ETC STPS745FP

STPS745D/F/G/FP
®
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
IF(AV)
7.5 A
VRRM
45 V
Tj (max)
175 °C
VF (max)
0.57 V
FEATURES AND BENEFITS
■
■
■
■
■
A
A
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
EXTREMELY FAST SWITCHING
INSULATED
PACKAGE:
ISOWATT220AC,
TO-220FPAC
Insulating voltage = 2000V DC
Capacitance = 12pF
AVALANCHE CAPABILITY SPECIFIED
K
TO-220AC
STPS745D
K
ISOWATT220AC
STPS745F
K
DESCRIPTION
A
Single Schottky rectifier suited for Switch Mode
Power Supply and high frequency DC to DC converters.
Packaged either in TO-220AC, ISOWATT220AC,
TO-220FPAC or D2PAK, this device is intended
for use in low voltage, high frequency inverters,
free wheeling and polarity protection applications.
A
NC
K
D2PAK
STPS745G
TO-220FPAC
STPS745FP
ABSOLUTE RATINGS (limiting values)
Symbol
Value
Unit
VRRM
Repetitive peak reverse voltage
45
V
IF(RMS)
RMS forward current
20
A
7.5
A
150
A
1
A
2
A
IF(AV)
Parameter
Average forward current
δ = 0.5
TO-220AC /
D2PAK
Tc = 160°C
ISOWATT220AC/
TO-220FPAC
Tc = 145°C
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
IRRM
Repetitive peak reverse current
tp = 2 µs square
IRSM
Non repetitive peak reverse current
tp = 100 µs square
PARM
Repetitive peak avalanche power
tp = 1µs
Tstg
Tj
dV/dt
* :
F = 1kHz
Tj = 25°C
Storage temperature range
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
2700
W
- 65 to + 175
°C
175
°C
10000
V/µs
dPtot
1
thermal runaway condition for a diode on its own heatsink
<
dTj
Rth( j − a )
July 2003 - Ed: 6G
1/7
STPS745D/F/G/FP
THERMAL RESISTANCES
Symbol
Rth (j-c)
Parameter
Junction to case
Value
Unit
TO-220AC / D2PAK
3.0
°C/W
ISOWATT220AC/
TO-220FPAC
5.5
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Tests Conditions
IR *
Reverse leakage current
Tj = 25°C
Min.
Forward voltage drop
Max.
Unit
100
µA
5
15
mA
0.5
0.57
V
VR = VRRM
Tj = 125°C
VF *
Typ.
Tj = 125°C
IF = 7.5 A
Tj = 25°C
IF = 15 A
Tj = 125°C
IF = 15 A
0.84
0.65
0.72
* tp = 380 µs, δ < 2%
Pulse test :
To evaluate the conduction losses use the following equation :
P = 0.42 x IF(AV) + 0.020 IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current.
Fig. 2: Average current
temperature (δ = 0.5).
6
δ = 0.1
δ = 0.5
δ = 0.2
δ = 0.05
δ=1
4
3
2
T
1
δ=tp/T
IF(av) (A)
0
0
2/7
1
ambient
IF(av)(A)
PF(av)(W)
5
versus
2
3
4
5
6
7
8
tp
9
10
9
8
7
6
5
4
3
2
1
0
Rth(j-a)=Rth(j-c)
TO-220AC
ISOWATT220AB
Rth(j-a)=15°C/W
Rth(j-a)=40°C/W
T
δ=tp/T
0
25
Tamb(°C)
tp
50
75
100
125
150
175
STPS745D/F/G/FP
Fig. 3: Normalized avalanche power derating
versus pulse duration.
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
1
0
10
100
0
1000
Fig. 5-1: Non repetitive surge peak forward
current versus overload duration (maximum
values) (TO-220AC and D2PAK).
25
50
75
100
125
150
Fig. 5-2: Non repetitive surge peak forward
current versus overload duration (maximum
values) (ISOWATT220AC/TO-220FPAC).
IM(A)
IM(A)
80
120
70
100
60
80
50
60
Tc=50°C
40
Tc=100°C
30
Tc=150°C
20
40
IM
20
t
0
1E-3
1E-2
1E-1
1E+0
Fig. 6-1: Relative variation of thermal transient
impedance junction to case versus pulse duration
(TO-220AC and D2PAK).
t
t(s)
δ=0.5
1E-2
1E-1
1E+0
Fig. 6-2: Relative variation of thermal transient
impedance junction to case versus pulse duration
(ISOWATT220AC/TO-220FPAC).
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
0.8
0.8
0.6
δ = 0.5
0.4
0.2
Tc=150°C
IM
0
1E-3
1.0
0.6
Tc=100°C
10
t(s)
δ=0.5
Tc=50°C
δ = 0.5
0.4
δ = 0.2
0.2
δ = 0.1
0.0
1E-4
T
T
tp(s)
Single pulse
1E-3
1E-2
δ=tp/T
1E-1
tp
1E+0
δ = 0.2
δ = 0.1
tp(s)
Single pulse
0.0
1E-3
1E-2
1E-1
δ=tp/T
1E+0
tp
1E+1
3/7
STPS745D/F/G/FP
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
IR(µA)
1000
5E+4
1E+4
Tj=150°C
1E+3
Tj=100°C
F=1MHz
Tj=25°C
Tj=125°C
500
Tj=75°C
1E+2
Tj=50°C
1E+1
200
Tj=25°C
1E+0
VR(V)
1E-1
0
5
10
15
20
25
VR(V)
30
35
40
45
Fig. 9: Forward voltage drop versus forward
current (maximum values).
100
1
2
5
10
20
50
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board, copper thickness: 35µm).
IFM(A)
Rth(j-a) (°C/W)
100.0
80
70
Tj=125°C
Typical values
60
Tj=25°C
10.0
50
40
Tj=125°C
30
1.0
20
10
VFM(V)
0.1
0.0
4/7
0.2
0.4
0.6
0.8
0
1.0
1.2
1.4
1.6
S(Cu) (cm²)
0
2
4
6
8
10
12
14
16
18
20
STPS745D/F/G/FP
PACKAGE MECHANICAL DATA
D2PAK (Plastic)
DIMENSIONS
REF.
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
R
V2
0.40 typ.
0°
8°
0.016 typ.
0°
8°
FOOTPRINT DIMENSIONS (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
5/7
STPS745D/F/G/FP
PACKAGE MECHANICAL DATA
TO-220FPAC
DIMENSIONS
REF.
Millimeters
Inches
A
B
D
E
F
F1
G
G1
H
L2
L3
L4
L5
L6
L7
Dia.
Min.
Max.
4.4
4.6
2.5
2.7
2.5
2.75
0.45
0.70
0.75
1
1.15
1.70
4.95
5.20
2.4
2.7
10
10.4
16 Typ.
28.6
30.6
9.8
10.6
2.9
3.6
15.9
16.4
9.00
9.30
3.00
3.20
Min.
Max.
0.173
0.181
0.098
0.106
0.098
0.108
0.018
0.027
0.030
0.039
0.045
0.067
0.195
0.205
0.094
0.106
0.393
0.409
0.63 Typ.
1.126
1.205
0.386
0.417
0.114
0.142
0.626
0.646
0.354
0.366
0.118
0.126
A
H
B
Dia
L6
L2
L7
L3
L5
D
F1
L4
F
E
G1
G
PACKAGE MECHANICAL DATA
TO-220AC
DIMENSIONS
REF.
A
H2
C
L5
L7
ØI
L6
L2
D
L9
F1
L4
G
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
H2
10.00
10.40
0.393
0.409
L4
E
16.40 typ.
13.00
14.00
0.645 typ.
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
Diam. I
6/7
Inches
Min.
L2
M
F
Millimeters
2.6 typ.
3.75
3.85
0.102 typ.
0.147
0.151
STPS745D/F/G/FP
PACKAGE MECHANICAL DATA
ISOWATT220AC
DIMENSIONS
A
H
B
REF.
Millimeters
Diam
Min.
L6
L7
L2
L3
F1
D
E
Max.
Min.
Typ.
Max.
A
4.40
4.60
0.173
0.181
B
2.50
2.70
0.098
0.106
D
2.40
2.75
0.094
0.108
E
0.40
0.70
0.016
0.028
F
0.75
1.00
0.030
0.039
F1
1.15
1.70
0.045
0.067
G
4.95
5.20
0.195
0.205
H
10.00
10.40 0.394
0.409
L2
F
Typ.
Inches
16.00
0.630
L3
28.60
30.60 1.125
1.205
L6
15.90
16.40 0.626
0.646
L7
9.00
9.30
0.354
0.366
Diam
3.00
3.20
0.118
0.126
G
■
■
■
■
Type
Marking
Package
Weight
Base qty
Delivery mode
STPS745D
STPS745D
TO-220AC
1.86 g.
50
Tube
STPS745F
STPS745F
ISOWATT220AC
2 g.
50
Tube
STPS745G
STPS745G
D2PAK
1.48 g.
50
Tube
STPS745G-TR
STPS745G
D2PAK
1.48 g.
1000
Tape & reel
STPS745FP
STPS745FP
TO-220FPAC
1.9 g.
50
Tube
Cooling method: by conduction (C)
Recommended torque value: 0.55 N.m
Maximum torque value: 0.7 N.m.
Epoxy meets UL94,V0
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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