AD AD8029AR

Low Power, High Speed
Rail-to-Rail Input/Output Amplifier
AD8029/AD8030/AD8040
CONNECTION DIAGRAMS
Battery-powered instrumentation
Filters
A-to-D drivers
Buffering
DISABLE
7
+VS
+IN 3
6
VOUT
–VS 4
5
NC
NC = NO CONNECT
VOUT 1
–VS 2
+
+IN 3
Figure 1. SOIC-8 (R)
8
–IN 1 2
7
+IN 1 3
6
–VS 4
5
+IN 2
+VS
5
DISABLE
4
–IN
Figure 2. SC70-6 (KS)
VOUT 1 1
VOUT 1 1
–
6
03679-A-002
8
13 –IN 4
+IN 1 3
12 +IN 4
+VS 4
+VS
14 V
OUT 4
–IN 1 2
11 –VS
+VOUT 2
+IN 2 5
10 +IN 3
–IN 2
–IN 2 6
9
–IN 3
VOUT 2 7
8
VOUT 3
Figure 3. SOIC-8(R) and
SOT23-8 (RJ)
Figure 4. SOIC-14 (R) and
TSSOP-14 (RU)
GENERAL DESCRIPTION
The AD8029 (single), AD8030 (dual), and AD8040 (quad) are
rail-to-rail input and output high speed amplifiers with a
quiescent current of only 1.3 mA per amplifier. Despite their
low power consumption, the amplifiers provide excellent
performance with 125 MHz small signal bandwidth and
60 V/µs slew rate. ADI’s proprietary XFCB process enables high
speed and high performance on low power.
powered systems with large bandwidth requirements to high
speed systems where component density requires lower power
dissipation.
The AD8029/AD8030 are the only low power, rail-to-rail input
and output high speed amplifiers available in SOT23 and SC70
micro packages. The amplifiers are rated over the extended
industrial temperature range, –40°C to +125°C.
This family of amplifiers exhibits true single-supply operation
with rail-to-rail input and output performance for supply
voltages ranging from 2.7 V to 12 V. The input voltage range
extends 200 mV beyond each rail without phase reversal. The
dynamic range of the output extends to within 40 mV of each
rail.
The versatility of the AD8029/AD8030/AD8040 allows the user
to operate the amplifiers on a wide range of supplies while
consuming less than 6.5 mW of power. These features extend
the operation time in applications ranging from battery-
INPUT
4.5
4.0
OUTPUT
3.5
VOLTAGE (V)
The AD8029/AD8030/AD8040 provide excellent signal quality
with minimal power dissipation. At G = +1, SFDR is –72 dBc at
1 MHz and settling time to 0.1% is only 80 ns. Low distortion
and fast settling performance make these amplifiers suitable
drivers for single-supply A/D converters.
5.0
3.0
2.5
2.0
1.5
1.0
G = +1
0.5 VS = +5V
RL = 1kΩ TIED TO MIDSUPPLY
0
TIME (µs)
1µs/DIV
03679-A-010
Figure 5. Rail-to-Rail Response
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703
© 2003 Analog Devices, Inc. All rights reserved.
03679-A-001
APPLICATIONS
NC 1
–IN 2
03679-A-003
Low power
1.3 mA supply current/amplifier
High speed
125 MHz, –3 dB bandwidth (G = +1)
60 V/µs slew rate
80 ns settling time to 0.1%
Rail-to-rail input and output
No phase reversal, inputs 200 mV beyond rails
Wide supply range: 2.7 V to 12 V
Offset voltage: 6 mV max
Low input bias current
+0.7 µA to –1.5 µA
Small packaging
SOIC-8, SC70-6, SOT23-8, SOIC-14, TSSOP-14
03679-A-004
FEATURES
AD8029/AD8030/AD8040
TABLE OF CONTENTS
Specifications..................................................................................... 3
Applications..................................................................................... 16
Specifications with ±5 V Supply ................................................. 3
Wideband Operation ................................................................. 16
Specifications with +5 V Supply ................................................. 4
Output Loading sensitivity........................................................ 16
Specifications with +3 V Supply ................................................. 5
Disable Pin .................................................................................. 17
Absolute Maximum Ratings............................................................ 6
Circuit Considerations .............................................................. 18
Maximum Power Dissipation ..................................................... 6
Design Tools and Technical Support ....................................... 18
Typical Performance Characteristics ............................................. 7
Outline Dimensions ....................................................................... 19
Theory of Operation ...................................................................... 15
Ordering Guide............................................................................... 20
Input Stage................................................................................... 15
ESD Caution................................................................................ 20
Output Stage................................................................................ 15
REVISION HISTORY
Revision A
11/03—Data Sheet Changed from Rev. 0 to Rev. A
Change
Page
Added AD8040 part .......................................................Universal
Change to Figure 5 ....................................................................... 1
Changes to Specifications ............................................................ 3
Changes to Figures 10–12............................................................ 7
Change to Figure 14 ..................................................................... 8
Changes to Figures 20 and 21 ..................................................... 9
Inserted new Figure 36............................................................... 11
Change to Figure 40 ................................................................... 12
Inserted new Figure 41............................................................... 12
Added Output Loading Sensitivity section ............................. 16
Changes to Table 5...................................................................... 17
Changes to Power Supply Bypassing section .......................... 18
Changes to Ordering Guide ...................................................... 20
Rev. A | Page 2 of 20
AD8029/AD8030/AD8040
SPECIFICATIONS
SPECIFICATIONS WITH ±5 V SUPPLY
Table 1. VS = ±5 V @ TA = 25°C, G = +1, RL = 1 kΩ to ground, unless otherwise noted. All specifications are per amplifier.
Parameter
Conditions
Min
Typ
G = +1, VO = 0.1 V p-p
G = +1, VO = 2 V p-p
G = +2, VO = 0.1 V p-p
G = +1, VO = 2 V Step
G = –1, VO = 2 V Step
G = +2, VO = 2 V Step
80
14
125
19
6
62
63
80
MHz
MHz
MHz
V/µs
V/µs
ns
Input Voltage Noise
fC = 1 MHz, VO = 2 V p-p
fC = 5 MHz, VO = 2 V p-p
f = 100 kHz
–74
–56
16.5
dBc
dBc
nV/√Hz
Input Current Noise
f = 100 kHz
1.1
Crosstalk (AD8030/AD8040)
f = 5 MHz, VIN = 2 V p-p
–79
pA/√Hz
dB
DYNAMIC PERFORMANCE
–3 dB Bandwidth
Bandwidth for 0.1 dB Flatness
Slew Rate
Settling Time to 0.1%
NOISE/DISTORTION PERFORMANCE
Spurious Free Dynamic Range (SFDR)
DC PERFORMANCE
Input Offset Voltage
Input Offset Voltage Drift
Input Bias Current1
Input Offset Current
Open-Loop Gain
INPUT CHARACTERISTICS
Input Resistance
Input Capacitance
Input Common-Mode Voltage Range
Common-Mode Rejection Ratio
DISABLE PIN (AD8029)
DISABLE Low Voltage
PNP Active, VCM = 0 V
1.6
5
NPN Active, VCM = 4.5 V
2
6
TMIN to TMAX
NPN Active, VCM = 4.5 V
TMIN to TMAX
PNP Active, VCM = 0 V
TMIN to TMAX
65
30
0.7
1
–1.7
2
±0.1
74
80
6
2
–5.2 to +5.2
90
Vo = ±4.0 V
VCM = –4.5 V to +3 V, RL = 10 kΩ
1.3
–2.8
±0.9
Unit
mV
mV
µV/°C
µA
µA
µA
µA
µA
dB
MΩ
pF
V
dB
–VS + 0.8
V
DISABLE Low Current
–6.5
µA
DISABLE High Voltage
–VS + 1.2
V
DISABLE High Current
0.2
µA
150
ns
85
ns
Turn-Off Time
Turn-On Time
OUTPUT CHARACTERISTICS
Output Overdrive Recovery Time
(Rising/Falling Edge)
Output Voltage Swing
Short-Circuit Current
Off Isolation (AD8029)
Capacitive Load Drive
POWER SUPPLY
Operating Range
Quiescent Current/Amplifier
1
Max
50% of DISABLE to <10% of Final VO,
VIN = –1 V, G = –1
50% of DISABLE to <10% of Final VO,
VIN = –1 V, G = –1
VIN = +6 V to –6 V, G = –1
RL = 1 kΩ
RL = 10 kΩ
Sinking and Sourcing
VIN = 0.1 V p-p, f = 1 MHz, DISABLE = Low
30% Overshoot
55/45
170/160
–55
ns
V
V
mA
dB
20
pF
–VS + 0.22
–VS + 0.05
+VS – 0.22
+VS – 0.05
2.7
Quiescent Current (Disabled)
DISABLE = Low
Power Supply Rejection Ratio
Vs ± 1 V
73
Plus, +, (or no sign) indicates current into pin; minus (–) indicates current out of pin.
Rev. A | Page 3 of 20
1.4
12
1.5
V
mA
150
200
µA
80
dB
AD8029/AD8030/AD8040
SPECIFICATIONS WITH +5 V SUPPLY
Table 2. VS = 5 V @ TA = 25°C, G = +1, RL = 1 kΩ to midsupply, unless otherwise noted. All specifications are per amplifier.
Parameter
DYNAMIC PERFORMANCE
–3 dB Bandwidth
Bandwidth for 0.1 dB Flatness
Slew Rate
Settling Time to 0.1%
NOISE/DISTORTION PERFORMANCE
Spurious Free Dynamic Range (SFDR)
Input Voltage Noise
Input Current Noise
Crosstalk (AD8030/AD8040)
DC PERFORMANCE
Input Offset Voltage
Input Offset Voltage Drift
Input Bias Current1
Input Offset Current
Open-Loop Gain
INPUT CHARACTERISTICS
Input Resistance
Input Capacitance
Input Common-Mode Voltage Range
Common-Mode Rejection Ratio
DISABLE PIN (AD8029)
DISABLE Low Voltage
DISABLE Low Current
DISABLE High Voltage
DISABLE High Current
Turn-Off Time
Turn-On Time
OUTPUT CHARACTERISTICS
Overdrive Recovery Time
(Rising/Falling Edge)
Output Voltage Swing
Short-Circuit Current
Off Isolation (AD8029)
Capacitive Load Drive
POWER SUPPLY
Operating Range
Quiescent Current/Amplifier
Quiescent Current (Disabled)
Power Supply Rejection Ratio
1
Conditions
Min
Typ
G = +1, VO = 0.1 V p-p
G = +1, VO = 2 V p-p
G = +2, VO = 0.1 V p-p
G = +1, VO = 2 V Step
G = –1, VO = 2 V Step
G = +2, VO = 2 V Step
80
13
120
18
6
55
60
82
MHz
MHz
MHz
V/µs
V/µs
ns
fC = 1 MHz, VO = 2 V p-p
fC = 5 MHz, VO = 2 V p-p
f = 100 kHz
f = 100 kHz
f = 5 MHz, VIN = 2 V p-p
–73
–55
16.5
1.1
-79
dBc
dBc
nV/√Hz
pA/√Hz
dB
PNP Active, VCM = 2.5 V
NPN Active, VCM = 4.5 V
TMIN to TMAX
NPN Active, VCM = 4.5 V
TMIN to TMAX
PNP Active, VCM = 2.5 V
TMIN to TMAX
65
1.4
1.8
25
0.8
1
–1.8
2
±0.1
74
80
6
2
–0.2 to +5.2
90
MΩ
pF
V
dB
–VS + 0.8
–6.5
–VS + 1.2
0.2
155
V
µA
V
µA
ns
90
ns
Vo = 1 V to 4 V
VCM = 0.25 V to 2 V, RL = 10 kΩ
50% of DISABLE to <10% of Final VO,
VIN = –1 V, G = –1
50% of DISABLE to <10% of Final VO,
VIN = –1 V, G = –1
VIN = –1 V to +6 V, G = –1
RL = 1 kΩ
RL = 10 kΩ
Sinking and Sourcing
Vin = 0.1 V p-p, f = 1 MHz, DISABLE = Low
30% Overshoot
Rev. A | Page 4 of 20
1.2
–2.8
±0.9
+VS – 0.17
+VS – 0.04
95/60
–55
15
73
Plus, +, (or no sign) indicates current into pin; minus (–) indicates current out of pin.
5
6
45/50
–VS + 0.17
–VS + 0.04
2.7
DISABLE = Low
VS ± 1 V
Max
1.3
140
80
12
1.5
200
Unit
mV
mV
µV/°C
µA
µA
µA
µA
µA
dB
ns
V
V
mA
dB
pF
V
mA
µA
dB
AD8029/AD8030/AD8040
SPECIFICATIONS WITH +3 V SUPPLY
Table 3. VS = +3 V @ TA = 25°C, G = +1, RL = 1 kΩ to midsupply, unless otherwise noted. All specifications are per amplifier.
Parameter
DYNAMIC PERFORMANCE
–3 dB Bandwidth
Bandwidth for 0.1 dB Flatness
Slew Rate
Settling Time to 0.1%
NOISE/DISTORTION PERFORMANCE
Spurious Free Dynamic Range (SFDR)
Input Voltage Noise
Input Current Noise
Crosstalk (AD8030/AD8040)
DC PERFORMANCE
Input Offset Voltage
Input Offset Voltage Drift
Input Bias Current1
Input Bias Current1
Input Offset Current
Open-Loop Gain
INPUT CHARACTERISTICS
Input Resistance
Input Capacitance
Input Common-Mode Voltage Range
Common-Mode Rejection Ratio
DISABLE PIN (AD8029)
DISABLE Low Voltage
DISABLE Low Current
DISABLE High Voltage
DISABLE High Current
Turn-Off Time
Turn-On Time
OUTPUT CHARACTERISTICS
Output Overdrive Recovery Time
(Rising/Falling Edge)
Output Voltage Swing
Short-Circuit Current
Off Isolation (AD8029)
Capacitive Load Drive
POWER SUPPLY
Operating Range
Quiescent Current/Amplifier
Quiescent Current (Disabled)
Power Supply Rejection Ratio
1
Conditions
Min
Typ
G = +1, VO = 0.1 V p-p
G = +1, VO = 2 V p-p
G = +2, VO = 0.1 V p-p
G = +1, VO = 2 V Step
G = –1, VO = 2 V Step
G = +2, VO = 2 V Step
80
13
112
18
6
55
57
110
MHz
MHz
MHz
V/µs
V/µs
ns
fC = 1 MHz, VO = 2 V p-p
fC = 5 MHz, VO = 2 V p-p
f = 100 kHz
f = 100 kHz
f = 5 MHz, VIN = 2 V p-p
–72
–60
16.5
1.1
-80
dBc
dBc
nV/√Hz
pA/√Hz
dB
PNP Active, VCM = 1.5 V
NPN Active, VCM = 2.5 V
TMIN to TMAX
NPN Active, VCM = 2.5 V
TMIN to TMAX
PNP Active, VCM = 1.5 V
TMIN to TMAX
64
1.1
1.6
24
0.7
1
–1.5
1.6
±0.1
73
78
6
2
–0.2 to +3.2
88
MΩ
pF
V
dB
–VS + 0.8
–6.5
–VS + 1.2
0.2
165
V
µA
V
µA
ns
95
ns
Vo = 0.5 V to 2.5 V
VCM = 0.25 V to 1.25 V, RL = 10 kΩ
50% of DISABLE to <10% of Final VO,
VIN = –1 V, G = –1
50% of DISABLE to <10% of Final VO,
VIN = –1 V, G = –1
VIN = –1 V to +4 V, G = –1
RL = 1 kΩ
RL = 10 kΩ
Sinking and Sourcing
VIN = 0.1 V p-p, f = 1 MHz, DISABLE = Low
30% Overshoot
Rev. A | Page 5 of 20
1.2
–2.5
±0.9
+VS – 0.09
+VS – 0.04
80/40
–55
10
70
Plus, +, (or no sign) indicates current into pin; minus (–) indicates current out of pin.
5
6
75/100
–VS + 0.09
–VS + 0.04
2.7
DISABLE = Low
VS ± 1 V
Max
1.3
145
76
12
1.4
200
Unit
mV
mV
µV/°C
µA
µA
µA
µA
µA
dB
ns
V
V
mA
dB
pF
V
mA
µA
dB
AD8029/AD8030/AD8040
ABSOLUTE MAXIMUM RATINGS
Table 4. AD8029/AD8030/AD8040 Stress Ratings
PD = Quiescent Power + (Total Drive Power – Load Power)
Rating
12.6 V
See Figure 6
±VS ± 0.5 V
±1.8 V
–65°C to +125°C
–40°C to +125°C
300°C
⎛V V
PD = (VS × I S ) + ⎜⎜ S × OUT
RL
⎝ 2
⎞ VOUT 2
⎟–
⎟
RL
⎠
RMS output voltages should be considered. If RL is referenced to
VS–, as in single-supply operation, then the total drive power is
VS × IOUT.
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8029/AD8030/
AD8040 package is limited by the associated rise in junction
temperature (TJ) on the die. The plastic encapsulating the die
locally reaches the junction temperature. At approximately
150°C, which is the glass transition temperature, the plastic
changes its properties. Even temporarily exceeding this
temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric
performance of the AD8029/AD8030/AD8040. Exceeding a
junction temperature of 175°C for an extended period can
result in changes in silicon devices, potentially causing failure.
If the rms signal levels are indeterminate, consider the worst
case, when VOUT = VS/4 for RL to midsupply:
PD = (VS × I S ) +
RL
In single-supply operation with RL referenced to VS–, worst case
is VOUT = VS/2.
Airflow will increase heat dissipation, effectively reducing θJA.
Also, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes will
reduce the θJA. Care must be taken to minimize parasitic capacitances at the input leads of high speed op amps, as discussed in
the PCB Layout section.
Figure 6 shows the maximum safe power dissipation in the
package versus the ambient temperature for the SOIC-8
(125°C/W), SOT23-8 (160°C/W), SOIC-14 (90°C/W),
TSSOP-14 (120°C/W), and SC70-6 (208°C/W) packages on a
JEDEC standard 4-layer board. θJA values are approximations.
2.5
MAXIMUM POWER DISSIPATION (W)
The still-air thermal properties of the package and PCB (θJA),
ambient temperature (TA), and the total power dissipated in the
package (PD) determine the junction temperature of the die. The
junction temperature can be calculated as
TJ = TA + (PD × θJA)
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). Assuming the load (RL) is referenced to
midsupply, the total drive power is VS/2 × IOUT, some of which is
dissipated in the package and some in the load (VOUT × IOUT).
The difference between the total drive power and the load
power is the drive power dissipated in the package.
(VS /4 )2
2.0
SOIC-14
1.5
TSSOP-14
SOIC-8
1.0
0.5
SOT-23-8
SC70-6
0
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110 120
AMBIENT TEMPERATURE (°C)
03679-A-018
Parameter
Supply Voltage
Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Storage Temperature
Operating Temperature Range
Lead Temperature Range
(Soldering 10 sec)
Junction Temperature
Figure 6. Maximum Power Dissipation
Output Short Circuit
Shorting the output to ground or drawing excessive current
from the AD8029/AD8030/AD8040 could cause catastrophic
failure.
Rev. A | Page 6 of 20
AD8029/AD8030/AD8040
TYPICAL PERFORMANCE CHARACTERISTICS
Default Conditions: VS = 5 V (TA = 25°C, RL = 1 kΩ tied to midsupply, unless otherwise noted.)
0.2
1
NORMALIZED CLOSED-LOOP GAIN (dB)
–1
–2
G = +10
RF = 9kΩ, RG = 1kΩ
–3
–4
–5
G = +1
RF = 0Ω
G = +2
RF = RG = 1kΩ
–6
–7
–8
–9
–10
–11
–12
–13
–14
0.1
VO = 0.1V p-p
1
0
–0.1
G = +1
–0.2
–0.3
–0.4
G = +2
–0.5
–0.6
–0.7
–0.8
10
FREQUENCY (MHz)
100
1000
1
NORMALIZED CLOSED-LOOP GAIN (dB)
CLOSED-LOOP GAIN (dB)
Figure 10. 0.1 dB Flatness Frequency Response
+3V
±5V
–1
100
03679-A-011
1
G = +1
VO = 0.1V p-p
0
10
FREQUENCY (MHz)
03679-0-004
Figure 7. Small Signal Frequency Response for Various Gains
1
RF = 1kΩ
DASHED LINES: VOUT = 2V p-p
0.1 SOLID LINES: VOUT = 0.1V p-p
NORMALIZED CLOSED-LOOP GAIN (dB)
G = –1
RF = RG = 1kΩ
0
–2
–3
–4
+5V
–5
–6
–7
G = +2
VO = 0.1V p-p
RF = 1kΩ
0
–1
–2
–3
±5V
–4
–5
–6
+5V
–7
+3V
–8
–8
1
10
100
FREQUENCY (MHz)
1000
1
NORMALIZED CLOSED-LOOP GAIN (dB)
±5V
CLOSED-LOOP GAIN (dB)
–1
–2
+3V
–3
–4
–5
–6
+5V
–7
100
03679-A-012
Figure 11. Small Signal Frequency Response for Various Supplies
G = +1
VO = 2V p-p
0
10
FREQUENCY (MHz)
03679-0-005
Figure 8. Small Signal Frequency Response for Various Supplies
1
1
–8
G = +2
VO = 2V p-p
0
RF = 1kΩ
–1
VS = ±5
–2
VS = +5
–3
–4
VS = +3
–5
–6
–7
–8
1
10
FREQUENCY (MHz)
100
1
03679-0-006
Figure 9. Large Signal Frequency Response for Various Supplies
10
FREQUENCY (MHz)
100
03679-A-013
Figure 12. Large Signal Frequency Response for Various Supplies
Rev. A | Page 7 of 20
AD8029/AD8030/AD8040
2
6
CLOSED-LOOP GAIN (dB)
3
2
G = +1
1 VO = 0.1V p-p
20pF
10pF
5pF
1
0
–1
0pF
–2
VICM = VS+ – 0.2V
VICM = 0V
0
CLOSED-LOOP GAIN (dB)
G = +1
5 V = 0.1V p-p
O
4
–3
–4
–5
–1
VICM = VS– + 0.2V
–2
–3
–4
–5
–6
–6
–7
–7
–8
–8
1
10
100
FREQUENCY (MHz)
1000
1
Figure 13. Small Signal Frequency Response for Various CLOAD
1
NORMALIZED CLOSED-LOOP GAIN (dB)
2
G = +1
VO = 0.1V p-p
1
+125°C
+85°C
+25°C
CLOSED-LOOP GAIN (dB)
–1
–2
–3
–4
–5
2V p-p
1V p-p
–6
0
–40°C
–1
–2
–3
–4
0.1V p-p
–7
–5
–8
1
10
FREQUENCY (MHz)
–6
100
1
80
225
1
G = +1
VO = 2V p-p
50
40
135
30
20
90
10
0
45
+125°C
–1
CLOSED-LOOP GAIN (dB)
180
OPEN-LOOP PHASE (Degrees)
0
60
100
03679-0-014
Figure 17. Small Signal Frequency Response vs. Temperature
70
–10
–20
10
10
FREQUENCY (MHz)
03679-A-014
Figure 14. Frequency Response for Various Output Amplitudes
OPEN-LOOP GAIN (dB)
1000
03679-0-013
Figure 16. Small Signal Frequency Response for Various
Input Common-Mode Voltages
G = +2
RF = 1kΩ
0
10
100
FREQUENCY (MHz)
03679-0-010
+25°C
–2
+85°C
–3
–4
–40°C
–5
–6
–7
100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
100M
0
1G
–8
1
03679-0-054
Figure 15. Open-Loop Gain and Phase vs. Frequency
10
FREQUENCY (MHz)
100
03679-0-015
Figure 18. Large Signal Frequency Response vs. Temperature
Rev. A | Page 8 of 20
AD8029/AD8030/AD8040
–40
G = +1
VOUT = 2V p-p
–50 SECOND HARMONIC: SOLID LINE
THIRD HARMONIC: DASHED LINE
G = +1
VOUT = 2V p-p
R
–45
L = 1kΩ
SECOND HARMONIC: SOLID LINE
THIRD HARMONIC: DASHED LINE
–55
HARMONIC DISTORTION (dBc)
HARMONIC DISTORTION (dBc)
–35
–65
VS = +3V
–75
–85
VS = +5V
VS = ±5V
–60
–70
RL = 1kΩ
–80
–90
RL = 5kΩ
–100
–95
RL = 2kΩ
–105
0.01
0.1
1
FREQUENCY (MHz)
–110
0.01
10
Figure 19. Harmonic Distortion vs. Frequency and Supply Voltage
–40
VS = +5V
VS = +3V
–55
–60
–65
–70
–75
G = +1
VOUT = 2V p-p
FREQ = 1MHz
–50
VS = +10V
HARMONIC DISTORTION (dBc)
HARMONIC DISTORTION (dBc)
G = +2
FREQ = 1MHz
–45 RF = 1kΩ
–80
0.5
2.5
3.5
4.5
5.5
6.5
7.5
OUTPUT AMPLITUDE (V p-p)
8.5
VS = +5V
VS = +3V
–60
–70
–80
–90
SECOND HARMONIC: SOLID LINE
THIRD HARMONIC: DASHED LINE
1.5
10
03679-0-075
Figure 22. Harmonic Distortion vs. Frequency and Load
–40
–50
0.1
1
FREQUENCY (MHz)
03679-0-016
SECOND HARMONIC: SOLID LINE
THIRD HARMONIC: DASHED LINE
–100
1.0
9.5
1.5
03679-A-015
2.0
2.5
3.0
3.5
INPUT COMMON-MODE VOLTAGE (V)
4.0
03679-0-020
Figure 23. Harmonic Distortion vs. Input Common Mode Voltage
Figure 20. Harmonic Distortion vs. Output Amplitude
–30
1000
100
100
10
G = +2
–60
G = –1
–70
–80
–90
VOLTAGE NOISE
10
1
CURRENT NOISE
G = +1
–100
–110
0.01
SECOND HARMONIC: SOLID LINE
THIRD HARMONIC: DASHED LINE
0.1
1
FREQUENCY (MHz)
1
10
10
100
1k
10k
100k
FREQUENCY (Hz)
0.1
10M
1M
03679-0-069
03679-A-016
Figure 24. Voltage and Current Noise vs. Frequency
Figure 21. Harmonic Distortion vs. Frequency and Gain
Rev. A | Page 9 of 20
CURRENT NOISE (pA/ Hz)
–50
VOLTAGE NOISE (nV/ Hz)
HARMONIC DISTORTION (dBc)
VS = +5V
VOUT = 2.0V p-p
–40 R = 1kΩ
L
RF = 1kΩ
AD8029/AD8030/AD8040
100
75
100
G = +1
VS = ±2.5V
75
25
0
–25
–50
25
0
–25
–50
–75
–75
25mV/DIV
25mV/DIV
20ns/DIV
TIME (ns)
TIME (ns)
03679-0-022
03679-0-025
Figure 28. Small Signal Transient Response with Capacitive Load
Figure 25. Small Signal Transient Response
5.0
G = +1
INPUT
4V p-p
2.0 VS = ±2.5V
4.5
1.5
4.0
3.5
1.0
VOLTAGE (V)
2V p-p
0.5
0
–0.5
3.0
2.5
2.0
–1.0
1.5
–1.5
1.0
G = +1
0.5 VS = +5V
RL = 1kΩ TIED TO MIDSUPPLY
0
TIME (Seconds)
–2.5
0.5V/DIV
25ns/DIV
TIME (ns)
03679-A-023
–2.0
1µs/DIV
03679-0-059
4
4
INPUT
3
INPUT
G = –1 (RF = 1kΩ)
RL = 1kΩ
VS = ±2.5V
3
OUTPUT VOLTAGE (V)
2
1
OUTPUT
Figure 29. Rail-to-Rail Response, G = +1
Figure 26. Large Signal Transient Response
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
20ns/DIV
–100
–100
2.5
CL = 20pF
CL = 10pF
CL = 5pF
50
OUTPUT VOLTAGE (mV)
OUTPUT VOLTAGE (mV)
50
G = +1
VS = ±2.5V
OUTPUT
0
–1
G = +1
RL = 1kΩ
VS = ±2.5V
2
OUTPUT
1
0
–1
–2
–2
–3
–3
1V/DIV
1V/DIV
200ns/DIV
200ns/DIV
–4
–4
TIME (ns)
TIME (ns)
03679-0-024
Figure 30. Input Overdrive Recovery
Figure 27. Output Overdrive Recovery
Rev. A | Page 10 of 20
03679-0-027
AD8029/AD8030/AD8040
VIN (250mV/DIV)
VOUT (500mV/DIV)
G = +2
VS = ±2.5V
G = +2
+1V
+0.1%
+0.1%
VOUT – 2VIN (0.1%/DIV)
VOUT – 2VIN (0.1%/DIV)
–0.1%
–0.1%
VOUT (500mV/DIV)
–1V
500ns/DIV
20ns/DIV
03679-0-062
03679-0-063
Figure 31. Long-Term Settling Time
Figure 34.0.1% Short-Term Settling Time
0
–20
–10
–30
–20
+PSRR
–40
–30
PSRR (dB)
CMRR (dB)
–50
–60
–70
–40
–50
–60
–70
–PSRR
–80
–80
–90
–90
–100
1k
–100
10k
100k
1M
10M
FREQUENCY (Hz)
100M
1G
10k
100M
1G
03679-0-033
–30
G = +1
RL = 1kΩ
DISABLE = LOW
VIN = 0.1V p-p
VIN
–40
DRIVE AMP
50Ω
1kΩ
–50
–60
CROSSTALK (dB)
–40
OUTPUT (dB)
10M
Figure 35. PSRR vs. Frequency
–20
–50
–60
LISTEN AMP
VOUT
–70
1kΩ
–80
CROSSTALK = 20log
–90
( )
VOUT
VIN
AD8030
(AMP 2 DRIVE
AMP 1 LISTEN)
–100
–110
–70
AD8040
(AMP 4 DRIVE
AMP 1 LISTEN)
–120
–80
0.1
1M
FREQUENCY (Hz)
Figure 32. Common-Mode Rejection Ratio vs. Frequency
–30
100k
03679-0-078
1
10
FREQUENCY (MHz)
100
1000
–130
0.01
03679-0-055
0.1
1.0
10
FREQUENCY (MHz)
100
Figure 36. AD8030/AD8040 Crosstalk vs. Frequency
Figure 33. AD8029 Off-Isolation vs. Frequency
Rev. A | Page 11 of 20
1000
03679-A-005
1k
AD8029/AD8030/AD8040
2.5
4
2.0
VS = +10V
INPUT OFFSET VOLTAGE (mV)
1.0
0.5
0
–0.5
–1.0
–1.5
–2.5
–1
0
1
2
3
4
5
6
7
8
9
INPUT COMMON-MODE VOLTAGE (V)
10
1
0
–1
–2
–4
–1
11
–1.2
0.8
NPN ACTIVE
VS = +5
0.6
VS = +3
0.4
–1.6
PNP ACTIVE
–1.8
–25
–10
5
20
35
50
65
TEMPERATURE (°C)
80
0.2
95
110
2
3
4
5
6
7
8
9
INPUT COMMON-MODE VOLTAGE (V)
10
11
Figure 40. Input Offset Voltage vs. Input Common-Mode Voltage
4
3
INPUT OFFSET VOLTAGE (mV)
1.0
VS = ±5
1
03679-A-017
INPUT BIAS CURRENT (NPN ACTIVE) (µA)
–1.0
–1.4
0
03679-0-074
Figure 37. Input Bias Current vs. Input Common-Mode Voltage
2
VS = ±5V
1
VS = +5V
0
–1
VS = +3V
–2
–3
–4
–40
0
125
–25
–10
5
20
35
50
65
TEMPERATURE (°C)
80
95
110
125
03679-0-073
Figure 38. Input Bias Current vs. Temperature
Figure 41. Input Offset Voltage vs. Temperature
1.8
120
COUNT = 1088
MEAN = 0.44mV
STDEV = 1.05mV
1.7
100
1.6
VS = +5V
1.5
VS = ±5V
80
1.4
FREQUENCY
SUPPLY CURRENT (mA)
INPUT BIAS CURRENT (PNP ACTIVE) (µA)
VS = +10V
–3
–2.0
–2.0
–40
VS = +5V
2
1.3
VS = +3V
1.2
1.1
60
40
1.0
20
0.9
0.8
–40
–20
0
20
40
60
TEMPERATURE (°C)
80
100
0
120
03679-0-067
Figure 39 Quiescent Supply Current vs. Temperature
–5
–4
–3
–2
–1
0
1
2
3
INPUT OFFSET VOLTAGE (mV)
Figure 42. Input Offset Voltage Distribution
Rev. A | Page 12 of 20
4
5
03679-0-064
03679-A-006
INPUT BIAS CURRENT (µA)
VS = +5V
VS = +3V
1.5
RL = 1kΩ TO
MIDSUPPLY
G = +1
VS = +3V
3
AD8029/AD8030/AD8040
1M
1000
G = +1
DISABLE = LOW
OUTPUT IMPEDANCE (Ω)
OUTPUT IMPEDANCE (Ω)
100k
10k
1k
100
100
10
1
10
1
100k
1M
10M
FREQUENCY (Hz)
100M
0.1
1k
1G
100k
1M
10M
FREQUENCY (Hz)
100M
2.0
0.5
LOAD RESISTANCE TIED
TO MIDSUPPLY
0.4
0.2
VOL – VS
0.1
VS = +3V
0
VS = ±2.5V
1.5
INPUT ERROR VOLTAGE (mV)
0.3
VS = +5V VS = ±5V
–0.1
VOH – VS
–0.2
–0.3
1.0
0.5
RL = 10kΩ
0
RL = 1kΩ
–0.5
–1.0
–1.5
–0.4
–0.5
100
1000
LOAD RESISTANCE (Ω)
–2.0
–2.5
10000
–2.0
–1.5
–1.0 –0.5 –0
0.5
1.0
OUTPUT VOLTAGE (V)
1.5
03679-0-041
Figure 46. Input Error Voltage vs. Output Voltage
Figure 44. Output Saturation Voltage vs. Load Resistance
170
OUTPUT SATURATION VOLTAGE (mV)
1G
03679-0-060
Figure 45. Output Impedance vs. Frequency, Enabled
Figure 43. AD8029 Output Impedance vs. Frequency, Disabled
OUTPUT SATURATION VOLTAGE (V)
10k
03679-0-061
VS = ±5V
150
130
110
VS = +5V
90
70
50
RL = 1kΩ TIED TO MIDSUPPLY
SOLID LINE: VS+ – VOH
DASHED LINE: VOL – VS–
VS = +3V
30
–40
–25
–10
5
20
35
50
65
TEMPERATURE (°C)
80
95
110
125
03679-0-066
Figure 42. Output Saturation Voltage vs. Temperature
Rev. A | Page 13 of 20
2.0
2.5
03679-0-072
AD8029/AD8030/AD8040
1
1.5
DISABLE (–0.5V TO –2V)
VS = +3V, +5V, +10V
0
DISABLE PIN CURRENT (µA)
OUTPUT AMPLITUDE (V)
1.0
0.5
RL = 100Ω
0
OUTPUT DISABLED
RL = 1kΩ
RL = 10kΩ
–0.5
–1
–2
–3
–4
–5
–1.0
–6
VS = ±2.5V
G = –1 (RF = 1kΩ)
–1.5
0
50
100
150
200
TIME (ns)
250
300
–7
0
350
03679-A-020
Figure 47. AD8029 DISABLE Turn-Off Timing
DISABLE (–2V TO –0.5V)
OUTPUT AMPLITUDE (V)
OUTPUT ENABLED
0.5
0
RL = 100Ω
RL = 1kΩ
RL = 10kΩ
–0.5
–1.0
–1.5
VS = ±2.5V
G = –1 (RF = 1kΩ)
0
50
100
150
200
TIME (ns)
250
3
03679-A-022
Figure 49. AD8029 DISABLE Pin Current vs. DISABLE Pin Voltage
1.5
1.0
0.8 1 1.2
2
DISABLE PIN VOLTAGE (V)
300
350
03679-A-021
Figure 48. AD8029 DISABLE Turn-On Timing
Rev. A | Page 14 of 20
AD8029/AD8030/AD8040
THEORY OF OPERATION
+VS
RTH
ITAIL
SPD
+VS –1.2V
DISABLE
Q9
TO DISABLE
CIRCUITRY
ITH
R1 R2
–VS
Q10
AD8029 ONLY
MTOP
Q1
IN–
OUTPUT
BUFFER
R3 R4
Q5
CMT
Q2
Q6
VOUT
CMB
Q7
Q8
Q3
IN+
Q4
MBOT
R5 R6 R7 R8
Q11
OUT
IN
COM
–VS
03679-0-051
Figure 50. Simplified Schematic
The AD8029 (single), AD8030 (dual), and AD8040 (quad) are
rail-to-rail input and output amplifiers fabricated using Analog
Devices’ XFCB process. The XFCB process enables the AD8029/
AD8030/AD8040 to operate on 2.7 V to 12 V supplies with a
120 MHz bandwidth and a 60 V/µs slew rate. A simplified schematic of the AD8029/AD8030/AD8040 is shown in Figure 50.
OUTPUT STAGE
The currents derived from the PNP and NPN input differential
pairs are injected into the current mirrors MBOT and MTOP, thus
establishing a common-mode signal voltage at the input of the
output buffer.
The output buffer performs three functions:
INPUT STAGE
For input common-mode voltages less than a set threshold
(1.2 V below VCC), the resistor degenerated PNP differential pair
(comprising Q1 toQ4) carries the entire ITAIL current, allowing
the input voltage to go 200 mV below –VS. Conversely, input
common-mode voltages exceeding the same threshold cause
ITAIL to be routed away from the PNP differential pair and into
the NPN differential pair through transistor Q9. Under this
condition, the input common-mode voltage is allowed to rise
200 mV above +VS while still maintaining linear amplifier
behavior. The transition between these two modes of operation
leads to a sudden, temporary shift in input stage transconductance, gm, and dc parameters (such as the input offset voltage
VOS), which in turn adversely affect the distortion performance.
The SPD block shortens the duration of this transition, thus
improving the distortion performance. As shown in Figure 50,
the input differential pair is protected by a pair of two series
diodes, connected in anti-parallel, which clamp the differential
input voltage to approximately ±1.5 V.
1.
It buffers and applies the desired signal voltage to the
output devices, Q10 and Q11.
2.
It senses the common-mode current level in the output
devices.
3.
It regulates the output common-mode current by
establishing a common-mode feedback loop.
The output devices Q10 and Q11 work in a common-emitter
configuration, and are Miller-compensated by internal
capacitors, CMT and CMB.
The output voltage compliance is set by the output devices’
collector resistance RC (about 25 Ω), and by the required load
current IL. For instance, a light equivalent load (5 kΩ) allows the
output voltage to swing to within 40 mV of either rail, while
heavier loads cause this figure to deteriorate as RC × IL.
Rev. A | Page 15 of 20
AD8029/AD8030/AD8040
APPLICATIONS
WIDEBAND OPERATION
RF
+VS
For example, if using the values shown in Table 5 for a gain of 2,
with resistor values of 2.5 kΩ, the effective load at the output is
1.67 kΩ. For inverting configurations, only the feedback resistor
RF is in parallel with the output load. If the load is greater than
that specified in the data sheet, the amplifier can introduce
nonlinearities in its open-loop response, which increases
distortion. Figure 53 and Figure 54 illustrate effective output
loading and distortion performance. Increasing the resistance of
the feedback network can reduce the current consumption, but
has other implications.
C2
10µF
C1
0.1µF
RG
–
AD8029
VOUT
R1
VIN
+
DISABLE
C4
0.1µF
C3
10µF
R1 = RF||RG
–40
VS = 5V
VOUT = 2.0V
0.1V p-p
–50 SECOND HARMONIC – SOLID LINES
THIRD HARMONIC – DOTTED LINES
HARMONIC DISTORTION (dBc)
03679-0-052
Figure 51. Wideband Non-inverting Gain Configuration
RF
+VS C2
10µF
C1
0.1µF
RG
–
AD8029
+
DISABLE
R1
RL = 1kΩ
–80
–90
–100
RL = 2.5kΩ
–120
0.01
C3
10µF
–VS
RL = 5kΩ
–110
VOUT
C4
0.1µF
R1 = RF||RG
–70
0.1
1.0
FREQUENCY (MHz)
10
03679-A-008
VIN
–60
10
03679-A-009
–VS
Figure 53. Gain of 1 Distortion
–40
VS = 5V
VOUT = 2.0V
0.1V p-p
–50 SECOND HARMONIC – SOLID LINES
THIRD HARMONIC – DOTTED LINES
03679-0-053
OUTPUT LOADING SENSITIVITY
To achieve maximum performance and low power dissipation,
the designer needs to consider the loading at the output of
AD8029/AD8030/AD8040. Table 5 shows the effects of output
loading and performance.
When operating at unity gain, the effective load at the amplifier
output is the resistance (RL) being driven by the amplifier. For
gains other than 1, in noninverting configurations, the feedback
network represents an additional current load at the amplifier
output. The feedback network (RF + RG) is in parallel with RL,
which lowers the effective resistance at the output of the
amplifier. The lower effective resistance causes the amplifier to
supply more current at the output. Lower values of feedback
resistance increase the current draw, thus increasing the
amplifier’s power dissipation.
HARMONIC DISTORTION (dBc)
Figure 52. Wideband Inverting Gain Configuration
Rev. A | Page 16 of 20
–60
RF = RL = 1kΩ
–70
–80
RF = RL = 5kΩ
–90
–100
RF = RL = 2.5kΩ
–110
–120
0.01
0.1
1.0
FREQUENCY (MHz)
Figure 54. Gain of 2 Distortion
AD8029/AD8030/AD8040
Table 5. Effect of Load on Performance
Noninverting
Gain
1
1
1
2
2
2
–1
–1
–1
RF
(kΩ)
0
0
0
1
2.5
5
1
2.5
5
RG
(kΩ)
N/A
N/A
N/A
1
2.5
5
1
2.5
5
RLOAD
(kΩ)
1
2
5
1
2.5
5
1
2.5
5
–3 dB SS BW
(MHz)
120
130
139
36
44.5
43
40
40
34
The feedback resistance (RF || RG) combines with the input
capacitance to form a pole in the amplifier’s loop response. This
can cause peaking and ringing in the amplifier’s response if the
RC time constant is too low. Figure 55 illustrates this effect.
Peaking can be reduced by adding a small capacitor (1 pF–4 pF)
across the feedback resistor. The best way to find the optimal
value of capacitor is to empirically try it in your circuit. Another
factor of higher resistance values is the impact it has on noise
performance. Higher resistor values generate more noise. Each
application is unique and therefore a balance must be reached
between distortion, peaking, and noise performance. Table 5
outlines the trade-offs that different loads have on distortion,
peaking, and noise performance. In gains of 1, 2, and 10,
equivalent loads of 1 kΩ, 2 kΩ, and 5 kΩ are shown.
With increasing load resistance, the distortion and –3 dB
bandwidth improve, while the noise and peaking degrade
slightly.
VS = 5V
VOUT = 0.1V p-p
1
RF = RL = 2.5kΩ
Disable Pin
Voltage
Low
(Disabled)
High
(Enabled)
RL = 5kΩ
RF = RL = 1kΩ
–3
–4
G = +1
–5
–6
G = +2
–7
–8
1
10
100
FREQUENCY (MHz)
1000
Output Noise
(nV/√Hz)
16.5
16.5
16.5
33.5
34.4
36
33.6
34
36
Table 6. Disable Pin Control Voltage
RL = 2.5kΩ
–2
HD3 at 1 MHz,
2 V p-p (dB)
–72
–83
–92.5
–60
–72.5
–86
–57
–68
–80
The AD8029 disable pin allows the amplifier to be shut down
for power conservation or multiplexing applications. When in
the disable mode, the amplifier draws only 150 µA of quiescent
current. The disable pin control voltage is referenced to the
negative supply. The amplifier enters power-down mode any
time the disable pin is tied to the most negative supply or within
0.8 V of the negative supply. If left open, the amplifier will
operate normally. For switching levels, refer to Table 6.
RF = RL = 5kΩ
RL = 1kΩ
0
–1
HD2 at 1 MHz,
2 V p-p (dB)
–80
–84
–87.5
–72
–79
–84
–68
–74
–78
DISABLE PIN
03679-A-007
NORMALIZED CLOSED-LOOP GAIN (dB)
2
Peaking
(dB)
0.02
0.6
1
0
0.2
2
0.01
0.05
1
Figure 55. Frequency Response for Various Feedback/Load Resistances
Rev. A | Page 17 of 20
Supply Voltage
+3 V
+5 V
±5 V
0 V to <0.8 V
0 V to <0.8 V
–5 V to <–4 .2 V
1.2 V to 3 V
1.2 V to 5 V
–3.8 V to +5 V
AD8029/AD8030/AD8040
CIRCUIT CONSIDERATIONS
PCB Layout
Power Supply Bypassing
High speed op amps require careful attention to PCB layout to
achieve optimum performance. Particular care must be
exercised to minimize lead lengths of the bypass capacitors.
Excess lead inductance can influence the frequency response
and even cause high frequency oscillations. Using a multilayer
board with an internal ground plane can help reduce ground
noise and enable a more compact layout.
Power supply pins are actually inputs to the op amp. Care must
be taken to provide the op amp with a clean, low noise dc
voltage source.
To achieve the shortest possible trace length at the inverting
input, the feedback resistor, RF, should be located the shortest
distance from the output pin to the input pin. The return node
of the resistor RG should be situated as close as possible to the
return node of the negative supply bypass capacitor.
On multilayer boards, all layers beneath the op amp should be
cleared of metal to avoid creating parasitic capacitive elements.
This is especially true at the summing junction, i.e., the inverting input, –IN. Extra capacitance at the summing junction can
cause increased peaking in the frequency response and lower
phase margin.
Grounding
To minimize parasitic inductances and ground loops in high
speed, densely populated boards, a ground plane layer is critical.
Understanding where the current flows in a circuit is critical in
the implementation of high speed circuit design. The length of
the current path is directly proportional to the magnitude of the
parasitic inductances and thus the high frequency impedance of
the path. Fast current changes in an inductive ground return
will create unwanted noise and ringing.
The length of the high frequency bypass capacitor pads and
traces is critical. A parasitic inductance in the bypass grounding
works against the low impedance created by the bypass
capacitor. Because load currents flow from supplies as well as
from ground, the load should be placed at the same physical
location as the bypass capacitor ground. For large values of
capacitors, which are intended to be effective at lower
frequencies, the current return path length is less critical.
Power supply bypassing is employed to provide a low impedance path to ground for noise and undesired signals at all
frequencies. This cannot be achieved with a single capacitor
type; but with a variety of capacitors in parallel the bandwidth
of power supply bypassing can be greatly extended. The bypass
capacitors have two functions:
1.
Provide a low impedance path for noise and undesired
signals from the supply pins to ground.
2.
Provide local stored charge for fast switching conditions
and minimize the voltage drop at the supply pins during
transients. This is typically achieved with large electrolytic
capacitors.
Good quality ceramic chip capacitors should be used and
always kept as close as possible to the amplifier package. A
parallel combination of a 0.1 µF ceramic and a 10 µF electrolytic
covers a wide range of rejection for unwanted noise. The 10 µF
capacitor is less critical for high frequency bypassing and, in
most cases, one per supply line is sufficient. The values of
capacitors are circuit-dependant and should be determined by
the system’s requirements.
DESIGN TOOLS AND TECHNICAL SUPPORT
Analog Devices is committed to the design process by providing
technical support and online design tools. ADI offers technical
support via free evaluation boards, sample ICs, Spice models,
interactive evaluation tools, application notes, phone and email
support—all available at www.analog.com.
Rev. A | Page 18 of 20
AD8029/AD8030/AD8040
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
8
5
4.00 (0.1574)
3.80 (0.1497) 1
4
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0040)
8.75 (0.3445)
8.55 (0.3366)
6.20 (0.2440)
5.80 (0.2284)
4.00 (0.1575)
3.80 (0.1496)
0.50 (0.0196)
× 45°
0.25 (0.0099)
1.75 (0.0688)
1.35 (0.0532)
0.51 (0.0201)
COPLANARITY
SEATING 0.31 (0.0122)
0.10
PLANE
8°
0.25 (0.0098) 0° 1.27 (0.0500)
0.40 (0.0157)
0.17 (0.0067)
8
1
7
6.20 (0.2441)
5.80 (0.2283)
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0039)
0.50 (0.0197)
× 45°
0.25 (0.0098)
1.75 (0.0689)
1.35 (0.0531)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MS-012AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
SEATING
PLANE
8°
0.25 (0.0098) 0° 1.27 (0.0500)
0.40 (0.0157)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012AB
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 59. 14-Lead Standard Small Outline Package [SOIC] (R-14)
Dimensions shown in millimeters and (inches)
Figure 56. 8-Lead Standard Small Outline Package, Narrow Body [SOIC] (R-8)
Dimensions shown in millimeters and (inches)
2.00 BSC
5.10
5.00
4.90
6
5
4
1
2
3
2.10 BSC
1.25 BSC
14
0.65 BSC
1.30 BSC
1.00
0.90
0.70
6.40
BSC
1
1.10 MAX
7
PIN 1
0.22
0.08
0.30
0.15
8
4.50
4.40
4.30
PIN 1
0.10 MAX
14
8°
4°
0°
SEATING
PLANE
0.46
0.36
0.26
1.05
1.00
0.80
0.65
BSC
1.20
MAX
0.15
0.05
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-203AB
0.30
0.19
0.20
0.09
SEATING
COPLANARITY
PLANE
0.10
8°
0°
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153AB-1
Figure 57. 6-Lead Plastic Surface-Mount Package [SC70] (KS-6)
Dimensions shown in millimeters
Figure 60. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14)
Dimensions shown in millimeters
2.90 BSC
8
7
6
5
1
2
3
4
1.60 BSC
2.80 BSC
PIN 1
0.65 BSC
1.30
1.15
0.90
1.95
BSC
1.45 MAX
0.15 MAX
0.38
0.22
SEATING
PLANE
0.22
0.08
8°
4°
0°
0.60
0.45
0.30
COMPLIANT TO JEDEC STANDARDS MO-178BA
Figure 58. 8-Lead Small Outline Transistor Package [SOT23] (RJ-8)
Dimensions shown in millimeters
Rev. A | Page 19 of 20
AD8029/AD8030/AD8040
ORDERING GUIDE
Model
AD8029AR
AD8029AR-REEL
AD8029AR-REEL7
AD8029AKS-R2
AD8029AKS-REEL
AD8029AKS-REEL7
AD8030AR
AD8030AR-REEL
AD8030AR-REEL7
AD8030ARJ-R2
AD8030ARJ-REEL
AD8030ARJ-REEL7
AD8040AR
AD8040AR-REEL
AD8040AR-REEL7
AD8040ARU
AD8040ARU-REEL
AD8040ARU-REEL7
Minimum Ordering Quantity
1
2,500
1,000
250
10,000
3,000
1
2,500
1,000
250
10,000
3,000
1
2500
1000
1
2500
1000
Temperature Range
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
Package Description
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
6-Lead SC70
6-Lead SC70
6-Lead SC70
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
8-Lead SOT23-8
8-Lead SOT23-8
8-Lead SOT23-8
14-Lead SOIC
14-Lead SOIC
14-Lead SOIC
14-Lead TSSOP
14-Lead TSSOP
14-Lead TSSOP
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
this product features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
© 2003 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C03679–0–11/03(A)
Rev. A | Page 20 of 20
Package Option
R-8
R-8
R-8
KS-6
KS-6
KS-6
R-8
R-8
R-8
RJ-8
RJ-8
RJ-8
R-14
R-14
R-14
RU-14
RU-14
RU-14
Branding
H6B
H6B
H6B
H7B
H7B
H7B
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