TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 D D D D D D D D Low rDS(on) . . . 1 Ω Typ Output Short-Circuit Protection Avalanche Energy . . . 75 mJ Eight 350-mA DMOS Outputs 50-V Switching Capability Enhanced Cascading for Multiple Stages All Registers Cleared With Single Input Low Power Consumption NE PACKAGE (TOP VIEW) DRAIN2 DRAIN3 SRCLR G PGND PGND RCK SRCK DRAIN4 DRAIN5 description The TPIC6A596 is a monolithic, high-voltage, high-current power logic 8-bit shift register designed for use in systems that require relatively high load power. The device contains a built-in voltage clamp on the outputs for inductive transient protection. Power driver applications include relays, solenoids, and other mediumcurrent or high-voltage loads. Each open-drain DMOS transistor features an independent chopping current-limiting circuit to prevent damage in the case of a short circuit. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 DRAIN1 DRAN0 SER IN VCC PGND PGND LGND SER OUT DRAIN7 DRAIN6 DW PACKAGE (TOP VIEW) DRAIN2 DRAIN3 SRCLR G PGND PGND PGND PGND RCK SRCK DRAIN4 DRAIN5 1 24 2 23 3 22 4 21 5 20 6 19 7 18 DRAIN1 DRAIN0 SER IN VCC PGND PGND PGND PGND LGND SER OUT DRAIN7 DRAIN6 This device contains an 8-bit serial-in, parallel-out 17 8 shift register that feeds an 8-bit, D-type storage 16 9 register. Data transfers through both the shift and 15 10 storage registers on the rising edge of the shift14 11 register clock (SRCK) and the register clock 13 12 (RCK), respectively. The storage register transfers data to the output buffer when shiftregister clear (SRCLR) is high. When SRCLR is low, all registers in the device are cleared. When output enable G is held high, all data in the output buffers is held low and all drain outputs are off. When G is held low, data from the storage register is transparent to the output buffers. The serial output (SER OUT) is clocked out of the device on the falling edge of SRCK to provide additional hold time for cascaded applications. This will provide improved performance for applications where clock signals may be skewed, devices are not located near one another, or the system must tolerate electromagnetic interference. Outputs are low-side, open-drain DMOS transistors with output ratings of 50 V and a 350-mA continuous sink current capability. When data in the output buffers is low, the DMOS-transistor outputs are off. When data is high, the DMOS-transistor outputs have sink current capability. Separate power ground (PGND) and logic ground (LGND) terminals are provided to facilitate maximum system flexibility. All PGND terminals are internally connected, and each PGND terminal must be externally connected to the power system ground in order to minimize parasitic impedance. A single-point connection between LGND and PGND must be made externally in a manner that reduces crosstalk between the logic and load circuits. The TPIC6A596 is offered in a thermally-enhanced dual-in-line (NE) package and a wide-body surface-mount (DW) package. The TPIC6A596 is characterized for operation over the operating case temperature range of – 40°C to 125°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 • DALLAS, TEXAS 75265 1 TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 logic symbol† G EN3 RCK C2 SRCLR SRCK SER IN R SRG8 C1 1D 2 3 DRAIN0 DRAIN1 DRAIN2 DRAIN3 DRAIN4 DRAIN5 DRAIN6 2 3 DRAIN7 SER OUT † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2 POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 • DALLAS, TEXAS 75265 TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 logic diagram (positive logic) G DRAIN0 RCK D SRCK C1 D C2 SRCLR CLR CLR D C1 D C2 CLR CLR D C1 D C2 CLR CLR D C1 D C2 CLR CLR D C1 D C2 CLR CLR D C1 D C2 CLR CLR D C1 D C2 CLR CLR D C1 D C2 CLR CLR DRAIN1 DRAIN2 Current Limit and Charge Pump SER IN DRAIN3 DRAIN4 DRAIN5 DRAIN6 DRAIN7 D PGND C1 CLR SER OUT POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 • DALLAS, TEXAS 75265 3 TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 schematic of inputs and outputs TYPICAL OF SERIAL OUT EQUIVALENT OF EACH INPUT VCC TYPICAL OF ALL DRAIN OUTPUTS DRAIN VCC Input SER OUT 25 V 12 V RSENSE LGND LGND PGND LGND absolute maximum ratings over recommended operating case temperature range (unless otherwise noted)† Logic supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Logic input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 7 V Power DMOS drain-to-source voltage, VDS (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V Continuous source-drain diode anode current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 A Pulsed source-drain diode anode current (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 A Pulsed drain current, each output, all outputs on, IDn, TA = 25°C (see Note 3) . . . . . . . . . . . . . . . . . . . . . 1.1 A Continuous drain current, each output, all outputs on, IDn, TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . 350 mA Peak drain current, single output, TA = 25°C (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 A Single-pulse avalanche energy, EAS (see Figure 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 mJ Avalanche current, IAS (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600 mA Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating case temperature range, TC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 125°C Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to LGND and PGND. 2. Each power DMOS source is internally connected to PGND. 3. Pulse duration ≤ 100 µs and duty cycle ≤ 2 %. 4. DRAIN supply voltage = 15 V, starting junction temperature (TJS) = 25°C, L = 210 mH, IAS = 600 mA (see Figure 6). DISSIPATION RATING TABLE PACKAGE TC ≤ 25°C POWER RATING DERATING FACTOR ABOVE TC = 25°C TC = 125°C POWER RATING DW 1750 mW 14 mW/°C 350 mW NE 2500 mW 20 mW/°C 500 mW 4 POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 • DALLAS, TEXAS 75265 TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 recommended operating conditions Logic supply voltage, VCC High-level input voltage, VIH MIN MAX 4.5 5.5 0.85 VCC Low-level input voltage, VIL 0 Pulsed drain output current, TC = 25°C, VCC = 5 V (see Notes 3 and 5) – 1.8 UNIT V VCC 0.15 VCC 0.6 V V A Setup time, SER IN high before SRCK↑, tsu (see Figure 2) 10 ns Hold time, SER IN high after SRCK↑, th (see Figure 2) 10 ns Pulse duration, tw (see Figure 2) 20 Operating case temperature, TC – 40 ns °C 125 NOTES: 3. Pulse duration ≤ 100 µs and duty cycle ≤ 2%. 5. Technique should limit TJ – TC to 10°C maximum. electrical characteristics, VCC = 5 V, TC = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS V(BR)DSX Drain-to-source breakdown voltage ID = 1 mA VSD Source-to-drain diode forward voltage IF = 350 mA, VOH High-level g output voltage, g , SER OUT IOH = – 20 µA IOH = – 4 mA VOL Low-level output voltage, g , SER OUT IOL = 20 µA IOL = 4 mA IIH IIL High-level input current TYP MAX 50 See Note 3 VCC VCC – 0.2 0 0.2 Low-level input current IO(chop) Output current at which chopping starts TC = 25°C, See Note 5 and Figures 3 and 4 ICC Logic supply current ICC(FRQ) Logic supply current at frequency IO = 0, fSRCK = 5 MHz, VI = VCC or 0, VI = VCC or 0 IO = 0, CL = 30 pF, VCC = 5 V, See Figure 7 I(nom) Nominal current ID Drain current, current off-state off state VDS(on) = 0.5 V, VCC = 5 V, VDS = 40 V, VDS = 40 V, ID = 350 mA, 0.6 UNIT V 0.8 VCC – 0.1 VCC – 0.5 VI = VCC VI = 0 Static drain-source on-state resistance MIN 1.1 V V 0.1 0.5 V 1 µA –1 µA 0.8 1.1 A 0.5 5 mA 1.3 mA I(nom) = ID, TC = 85°C, See Notes 5, 6, and 7 350 mA TC = 25°C 0.1 1 TC = 125°C 0.2 5 1 1.5 TC = 25°C See Notes 5 and 6 and Figures 10 and 11 µA Ω ID = 350 mA, TC = 125°C 1.7 2.5 NOTES: 5. Technique should limit TJ – TC to 10°C maximum. 6. These parameters are measured with voltage-sensing contacts separate from the current-carrying contacts. 7. Nominal current is defined for a consistent comparison between devices from different sources. It is the current that produces a voltage drop of 0.5 V at TC = 85°C. rDS(on DS( ) POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 • DALLAS, TEXAS 75265 5 TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 switching characteristics, VCC = 5 V, TC = 25°C PARAMETER TEST CONDITIONS tPHL tPLH Propagation delay time, high-to-low-level output from G tr tf Rise time, drain output Propagation delay time, low-to-high-level output from G MIN TYP CL = 30 pF,, ID = 350 mA,, See Figures 1, 2, and 12 tpd Propagation delay time, SRCK↓ to SEROUT f(SRCK) Serial clock frequency CL = 30 pF, See Note 8 ta trr Reverse-recovery-current rise time ID = 350 mA, ID = 350 mA, 125 ns 60 ns 30 ns 20 ns 10 IF = 350 mA, di/dt = 20 A/µs, µ See Notes 5 and 6 and Figure 5 Reverse-recovery time UNIT ns Fall time, drain output CL = 30 pF, See Figure 2 MAX 30 MHz 100 ns 300 ns NOTES: 5. Technique should limit TJ – TC to 10°C maximum. 6. These parameters are measured with voltage-sensing contacts separate from the current-carrying contacts. 8. This is the maximum serial clock frequency assuming cascaded operation where serial data is passed from one stage to a second stage. The clock period allows for SRCK → SEROUT propagation delay and setup time plus some timing margin. thermal resistance PARAMETER TEST CONDITIONS DW RθJC Thermal resistance, resistance junction-to-case junction to case RθJA Thermal resistance, resistance junction-to-ambient junction to ambient MIN 10 All eight outputs with equal power NE DW 10 50 All eight outputs with equal power NE MAX 50 UNIT °C/W °C/W PARAMETER MEASUREMENT INFORMATION 24 V 5V 7 6 5 4 3 2 1 0 SRCK SRCLR SRCK Word Generator (see Note A) 0V ID VCC SER IN 5V G RL = 68 Ω DUT Output 0V 5V 0V 5V SER IN DRAIN RCK CL = 30 pF (see Note B) RCK 0V 5V SRCLR G 0V LGND PGND 24 V DRAIN 0, 1, 4, 5 TEST CIRCUIT 5V 0.5 V 24 V DRAIN 2, 3, 6, 7 0.5 V VOLTAGE WAVEFORMS NOTES: A. The word generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, tw = 300 ns, pulsed repetition rate (PRR) = 5 kHz, ZO = 50 Ω. B. CL includes probe and jig capacitance. Figure 1. Resistive Load Operation 6 POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 • DALLAS, TEXAS 75265 TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 PARAMETER MEASUREMENT INFORMATION 5V G 50% 50% 0V tPLH Output 5V tPHL 90% 24 V 90% 10% 10% tr 24 V 0.5 V tf SWITCHING TIMES SRCLR RL = 68 Ω SRCK Word Generator (see Note A) DUT SER IN 5V ID VCC 50% SRCK 0V tsu Output th DRAIN RCK G 5V SER IN 50% 50% CL = 30 pF (see Note B) 0V tw LGND PGND INPUT SETUP AND HOLD WAVEFORMS TEST CIRCUIT SRCK 50% 50% tpd SER OUT 50% tpd 50% SER OUT PROPAGATION DELAY WAVEFORM NOTES: A. The word generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, tw = 300 ns, pulsed repetition rate (PRR) = 5 kHz, ZO = 50 Ω. B. CL includes probe and jig capacitance. Figure 2. Test Circuit, Switching Times, and Voltage Waveforms POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 • DALLAS, TEXAS 75265 7 TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 PARAMETER MEASUREMENT INFORMATION OUTPUT CURRENT vs TIME FOR INCREASING LOAD RESISTANCE REGION 1 CURRENT WAVEFORM 1.5 IOK IOK (see Notes A and B) I O – Output Current I O – Output Current – A 1.25 1 0.75 0.5 0 0.25 t1 t2 t1 t2 t1 t1 ≈ 40 µs t2 ≈ 2.5 ms 0 Region 2 Region 1 Time Time First output current pulses after turn-on in chopping mode with resistive load. NOTES: A. Figure 3 illustrates the output current characteristics of the device energizing a load having initially low, increasing resistance, e.g., an incandescent lamp. In region 1, chopping occurs and the peak current is limited to IOK. In region 2, output current is continuous. The same characteristics occur in reverse order when the device energizes a load having an initially high, decreasing resistance. B. Region 1 duty cycle is approximately 2%. Figure 3. Chopping-Mode Characteristics OUTPUT CURRENT LIMIT vs CASE TEMPERATURE 1.5 I O – Output Current Limit – A VCC = 5.5 V 1.2 0.9 VCC = 4.5 V 0.6 0.3 0 – 50 – 25 0 25 50 75 100 125 TC – Case Temperature – °C Figure 4 8 POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 • DALLAS, TEXAS 75265 150 TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 PARAMETER MEASUREMENT INFORMATION TP K DRAIN 0.35 A 2500 µF 250 V Circuit Under Test di/dt = 20 A/µs + 24 V L = 1 mH IF (see Note B) IF – 0 TP A 25% of IRM t2 t1 t3 Driver IRM (see Note C) RG VGG (see Note A) ta 50 Ω trr CURRENT WAVEFORM TEST CIRCUIT NOTES: A. The VGG amplitude and RG are adjusted for di/dt = 20 A/µs. A VGG double-pulse train is used to set IF = 0.35 A, where t1 = 10 µs, t2 = 7 µs, and t3 = 3 µs. B. The DRAIN terminal under test is connected to the TP K test point. All other terminals are connected together and connected to the TP A test point. C. IRM = maximum recovery current Figure 5. Reverse-Recovery-Current Test Circuit and Waveforms of Source-Drain Diode 5V 15 V tw 1Ω V SRCLR CC SRCK DUT Word Generator (see Note A) 5V Input ID See Note B 0V IAS = 600 mA 210 mH SER IN tav† ID RCK G DRAIN VDS V(BR)DSX = 50 V MIN LGND PGND VDS VOLTAGE AND CURRENT WAVEFORMS SINGLE-PULSE AVALANCHE ENERGY TEST CIRCUIT † Non JEDEC symbol for avalanche time. NOTES: A. The word generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, ZO = 50 Ω. B. Input pulse duration, tw, is increased until peak current IAS = 600 mA. Energy test level is defined as EAS = (IAS × V(BR)DSX × tav)/2 = 75 mJ. Figure 6. Single-Pulse Avalanche Energy Test Circuit and Waveforms POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 • DALLAS, TEXAS 75265 9 TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 TYPICAL CHARACTERISTICS MAXIMUM CONTINUOUS DRAIN CURRENT OF EACH OUTPUT vs NUMBER OF OUTPUTS CONDUCTING SIMULTANEOUSLY SUPPLY CURRENT vs FREQUENCY 0.7 4 VCC = 5 V TJS = – 40°C to 125°C ID – Maximum Continuous Drain Current of Each Output – A I CC – Supply Current – mA 3.5 3 2.5 2 1.5 1 0.5 0 0.1 VCC = 5 V 0.6 TA = 25°C 0.5 0.4 TA = 100°C 0.3 0.2 TA = 125°C 0.1 0 1 10 100 6 7 8 1 2 3 4 5 N – Number of Outputs Conducting Simultaneously f – Frequency – MHz Figure 8 Figure 7 0.9 0.8 d = 50% d = 20% 0.7 0.6 0.5 d = 80% 0.4 0.3 0.2 0.1 VCC = 5 V TA = 25°C d = tw/tperiod d = 1 ms/tperiod 0 1 2 3 4 5 6 7 8 N – Number of Outputs Conducting Simultaneously STATIC DRAIN-SOURCE ON-STATE RESISTANCE vs DRAIN CURRENT r DS(on) – Static Drain-Source On-State Resistance – Ω IDM – Maximum Peak Drain Current of Each Output – A MAXIMUM PEAK DRAIN CURRENT OF EACH OUTPUT vs NUMBER OF OUTPUTS CONDUCTING SIMULTANEOUSLY 2 VCC = 5 V See Note A 1.75 TC = 125°C 1.5 Current Limit 1.25 TC = 25°C 1 0.75 TC = – 40°C 0.5 0.25 0 0 0.2 0.4 0.6 0.8 1 1.2 ID – Drain Current – A NOTE A: Technique should limit TJ – TC to 10°C maximum. Figure 9 10 POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 Figure 10 • DALLAS, TEXAS 75265 TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE vs LOGIC SUPPLY VOLTAGE SWITCHING TIME vs CASE TEMPERATURE 140 2 ID = 350 mA See Note A 1.75 120 TC = 125°C tPLH 1.5 Switching Time – ns r DS(on) – Static Drain-Source On-State Resistance – Ω TYPICAL CHARACTERISTICS 1.25 TC = 25°C 1 0.75 TC = – 40°C 100 80 tr 60 0.5 tf 20 – 50 0 4 tPHL 40 ID = 350 mA See Note A 0.25 5 6 7 0 50 100 150 TC – Case Temperature – °C VCC – Logic Supply Voltage – V Figure 11 Figure 12 NOTE A: Technique should limit TJ – TC to 10°C maximum. TYPICAL RθJATHERMAL RESISTANCE vs ON BOARD HEATSINK AREA 110 R θ JC – Thermal Resistance – °C/W 100 90 DW Package 80 PC Board Copper Area 1oz Copper 70 60 NE Package 50 40 30 0 1 2 7 3 4 5 6 Copper Heatsink Area – cm2 8 9 10 Figure 13 POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 • DALLAS, TEXAS 75265 11 TPIC6A596 POWER LOGIC 8-BIT SHIFT REGISTER SLIS094 – MARCH 2000 THERMAL INFORMATION NE PACKAGE TRANSIENT THERMAL IMPEDANCE vs ON TIME The single-pulse curve represents measured data. The curves for various pulse durations are based on the following equation: Z θJA – Transient Thermal Impedance – ° C /W 100 Zq JA + Where: d = 20% Rq JA ) 1 – tw tc ǒ Ǔ ǒǓ ǒ Ǔ q ) Z q t c = the single-pulse thermal impedance for t = tc seconds Z tw d = 2% t c = the single-pulse thermal impedance for t = tw + tc seconds d = tw/tc tc Single Pulse tw 0.1 0.001 0.01 ǒ ) Ǔ Z q tw Z q t w = the single-pulse thermal impedance for t = tw seconds d = 10% d = 5% 1 tw tc ) ZqǒtwǓ–ZqǒtcǓ d = 50% 10 ŤŤ Ť Ť 0.1 1 10 100 1000 0 t – On Time – s Figure 14 12 POST OFFICE BOX 655303 Powered by ICminer.com Electronic-Library Service CopyRight 2003 ID • DALLAS, TEXAS 75265 tc IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 2000, Texas Instruments Incorporated Powered by ICminer.com Electronic-Library Service CopyRight 2003