ETC PH8230E

PH8230E
TrenchMOS™ enhanced logic level FET
Rev. 02 — 29 April 2003
M3D748
Product data
1. Product profile
1.1 Description
N-channel enhancement mode field-effect power transistor in a plastic package using
TrenchMOS™ technology.
Product availability:
PH8230E in SOT669 (LFPAK).
1.2 Features
■ Low thermal resistance
■ Low gate drive current
■ SO8 equivalent area footprint
■ Low on-state resistance.
1.3 Applications
■ DC-to-DC converters
■ Portable appliances
■ Switched-mode power supplies
■ Notebook computers.
1.4 Quick reference data
■ VDS ≤ 30 V
■ Ptot ≤ 62.5 W
■ ID ≤ 67 A
■ RDSon ≤ 8.2 mΩ
2. Pinning information
Table 1:
Pinning - SOT669 (LFPAK), simplified outline and symbol
Pin
Description
1,2,3
source (s)
4
gate (g)
mb
mounting base;
connected to drain (d)
Simplified outline
Symbol
d
mb
g
MBB076
1
2
Top view
3
4
MBL286
SOT669 (LFPAK)
s
PH8230E
Philips Semiconductors
TrenchMOS™ enhanced logic level FET
3. Limiting values
Table 2: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
VDS
drain-source voltage (DC)
VGS
gate-source voltage (DC)
ID
drain current (DC)
Conditions
Min
Max
Unit
25 °C ≤ Tj ≤ 150 °C
-
30
V
-
±20
V
Tmb = 25 °C; VGS = 10 V; Figure 2 and 3
-
67
A
Tmb = 100 °C; VGS = 10 V; Figure 2
-
42
A
IDM
peak drain current
Tmb = 25 °C; pulsed; tp ≤ 10 µs; Figure 3
-
268
A
Ptot
total power dissipation
Tmb = 25 °C; Figure 1
-
62.5
W
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−55
+150
°C
Source-drain diode
IS
source (diode forward) current (DC) Tmb = 25 °C
-
52
A
ISM
peak source (diode forward) current Tmb = 25 °C; pulsed; tp ≤ 10 µs
-
150
A
-
115
mJ
Avalanche ruggedness
EDS(AL)S non-repetitive drain-source
avalanche energy
unclamped inductive load; ID = 33.9 A;
tp = 0.15 ms; VDD = 30 V; VGS = 10 V;
starting Tj = 25 °C
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11388
Product data
Rev. 02 — 29 April 2003
2 of 12
PH8230E
Philips Semiconductors
TrenchMOS™ enhanced logic level FET
03aa15
120
03aa23
120
Ider
(%)
Pder
(%)
80
80
40
40
0
0
0
50
100
150
200
Tmb (°C)
0
50
100
150
200
Tmb (°C)
VGS ≥ 10 V
P tot
P der = ----------------------- × 100%
P
°
ID
I der = ------------------- × 100%
I
°
tot ( 25 C )
D ( 25 C )
Fig 1. Normalized total power dissipation as a
function of mounting base temperature.
Fig 2. Normalized continuous drain current as a
function of mounting base temperature.
003aaa369
103
ID
(A)
102
Limit RDSon = VDS/ID
tp = 10 µ s
100 µ s
1 ms
10
10 ms
DC
100 ms
1
10-1
10-1
1
10
VDS (V)
102
Tmb = 25 °C; IDM is single pulse; VGS = 10 V
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11388
Product data
Rev. 02 — 29 April 2003
3 of 12
PH8230E
Philips Semiconductors
TrenchMOS™ enhanced logic level FET
4. Thermal characteristics
Table 3:
Thermal characteristics
Symbol Parameter
Conditions
Min Typ Max Unit
thermal resistance from junction to mounting base Figure 4
Rth(j-mb)
-
-
2
K/W
4.1 Transient thermal impedance
003aaa370
10
Zth(j-mb)
(K/W)
δ = 0.5
1
0.2
0.05
0.02
δ=
P
0.1
tp
T
single pulse
t
tp
T
10-1
10-4
10-3
10-2
10-1
tp (s)
1
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11388
Product data
Rev. 02 — 29 April 2003
4 of 12
PH8230E
Philips Semiconductors
TrenchMOS™ enhanced logic level FET
5. Characteristics
Table 4: Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
ID = 250 µA; VGS = 0 V
30
-
-
V
Tj = 25 °C
1
1.7
2.5
V
Tj = 150 °C
0.5
-
-
V
Tj = 25 °C
-
0.06
1
µA
Tj = 150 °C
-
-
500
µA
-
20
100
nA
Tj = 25 °C
-
7.6
8.2
mΩ
Tj = 150 °C
-
13
14
mΩ
VGS = 4.5 V; ID = 10 A; Figure 7
-
11
13.2
mΩ
ID = 20 A; VDD = 10 V; VGS = 5 V; Figure 13
Static characteristics
V(BR)DSS drain-source breakdown voltage
VGS(th)
IDSS
gate-source threshold voltage
drain-source leakage current
ID = 1 mA; VDS = VGS; Figure 9
VDS = 30 V; VGS = 0 V
IGSS
gate-source leakage current
VGS = ±20 V; VDS = 0 V
RDSon
drain-source on-state resistance
VGS = 10 V; ID = 10 A; Figure 7 and 8
Dynamic characteristics
Qg(tot)
total gate charge
-
14
-
nC
Qgs
gate-source charge
-
5.7
-
nC
Qgd
gate-drain (Miller) charge
-
5
-
nC
Ciss
input capacitance
-
1400 -
pF
VGS = 0 V; VDS = 10 V; f = 1 MHz; Figure 11
Coss
output capacitance
-
527
-
pF
Crss
reverse transfer capacitance
-
235
-
pF
td(on)
turn-on delay time
-
28
-
ns
tr
rise time
-
123
-
ns
td(off)
turn-off delay time
-
33
-
ns
tf
fall time
-
21
-
ns
-
0.85
1.2
V
-
38
-
ns
VDD = 10 V; ID = 10 A; VGS = 4.5 V; RG = 4.7 Ω
Source-drain diode
VSD
source-drain (diode forward) voltage IS = 10 A; VGS = 0 V; Figure 12
trr
reverse recovery time
IS = 20 A; dIS/dt = −100 A/µs; VDS = 20 V
VGS = 0 V
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11388
Product data
Rev. 02 — 29 April 2003
5 of 12
PH8230E
Philips Semiconductors
TrenchMOS™ enhanced logic level FET
003aaa371
4
3.2 V
ID
(A)
ID
(A)
VGS = 3.1 V
4V
003aaa372
8
6
3
3V
2
4
Tj = 150 °C
25 °C
2.9 V
2
1
2.8 V
2.7 V
0
0
0
0.5
1
1.5
VDS (V)
1
2
Tj = 25 °C
3
4
VGS (V)
Tj = 25 °C and 150 °C; VDS > ID x RDSon
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values.
Fig 6. Transfer characteristics: drain current as a
function of gate-source voltage; typical values.
003aaa373
100
3V
RDSon
(mΩ)
2
3.1 V
03aa27
2
3.2 V
a
75
1.5
50
1
VGS = 3.5 V
25
0.5
4V
10 V
0
0
0
2
4
6
ID (A)
8
Tj = 25 °C
-60
60
120
Tj (°C)
180
R DSon
a = ---------------------------R DSon ( 25 °C )
Fig 7. Drain-source on-state resistance as a function
of drain current; typical values.
Fig 8. Normalized drain-source on-state resistance
factor as a function of junction temperature.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11388
Product data
0
Rev. 02 — 29 April 2003
6 of 12
PH8230E
Philips Semiconductors
TrenchMOS™ enhanced logic level FET
03am28
10-1
003aa414
3
ID
(A)
VGS(th)
max
(V)
10-2
2
typ
1
0
-100
10-3
min
min
typ
max
10-4
10-5
0
100
Tj (°C)
0
200
1
2
VGS (V)
3
Tj = 25 °C; VDS = 5 V
ID = 1 mA; VDS = VGS
Fig 9. Gate-source threshold voltage as a function of
junction temperature.
Fig 10. Sub-threshold drain current as a function of
gate-source voltage.
003aaa374
104
C
(pF)
Ciss
103
Coss
Crss
102
10-1
1
10
VDS (V)
102
VGS = 0 V; f = 1 MHz
Fig 11. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11388
Product data
Rev. 02 — 29 April 2003
7 of 12
PH8230E
Philips Semiconductors
TrenchMOS™ enhanced logic level FET
003aaa375
8
003aaa376
10
VGS
IS
(A)
(V)
8
6
6
4
150 °C
4
Tj = 25 °C
2
2
0
0
0
0.2
0.4
0.6
0.8
1
VSD (V)
0
Tj = 25 °C and 150 °C; VGS = 0 V
20
QG (nC)
30
ID = 20 A; VDD = 10 V
Fig 12. Source (diode forward) current as a function of
source-drain (diode forward) voltage; typical
values.
Fig 13. Gate-source voltage as a function of gate
charge; typical values.
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11388
Product data
10
Rev. 02 — 29 April 2003
8 of 12
PH8230E
Philips Semiconductors
TrenchMOS™ enhanced logic level FET
6. Package outline
Plastic single-ended surface mounted package (Philips version LFPAK); 4 leads
A2
A
E
SOT669
C
c2
b2
L1
E1
mounting
base
D1
D
H
L2
1
2
3
4
X
e
w M A
b
c
1/2 e
A
(A 3)
A1
C
θ
L
detail X
0
2.5
y C
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
A2
A3
b
b2
c
c2
D(1)
D1(1)
max
E(1)
E1(1)
e
H
L
L1
L2
w
y
θ
mm
1.20
1.01
0.15
0.00
1.10
0.95
0.25
0.50
0.35
4.41
3.62
0.25
0.19
0.30
0.24
4.10
3.80
4.20
5.0
4.8
3.3
3.1
1.27
6.2
5.8
0.85
0.40
1.3
0.8
1.3
0.8
0.25
0.1
8°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT669
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-07-10
03-02-05
MO-235
Fig 14. SOT669 (LFPAK).
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11388
Product data
Rev. 02 — 29 April 2003
9 of 12
PH8230E
Philips Semiconductors
TrenchMOS™ enhanced logic level FET
7. Revision history
Table 5:
Revision history
Rev Date
02
20030429
CPCN
Description
-
Product data (9397 750 11388)
Modifications:
•
•
•
01
20030304
-
Avalanche ruggedness data added in Table 2
Qg(tot) data revised in Table 4
IGSS data revised in Table 4
Preliminary data (9397 750 11145)
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11388
Product data
Rev. 02 — 29 April 2003
10 of 12
PH8230E
Philips Semiconductors
TrenchMOS™ enhanced logic level FET
8. Data sheet status
Level
Data sheet status[1]
Product status[2][3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
9. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
11. Trademarks
TrenchMOS — is a trademark of Koninklijke Philips Electronics N.V.
10. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: [email protected].
Product data
Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
9397 750 11388
Rev. 02 — 29 April 2003
11 of 12
Philips Semiconductors
PH8230E
TrenchMOS™ enhanced logic level FET
Contents
1
1.1
1.2
1.3
1.4
2
3
4
4.1
5
6
7
8
9
10
11
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Transient thermal impedance . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
© Koninklijke Philips Electronics N.V. 2003.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 29 April 2003
Document order number: 9397 750 11388