ETC NTGS3446T1

NTGS3446
Power MOSFET
5 Amps, 20 Volts
N–Channel TSOP–6
Features
•
•
•
•
•
•
Ultra Low RDS(on)
Higher Efficiency Extending Battery Life
Logic Level Gate Drive
Diode Exhibits High Speed, Soft Recovery
Avalanche Energy Specified
IDSS and VDS(on) Specified at Elevated Temperature
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5 AMPERES
20 VOLTS
RDS(on) = 45 m
Applications
• Power Management in portable and battery–powered products, i.e.
•
•
N–Channel
computers, printers, PCMCIA cards, cellular and cordless
Lithium Ion Battery Applications
Note Book PC
1 2 5 6
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Drain–Source Voltage
Gate–Source Voltage
– Continuous
Symbol
Value
Unit
VDSS
VGS
20
Vdc
Drain – Continuous
– Continuous @ 70°C
– Single Pulse (tp10 µs)
Operating and Storage
Temperature Range
Vdc
5.8
TBD
20
Adc
1.6
Watts
TJ, Tstg
–55 to
150
°C
EAS
TBD
mJ
Single Drain–to–Source Avalanche
Energy – Starting TJ = 25°C
(VDD = 20 Vdc, VGS = 4.5 Vdc,
IL = 5.8 A, L = TBD mH, RG = 25 Ω)
Thermal Resistance
Junction–to–Ambient (Note 1.)
Steady State
Junction–to–Ambient (Note 2.)
Junction–to–Lead
Steady State
4
20
ID
ID
IDM
PD
Total Power Dissipation
3
MARKING
DIAGRAM
3
4
°C/W
RθJA
RθJA
RθJL
5
2
1
446
W
TSOP–6
CASE 318G
STYLE 1
6
W
TBD
TBD
TBD
= Work Week
PIN ASSIGNMENT
Drain Drain Source
1. When surface mounted to Min Pad.
2. When surface mounted to 1″ x 1″ FR4 Board.
6
5
4
1
2
3
Drain Drain Gate
ORDERING INFORMATION
Device
NTGS3446T1
 Semiconductor Components Industries, LLC, 2000
November, 2000 – Rev. 1
1
Package
TSOP–6
Shipping
3000 Tape & Reel
Publication Order Number:
NTGS3446/D
NTGS3446
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
20
–
–
TBD
–
–
–
–
–
–
1.0
25
–
–
–
–
100
100
0.6
–
0.9
TBD
1.2
–
–
–
36
44
45
55
gFS
10
17
–
mhos
Ciss
–
930
TBD
pF
Coss
–
370
TBD
Crss
–
105
TBD
td(on)
–
8.6
TBD
tr
–
14
TBD
td(off)
–
57
TBD
tf
–
54
TBD
QT
–
11
15
Q1
–
2.4
–
Q2
–
2.4
–
–
–
0.74
TBD
1.1
–
trr
–
30
–
ta
–
14.5
–
tb
–
15.5
–
QRR
–
0.01
–
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 0.25 mAdc)
Temperature Coefficient (Positive)
V(BR)DSS
Zero Gate Voltage Collector Current
(VDS = 20 Vdc, VGS = 0 Vdc)
(VDS = 20 Vdc, VGS = 0 Vdc, TJ = 85°C)
Vdc
µAdc
IDSS
Gate–Body Leakage Current (VGS = ±12 Vdc, VDS = 0)
IGSS(f)
IGSS(r)
mV/°C
nAdc
ON CHARACTERISTICS (Note 1.)
Gate Threshold Voltage
ID = 0.25 mA, VDS = VGS
Temperature Coefficient (Negative)
VGS(th)
Static Drain–to–Source On–Resistance
(VGS = 4.5 Vdc, ID = 5.3 Adc)
(VGS = 2.5 Vdc, ID = 4.4 Adc)
VDS(on)
Forward Transconductance (VDS = 10 Vdc, ID = 5.3 Adc)
Vdc
mV/°C
m
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
(VDS = 10 Vd
Vdc, VGS = 0 Vdc,
Vd
f = 1.0 MHz)
Transfer Capacitance
SWITCHING CHARACTERISTICS (Note 2.)
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
(VDD = 10 Vdc, ID = 1.0 Adc,
VGS = 4
4.5
5 Vdc
Vdc, RL = 10 RG = 6.0 Ω)
Fall Time
Gate Charge
(VDS = 10 Vdc,
Vd ID = 5.8
5 8 Adc,
Ad
VGS = 4.5 Vdc)
ns
nC
SOURCE–DRAIN DIODE CHARACTERISTICS
VSD
Forward On–Voltage (Note 1.)
(IS = 1.7 Adc, VGS = 0 Vdc)
(IS = 1.7 Adc, VGS = 0 Vdc, TJ = 85°C)
Reverse Recovery Time
(IS = 1.7
1 7 Adc,
Adc VGS = 0 Vdc,
Vdc
diS/dt = 100 A/µs)
Reverse Recovery Stored
Charge
1. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
2. Switching characteristics are independent of operating junction temperature.
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2
Vdc
ns
µC
NTGS3446
PACKAGE DIMENSIONS
TSOP–6
CASE 318G–02
ISSUE G
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
L
6
S
1
5
4
2
3
B
D
G
M
J
C
0.05 (0.002)
H
K
DIM
A
B
C
D
G
H
J
K
L
M
S
MILLIMETERS
MIN
MAX
2.90
3.10
1.30
1.70
0.90
1.10
0.25
0.50
0.85
1.05
0.013
0.100
0.10
0.26
0.20
0.60
1.25
1.55
0
10 2.50
3.00
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
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3
DRAIN
DRAIN
GATE
SOURCE
DRAIN
DRAIN
INCHES
MIN
MAX
0.1142 0.1220
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0610
0
10 0.0985 0.1181
NTGS3446
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
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attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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4
NTGS3446/D