ETC UT54ACT245-UCX

UT54ACS245/UT54ACTS245
Radiation-Hardened
Octal Bus Transceiver with Three-State Outputs
FEATURES
PINOUTS
20-Pin DIP
Top View
Three-state outputs drive bus line directly
radiation-hardened CMOS
- Latchup immune
High speed
Low power consumption
Single 5 volt supply
Available QML Q or V processes
Flexible package
- 20-pin DIP
- 20-lead flatpack
DIR
A1
1
2
20
19
VDD
G
A2
3
18
B1
A3
4
17
B2
A4
5
16
B3
A5
A6
6
7
15
14
B4
B5
A7
A8
8
9
13
12
B6
B7
VSS
10
11
B8
DESCRIPTION
The UT54ACS245 and the UT54ACTS245 are non-inverting
octal bus transceivers designed for asynchronous two-way communication between data buses. The control function implementation minimizes external timing requirements.
The devices allow data transmission from the A bus to the B bus
or from the B bus to the A bus depending upon the logic level
at the direction control (DIR) input. The enable input (G) disables the device so that the buses are effectively isolated.
The devices are characterized over full military temperature
range of -55 C to +125 C.
FUNCTION TABLE
ENABLE
G
DIRECTION
CONTROL DIR
OPERATION
L
L
B Data To A Bus
L
H
A Data To B Bus
H
X
Isolation
20-Lead Flatpack
Top View
DIR
1
20
VDD
A1
2
19
G
A2
3
18
B1
A3
A4
4
5
17
16
B2
B3
A5
6
15
B4
A6
7
14
B5
A7
A8
VSS
8
9
10
13
12
11
B6
B7
B8
LOGIC SYMBOL
G
DIR
A1
A2
A3
A4
A5
A6
A7
A8
(19)
(1)
(2)
(3)
G3
3 EN1 (BA)
3 EN2 (AB)
(18)
1
B1
2
(17)
(4)
(16)
(5)
(6)
(15)
(7)
(8)
(9)
(14)
B2
B3
B4
B5
(13)
B6
(12)
B7
(11)
B8
Note:
1. Logic symbol in accordance with ANSI/IEEE Std 91-1984 and IEC
Publication 617-12.
165
RadHard MSI Logic
UT54ACS245/UT54ACTS245
LOGIC DIAGRAM
DIR
(1)
(19)
A1
(18)
A2
B7
(9)
(11)
RadHard MSI Logic
B6
(8)
(12)
A8
B5
(7)
(13)
A7
B4
(6)
(14)
A6
B3
(5)
(15)
A5
B2
(4)
(16)
A4
B1
(3)
(17)
A3
G
(2)
B8
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UT54ACS245/UT54ACTS245
RADIATION HARDNESS SPECIFICATIONS 1
PARAMETER
LIMIT
UNITS
Total Dose
1.0E6
rads(Si)
SEU Threshold 2
80
MeV-cm2/mg
SEL Threshold
120
MeV-cm2/mg
Neutron Fluence
1.0E14
n/cm2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
LIMIT
UNITS
VDD
Supply voltage
-0.3 to 7.0
V
VI/O
Voltage any pin
-.3 to VDD +.3
V
TSTG
Storage Temperature range
-65 to +150
C
TJ
Maximum junction temperature
+175
C
TLS
Lead temperature (soldering 5 seconds)
+300
C
Thermal resistance junction to case
20
C/W
II
DC input current
10
mA
PD
Maximum power dissipation
1
W
JC
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device
at these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
167
SYMBOL
PARAMETER
LIMIT
UNITS
VDD
Supply voltage
4.5 to 5.5
V
VIN
Input voltage any pin
0 to VDD
V
TC
Temperature range
-55 to + 125
C
RadHard MSI Logic
UT54ACS245/UT54ACTS245
DC ELECTRICAL CHARACTERISTICS 7
(VDD = 5.0V 10%; V SS = 0V 6, -55 C < TC < +125 C)
SYMBOL
VIL
VIH
IIN
PARAMETER
CONDITION
MIN
Low-level input voltage 1
ACTS
ACS
High-level input voltage 1
ACTS
ACS
MAX
UNIT
0.8
.3VDD
V
.5VDD
.7VDD
V
Input leakage current
ACTS/ACS
VIN = VDD or VSS
Low-level output voltage 3
ACTS
ACS
IOL = 12.0mA
IOL = 100 A
High-level output voltage 3
ACTS
ACS
IOH = -12.0mA
IOH = -100 A
IOZ
Three-state output leakage current
VO = VDD and VSS
-30
30
A
IOS
Short-circuit output current 2 ,4
ACTS/ACS
VO = VDD and VSS
-300
300
mA
Output current10
VIN = VDD or VSS
12
mA
(Sink)
VOL = 0.4V
Output current10
VIN = VDD or VSS
-12
mA
(Source)
VOH = VDD - 0.4V
Ptotal
Power dissipation 2, 8, 9
CL = 50pF
2.0
mW/MHz
IDDQ
Quiescent Supply Current
VDD = 5.5V
10
A
Quiescent Supply Current Delta
For input under test
1.6
mA
VOL
VOH
IOL
IOH
IDDQ
ACTS
-1
1
A
0.40
0.25
V
.7VDD
VDD - 0.25
V
VIN = VDD - 2.1V
For all other inputs
VIN = VDD or VSS
VDD = 5.5V
CIN
COUT
Input capacitance 5
= 1MHz @ 0V
15
pF
Output capacitance 5
= 1MHz @ 0V
15
pF
RadHard MSI Logic
168
UT54ACS245/UT54ACTS245
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V IH = VIH (min) + 20%, - 0%; VIL = VIL(max) + 0%,
- 50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but
are guaranteed to VIH(min) and VIL(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density 5.0E5 amps/cm2, the maximum product of load capacitance (per output buffer) times frequency should not exceed
3,765 pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and VSS
at frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose 1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
169
RadHard MSI Logic
UT54ACS245/UT54ACTS245
AC ELECTRICAL CHARACTERISTICS 2
(VDD = 5.0V 10%; V SS = 0V 1, -55 C < TC < +125 C)
SYMBOL
PARAMETER
MINIMUM
MAXIMUM
UNIT
tPLH
Data to bus
1
11
ns
tPHL
Data to bus
1
15
ns
tPZL
G low to bus active
2
12
ns
tPZH
G low to bus active
2
12
ns
tPLZ
G high to bus three-state
2
12
ns
tPHZ
G high to bus three-state
2
12
ns
Notes:
1. Maximum allowable relative shift equals 50mV.
2. All specifications valid for radiation dose 1E6 rads(Si)
RadHard MSI Logic
170