### ETC 06035G473Z-MR

```Y5V Dielectric
General Specifications
Y5V formulations are for general-purpose use in a limited
temperature range. They have a wide temperature characteristic of +22% –82% capacitance change over the operating
temperature range of –30°C to +85°C.
Y5V’s high dielectric constant allows the manufacture of the
highest capacitance value in a given case size.
These characteristics make Y5V ideal for decoupling applications within limited temperature range.
PART NUMBER (see page 3 for complete part number explanation)
0805
3
G
104
Z
A
T
2
A
Size
(L" x W")
Voltage
10V = Z
16V = Y
25V = 3
50V = 5
Dielectric
Y5V = G
Capacitance
Code
Capacitance
Tolerance
Z = +80 –20%
Failure
Rate
A = Not
Applicable
Terminations
T = Plated Ni
and Solder
Packaging
2 = 7" Reel
4 = 13" Reel
Special
Code
A = Std.
Product
PERFORMANCE CHARACTERISTICS
Capacitance Range
Capacitance Tolerances
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Dissipation Factor
Insulation Resistance (+25°C, RVDC)
Dielectric Strength
Test Voltage
Test Frequency
16
2200 pF to 22 µF
+80 –20%
–30°C to +85°C
+22% to –82% max. within operating temperature
10, 16, 25 and 50 VDC (+85°C)
For 50 volts: 5.0% max.
For 16 and 25 volts: 7% max.
For 10 volts: 10% max.
10,000 megohms min. or 1000 MΩ - µF min., whichever is less
250% of rated voltage for 5 seconds at 50 mamp max. current
1.0 Vrms ± 0.2 Vrms
1 KHz
Y5V Dielectric
Typical Characteristic Curves**
0.1 ␮F - 0603
Impedance vs. Frequency
Temperature Coefficient
10,000
1,000
100
|Z| (Ohms)
% ⌬ Capacitance
+20
+10
0
-10
-20
-30
-40
-50
-60
-70
-80
10
1
0.1
-55
-35 -15
0.01
10,000
+5 +25 +45 +65 +85 +105 +125
Temperature °C
100,000
1,000,000
10,000,000
Frequency (Hz)
0.22 ␮F - 0805
Impedance vs. Frequency
Capacitance Change
vs. DC Bias Voltage
1,000
+40
100
|Z| (Ohms)
⌬ c/c (%)
+20
0
-20
-40
-60
10
1
0.1
-80
-100
0
20
40
60
80
0.01
10,000
100
Insulation Resistance vs. Temperature
1,000,000
10,000,000
1 ␮F - 1206
Impedance vs. Frequency
10,000
1,000
100
1,000
|Z| (Ohms)
100,000
Frequency (Hz)
DC Bias Voltage
100
10
1
0.1
0
+20
+30
+40
+50
+60
+70
0.01
10,000
+80 +85
Temperature °C
100,000
1,000,000
10,000,000
Frequency (Hz)
SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE
Style
0402*
0603*
0805*
1206*
1210*
1812*
1825*
2220
2225
10V
2.2nF - 0.1µF
2.2nF - 1µF
10nF - 4.7µF
10nF - 10µF
10nF - 22µF
→
→
—
→
16V
2.2nF - 0.1µF
2.2nF - 0.33µF
10nF - 2.2µF
10nF - 4.7µF
0.1µF - 10µF
→
→
—
→
25V
2.2nF - 22nF
2.2nF - 0.22µF
10nF - 1µF
10nF - 2.2µF
0.1µF - 4.7µF
0.15µF - 1.5µF
0.47µF - 1.5µF
—
0.68µF - 2.2µF
50V
2.2nF - 10nF
2.2nF - 56nF
10nF - 0.33µF
10nF - 1µF
0.1µF - 1µF
1.5nF - 1.5µF
0.47µF - 1.5µF
1µF - 1.5µF
0.68µF - 1.5µF
* Standard Sizes
** For additional information on performance changes with operating conditions consult AVX’s software SpiCap.
17
Y5V Dielectric
Capacitance Range
1.00 ± .10
(.040 ± .004)
.50 ± .10
(.020 ± .004)
.60
(.024)
.25 ± .15
(.010 ± .006)
1.60 ± .15
(.063 ± .006)
.81 ± .15
(.032 ± .006)
.90
(.035)
.35 ± .15
(.014 ± .006)
MM
(in.)
MM
(in.)
MM
(in.)
MM
(in.)
(L) Length
(W) Width
(T) Max. Thickness
(t) Terminal
WVDC
10
16
25
50
10
16
25
1210
2.01 ± .20
(.079 ± .008)
1.25 ± .20
(.049 ± .008)
1.30
(.051)
.50 ± .25
(.020 ± .010)
50
10
16
25
3.20 ± .20
(.126 ± .008)
1.60 ± .20
(.063 ± .008)
1.50
(.059)
.50 ± .25
(.020 ± .010)
50
10
16
25
3.20 ± .20
(.126 ± .008)
2.50 ± .20
(.098 ± .008)
1.70
(.067)
.50 ± .25
(.020 ± .010)
50
10
16
25
50
1812*
1825*
2220*
2225*
All Embossed
All Embossed
All Embossed
All Embossed
4.50 ± .30
(.177 ± .012)
3.20 ± .20
(.126 ± .008)
1.70
(.067)
.61 ± .36
(.024 ± .014)
4.50 ± .30
(.252 ± .016)
6.40 ± .40
(.252 ± .016)
1.70
(.067)
.61 ± .36
(.024 ± .014)
5.7 ± 0.4
(.225 ± .016)
5.0 ± 0.4
(.197 ± .016)
2.30
(.090)
.64 ± .39
(.025 ± .015)
5.72 ± .25
(.225 ± .010)
6.35 ± .25
(.250 ± .010)
1.70
(.067)
.64 ± .39
(.025 ± .015)
25
25
50
50
䉲
2200
2700
3300
1206
50
25
䉲
Cap
(pF)
0805
Paper/Embossed Paper/Embossed Paper/Embossed
L
W
䉲
䉲
Cap
(µF)
T
䉲
3900
4700
5600
6800
8200
50
䉲
0603*
All Paper
䉲
0402*
All Paper
䉲
SIZE
Standard Reel
Packaging
t
.01
.012
.015
.018
.022
.027
.033
.039
.047
.056
.068
.082
.10
.12
.15
.18
.22
.27
.33
.39
.47
.56
.68
.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10.0
12.0
15.0
18.0
22.0
*Reflow soldering only.
= Paper Tape
NOTES: For low profile product, see page 19.
18
= Embossed Tape
How to Order
Part Number Explanation
EXAMPLE: 08055A101JAT2A
0805
Size
(L" x W")
0402
0504
0603
0805
1005
0907
1206
1210
1505
1805
1808
1812
1825
2225
3640
5
A
101
Dielectric
C0G (NP0) = A
X7R = C
X5R = D
Z5U = E
Y5V = G
Voltage
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
250V = V
500V = 7
600V = C
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
4000V = J
5000V = K
J
C
D
F
G
J
K
M
Z
P
A
Capacitance
Tolerance
= ±.25 pF*
= ±.50 pF*
= ±1% (≥ 25 pF)
= ±2% (≥ 13 pF)
= ±5%
= ±10%
= ±20%
= +80%, -20%
= +100%, -0%
Capacitance
Code
(2 significant
digits + no. of
zeros)
Examples:
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 µF = 105
For values below 10 pF,
use “R” in place of
decimal point, e.g., 9.1
pfd = 9R1.
T
2
Terminations
Standard:
T = Ni and Tin
Plated
Others:
7 = Plated Ni
Gold Plated
1 = Pd/Ag
Failure
Rate
A = Not
Applicable
A
Special**
Code
A = Standard
Product
Non-Standard
P = Embossed
unmarked
M = Embossed
marked
E = Standard
packaging
marked
Low Profile
Chips Only
Max. Thickness
T = .66mm (.026")
S = .56mm (.022")
R = .46mm (.018")
Packaging**
Recommended:
2 =7" Reel
4 =13" Reel
Others:
7 = Bulk Cassette
9 = Bulk
* C&D tolerances for ⱕ10 pF values.
** Standard Tape and Reel material depends upon chip size and thickness.
See individual part tables for tape material type for each capacitance value.
Standard packaging is shown in the individual tables.
3
Surface Mounting Guide
MLC Chip Capacitors
Component pads should be designed to achieve good solder filets and minimize component movement during reflow
soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave
and reflow soldering. The basis of these designs is:
• Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
• Pad overlap 0.5mm beneath component.
• Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
REFLOW SOLDERING
D2
D1
D3
D4
D5
Dimensions in millimeters (inches)
Case Size
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
D1
D2
D3
D4
D5
1.70 (0.07)
2.30 (0.09)
3.00 (0.12)
4.00 (0.16)
4.00 (0.16)
5.60 (0.22)
5.60 (0.22)
5.60 (0.22)
6.60 (0.26)
6.60 (0.26)
0.60 (0.02)
0.80 (0.03)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04))
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
0.50 (0.02)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
2.00 (0.09)
3.60 (0.14)
3.60 (0.14)
3.60 (0.14)
4.60 (0.18)
4.60 (0.18)
0.60 (0.02)
0.80 (0.03)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
0.50 (0.02)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
2.50 (0.10)
2.00 (0.08)
3.00 (0.12)
6.35 (0.25)
5.00 (0.20)
6.35 (0.25)
41
Surface Mounting Guide
MLC Chip Capacitors
WAVE SOLDERING
Case Size
0603
0805
1206
1210
D2
D1
D3
D4
D1
D2
D3
D4
D5
3.10 (0.12)
4.00 (0.15)
5.00 (0.19)
5.00 (0.19)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
1.50 (0.06)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
2.00 (0.09)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
1.50 (0.06)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
2.50 (0.10)
D5
Dimensions in millimeters (inches)
Component Spacing
Preheat & Soldering
For wave soldering components, must be spaced sufficiently
far apart to avoid bridging or shadowing (inability of solder
to penetrate properly into small spaces). This is less important for reflow soldering but sufficient space must be
allowed to enable rework should it be required.
The rate of preheat should not exceed 4°C/second to
prevent thermal shock. A better maximum figure is about
2°C/second.
For capacitors size 1206 and below, with a maximum
thickness of 1.25mm, it is generally permissible to allow a
temperature differential from preheat to soldering of 150°C.
In all other cases this differential should not exceed 100°C.
consult AVX.
≥1.5mm (0.06)
≥1mm (0.04)
≥1mm (0.04)
42
Cleaning
Care should be taken to ensure that the capacitors are
thoroughly cleaned of flux residues especially the space
beneath the capacitor. Such residues may otherwise
become conductive and effectively offer a low resistance
bypass to the capacitor.
Ultrasonic cleaning is permissible, the recommended
conditions being 8 Watts/litre at 20-45 kHz, with a process
cycle of 2 minutes vapor rinse, 2 minutes immersion in the
ultrasonic solvent bath and finally 2 minutes vapor rinse.
Surface Mounting Guide
MLC Chip Capacitors
APPLICATION NOTES
General
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
Surface mounting chip multilayer ceramic capacitors
are designed for soldering to printed circuit boards or other
substrates. The construction of the components is such that
they will withstand the time/temperature profiles used in both
wave and reflow soldering methods.
Solderability
Handling
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ±5°C for 2±1 seconds.
Chip multilayer ceramic capacitors should be handled with
care to avoid damage or contamination from perspiration
and skin oils. The use of tweezers or vacuum pick ups
is strongly recommended for individual components. Bulk
handling should ensure that abrasion and mechanical shock
are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement
machine. Any mechanical shock should be minimized during
handling chip multilayer ceramic capacitors.
Storage
Leaching
Terminations will resist leaching for at least the immersion
times and conditions shown below.
Termination Type
Nickel Barrier
Solder
Solder
60/40/0
260±5
Immersion Time
Seconds
30±1
Preheat
Recommended Soldering Profiles
Reflow
300
Natural
Cooling
Preheat
Solder Temp.
250
200
220°C
to
250°C
150
Soldering
100
50
0
1min
10 sec. max
1min
(Minimize soldering time)
Wave
Preheat
Natural
Cooling
250
Solder Temp.
Mildly activated rosin fluxes are preferred. The minimum
amount of solder to give a good joint should be used.
Excessive solder can lead to damage from the stresses
caused by the difference in coefficients of expansion
between solder, chip and substrate. AVX terminations are
suitable for all wave and reflow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the
utilization of hot air soldering tools.
Cooling
300
200
It is important to avoid the possibility of thermal shock during
soldering and carefully controlled preheat is therefore
required. The rate of preheat should not exceed 4°C/second
and a target figure 2°C/second is recommended. Although
an 80°C to 120°C temperature differential is preferred,
recent developments allow a temperature differential
between the component surface and the soldering temperature of 150°C (Maximum) for capacitors of 1210 size and
below with a maximum thickness of 1.25mm. The user is
cautioned that the risk of thermal shock increases as chip
size or temperature differential increases.
T
230°C
to
250°C
150
100
50
0
1 to 2 min
3 sec. max
(Preheat chips before soldering)
T/maximum 150°C
Natural cooling in air is preferred, as this minimizes stresses
within the soldered joint. When forced air cooling is used,
cooling rate should not exceed 4°C/second. Quenching
is not recommended but if used, maximum temperature
differentials should be observed according to the preheat
conditions above.
Cleaning
Flux residues may be hygroscopic or acidic and must be
removed. AVX MLC capacitors are acceptable for use with
all of the solvents described in the specifications MIL-STD202 and EIA-RS-198. Alcohol based solvents are acceptable
and properly controlled water cleaning systems are also
acceptable. Many other solvents have been proven successful,
and most solvents that are acceptable to other components
on circuit assemblies are equally acceptable for use with
ceramic capacitors.
43
Packaging of Chip Components
Automatic Insertion Packaging
TAPE & REEL QUANTITIES
All tape and reel specifications are in compliance with RS481.
8mm
Paper or Embossed Carrier
(1)
12mm
0805, 1005, 1206,
1210
Embossed Only
0504, 0907
Paper Only
0402, 0603
1505, 1805,
1808
1812, 1825
2220, 2225
Qty. per Reel/7" Reel
2,000 or 4,000 (1)
3,000
1,000
Qty. per Reel/13" Reel
10,000
10,000
4,000
Dependent on chip thickness. Low profile chips shown on page 27 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per 7" reels and are
not available on 13" reels. For 3640 size chip contact factory for quantity per reel.
REEL DIMENSIONS
Tape
Size(1)
A
Max.
B*
Min.
C
D*
Min.
N
Min.
8mm
330
(12.992)
1.5
(.059)
13.0±0.20
(.512±.008)
20.2
(.795)
W2
Max.
W3
8.4 +1.0
–0.0
(.331 +.060
–0.0 )
14.4
(.567)
7.9 Min.
(.311)
10.9 Max.
(.429)
12.4 +2.0
–0.0
+.076
)
(.488 –0.0
18.4
(.724)
11.9 Min.
(.469)
15.4 Max.
(.607)
50
(1.969)
12mm
Metric dimensions will govern.
English measurements rounded and for reference only.
(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.
32
W1
Embossed Carrier Configuration
8 & 12mm Tape Only
8 & 12mm Embossed Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size
8mm
and
12mm
D0
+0.10
-0.0
+.004
-0.0
8.4
(.059
E
)
P0
P2
1.75 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
(.069 ± .004) (.157 ± .004) (.079 ± .002)
T Max.
T1
G1
G2
0.600
(.024)
0.10
(.004)
Max.
0.75
(.030)
Min.
See Note 3
0.75
(.030)
Min.
See Note 4
R
Min.
See Note 2
T2
W
A0 B0 K0
VARIABLE DIMENSIONS
Tape Size
B1
D1
Max.
Min.
See Note 6 See Note 5
F
P1
8mm
4.55
(.179)
1.0
(.039)
3.5 ± 0.05
4.0 ± 0.10
(.138 ± .002) (.157 ± .004)
25
(.984)
2.5 Max
(.098)
8.0 +0.3
-0.1
(.315 +.012
-.004 )
See Note 1
12mm
8.2
(.323)
1.5
(.059)
5.5 ± 0.05
4.0 ± 0.10
(.217 ± .002) (.157 ± .004)
30
(1.181)
6.5 Max.
(.256)
12.0 ± .30
(.472 ± .012)
See Note 1
8mm
1/2 Pitch
4.55
(.179)
1.0
(.039)
3.5 ± 0.05
2.0 ± 0.10
(.138 ± .002) 0.79 ± .004
25
(.984)
2.5 Max.
(.098)
8.0 +0.3
-0.1
(.315 +.012
-.004 )
See Note 1
12mm
Double
Pitch
8.2
(.323)
1.5
(.059)
5.5 ± 0.05
8.0 ± 0.10
(.217 ± .002) (.315 ± .004)
30
(1.181)
6.5 Max.
(.256)
12.0 ± .30
(.472 ± .012)
See Note 1
NOTES:
1. A0, B0, and K0 are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The
clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and K0) must be within 0.05 mm (.002) min. and 0.50 mm
(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches C & D).
2. Tape with components shall pass around radius “R” without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12 mm
embossed tape for reels with hub diameters approaching N min. (Table 4).
3. G1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the
cavity whichever is less.
4. G2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity
or to the edge of the cavity whichever is less.
5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment.
Dimensions of embossment location and hole location shall be applied independent of each other.
6. B1 dimension is a reference dimension for tape feeder clearance only.
33
Paper Carrier Configuration
8 & 12mm Tape Only
8 & 12mm Paper Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size
8mm
and
12mm
D0
1.5
(.059
+0.1
-0.0
+.004
-.000
E
)
1.75 ± 0.10
(.069 ± .004)
P0
P2
4.0 ± 0.10
2.0 ± 0.05
(.157 ± .004) (.079 ± .002)
T1
G1
G2
R MIN.
0.10
(.004)
Max.
0.75
(.030)
Min.
0.75
(.030)
Min.
25 (.984)
See Note 2
VARIABLE DIMENSIONS
Tape Size
P1
F
W
A0 B0
T
8mm
4.0 ± 0.10
(.157 ± .004)
3.5 ± 0.05
(.138 ± .002)
8.0 +0.3
-0.1
(.315 +.012
-.004 )
See Note 1
See Note 3
12mm
4.0 ± .010
(.157 ± .004)
5.5 ± 0.05
(.217 ± .002)
12.0 ± 0.3
(.472 ± .012)
8mm
1/2 Pitch
2.0 ± 0.10
(.079 ± .004)
3.5 ± 0.05
(.138 ± .002)
8.0 +0.3
-0.1
(.315 +.012
-.004 )
12mm
Double
Pitch
8.0 ± 0.10
(.315 ± .004)
5.5 ± 0.05
(.217 ± .002)
12.0 ± 0.3
(.472 ± .012)
NOTES:
1. A0, B0, and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The
clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and T) must be within 0.05 mm (.002) min. and 0.50 mm
(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A & B).
2. Tape with components shall pass around radius “R” without damage.
3. 1.1 mm (.043) Base Tape and 1.6 mm (.063) Max. for Non-Paper Base Compositions.
Bar Code Labeling Standard
AVX bar code labeling is available and follows latest version of EIA-556-A.
34
Bulk Case Packaging
BENEFITS
BULK FEEDER
• Easier handling
• Smaller packaging volume
(1/20 of T/R packaging)
• Easier inventory control
Case
• Flexibility
• Recyclable
Cassette
Gate
Shooter
CASE DIMENSIONS
Shutter
Slider
12mm
36mm
Mounter
Expanded Drawing
110mm
Chips
Attachment Base
CASE QUANTITIES
Part Size
0402
0603
0805
Qty.
(pcs / cassette)
80,000
15,000
10,000 (T=0.6mm)
5,000 (T¯≥0.6mm)
35
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