ETC STPS5L25

STPS5L25B
®
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
IF(AV)
5A
VRRM
25 V
Tj (max)
150°C
VF (max)
0.35 V
2
4 (TAB)
3
4
FEATURES AND BENEFITS
n
n
n
n
VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS
HIGH POWER SURFACE MOUNT MINIATURE
PACKAGE
AVALANCHE CAPABILITY SPECIFIED
2
3
1
NC
DPAK
DESCRIPTION
Single Schottky rectifier suited to Switched Mode
Power Supplies and high frequency DC to DC converters.
This device is especially intended for use as a
Rectifier at the secondary of 3.3V SMPS units.
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
25
V
IF(RMS)
RMS forward current
7
A
IF(AV)
Average forward current
Tc = 145°C δ = 0.5
5
A
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
75
A
IRRM
Repetitive peak reverse current
tp=2 µs square F=1kHz
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
2
A
PARM
Repetitive peak avalanche power
tp = 1µs
3000
W
- 65 to + 150
°C
150
°C
10000
V/µs
Tstg
Tj
dV/dt
* :
Storage temperature range
Tj = 25°C
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth( j − a )
July 2003 - Ed: 5A
1/4
STPS5L25B
THERMAL RESISTANCES
Symbol
Rth(j-c)
Parameter
Value
Unit
2.5
°C/W
Junction to case
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Tests Conditions
IR *
Reverse leakage current
Tests Conditions
Tj = 25°C
Min.
Typ.
Max.
Unit
350
µA
55
115
mA
0.47
V
0.31
0.35
VR = VRRM
Tj = 125°C
VF *
Forward voltage drop
Tj = 25°C
IF = 5 A
Tj = 125°C
IF = 5 A
Tj = 25°C
IF = 10 A
Tj = 125°C
IF = 10 A
0.41
0.50
* tp = 380 µs, δ < 2%
Pulse test :
Fig. 1: Average forward power dissipation versus
average forward current.
Fig. 2: Average forward current versus ambient
temperature (δ=0.5).
PF(av)(W)
6
2.5
δ = 0.2
δ = 0.1
δ = 0.5
IF(av)(A)
Rth(j-a)=Rth(j-c)
5
δ = 0.05
2.0
0.59
4
δ=1
1.5
3
1.0
Rth(j-a)=70°C/W
2
T
T
0.5
1
δ=tp/T
IF(av) (A)
0.0
0
1
2
3
4
5
δ=tp/T
tp
6
Fig. 3: Normalized avalanche power derating
versus pulse duration.
0
0
25
50
75
100
125
150
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
Tamb(°C)
tp
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
0.01
2/4
Tj(°C)
tp(µs)
0.001
0.1
1
0
10
100
1000
0
25
50
75
100
125
150
STPS5L25B
Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values).
100
Fig. 5: Relative variation of thermal impedance
junction to case versus pulse duration.
IM(A)
Zth(j-c)/Rth(j-c)
1.0
80
0.8
60
Tc=25°C
δ = 0.5
0.6
Tc=75°C
40
0.4
δ = 0.2
T
Tc=100°C
IM
20
0.2
t
δ = 0.1
t(s)
δ=0.5
0
1E-3
δ=tp/T
tp(s)
1E-2
1E-1
1E+0
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
3E+2
1E+2
Single pulse
0.0
1.0E-4
1.0E-3
1.0E-2
tp
1.0E-1
1.0E+0
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values).
IR(mA)
C(pF)
2000
Tj=150°C
F=1MHz
Tj=25°C
1E+1
Tj=125°C
1000
1E+0
500
1E-1
Tj=25°C
200
1E-2
VR(V)
VR(V)
1E-3
0
5
10
15
20
25
Fig. 9: Forward voltage drop versus forward
current (maximum values).
100.0
100
1
2
5
10
20
30
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35µm).
Rth(j-a) (°C/W)
IFM(A)
100
Typical values
Tj=150°C
80
10.0
60
Tj=125°C
40
Tj=25°C
1.0
20
VFM(V)
0.1
0.0
0.2
0.4
0.6
0.8
1.0
0
1.2
1.4
1.6
1.8
2.0
0
2
4
6
8
10
12
S(Cu) (cm²)
14
16
18
20
3/4
STPS5L25B
PACKAGE MECHANICAL DATA
DPAK
DIMENSIONS
REF.
Millimeters
Min.
A
A1
A2
B
B2
C
C2
D
E
G
H
L2
L4
V2
Max
2.20
2.40
0.90
1.10
0.03
0.23
0.64
0.90
5.20
5.40
0.45
0.60
0.48
0.60
6.00
6.20
6.40
6.60
4.40
4.60
9.35
10.10
0.80 typ.
0.60
1.00
0°
8°
Inches
Min.
Max.
0.086
0.094
0.035
0.043
0.001
0.009
0.025
0.035
0.204
0.212
0.017
0.023
0.018
0.023
0.236
0.244
0.251
0.259
0.173
0.181
0.368
0.397
0.031 typ.
0.023
0.039
0°
8°
FOOT PRINT DIMENSIONS (in millimeters)
6.7
6.7
3
3
1.6
1.6
2.3
n
2.3
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS5L25B
STPS15LB-TR
STPS5L25B
STPS5L25B
DPAK
DPAK
0.30g
0.30g
75
2500
Tube
Tape & reel
Epoxy meets UL94,V0
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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approval of STMicroelectronics.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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