ETC HM5116400TS-7

HM5116400 Series,
HM5117400 Series
16 M FP DRAM (4-Mword × 4-bit)
4 k Refresh/2 k Refresh
ADE-203-648E (Z)
Rev. 5.0
Nov. 1997
Description
The Hitachi HM5116400 Series, HM5117400 Series are CMOS dynamic RAMs organized 4,194,304-word
× 4-bit. They employ the most advanced 0.5 µm CMOS technology for high performance and low power.
The HM5116400 Series, HM5117400 Series offer Fast Page Mode as a high speed access mode. They
have package variations of standard 300-mil 26-pin plastic SOJ and standard 300-mil 26-pin plastic TSOP.
Features
• Single 5 V (±10%)
• Access time: 60 ns/70 ns (max)
• Power dissipation
 Active mode
: 440 mW/385 mW (max) (HM5116400 Series)
: 495 mW/440 mW (max) (HM5117400 Series)
 Standby mode
:11 mW (max)
:0.83 mW (max) (L-version)
• Fast page mode capability
• Long refresh period
 4096 refresh cycles : 64 ms (HM5116400 Series)
: 128 ms (L-version)
 2048 refresh cycles : 32 ms (HM5117400 Series)
: 128 ms (L-version)
• 3 variations of refresh
 RAS-only refresh
 CAS-before-RAS refresh
 Hidden refresh
• Battery backup operation (L-version)
• Test function
 16-bit parallel test mode
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HM5116400 Series, HM5117400 Series
Ordering Information
Type No.
Access time
Package
HM5116400S-6
HM5116400S-7
60 ns
70 ns
300-mil 26-pin plastic SOJ
(CP-26/24DB)
HM5116400LS-6
HM5116400LS-7
60 ns
70 ns
HM5117400S-6
HM5117400S-7
60 ns
70 ns
HM5117400LS-6
HM5117400LS-7
60 ns
70 ns
HM5116400TS-6
HM5116400TS-7
60 ns
70 ns
HM5116400LTS-6
HM5116400LTS-7
60 ns
70 ns
HM5117400TS-6
HM5117400TS-7
60 ns
70 ns
HM5117400LTS-6
HM5117400LTS-7
60 ns
70 ns
2
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300-mil 26-pin plastic TSOP II
(TTP-26/24DA)
HM5116400 Series, HM5117400 Series
Pin Arrangement
HM5116400S/LS Series
HM5116400TS/LTS Series
VCC
1
26
VSS
VCC
1
26
VSS
I/O1
2
25
I/O4
I/O1
2
25
I/O4
I/O2
3
24
I/O3
I/O2
3
24
I/O3
WE
4
23
CAS
WE
4
23
CAS
RAS
5
22
OE
RAS
5
22
OE
A11
6
21
A9
A11
6
21
A9
A10
8
19
A8
A10
8
19
A8
A0
9
18
A7
A0
9
18
A7
A1
10
17
A6
A1
10
17
A6
A2
11
16
A5
A2
11
16
A5
A3
12
15
A4
A3
12
15
A4
13
14
VSS
13
14
VSS
VCC
(Top view)
VCC
(Top view)
Pin Description
Pin name
Function
A0 to A11
Address input
Row/Refresh address
Column address
I/O1 to I/O4
Data input/Data output
RAS
Row address strobe
CAS
Column address strobe
WE
Write enable
OE
Output enable
VCC
Power supply
VSS
Ground
A0 to A11
A0 to A9
3
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HM5116400 Series, HM5117400 Series
Pin Arrangement
HM5117400S/LS Series
HM5117400TS/LTS Series
1
26
VSS
I/O1
2
25
I/O4
I/O3
I/O2
3
24
I/O3
23
CAS
WE
4
23
CAS
5
22
OE
RAS
5
22
OE
NC
6
21
A9
NC
6
21
A9
A10
8
19
A8
A10
8
19
A8
A0
9
18
A7
A0
9
18
A7
A1
10
17
A6
A1
10
17
A6
A2
11
16
A5
A2
11
16
A5
A3
12
15
A4
A3
12
15
A4
13
14
VSS
13
14
VSS
VCC
1
26
VSS
I/O1
2
25
I/O4
I/O2
3
24
WE
4
RAS
VCC
(Top view)
Function
A0 to A10
Address input
Row/Refresh address
Column address
I/O1 to I/O4
Data input/Data output
RAS
Row address strobe
CAS
Column address strobe
WE
Write enable
OE
Output enable
VCC
Power supply
VSS
Ground
NC
No connection
4
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VCC
(Top view)
Pin Description
Pin name
VCC
A0 to A10
A0 to A10
HM5116400 Series, HM5117400 Series
Block Diagram (HM5116400 Series)
RAS
CAS
WE
OE
Timing and control
A0
Column decoder
A1
to
Column
•
•
•
4M array
address
buffers
A9
•
•
•
Row
address
Row decoder
4M array
I/O buffers
4M array
I/O1
to
I/O4
buffers
A10
4M array
A11
5
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HM5116400 Series, HM5117400 Series
Block Diagram (HM5117400 Series)
RAS
CAS
WE
OE
Timing and control
A0
Column decoder
A1
to
Column
•
•
•
4M array
address
buffers
A10
•
•
•
Row
address
Row decoder
4M array
I/O buffers
4M array
buffers
4M array
6
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I/O1
to
I/O4
HM5116400 Series, HM5117400 Series
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Voltage on any pin relative to V SS
VT
–1.0 to +7.0
V
Supply voltage relative to VSS
VCC
–1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
1.0
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
–55 to +125
°C
Recommended DC Operating Conditions (Ta = 0 to +70°C)
Parameter
Symbol
Min
Typ
Max
Unit
Note
Supply voltage
VCC
4.5
5.0
5.5
V
1
Input high voltage
VIH
2.4
—
6.5
V
1
Input low voltage
VIL
–1.0
—
0.8
V
1
Note:
1. All voltage referred to VSS .
7
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HM5116400 Series, HM5117400 Series
DC Characteristics
(Ta = 0 to +70°C, VCC = 5 V ± 10%, VSS = 0 V) (HM5116400 Series)
HM5116400
-6
Parameter
-7
Symbol
Min
Max
Min
Max
Unit
Test conditions
I CC1
—
80
—
70
mA
t RC = min
I CC2
—
2
—
2
mA
TTL interface
RAS, CAS = VIH
Dout = High-Z
—
1
—
1
mA
CMOS interface
RAS, CAS ≥ VCC – 0.2 V
Dout = High-Z
I CC2
—
150
—
150
µA
CMOS interface
RAS, CAS ≥ VCC – 0.2 V
Dout = High-Z
I CC3
—
80
—
70
mA
t RC = min
Standby current*
I CC5
—
5
—
5
mA
RAS = VIH
CAS = VIL
Dout = enable
CAS-before-RAS refresh
current
I CC6
—
80
—
70
mA
t RC = min
Fast page mode current*1, * 3
I CC7
—
70
—
60
mA
t PC = min
Battery backup current
(Standby with CBR refresh)
(L-version)
I CC10
—
350
—
350
µA
CMOS interface
Dout = High-Z, CBR
refresh: tRC = 31.3 µs
t RAS ≤ 0.3 µs
Input leakage current
I LI
–10
10
–10
10
µA
0 V ≤ Vin ≤ 7 V
Output leakage current
I LO
–10
10
–10
10
µA
0 V ≤ Vin ≤ 7 V
Dout = disable
Output high voltage
VOH
2.4
VCC
2.4
VCC
V
High Iout = –5 mA
Output low voltage
VOL
0
0.4
0
0.4
V
Low Iout = 4.2 mA
Operating current* , *
1
2
Standby current
Standby current
(L-version)
RAS-only refresh current*2
1
Notes : 1. I CC depends on output load condition when the device is selected. ICC max is specified at the
output open condition.
2. Address can be changed once or less while RAS = VIL.
3. Address can be changed once or less while CAS = VIH.
8
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HM5116400 Series, HM5117400 Series
DC Characteristics
(Ta = 0 to +70°C, VCC = 5 V ± 10%, VSS = 0 V) (HM5117400 Series)
HM5117400
-6
Parameter
-7
Symbol
Min
Max
Min
Max
Unit
Test conditions
Operating current* , * 2
I CC1
—
90
—
80
mA
t RC = min
Standby current
I CC2
—
2
—
2
mA
TTL interface
RAS, CAS = VIH
Dout = High-Z
—
1
—
1
mA
CMOS interface
RAS, CAS ≥ VCC – 0.2 V
Dout = High-Z
I CC2
—
150
—
150
µA
CMOS interface
RAS, CAS ≥ VCC – 0.2 V
Dout = High-Z
I CC3
—
90
—
80
mA
t RC = min
Standby current*
I CC5
—
5
—
5
mA
RAS = VIH
CAS = VIL
Dout = enable
CAS-before-RAS refresh
current
I CC6
—
90
—
80
mA
t RC = min
Fast page mode current*1, * 3
I CC7
—
80
—
70
mA
t PC = min
Battery backup current
(Standby with CBR refresh)
(L-version)
I CC10
—
350
—
350
µA
CMOS interface
Dout = High-Z, CBR
refresh: tRC = 62.5 µs
t RAS ≤ 0.3 µs
Input leakage current
I LI
–10
10
–10
10
µA
0 V ≤ Vin ≤ 7 V
Output leakage current
I LO
–10
10
–10
10
µA
0 V ≤ Vin ≤ 7 V
Dout = disable
Output high voltage
VOH
2.4
VCC
2.4
VCC
V
High Iout = –5 mA
Output low voltage
VOL
0
0.4
0
0.4
V
Low Iout = 4.2 mA
1
Standby current
(L-version)
RAS-only refresh current*2
1
Notes : 1. I CC depends on output load condition when the device is selected. ICC max is specified at the
output open condition.
2. Address can be changed once or less while RAS = VIL.
3. Address can be changed once or less while CAS = VIH.
9
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HM5116400 Series, HM5117400 Series
Capacitance (Ta = 25°C, VCC = 5 V ±10%)
Parameter
Symbol
Typ
Max
Unit
Notes
Input capacitance (Address)
CI1
—
5
pF
1
Input capacitance (Clocks)
CI2
—
7
pF
1
Output capacitance (Data-in, Data-out)
CI/O
—
7
pF
1, 2
Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.
2. CAS = VIH to disable Dout.
AC Characteristics (Ta = 0 to +70°C, VCC = 5 V ±10%, VSS = 0 V) *1, *2, *18, *19
Test Conditions
• Input rise and fall time: 5 ns
• Input timing reference levels: 0.8 V, 2.4 V
• Output load: 2 TTL gate + C L (100 pF) (Including scope and jig)
10
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HM5116400 Series, HM5117400 Series
Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters)
HM5116400/HM5117400
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Random read or write cycle time
t RC
110
—
130
—
ns
RAS precharge time
t RP
40
—
50
—
ns
CAS precharge time
t CP
10
—
10
—
ns
RAS pulse width
t RAS
60
10000
70
10000
ns
CAS pulse width
t CAS
15
10000
18
10000
ns
Row address setup time
t ASR
0
—
0
—
ns
Row address hold time
t RAH
10
—
10
—
ns
Column address setup time
t ASC
0
—
0
—
ns
Column address hold time
t CAH
10
—
15
—
ns
RAS to CAS delay time
t RCD
20
45
20
52
ns
3
RAS to column address delay time
t RAD
15
30
15
35
ns
4
RAS hold time
t RSH
15
—
18
—
ns
CAS hold time
t CSH
60
—
70
—
ns
CAS to RAS precharge time
t CRP
5
—
5
—
ns
OE to Din delay time
t OED
15
—
18
—
ns
5
OE delay time from Din
t DZO
0
—
0
—
ns
6
CAS delay time from Din
t DZC
0
—
0
—
ns
6
Transition time (rise and fall)
tT
3
50
3
50
ns
7
11
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HM5116400 Series, HM5117400 Series
Read Cycle
HM5116400/HM5117400
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Access time from RAS
t RAC
—
60
—
70
ns
8, 9, 20
Access time from CAS
t CAC
—
15
—
18
ns
9, 10, 17,
20
Access time from address
t AA
—
30
—
35
ns
9, 11, 17,
20
Access time from OE
t OEA
—
15
—
18
ns
9, 20
Read command setup time
t RCS
0
—
0
—
ns
Read command hold time to CAS
t RCH
0
—
0
—
ns
12
Read command hold time to RAS
t RRH
0
—
0
—
ns
12
Column address to RAS lead time
t RAL
30
—
35
—
ns
Column address to CAS lead time
t CAL
30
—
35
—
ns
CAS to output in low-Z
t CLZ
0
—
0
—
ns
Output data hold time
t OH
3
—
3
—
ns
Output data hold time from OE
t OHO
3
—
3
—
ns
Output buffer turn-off time
t OFF
—
15
—
15
ns
13
Output buffer turn-off to OE
t OEZ
—
15
—
15
ns
13
CAS to Din delay time
t CDD
15
—
18
—
ns
5
Write Cycle
HM5116400/HM5117400
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Write command setup time
t WCS
0
—
0
—
ns
14
Write command hold time
t WCH
10
—
15
—
ns
Write command pulse width
t WP
10
—
10
—
ns
Write command to RAS lead time
t RWL
15
—
18
—
ns
Write command to CAS lead time
t CWL
15
—
18
—
ns
Data-in setup time
t DS
0
—
0
—
ns
15
Data-in hold time
t DH
10
—
15
—
ns
15
12
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HM5116400 Series, HM5117400 Series
Read-Modify-Write Cycle
HM5116400/HM5117400
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Read-modify-write cycle time
t RWC
155
—
181
—
ns
RAS to WE delay time
t RWD
85
—
98
—
ns
14
CAS to WE delay time
t CWD
40
—
46
—
ns
14
Column address to WE delay time
t AWD
55
—
63
—
ns
14
OE hold time from WE
t OEH
15
—
18
—
ns
Refresh Cycle
HM5116400/HM5117400
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
CAS setup time (CBR refresh cycle)
t CSR
5
—
5
—
ns
CAS hold time (CBR refresh cycle)
t CHR
10
—
10
—
ns
WE setup time (CBR refresh cycle)
t WRP
0
—
0
—
ns
WE hold time (CBR refresh cycle)
t WRH
10
—
10
—
ns
RAS precharge to CAS hold time
t RPC
5
—
5
—
ns
Notes
Fast Page Mode Cycle
HM5116400/HM5117400
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Fast page mode cycle time
t PC
40
—
45
—
ns
Fast page mode RAS pulse width
t RASP
—
100000 —
100000 ns
16
Access time from CAS precharge
t CPA
—
35
—
40
ns
9, 17, 20
RAS hold time from CAS precharge
t CPRH
35
—
40
—
ns
13
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HM5116400 Series, HM5117400 Series
Fast Page Mode Read-Modify-Write Cycle
HM5116400/HM5117400
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Notes
Fast page mode read-modify-write
cycle time
t PRWC
85
—
96
—
ns
WE delay time from CAS precharge
t CPW
60
—
68
—
ns
14
Notes
Test Mode Cycle *19
HM5116400/HM5117400
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Unit
Test mode WE setup time
t WTS
0
—
0
—
ns
Test mode WE hold time
t WTH
10
—
10
—
ns
Refresh (HM5116400 Series)
Parameter
Symbol
Max
Unit
Notes
Refresh
t REF
64
ms
4096 cycles
Refresh (L-version)
t REF
128
ms
4096 cycles
14
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HM5116400 Series, HM5117400 Series
Refresh (HM5117400 Series)
Parameter
Symbol
Max
Unit
Notes
Refresh period
t REF
32
ms
2048 cycles
Refresh period (L-version)
t REF
128
ms
2048 cycles
Notes: 1. AC measurements assume t T = 5 ns.
2. An initial pause of 200 µs is required after power up followed by a minimum of eight initialization
cycles (any combination of cycles containing RAS-only refresh or CAS-before-RAS refresh). If
the internal refresh counter is used, a minimum of eight CAS-before-RAS refresh cycles are
required.
3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a
reference point only; if t RCD is greater than the specified tRCD (max) limit, then access time is
controlled exclusively by tCAC .
4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a
reference point only; if t RAD is greater than the specified tRAD (max) limit, then access time is
controlled exclusively by tAA .
5. Either t OED or tCDD must be satisfied.
6. Either t DZO or tDZC must be satisfied.
7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition
times are measured between V IH (min) and VIL (max).
8. Assumes that t RCD ≤ tRCD (max) and tRAD ≤ tRAD (max). If tRCD or tRAD is greater than the maximum
recommended value shown in this table, t RAC exceeds the value shown.
9. Measured with a load circuit equivalent to 2 TTL loads and 100 pF.
10. Assumes that t RCD ≥ tRCD (max) and tRCD + tCAC (max) ≥ tRAD + tAA (max).
11. Assumes that t RAD ≥ tRAD (max) and tRCD + tCAC (max) ≤ tRAD + tAA (max).
12. Either t RCH or tRRH must be satisfied for a read cycles.
13. t OFF (max) and tOEZ (max) define the time at which the outputs achieve the open circuit condition
and are not referred to output voltage levels.
14. t WCS , t RWD, t CWD, t AWD and t CPW are not restrictive operating parameters. They are included in the
data sheet as electrical characteristics only; if t WCS ≥ tWCS (min), the cycle is an early write cycle
and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD
≥ tRWD (min), tCWD ≥ tCWD (min), and tAWD ≥ tAWD (min), or tCWD ≥ tCWD (min), tAWD ≥ tAWD (min) and tCPW ≥
t CPW (min), the cycle is a read-modify-write and the data output will contain data read from the
selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out
(at access time) is indeterminate.
15. These parameters are referred to CAS leading edge in early write cycles and to WE leading
edge in delayed write or read-modify-write cycles.
16. t RASP defines RAS pulse width in Fast page mode cycles.
17. Access time is determined by the longest among t AA , t CAC and t CPA.
18. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data
to the device.
19. The 16M DRAM offers a 16-bit time saving parallel test mode. Address CA0 and CA1 for the 4M
× 4 are don’t care during test mode. Test mode is set by performing a WE-and-CAS-before-RAS
(WCBR) cycle. In 16-bit parallel test mode, data is written into 4 bits in parallel at each I/O (I/O1
to I/O4) and read out from each I/O.
If 4 bits of each I/O are equal (all 1s or 0s), data output pin is a high state during test mode read
cycle, then the device has passed. If they are not equal, data output pin is a low state, then the
device has failed.
Refresh during test mode operation can be performed by normal read cycles or by WCBR
refresh cycles.
15
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HM5116400 Series, HM5117400 Series
To get out of test mode and enter a normal operation mode, perform either a regular CASbefore-RAS refresh cycle or RAS-only refresh cycle.
20. In a test mode read cycle, the value of tRAC , t AA , t CAC and t CPA is delayed by 2 ns to 5 ns for the
specified value. These parameters should be specified in test mode cycles by adding the above
value to the specified value in this data sheet.
21. XXX: H or L (H: VIH (min) ≤ VIN ≤ VIH (max), L: VIL (min) ≤ VIN ≤ VIL (max))
///////: Invalid Dout
When the address, clock and input pins are not described on timing waveforms, their pins must
be applied VIH or VIL.
16
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HM5116400 Series, HM5117400 Series
Timing Waveforms*21
Read Cycle
t RC
t RAS
t RP
RAS
t CSH
t CRP
t RCD
t RSH
t CAS
tT
CAS
t RAD
t ASR
Address
t RAH
t RAL
t ASC
t CAL
t CAH
Column
Row
t RRH
t RCH
t RCS
WE
t DZC
t CDD
High-Z
Din
t DZO
t OEA
t OED
OE
t OEZ
t CAC
t OHO
t AA
t OFF
t RAC
t CLZ
Dout
t OH
Dout
17
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HM5116400 Series, HM5117400 Series
Early Write Cycle
tRC
tRAS
tRP
RAS
tCSH
tCRP
tRCD
tRSH
tCAS
tT
CAS
tASR
Address
tRAH
Row
tASC
tCAH
Column
tWCS
tWCH
WE
tDS
Din
Dout
tDH
Din
High-Z*
* t WCS
18
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t WCS (min)
HM5116400 Series, HM5117400 Series
Delayed Write Cycle*18
t RC
t RAS
t RP
RAS
t CSH
t CRP
t RCD
t RSH
t CAS
tT
CAS
t ASR
Address
t RAH
t ASC
Row
t CAH
Column
t CWL
t RWL
t WP
t RCS
WE
t DZC
t DS
High-Z
Din
t DH
Din
t DZO
t OEH
t OED
OE
t OEZ
t CLZ
High-Z
Dout
Invalid Dout
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19
HM5116400 Series, HM5117400 Series
Read-Modify-Write Cycle*18
t RWC
t RAS
t RP
RAS
tT
t RCD
t CAS
t CRP
CAS
t RAD
t ASR
Address
tRAH
t ASC
Row
t CAH
Column
t RCS
t CWD
tCWL
t AWD
t RWL
t RWD
t WP
WE
t DZC
t DH
t DS
High-Z
Din
Din
t OED
t DZO
t OEH
t OEA
OE
t CAC
t OEZ
t AA
t RAC
t OHO
Dout
Dout
t CLZ
20
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High-Z
HM5116400 Series, HM5117400 Series
RAS-Only Refresh Cycle
t RC
t RAS
t RP
RAS
tT
t RPC
t CRP
t CRP
CAS
t ASR
Address
t RAH
Row
t OFF
Dout
High-Z
21
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HM5116400 Series, HM5117400 Series
CAS-Before-RAS Refresh Cycle
t RC
t RP
t RAS
t RC
t RP
t RAS
t RP
RAS
t RPC
t CP
tT
t CSR
t CHR
t RPC
t CP
t CRP
t CSR
t CHR
CAS
t WRP t WRH
t WRP
WE
Address
t OFF
Dout
22
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High-Z
t WRH
HM5116400 Series, HM5117400 Series
Hidden Refresh Cycle
t RC
t RAS
t RP
t RC
t RAS
t RC
t RP
t RAS
t RP
RAS
tT
t RSH
t CHR
t CRP
t RCD
CAS
t RAD
t ASR t RAH
Address
t RAL
t ASC
Row
t CAH
Column
t WRP
t RRH
t WRH
t WRP
t WRH
t RCS
WE
t DZC
t CDD
High-Z
Din
t DZO
t OED
t OEA
OE
t CAC
t AA
t RAC
t OFF
t OH
t CLZ
Dout
t OEZ
t OHO
Dout
23
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HM5116400 Series, HM5117400 Series
Fast Page Mode Read Cycle
t RASP
t CPRH
t RP
RAS
tT
t CSH
t RCD
t PC
t CAS
t CP
t RSH
t CAS
t CP
t CRP
t CAS
CAS
t RAL
t RAD
t ASR t RAH
Address
Row
t CAL
t ASC t CAH
t CAL
t ASC t CAH
t CAL
t ASC t CAH
Column 1
Column 2
Column N
t RCS
t RCS
t RCH
t RCS
t RRH
t RCH
t RCH
WE
t DZC
Din
t DZO
t DZC
t DZC
t CDD
t CDD
High-Z
High-Z
t OED
t DZO t OED
t CDD
High-Z
t DZO
t OED
OE
t RAC
t AA
t OH
t OEA
24
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t OHO
t OH
t OEA
t OFF t CAC
t OEZ t CLZ
t CAC
t CLZ
Dout
t CPA
t AA
Dout 1
t CPA
t AA
t OHO
t OFF
t OEZ
Dout 2
t OH
t OHO
t OEA
t CAC
t CLZ
t OFF
t OEZ
Dout N
HM5116400 Series, HM5117400 Series
Fast Page Mode Early Write Cycle
t RP
t RASP
RAS
tT
t CSH
t RCD
t CAS
t PC
t CP
t CAS
t CP
t RSH
t CAS
t CRP
CAS
Address
t ASR t RAH
t ASC t CAH
t ASC t CAH
t ASC t CAH
ROW
Column 1
Column 2
Column N
t WCS
t WCH
t WCS
t WCH
t WCS
t WCH
WE
t DS
Din
t DH
Din 1
Dout
t DS
t DH
Din 2
t DS
t DH
Din N
High-Z*
* t WCS
t WCS (min)
25
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HM5116400 Series, HM5117400 Series
Fast Page Mode Delayed Write Cycle*18
t RASP
t RP
RAS
tT
t CP
t CSH
t CRP
t CP
t PC
t RCD
t CAS
t RSH
t CAS
t CAS
CAS
t RAD
t ASR
t ASC
t RAH
Address
t ASC
t CAH
Row
t ASC
t CAH
Column 1
t CAH
Column 2
t CWL
Column N
t CWL
t CWL
t RWL
t RCS
t RCS
t RCS
WE
t WP
t WP
t WP
t DZC t DS
t DZC t DS
t DZC t DS
t DH
t DH
Din
1
Din
t DZO
t DH
Din
2
t DZO
t OED
Din
N
t DZO
t OED
t OED
t OEH
t OEH
t OEH
OE
t CLZ
t CLZ
t OEZ
t CLZ
t OEZ
t OEZ
High-Z
Dout
Invalid Dout
26
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Invalid Dout
Invalid Dout
HM5116400 Series, HM5117400 Series
Fast Page Mode Read-Modify-Write Cycle*18
t RASP
t RP
RAS
tT
t PRWC
t CP
t RCD
t RSH
t CP
t CAS
t CAS
t CRP
t CAS
CAS
t RAD
t ASR
Address
t ASC
t RAH
Row
t ASC
t CAH
t CAH
Column 1
t ASC
t CAH
Column 2
t RWD
t CWL
Column N
t CPW
t AWD
t CWL
t CPW
t AWD
t CWD
t RCS
t CWL
t AWD
t CWD
t RCS
t RWL
t CWD
WE
t RCS
t WP
t
t DZC DS
t WP
t
t DZC DS
t WP
t
t DZC DS
t DH
t DH
Din
1
Din
t DZO
t OED
t DH
Din
2
t OED
t DZO
t OED
t DZO
t OEH
t OEH
t OEH
Din
N
OE
t OHO
t OEA
t CAC
t OHO
t OEA
t CAC
t AA
t AA
t CPA
t RAC
t OEZ
t CLZ
t OHO
t OEA
t CAC
t AA
t CPA
t OEZ
t CLZ
t OEZ
t CLZ
High-Z
Dout
Dout 1
Dout 2
Dout N
27
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HM5116400 Series, HM5117400 Series
Test Mode Cycle*19
Set Cycle**
Test Mode Cycle
*,**
Reset Cycle
Normal Mode
RAS
CAS
WE
* CBR or RAS-only refresh
** Address, Din, OE: H or L
28
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HM5116400 Series, HM5117400 Series
Test Mode Set Cycle
t RC
t RP
t RAS
t RP
RAS
t CSR
t CHR
tT
t CRP
CAS
t RPC
@
€
À
@ @
t RPC
t CP
t WTS
WE
t WTH
t CP
Address
t OFF
Dout
High-Z
29
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HM5116400 Series, HM5117400 Series
Package Dimensions
HM5116400S/LS Series
HM5117400S/LS Series (CP-26/24DB)
Unit: mm
1.30 Max
0.43 ± 0.10
0.41 ± 0.08
1.27
2.54
Dimension including the plating thickness
Base material dimension
30
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2.65 ± 0.12
13
0.80 +0.25
–0.17
6 8
0.74
3.50 ± 0.26
1
8.51 ± 0.13
14
7.62 ± 0.13
26
16.90
17.27 Max
21 19
+ 0.19
6.79 – 0.18
0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
CP-26/24DB
Conforms
Conforms
0.8 g
HM5116400 Series, HM5117400 Series
HM5116400TS/LTS Series
HM5117400TS/LTS Series (TTP-26/24DA)
Unit: mm
14
7.62
26
17.14
17.54 Max
21 19
0.42 ± 0.08
0.40 ± 0.06
6 8
1.27
13
0.80
0.21 M
9.22 ± 0.20
1.15 Max
0.10
Dimension including the plating thickness
Base material dimension
0.13 ± 0.05
2.54
0.145 ± 0.05
0.125 ± 0.04
1.20 Max
0° – 5°
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
0.68
1
TTP-26/24DA
Conforms
—
0.30 g
31
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HM5116400 Series, HM5117400 Series
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of
this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any
other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual
property claims or other problems that may result from applications based on the examples described
herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third party or
Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are
requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi Semiconductor
(America) Inc.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1897
USA
Tel: 800-285-1601
Fax:303-297-0447
Hitachi Europe GmbH
Continental Europe
Dornacher Straße 3
D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30-00
Hitachi Europe Ltd.
Electronic Components Div.
Northern Europe Headquarters
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA
United Kingdom
Tel: 01628-585000
Fax: 01628-585160
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
Hitachi Asia (Hong Kong) Ltd.
Unit 706, North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon
Hong Kong
Tel: 27359218
Fax: 27306071
Copyright © Hitachi, Ltd., 1997. All rights reserved. Printed in Japan.
32
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HM5116400 Series, HM5117400 Series
Revision Record
Rev.
Date
Contents of Modification
Drawn by
Approved by
1.0
Oct. 14, 1996
Initial issue
Y. Kasama
M. Mishima
2.0
Nov. 14, 1996
Addition of HM5116400-5 Series
Y. Kasama
Y. Matsuno
Addition of HM5117400-5 Series
Power dissipation (active)
605/550 mW(max) to 550/495/440 mW (max)
(HM5117400 Series)
DC Characteristics (HM5117400 Series)
I CC1 max: 110/100 mA to 100/90/80 mA
I CC3 max: 110/100 mA to 100/90/80 mA
I CC6 max: 110/100 mA to 100/90/80 mA
3.0
Feb. 27, 1997
AC Characteristics
t RRH min: 5/5/5 ns to 0/0/0 ns
Y. Kasama
Y. Matsuno
4.0
Jun. 12, 1997
Deletion of HM5116400/HM5117400-5 Series
Y. Kasama
Y. Matsuno
5.0
Nov. 1997
Change of Subtitle
33
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