
3. The outputs are terminated with 50 Ω
connected to VCC - 2 V.
4. The power supply current needed to
operate the transmitter is provided to
differential ECL circuitry. This
circuitry maintains a nearly constant
current flow from the power supply.
Constant current operation helps to
prevent unwanted electrical noise
from being generated and conducted
or emitted to neighboring circuitry.
5. These optical power values are
measured as follows:
• The Beginning of Life (BOL) to the
End of Life (EOL) optical power
degradation is typically 1.5 dB per
the industry convention for long
wavelength LEDs. The actual
degradation observed in HewlettPackard’s 1300 nm LED products is
< 1dB, as specified in this data
sheet.
• Over the specified operating
voltage and temperature ranges.
• With 25 MBd (12.5 MHz squarewave), input signal.
• At the end of one meter of noted
optical fiber with cladding modes
removed.
The average power value can be
converted to a peak power value by
adding 3 dB. Higher output optical
power transmitters are available on
special request.
6. The Extinction Ratio is a measure of
the modulation depth of the optical
signal. The data “0” output optical
power is compared to the data “1”
peak output optical power and
expressed as a percentage. With the
transmitter driven by a 12.5 MHz
square-wave signal, the average
optical power is measured. The data
“1” peak power is then calculated by
adding 3 dB to the measured average
optical power. The data “0” output
optical power is found by measuring
the optical power when the transmitter is driven by a logic “0” input. The
extinction ratio is the ratio of the
optical power at the “0” level
compared to the optical power at the
“1” level expressed as a percentage or
in decibels.
7. This parameter complies with the
requirements for the tradeoffs
between center wave length, spectral
width, and rise/fall times shown in
Figure 8.
8. The optical rise and fall times are
measured from 10% to 90% when the
transmitter is driven by a 25 MBd
(12.5 MHz square-wave) input signal.
This parameter complies with the
requirements for the tradeoffs
between center wavelength, spectral
width, and rise/fall times shown in
Figure 8.
9. Deterministic Jitter is defined as the
combination of Duty Cycle Distortion
and Data Dependent Jitter. Deterministic Jitter is measured with a test
pattern consisting of repeating K28.5
(00111110101100000101) data
bytes and evaluated per the method in
FC-PH Annex A.4.3.
10. Random Jitter is specified with a
sequence of K28.7 (square wave of
alternating 5 ones and 5 zeros) data
bytes and, for the receiver, evaluated
at a Bit-Error-Ratio (BER) of 1 x 10-12
per the method in FC-PH Annex
A.4.4.
11. This specification is intended to
indicate the performance of the
receiver when Input Optical Power
signal characteristics are present per
the following definitions. The Input
Optical Power dynamic range from
the minimum level (with a window
time-width) to the maximum level is
the range over which the receiver is
guaranteed to provide output data
with a Bit-Error-Ratio (BER) better
than or equal to 1 x 10 -12.
• At the Beginning of Life (BOL).
• Over the specified operation
temperature and voltage ranges.
• Input symbol pattern is a 266 MBd,
2 7 - 1 pseudo-random bit stream
data pattern.
• Receiver data window time-width is
± 0.94 ns or greater and centered
at mid-symbol. This data window
time width is calculated to simulate
the effect of worst-case input jitter
per FC-PH Annex J and clock
recovery sampling position in order
to insure good operation with the
various FC-0 receiver circuits.
• The maximum total jitter added by
the receiver and the maximum total
jitter presented to the clock
recovery circuit comply with the
maximum limits listed in Annex J,
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12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
but the allocations of the Rx added
jitter between deterministic jitter
and random jitter are different than
in Annex J.
All conditions of Note 11 apply
except that the measurement is made
at the center of the symbol with no
window time-width.
This value is measured during the
transition from low to high levels of
input optical power.
This value is measured during the
transition from high to low levels of
input optical power.
These values are measured with the
outputs terminated into 50 Ω connected to VCC - 2 V and an input
optical power level of -14 dBm
average.
The power dissipation value is the
power dissipated in the transmitter or
the receiver itself. Power dissipation
is calculated as the sum of the
products of supply voltage and supply
current, minus the sum of the
products of the output voltages and
currents.
These values are measured with
respect to VCC with the output
terminated into 50 Ω connected to
VCC - 2 V.
The output rise and fall times are
measured between 20% and 80%
levels with the output connected to
VCC - 2 V through 50 Ω.
The Signal Detect output shall be
asserted, logic-high (VOH), within
100 µs after a step increase of the
Input Optical Power.
Signal Detect output shall be deasserted, logic-low (VOL), within
350 µs after a step decrease in the
Input Optical Power.
This value is measured with an output
load RL = 10 kΩ.
www.semiconductor.agilent.com
Data subject to change.
Copyright © 1999 Agilent Technologies, Inc.
5965-3483E (11/99)
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