ETC ST303S08PFL0

Bulletin I25173 rev. B 03/94
ST303S SERIES
Stud Version
INVERTER GRADE THYRISTORS
Features
300A
All diffused design
Center amplifying gate
Guaranteed high dv/dt
Guaranteed high di/dt
High surge current capability
Low thermal impedance
High speed performance
Typical Applications
Inverters
Choppers
Induction heating
All types of force-commutated converters
Major Ratings and Characteristics
Parameters
ST303S
Units
300
A
65
°C
471
A
@ 50Hz
7950
A
@ 60Hz
8320
A
@ 50Hz
316
KA2s
@ 60Hz
288
KA2s
VDRM /VRRM
400 to 1200
V
tq range (*)
10 to 30
µs
- 40 to 125
°C
IT(AV)
@ TC
IT(RMS)
ITSM
2
It
TJ
case style
TO-209AE (TO-118)
(*) t = 10 to 20µs for 400 to 800V devices
q
t = 15 to 30µs for 1000 to 1200V devices
q
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1
ST303S Series
Bulletin I25173 rev. B 03/94
ELECTRICAL SPECIFICATIONS
Voltage Ratings
Voltage
V DRM/V RRM, maximum
VRSM , maximum
I DRM/I RRM max.
Code
repetitive peak voltage
non-repetitive peak voltage
@ TJ = TJ max.
V
V
mA
400
500
Type number
04
ST303S
08
800
900
10
1000
1100
12
1200
1300
50
Current Carrying Capability
ITM
Frequency
ITM
ITM
180oel
180oel
50Hz
400Hz
670
480
470
330
1000Hz
230
2500Hz
35
Recovery voltage Vr
Voltage before turn-on Vd
50
Units
100µs
1050
1021
940
710
5240
1800
4300
1270
140
760
470
730
430
-
150
-
90
-
50
50
50
50
V DRM
V DRM
50
VDRM
A
V
Rise of on-state current di/dt
50
50
-
-
-
-
A/µs
Case temperature
40
65
40
65
40
65
°C
Equivalent values for RC circuit
10Ω / 0.47µF
10Ω / 0.47µF
10Ω / 0.47µF
On-state Conduction
Parameter
IT(AV)
Max. average on-state current
@ Case temperature
IT(RMS) Max. RMS on-state current
ITSM
ST303S
Units
300
A
65
°C
471
Max. peak, one half cycle,
7950
non-repetitive surge current
8320
Maximum I2t for fusing
DC @ 45°C case temperature
A
2
reapplied
t = 10ms
100% VRRM
t = 8.3ms
reapplied
Sinusoidal half wave,
316
t = 10ms
No voltage
Initial TJ = TJ max
288
t = 8.3ms
reapplied
t = 10ms
100% VRRM
t = 8.3ms
reapplied
KA2s
204
Maximum I2√t for fusing
No voltage
t = 8.3ms
7000
224
I 2 √t
180° conduction, half sine wave
t = 10ms
6690
I 2t
Conditions
3160
KA2 √s
t = 0.1 to 10ms, no voltage reapplied
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ST303S Series
Bulletin I25173 rev. B 03/94
On-state Conduction
Parameter
V TM
ST303S
Max. peak on-state voltage
2.16
V T(TO)1 Low level value of threshold
1.44
voltage
V T(TO)2 High level value of threshold
voltage
0.57
rt 2
High level value of forward
slope resistance
0.56
IH
Maximum holding current
600
IL
Typical latching current
1000
Conditions
ITM= 1255A, TJ = TJ max, tp = 10ms sine wave pulse
V
(16.7% x π x IT(AV) < I < π x IT(AV)), TJ = TJ max.
(I > π x I T(AV)), TJ = TJ max.
1.46
Low level value of forward
slope resistance
rt 1
Units
mΩ
(16.7% x π x IT(AV) < I < π x IT(AV)), TJ = TJ max.
(I > π x IT(AV)), T J = TJ max.
mA
T J = 25°C, I T > 30A
T J = 25°C, VA = 12V, Ra = 6Ω, I G = 1A
Switching
Parameter
di/dt
ST303S
Max. non-repetitive rate of rise
1000
of turned-on current
t
t
Typical delay time
d
Conditions
A/µs
TJ = TJ max, VDRM = rated VDRM
Min
10
Max
30
ITM = 2 x di/dt
TJ= 25°C, VDM = rated VDRM, ITM = 50A DC, tp = 1µs
0.80
Max. turn-off time (*)
q
Units
µs
Resistive load, Gate pulse: 10V, 5Ω source
TJ = TJ max, ITM = 550A, commutating di/dt = 40A/µs
VR = 50V, tp = 500µs, dv/dt: see table in device code
(*) t = 10 to 20µs for 400 to 800V devices; t = 15 to 30µs for 1000 to 1200V devices.
q
q
Blocking
Parameter
ST303S
Units
Conditions
TJ = TJ max, linear to 80% VDRM, higher value
available on request
dv/dt
Maximum critical rate of rise of
off-state voltage
500
V/µs
IRRM
IDRM
Max. peak reverse and off-state
leakage current
50
mA
ST303S
Units
TJ = TJ max, rated V DRM/V RRM applied
Triggering
Parameter
PGM
Maximum peak gate power
PG(AV) Maximum average gate power
10
IGM
Max. peak positive gate current
10
+VGM
Maximum peak positive
gate voltage
20
-V GM
Maximum peak negative
gate voltage
5
IGT
Max. DC gate current required
to trigger
VGT
Max. DC gate voltage required
to trigger
W
T J = TJ max, f = 50Hz, d% = 50
A
TJ = TJ max, tp ≤ 5ms
V
T J = TJ max, tp ≤ 5ms
200
mA
3
V
T J = 25°C, V A = 12V, Ra = 6Ω
IGD
Max. DC gate current not to trigger
20
mA
VGD
Max. DC gate voltage not to trigger
0.25
V
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Conditions
60
T J = TJ max, rated VDRM applied
3
ST303S Series
Bulletin I25173 rev. B 03/94
Thermal and Mechanical Specifications
Parameter
ST303S
Units
TJ
Max. junction operating temperature range
-40 to 125
Tstg
Max. storage temperature range
-40 to 150
RthJC
Max. thermal resistance, junction to case
0.10
RthCS
Max. thermal resistance, case to heatsink
0.03
T
Mounting torque, ± 10%
48.5
Nm
(425)
(Ibf-in)
535
g
wt
Approximate weight
Case style
Conditions
°C
DC operation
K/W
TO-209AE (TO-118)
Mounting surface, smooth, flat and greased
Non lubricated threads
See Outline Table
∆RthJC Conduction
(The following table shows the increment of thermal resistence RthJC when devices operate at different conduction angles than DC)
Conduction angle
Sinusoidal conduction Rectangular conduction Units
180°
0.011
0.008
120°
0.013
0.014
90°
0.017
0.018
60°
0.025
0.026
30°
0.041
0.042
Conditions
T J = TJ max.
K/W
Ordering Information Table
Device Code
ST
30
3
S
12
P
F
N
0
1
2
3
4
5
6
7
8
9
1
- Thyristor
2
- Essential part number
3
- 3 = Fast turn off
4
- S = Compression bonding Stud
5
- Voltage code: Code x 100 = VRRM (See Voltage Ratings table)
6
- P = Stud base 3/4" 16UNF-2A
7
- Reapplied dv/dt code (for tq test condition)
8
- tq code
9
- 0 = Eyelet terminals (Gate and Aux. Cathode Leads)
10
M = Stud base metric threads M24 x 1.5
1 = Fast-on terminals (Gate and Aux. Cathode Leads)
3 = Threaded top terminal 3/8" 24UNF-2A
10 - Critical dv/dt:
None = 500V/µsec (Standard value)
L
= 1000V/µsec (Special selection)
dv/dt - tq combinations available
dv/dt (V/µs) 20
10
CN
q
12
CM
up to 800V
15
CL
20
CK
50
DN
DM
DL
DK
100
EN
EM
EL
EK
200
FN *
FM
FL *
FK *
400
HN
HM
HL
HK
t (µs)
-DP
DK
DJ
DH
--EK
EJ
EH
--FK *
FJ *
FH
--HK
HJ
HH
t (µs)
q
only for
1000/1200V
15
18
20
25
30
CL
CP
CK
CJ
--
*Standard part number.
All other types available only on request.
4
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ST303S Series
Bulletin I25173 rev. B 03/94
Outline Table
CERAMIC HOUSING
22 (0.87) MAX.
4.5 (0.18) MAX.
MI
N.
9 .5
(0 .
37
)
MIN
.
4.3 (0.17) DIA.
WHITE GATE
RED SILICON RUBBER
245 (9.65) ± 10 (0.39)
FLEXIBLE LEAD
RED CATHODE
C.S. 50mm 2
(0.078 s.i.)
Fast-on Terminals
AMP. 280000-1
REF-250
47 (1.85)
MAX.
RED SHRINK
21 (0.82) MAX.
245 (9.65)
WHITE SHRINK
MAX.
27.5 (1.08)
255 (10.04)
38 (1.50)
MAX. DIA.
22
(
0.8
6)
10.5 (0.41)
NOM.
SW 45
Case Style TO-209AE (TO-118)
3/4"16 UNF-2A
All dimensions in millimeters (inches)
49 (1.92) MAX.
* FOR METRIC DEVICE: M24 X 1.5 - LENGHT SCREW 21 (0.83) MAX.
CERAMIC HOUSING
17 (0.67) DIA.
25 (0.98)
3/8"-24UNF-2A
80.5 (3.17)
MAX.
27.5 (1.08)
All dimensions in millimeters (inches)
MAX.
47 (1.85)
21 (0.83)
Case Style TO-209AE (TO-118)
with top thread terminal 3/8"
MAX.
77.5 (3.05)
38 (1.5)
DIA. MAX.
SW 45
3/4"-16UNF-2A *
* FOR METRIC DEVICE: M24 x 1.5 - LENGHT SCREW 21 (0.83) MAX.
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ST303S Series
Maximum Allowable Case Temperature (°C)
Maximum Allowable Case Temperature (°C)
Bulletin I25173 rev. B 03/94
130
ST303S Series
R thJC (DC) = 0.10 K/W
120
110
100
Conduction Angle
90
30°
60°
80
90°
120°
70
180°
60
0
50
100
150
200
250
300
350
130
ST303S Series
R
(DC) = 0.10 K/W
120
thJC
110
100
Conduction Period
90
80
70
30°
60°
60
90°
120°
50
0
100
200
300
DC
400
500
Average On-state Current (A)
Average On-state Current (A)
Fig. 1 - Current Ratings Characteristics
Fig. 2 - Current Ratings Characteristics
600
01
0.
K/
/W
2K
/W
0. 1
6K
/W
0.2
K /W
0. 3
K/W
W
0.5 K/
R
100
ST303S Series
TJ = 125°C
ta
el
-D
Conduction Angle
=
200
A
K/
W
08
K
0.1
RMS Limit
300
W
K/
400
0.0
6
0.
S
R th
180°
120°
90°
60°
30°
500
03
0.
Maximum Average On-state Power Loss (W)
180°
40
W
0
0
50
100
150
200
250
300
25
Average On-state Current (A)
50
75
100
125
Maximum Allowable Ambient Temperature (°C)
Maximum Average On-state Power Loss (W)
Fig. 3 - On-state Power Loss Characteristics
900
DC
180°
120°
90°
60°
30°
800
700
600
R
th
S
A =
0.
03
01
K/
K/
W
W
0.0
-D
6K
e lt
/W
a
R
0. 1
2K
/W
0.
500
400
RMS Limit
300
200
Conduction Period
ST303S Series
TJ = 125°C
100
0. 2
K
/W
0.3 K
/W
0 .5 K /W
0
0
25
50 100 150 200 250 300 350 400 450 500
Average On-state Current (A)
50
75
100
125
Maximum Allowable Ambient Temperature (°C)
Fig. 4 - On-state Power Loss Characteristics
6
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ST303S Series
Bulletin I25173 rev. B 03/94
At Any Rated Load Condition And With
Rated VRRM Applied Following Surge.
Initial TJ = 125°C
@ 60 Hz 0.0083 s
@ 50 Hz 0.0100 s
6500
6000
5500
5000
4500
4000
ST303S Series
3500
3000
1
10
8000
Peak Half Sine Wave On-state Current (A)
Peak Half Sine Wave On-state Current (A)
7000
Maximum Non Repetitive Surge Current
Versus Pulse Train Duration. Control
Of Conduction May Not Be Maintained.
7000
Initial TJ = 125°C
No Voltage Reapplied
6500
Rated VRRM Reapplied
6000
7500
5500
5000
4500
4000
ST303S Series
3500
3000
0.01
100
Fig. 5 - Maximum Non-repetitive Surge Current
1000
TJ = 25°C
TJ = 125°C
ST303S Series
100
1
2
3
4
5
6
7
8
1
Steady State Value
R thJC = 0.10 K/W
(DC Operation)
0.1
0.01
ST303S Series
0.001
0.001
I
280
260
TM
= 500 A
300 A
200 A
100 A
50 A
240
220
200
180
160
ST303S Series
TJ = 125 °C
140
120
100
80
10
20 30
40
50
60
70
80
90 100
Rate Of Fall Of On-state Current - di/dt (A/µs)
Fig. 9 - Reverse Recovered Charge Characteristics
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0.1
1
10
Fig. 8 - Thermal Impedance ZthJC Characteristic
Maximum Reverse Recovery Current - Irr (A)
Maximum Reverse Recovery Charge - Qrr (µC)
Fig. 7 - On-state Voltage Drop Characteristics
300
0.01
Square Wave Pulse Duration (s)
Instantaneous On-state Voltage (V)
320
1
Fig. 6 - Maximum Non-repetitive Surge Current
Transient Thermal Impedance Z thJC (K/W)
Instantaneous On-state Current (A)
10000
0.1
Pulse Train Duration (s)
Number Of Equal Amplitude Half Cycle Current Pulses (N)
180
I
TM
160
140
= 500 A
300 A
200 A
100 A
50 A
120
100
80
ST303S Series
TJ = 125 °C
60
40
20
10
20 30
40 50
60
70 80 90 100
Rate Of Fall Of On-state Current - di/dt (A/µs)
Fig. 10 - Reverse Recovery Current Characteristics
7
ST303S Series
Bulletin I25173 rev. B 03/94
Peak On-state Current (A)
1E4
1000
1E3
400 200
500
50 Hz
400 200
500
100
50 Hz
1000
1500
Snubber circuit
R s = 10 ohms
Cs = 0.47 µF
V D = 80% V DRM
2000
1E2
100
2500
ST303S Series
Sinusoidal pulse
TC = 40°C
tp
1E1
1E1
1E2
Snubber circuit
R s = 10 ohms
C s = 0.47 µF
V D = 80% VDRM
1500
1E1
1E41E1
1E4
1E3
ST303S Series
Sinusoidal pulse
TC = 65°C
tp
1E2
1E3
1E4
Pulse Basewidth (µs)
Pulse Basewidth (µs)
Fig. 11 - Frequency Characteristics
Peak On-state Current (A)
1E4
1E3
500
400 200
100
50 Hz
400
Snubber circuit
R s = 10 ohms
C s = 0.47 µF
V D = 80% VDRM
2000
1000
Snubber circuit
R s = 10 ohms
C s = 0.47 µF
V D = 80% VDRM
1500
2500
1E1
ST303S Series
Trapezoidal pulse
TC = 40°C
di/dt = 50A/µs
1E0
1E1
1E2
50 Hz
500
1000
1500
1E2
100
200
1E1
1E41E1
1E4
1E3
2000
ST303S Series
Trapezoidal pulse
TC = 65°C
di/dt = 50A/µs
1E2
1E3
1E4
Pulse Basewidth (µs)
Pulse Basewidth (µs)
Fig. 12 - Frequency Characteristics
Peak On-state Current (A)
1E4
1E3
400
100
200
50 Hz
500
400
Snubber circuit
R s = 10 ohms
C s = 0.47 µF
V D = 80% V DRM
1500
2000
1E1
50 Hz
1000
Snubber circuit
R s = 10 ohms
C s = 0.47 µF
V D = 80% V DRM
1500
2500
1E2
2000
ST303S Series
Trapezoidal pulse
TC = 40°C
di/dt = 100A/µs
tp
1E0
1E1
100
500
1000
1E2
200
1E3
ST303S Series
Trapezoidal pulse
TC = 65°C
di/dt = 100A/µs
tp
1E1
1E41E1
1E4
1E2
1E3
1E4
Pulse Basewidth (µs)
Pulse Basewidth (µs)
Fig. 13 - Frequency Characteristics
8
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ST303S Series
Bulletin I25173 rev. B 03/94
ST303S Series
Rectangular pulse
di/dt = 50A/µs
tp
1E4
20 joules per pulse
3
5
10
20 joules per pulse
10
2
1
1E3
5
3
2
0.5
1
0.4
0.5
1E2
0.4
ST303S Series
Sinusoidal pulse
tp
1E1
1E1
1E2
1E1
1E41E1
1E4
1E3
1E2
1E3
1E4
Pulse Basewidth (µs)
Pulse Basewidth (µs)
Fig. 14 - Maximum On-state Energy Power Loss Characteristics
100
Rectangular gate pulse
a) Recommended load line for
rated di/dt : 20V, 10ohms; tr<=1 µs
b) Recommended load line for
<=30% rated di/dt : 10V, 10ohms
10
tr<=1 µs
(1) PGM = 10W,
(2) PGM = 20W,
(3) PGM = 40W,
(4) PGM = 60W,
tp = 20ms
tp = 10ms
tp = 5ms
tp = 3.3ms
(a)
(b)
Tj=25 °C
1
Tj=-40 °C
Tj=125 °C
Instantaneous Gate Voltage (V)
Peak On-state Current (A)
1E5
(1)
(2)
(3) (4)
VGD
IGD
0.1
0.001
0.01
Device: ST303S Series
0.1
Frequency Limited by PG(AV)
1
10
100
Instantaneous Gate Current (A)
Fig. 15 - Gate Characteristics
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