ETC UC3849Q

UC1849
UC2849
UC3849
Secondary Side Average Current Mode Controller
FEATURES
DESCRIPTION
•
Practical Secondary Side Control
of Isolated Power Supplies
•
1MHz Operation
•
Differential AC Switching Current
Sensing
•
Accurate Programmable
Maximum Duty Cycle
•
Multiple Chips Can be
Synchronized to Fastest
Oscillator
The UC1849 family of average current mode controllers accurately accomplishes secondary side average current mode control. The secondary side
output voltage is regulated by sensing the output voltage and differentially
sensing the AC switching current. The sensed output voltage drives a voltage error amplifier. The AC switching current, monitored by a current sense
resistor, drives a high bandwidth, low offset current sense amplifier. The
outputs of the voltage error amplifier and current sense amplifier differentially drive a high bandwidth, integrating current error amplifier. The sawtooth
waveform at the current error amplifier output is the amplified and inverted
inductor current sensed through the resistor. This inductor current downslope compared to the PWM ramp achieves slope compensation, which
gives an accurate and inherent fast transient response to changes in load.
•
Wide Gain Bandwidth Product
(70MHz, Acl>10) Current Error
and Current Sense Amplifiers
•
Up to Ten Devices Can Easily
Share a Common Load
The UC1849 features load share, oscillator synchronization, undervoltage
lockout, and programmable output control. Multiple chip operation can be
achieved by connecting up to ten UC1849 chips in parallel. The SHARE bus
and CLKSYN bus provide load sharing and synchronization to the fastest
oscillator respectively. The UC1849 is an ideal controller to achieve high
power, secondary side average current mode control.
BLOCK DIAGRAM
Pin numbers refer to 24-pin packages.
UDG-94110
7/95
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UC1849
UC2849
UC3849
Junction Temperature . . . . . . . . . . . . . . . . . . .−65°C to +150°C
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . .+300°C
All voltages with respect to VEE except where noted; all currents
are positive into, negative out of the specified terminal.
Consult Packaging Section of Databook for thermal limitations
and considerations of packages.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20V
Output Current Source or Sink . . . . . . . . . . . . . . . . . . . . . .0.3A
Analog Input Voltages . . . . . . . . . . . . . . . . . . . . . . .−0.3V to 7V
ILIM, KILL, SEQ, ENBL, RUN . . . . . . . . . . . . . . . .−0.3V to 7 V
CLKSYN Current Source . . . . . . . . . . . . . . . . . . . . . . . . .12mA
RUN Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15mA
SEQ Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA
RDEAD Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA
Share Bus Voltage (voltage with respect to GND) . . .0V to 6.2V
ADJ Voltage (voltage with respect to GND) . . . . . .0.9V to 6.3V
VEE (voltage with respect to GND) . . . . . . . . . . . . . . . . .−1.5V
Storage Temperature . . . . . . . . . . . . . . . . . . .−65°C to +150°C
RECOMMENDED OPERATING CONDITIONS
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8V to20V
Sink/Source Output Current . . . . . . . . . . . . . . . . . . . . . .250mA
Timing Resistor (RT) . . . . . . . . . . . . . . . . . . . . . . . . .1k to 200k
Timing Capacitor (CT) . . . . . . . . . . . . . . . . . . . . . .75pF to 2nF
CONNECTION DIAGRAMS
DIL-24, SOIC-24,TSSOP-24 (Top View)
J or N, DW, PW Packages
PLCC-28 (Top View)
Q Package
ELECTRICAL CHARACTERISTICS Unless otherwise stated these specifications apply for TA = −55°C to +125°C for
UC1849; −40°C to +85°C for UC2849; and 0°C to +70°C for UC3849; VCC = 12V, VEE = GND, Output no load, CT = 345pF, RT =
4530Ω, RDEAD = 511Ω, RCLKSYN = 1k, TA = TJ.
PARAMETER
Current Sense Amplifier
Ib
Vio
Avo
GBW (Note 2)
Vol
Voh
CMRR
PSRR
Current Error Amplifier
Ib
Vio
TEST CONDITIONS
MIN
TYP
0.5
TA = +25°C
Over Temperature
Acl = 1, RIN = 1k, CC = 15pF, f = 200kHz (Note 1)
Io = 1mA, Voltage above VEE
Io = 0mA
Io = −1mA
−0.2 < Vcm < 8V
10V < VCC < 20V
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60
4.5
3
3
5
µA
mV
mV
dB
MHz
V
V
V
dB
dB
3
20
µA
mV
90
7
0.5
3.8
3.5
80
80
0.5
3
2
MAX UNITS
UC1849
UC2849
UC3849
ELECTRICAL CHARACTERISTICS Unless otherwise stated these specifications apply for TA = −55°C to +125°C for
UC1849; −40°C to +85°C for UC2849; and 0°C to +70°C for UC3849; VCC = 12V, VEE = GND, Output no load, CT = 345pF, RT =
4530Ω, RDEAD = 511Ω, RCLKSYN = 1k, TA = TJ.
PARAMETER
Current Error Amplifier (cont.)
Avo
GBW (Note 2)
Vol
Voh
CMRR
PSRR
Voltage Error Amplifier
Ib
Vio
Avo
GBW (Note 2)
Vol
Voh
Voh - ILIM
CMRR
PSRR
2X Amplifier and Share Amplifier
V offset (b; y = mx + b)
GAIN (m; y = mx + b)
GBW (Note 2)
RSHARE
Total Offset
Vol
Voh
Adjust Amplifier
Vio
gm
Vol
Voh
TEST CONDITION
Acl = 1, RIN = 1k, CC=15pF, f=200kHz (Note 1)
IO = 1mA, Voltage above VEE
IO = 0mA
IO = −1mA
−0.2 < Vcm < 8V
10V < VCC < 20V
TYP
60
4.5
90
7
0.5
3.8
3.5
80
80
60
4.5
f = 200kHz
IO = 175µA, Volts above VEE
ILIM > 3V
Tested ILIM = 0.5V, 1.0V, 2.0V
−0.2 < Vcm < 8V
10V < VCC < 20V
2.85
−100
Slope with AVOUT = 1V and 2V
1.98
VCC = 0, VSHARE/ISHARE
Negative supply is VEE, GND Open, VAO = GND
VAO = Voltage Amplifier Vol, Volts above VEE
IO = 0mA, ILIM = 3V, VAO = Voltage Amp Voh
IO = −1mA, ILIM = 3V, VAO = Voltage Amp Voh
RCLKSYN = 200Ω
VCC = 0, VCLKSYN/ICLKSYN
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3
0.5
2
90
7
0.3
3
MAX UNITS
dB
MHz
V
V
V
dB
dB
3
5
0.6
3.15
100
80
80
−75
0.2
5.7
5.7
40
IOUT= −10µA to 10µA, VOUT = 3.5V, CADJ = 1µF
IOUT = 0
IOUT = 50µA
IOUT = 0, VSHARE = 6.5V
IOUT = −50µA, VSHARE = 6.5V
Oscillator
Frequency
Max Duty Cycle
OSC Ramp Amplitude
Clock Driver/SYNC (CLKSYN)
Vol
Voh
ISOURCE
RCLKSYN
VTH
MIN
20
2.02
100
200
0
0.45
6
6
75
0.6
6.3
6.3
60
80
µA
mV
dB
MHz
V
V
mV
dB
dB
mV
V
kHZ
k
mV
V
V
V
0.9
0.85
5.7
5.7
1
1
6
6
1.1
1.15
6.3
6.3
mV
mS
V
V
V
V
450
80
2
500
85
2.5
550
90
2.8
kHz
%
V
0.02
3.6
3.2
25
10
1.5
0.2
V
V
V
mA
k
V
−1
UC1849
UC2849
UC3849
ELECTRICAL CHARACTERISTICS (cont)Unless otherwise stated these specifications apply for TA = −55°C to +125°C
for UC1849; −40°C to +85°C for UC2849; and 0°C to +70°C for UC3849; VCC = 12V, VEE = GND, Output no load, CT = 345pF,
RT = 4530Ω, RDEAD = 511Ω, RCLKSYN = 1k, TA = TJ.
PARAMETER
VREF Comparator
Turn-on threshold
Hysteresis
VCC Comparator
Turn-on Threshold
Hysteresis
KILL Comparator
Voltage Threshold
Sequence Comparator
Voltage Threshold
SEQ SAT
Enable Comparator
Voltage Threshold
RUN SAT
Reference
VREF
VREF
Line Regulation
Load Regulation
Short Circuit I
Output Stage
Rise Time
Fall Time
Voh
Vol
Virtual Ground
VGND-VEE
TEST CONDITION
MIN
TYP
MAX UNITS
4.65
0.4
7.9
8.3
0.4
V
V
8.7
V
V
3
V
IO = 10mA
2.5
0.25
V
V
IO = 10mA
2.5
0.25
V
V
TA = 25°C
VCC = 15V
10 < VCC < 20
0 < Io < 10mA
VREF = 0V
4.95
4.9
30
CL = 100pF
CL = 100pF
VCC > 11V, IO = −10mA
IO = −200mA
IO = 200mA
IO = 10mA
VEE is externally supplied, GND is floating
and used as Signal GND.
Icc
Icc (run)
8.0
7.8
5
3
3
60
5.05
5.1
15
15
90
V
V
mV
mV
mA
10
10
8.4
20
20
8.8
ns
ns
V
V
V
V
3.0
0.5
0.2
0.75
21
V
30
mA
Note 1: If a closed loop gain greater than 1 is used, the possible GBW will increase by a factor of ACL + 10; where ACL is the
closed loop gain.
Note 2: Guaranteed by design. Not 100% tested in production.
Note 3: Unless otherwise specified all voltages are with respect to GND. Currents are positive into, negative out of the
specified terminal.
PIN DESCRIPTIONS
ADJ: The output of the transconductance (gm = −1mS)
amplifier adjusts the control voltage to maintain equal
current sharing. The chip sensing the highest output current will have its output clamped to 1V. A resistor divider
between VREF and ADJ drives the control voltage (VA+)
for the voltage amplifier. Each slave unit’s ADJ voltage
increases (to a maximum of 6V) its control voltage (VA+)
until its load current is equal to the master. The 60mV
input offset on the gm amplifier guarantees that the unit
sensing the highest load current is chosen as the masPowered by ICminer.com Electronic-Library Service CopyRight 2003
ter. The 60mV offset guarantees by design to be greater
than the inherent offset of the gm amplifier and the buffer
amplifier. While the 60mV offset represents an error in
current sharing, the gain of the current and 2X amplifiers
reduces it to only 30mV. This pin needs a 1µF capacitor
to compensate the amplifier.
CA-: The inverting input to the current error amplifier.
This amplifier needs a capacitor between CA- and CAO
to set its dominant pole.
4
UC1849
UC2849
UC3849
PIN DESCRIPTIONS (cont.)
CAO: The output of the current error amplifier which is
internally clamped to 4V. It is internally connected to the
inverting input of the PWM comparator.
The dead time is approximately TDISCHARGE = 2
CT.
(1) Frequency ≈
CS-, CS+: The inverting and non-inverting inputs to the
current sense amplifier. This amplifier is not internally
compensated so the user must compensate externally to
attain the highest GBW for the application.
TCHARGE + TDISCHARGE
TCHARGE
TCHARGE + TDISCHARGE
The CT capacitance should be increased by approximately 40pF to account for parasitic capacitance.
OUT: The output of the PWM driver. It has an upper
clamp of 8.5V. The peak current sink and source are
250mA. All UVLO, SEQ, ENBL, and KILL logic either
enable or disable the output driver.
RDEAD: The pin that programs the maximum duty cycle
by connecting a resistor between it and OSC. The maximum duty cycle is decreased by increasing this resistor
value which increases the discharge time. The dead
time, the time when the output is low, is 2 RDEAD
CT. The CT capacitance should be increased by approximately 40pF to account for parasitic capacitance.
CSO: The output of the current sense amplifier which is
internally clamped to 4V.
·
ENBL: The active low input with a 2.5V threshold
enables the output to switch. SEQ and RUN are driven
low when ENBL is above its 2.5V threshold.
·
RT: This pin programs the charge time of the oscillator
ramp. The charge current is
GND: The signal ground used for the voltage sense
amplifier, current sense amplifier, current error amplifier,
voltage reference, 2X amplifier, and share amplifier. The
output sink transistor is wired directly to this pin.
VREF
2
· RT
The charge time is approximately TCHARGE ≈ RT
when the RDEAD resistor is used.
KILL: The active low input with a 3.0V threshold stops
the output from switching. Once this function is activated
RUN must be cycled low by driving KILL above 3.0V and
either resetting the power to the chip (VCC) or resetting
the ENBL signal.
· CT
The dead time is approximately T DISCHARGE ≈ 2
RDEAD CT.
·
·
RUN: This is an open collector logic output that signifies
when the chip is operational. RUN is pulled high to VREF
through an external resistor when VCC is greater than
8.4V, VREF is greater than 4.65V, SEQ is greater than
2.5V, and KILL lower than 3.0V. RUN connected to the
VA+ pin and to a capacitor to ground adds an RC rise
time on the VA+ pin initiating a soft start.
ILIM: A voltage on this pin programs the voltage error
amplifier’s Voh clamp. The voltage error amplifier output
represents the average output current. The Voh clamp consequently limits the output current. If ILIM is tied to VREF, it
defaults to 3.0V. A voltage less than 3.0V connected to
ILIM clamps the voltage error amplifier at this voltage and
consequently limits the maximum output current.
SEQ: The sequence pin allows the sequencing of startup
for multiple units. A resistor between VREF and SEQ and
a capacitor between SEQ and GND creates a unique RC
rise time for each unit which sequences the output startup.
OSC: The oscillator ramp pin which has a capacitor (CT)
to ground and a resistor (RDEAD) to the RDEAD pin programs its maximum duty cycle by programming a minimum dead time. The ramp oscillates between 1.2V to
3.4V when an RDEAD resistor is used. The maximum
duty cycle can be increased by connecting RDEAD to
OSC which changes the oscillator ramp to vary between
0.2V and 3.5V. In order to guarantee zero duty cycle in
this configuration VEE should not be connected to GND.
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1
(2) Maximum Duty Cycle ≈
CLKSYN: The clock and synchronization pin for the
oscillator. This is a bidirectional pin that can be used to
synchronize several chips to the fastest oscillator. Its
input synchronization threshold is 1.4V. The CLKSYN
voltage is 3.6V when the oscillator capacitor (CT) is
being discharged, otherwise it is 0V. If the recommended
synchronization circuit is not used, a 1k or lower value
resistor from CLKSYN to GND may be needed to
increase fall time on CLKSYN pin.
The charge time is approximately TCHARGE = RT
when the RDEAD resistor is used.
· RDEAD ·
SHARE:The nearly DC voltage representing the average
output current. This pin is wired directly to all SHARE
pins and is the load share bus.
VA+, VA-: The inverting and non-inverting inputs to the
voltage error amplifier.
· CT
VAO: The output of the voltage error amplifier. Its Voh is
clamped with the ILIM pin.
5
UC1849
UC2849
UC3849
PIN DESCRIPTIONS (cont.)
VCC: The input voltage of the chip. The chip is operational between 8.4V and 20V.
tual ground because of an internal diode between VEE
and GND. The GND current flows through the forward
biased diode and out VEE. GND is always the signal
ground from which the voltage reference and all amplifier
inputs are referenced.
VEE: The negative supply to the chip which powers the
lower voltage rail for all amplifiers. The chip is operational
if VEE is connected to GND or if GND is floating. When
voltage is applied externally to VEE, GND becomes a vir-
VREF: The reference voltage equal to 5.0V.
UDG-94111-1
Figure 1. Oscillator Block with External Connections
CIRCUIT BLOCK DESCRIPTION:
nized to the highest free running frequency by connecting 100pF capacitors in series with each CLKSYN pin
and connecting the other side of the capacitors together
forming the CLKSYN bus. The CLKSYN bus is then
pulled down to ground with a resistance of approximately
10k. Referring to Figure1, the synchronization threshold
is 1.4V. The oscillator blanks any synchronization pulse
that occurs when OSC is below 2.5V. This allows units,
once they discharge below 2.5V, to continue through the
PWM Oscillator:The oscillator block diagram with external connections is shown in Figure 1. A resistor (RT) connected to pin RT sets the linear charge current;
2.5V
RT .
The timing capacitor (CT) is linearly charged with the
charge current forcing the OSC pin to charge to a 3.4V
threshold. After exceeding this threshold, the RS flip-flop
is set driving CLKSYN high and RDEAD low which discharges CT. This discharge time with the RC time delay
of 2 CT RDEAD is the minimum output low time. OSC
continues to discharge until it reaches a 1.2V threshold
and resets the RS flip-flop which repeats the charging
sequence as shown in Figure 2. Equations to approximate frequency and maximum duty cycle are listed
under the OSC pin description. Figure 3 and 4 graphs
show measured variation of frequency and maximum
duty cycle with varying RT, CT, and RDEAD component
values.
IRT ≈
· ·
UDG-94112
As shown in Figure 5, several oscillators are synchroPowered by ICminer.com Electronic-Library Service CopyRight 2003
Figure 2. Oscillator and PWM Output Waveform
6
UC1849
UC2849
UC3849
CIRCUIT BLOCK DESCRIPTION (cont.)
Ω
Figure 3. Output Frequency
UDG-94113
Figure 5. Oscillator Synchronization
Connection Diagram
Figure 4. Maximum Duty Cycle
current discharge and subsequent charge cycles whether
or not other units on the CLKSYN bus are still synchronizing. This requires the frequency of all free running
oscillators to be within 40% of each other to guarantee
synchronization.
Grounds, Voltage Sensing and Current Sensing: The
voltage is sensed directly at the load. Proper load sharing
requires the same sensed voltage for each power supply
connected in parallel. Referring to Figure 6, the positive
sense voltage (VSP) connects to the voltage error amplifier inverting terminal (VA-), the return lead for the onchip reference is used as the negative sense (VSM). The
current is sensed across the shunt resistor, RS.
Figure 6 shows one recommended voltage and current
sensing scheme when VEE is connected to GND. The
signal ground is the negative sense point for the output
voltage and the positive sense point for the output current. The voltage offset on the current sense amplifier is
not needed if VEE is separated from GND. VEE is the
negative supply for the current sense amplifier. When it is
separated from GND, it extends the current sense amplifier’s common mode input voltage range to include VEE
which is approximately −0.7V below ground. The resistor
RADJ is used for load sharing. The unit which is the master will force VADJ to 1.0V. Therefore, the regulated voltage being sensed is actually
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UDG-94114
Figure 6.Voltage and Current Sense VEE Tied to GND
VSP − VSM = (VREF − VADJ)
RADJ
· ( R1 + R ) + VADJ
ADJ
VSM = 0V, VADJ = 1V (master), VREF = 5V
VSP = 4
7
RADJ
· ( R1 + R )
ADJ
+ 1V
UC1849
UC2849
UC3849
CIRCUIT BLOCK DESCRIPTION (cont.)
The ADJ pin voltage on the slave chips will increase forcing their load currents to increase to match the master.
voltage error amplifier output is the current command
signal representing the average output load current. The
ILIM pin programs the upper clamp voltage of this amplifier and consequently the maximum load current. A gain
of 2 amplifier connected between the voltage error amplifier output and the share amplifier input increases the
current share resolution and noise margin. The average
current is used as an input to a source only load share
buffer amplifier. The output of this amplifier is the current
share bus. The IC with the highest sensed current will
have the highest voltage on the current share bus and
consequently act as the master. The 60mV input offset
guarantees that the unit sensing the highest load current
is chosen as the master.
The AC frequency response of the voltage error amplifier
is shown in Figure 7.
The adjust amplifier is used by the remaining (slave) ICs
to adjust their respective references high in order to balance each IC’s load current. The master’s ADJ pin will be
at its 1.0V clamp and connected back to the non-inverting voltage error amplifier input through a high value
resistor. This requires the user to initially calculate the
control voltage with the ADJ pin at 1.0V.
∅m ≈
Figure 7. AC Frequency Response of the Voltage
Error Amplifier
VREF can be adjusted 150mV to 300mV which compensates for 5% unit to unit reference mismatch and external
resistor mismatch. RADJ will typically be 10 to 30 times
larger than R1. This also attenuates the overall variation of
the ADJ clamp of 1V ±100mV by a factor of 10 to 30, contributing only a 3mV to 10mV additional delta to VREF.
Refer to the UC3907 Application Note U-130 for further
information on parallel power supply load sharing.
Startup and Shutdown: Isolated power up can be
accomplished using the UCC1889. Application Note U149 is available for additional information.
The UC1849 offers several features that enhance startup
and shutdown. Soft start is accomplished by connecting
RUN to VA+ and a capacitor to ground. The resulting RC
rise time on the VA+ pin initiates a soft start. It can also
be accomplished by connecting RUN to ILIM. When RUN
is low it will command zero load current, guaranteeing a
soft start. The undervoltage lockout (UVLO) is a logical
AND of ENBL < 2.5V, SEQ > 2.5V, VCC > 8.4V and
VREF > 4.65V. The block diagram shows that the thresholds are set by comparators. By placing an RC divider on
the SEQ pin, the enabling of multiple chips can be
sequenced with different RC time constants. Similarly,
different RC time constants on the ENBL pins can
sequence shutdown. The UVLO keeps the output from
switching; however the internal reference starts up with
VCC less than 8.4V. The KILL input shuts down the
switching of the chip. This can be used in conjunction
with an overvoltage comparator for overvoltage protection. In order to restart the chip after KILL has been initiated, the chip must be powered down and then back up.
A pulse on the ENBL pin also accomplishes this without
actually removing voltage to the VCC pin.
Current Control Loop: The current sense amplifier (CSA)
is designed specifically for the task of sensing and amplifying the inductor ripple current at frequencies up to 1MHz.
The CSA’s input offset voltage (VIO) is trimmed to less
than 1mV to minimize error of the average current signal.
This amplifier is not internally compensated allowing the
user to optimally choose the zero crossing bandwidth.
(3)
1
·
2π RINV CCOMP
RINV is the input resistance at the inverting terminal CSCCOMP is the capacitance between CS- and CSO.
Although it is only unity gain stable for a GBW of 7MHz,
the amplifier is typically configured with a differential gain
of at least 10, allowing the amplifier to operate at 70MHz
with sufficient phase margin. A closed loop gain of 10
attenuates the output by 20.8dB.
20.8 = 20log
Load Sharing: Load sharing is accomplished similar to
the UC1907. The sensed current for the UC1849 has an
AC component that is amplified and then averaged. The
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Frequency (0dB) =
· 111
to the inverting terminal assuring stability. The amplifier’s
gain fed back into the inverting terminal is less than unity
8
UC1849
UC2849
UC3849
CIRCUIT BLOCK DESCRIPTION (cont.)
at 7MHz, where the phase margin begins to roll off. See
Figure 8 for typical Bode plot.
CSGAIN = VILIM
VRS.
The current error amplifier (CEA) also needs its loop
compensated by the user with the same criteria as the
current sense amplifier. This amplifier is essentially the
same wide bandwidth amplifier without the input offset
voltage trim. The zero crossing can also be approximately calculated with Equation 3. The gain bandwidth of the
current loop is optimized by matching the inductor
downslope (Vo/L) to the oscillator ramp slope (Vs
fs).
Subharmonic oscillation problems are avoided by keeping the amplified inductor downslope less than the oscillator ramp slope.
(5)
·
−
β
∅m
The following equation determines the current error
amplifier gain (GCA):
(6)
GCA =
Figure 8. Current Sense Amplifier and Current Error
Amplifier Bode Plot
where CSGAIN and RS are defined by equations
4 and 5,
Vs is the oscillator peak to peak voltage,
fs is the oscillator frequency,
Vo is the output voltage,
and L is the inductance.
The gain of the differential current sense amplifier
(CSGAIN) is calculated by knowing the maximum load
current. The maximum voltage across the shunt resistor
(R S ) divided by R S is the maximum load current. By
amplifying the voltage across RS, VRS, to be equal to the
voltage error amplifier Voh, the current control loop keeps
the load from exceeding its current limit. Voh is set at
3.0V if ILIM is connected to VREF. The maximum current
limit clamp can be reduced by reducing the voltage at
ILIM to less than 3.0V as described in the ILIM pin
description.
(4)
RS =
· fs
;
(Vo/L) · RS · CSGAIN
Vs
Additional Information about average current mode control can be found in Unitrode Application Note U-140.
Design Example: Figure 9 is an open loop test that lets
the user test the circuit blocks discussed without having
to build an entire control loop. The pulse width can be
varied by either the VADJ or the VISENSE inputs. Figure 10
shows an isolated power supply using the UC1849 secondary side average current mode controller.
VRS
Max ILOAD
UDG-94115-1
Figure 9. Open Loop Circuit
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9
UC1849
UC2849
UC3849
UDG-94116-1
Figure 10. UC1849 Application Diagram
UNITRODE INTEGRATED CIRCUITS
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
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IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright  1999, Texas Instruments Incorporated
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