ETC 200GL120DN2

BSM 200 GAL 120 DN2
IGBT Power Module
• Single switch with chopper diode at collector
• Chopper diode like diode of BSM300GA120DN2
• Package with insulated metal base plate
Type
VCE
BSM 200 GAL 120 DN2
1200V 290A
IC
Package
Ordering Code
HB 200GAL
C67070-A2301-A70
Maximum Ratings
Parameter
Symbol
Collector-emitter voltage
VCE
Collector-gate voltage
VCGR
RGE = 20 kΩ
Values
Unit
1200
V
1200
Gate-emitter voltage
VGE
DC collector current
IC
± 20
A
TC = 25 °C
290
TC = 80 °C
200
Pulsed collector current, tp = 1 ms
ICpuls
TC = 25 °C
580
TC = 80 °C
400
Power dissipation per IGBT
W
Ptot
TC = 25 °C
1400
Chip temperature
Tj
Storage temperature
Tstg
Thermal resistance, chip case
RthJC
Diode thermal resistance, chip case
RthJCD
Diode thermal resistance, chip-case,chopper
RTHJCDC
Insulation test voltage, t = 1min.
Vis
2500
Vac
Creepage distance
-
20
mm
Clearance
-
11
DIN humidity category, DIN 40 040
-
F
IEC climatic category, DIN IEC 68-1
-
1
+ 150
°C
-40 ... + 125
≤ 0.09
K/W
≤ 0.125
sec
40 / 125 / 56
Nov-24-1997
BSM 200 GAL 120 DN2
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
min.
typ.
Unit
max.
Static Characteristics
Gate threshold voltage
V
VGE(th)
VGE = VCE, IC = 8 mA
4.5
5.5
6.5
VGE = 15 V, IC = 200 A, Tj = 25 °C
-
2.5
3
VGE = 15 V, IC = 200 A, Tj = 125 °C
-
3.1
3.7
Collector-emitter saturation voltage
Zero gate voltage collector current
VCE(sat)
mA
ICES
VCE = 1200 V, VGE = 0 V, Tj = 25 °C
-
3
4
VCE = 1200 V, VGE = 0 V, Tj = 125 °C
-
12
-
Gate-emitter leakage current
nA
IGES
VGE = 20 V, VCE = 0 V
-
-
400
AC Characteristics
Transconductance
VCE = 20 V, IC = 200 A
Input capacitance
108
nF
-
13
-
-
2
-
-
1
-
Coss
VCE = 25 V, VGE = 0 V, f = 1 MHz
Reverse transfer capacitance
-
Ciss
VCE = 25 V, VGE = 0 V, f = 1 MHz
Output capacitance
S
gfs
Crss
VCE = 25 V, VGE = 0 V, f = 1 MHz
2
Nov-24-1997
BSM 200 GAL 120 DN2
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
min.
typ.
Unit
max.
Switching Characteristics, Inductive Load at Tj = 125 °C
Turn-on delay time
ns
td(on)
VCC = 600 V, VGE = 15 V, IC = 200 A
RGon = 4.7 Ω
Rise time
-
110
220
-
80
160
-
550
800
-
80
120
tr
VCC = 600 V, VGE = 15 V, IC = 200 A
RGon = 4.7 Ω
Turn-off delay time
td(off)
VCC = 600 V, VGE = -15 V, IC = 200 A
RGoff = 4.7 Ω
Fall time
tf
VCC = 600 V, VGE = -15 V, IC = 200 A
RGoff = 4.7 Ω
Free-Wheel Diode
Diode forward voltage
V
VF
IF = 200 A, VGE = 0 V, Tj = 25 °C
-
-
-
IF = 200 A, VGE = 0 V, Tj = 125 °C
-
-
-
Reverse recovery time
µs
trr
IF = 200 A, VR = -600 V, VGE = 0 V
diF/dt = -2000 A/µs, Tj = 125 °C
Reverse recovery charge
-
-
µC
Qrr
IF = 200 A, VR = -600 V, VGE = 0 V
diF/dt = -2000 A/µs
Tj = 25 °C
-
-
-
Tj = 125 °C
-
-
-
3
Nov-24-1997
BSM 200 GAL 120 DN2
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
min.
typ.
Unit
max.
Chopper Diode
Chopper diode forward voltage
V
VFC
IFC = 300 A, VGE = 0 V, Tj = 25 °C
-
2
2.5
IFC = 300 A, VGE = 0 V, Tj = 125 °C
-
1.8
-
Reverse recovery time, chopper
ns
trrC
IFC = 300 A, VR = -600 V, VGE = 0 V
diF/dt = -2500 A/µs, Tj = 25 °C
Reverse recovery charge, chopper
-
500
µC
QrrC
IFC = 300 A, VR = -600 V, VGE = 0 V
diF/dt = -2500 A/µs
Tj = 25 °C
-
14
-
Tj = 125 °C
-
40
-
4
Nov-24-1997
IGBT-Module
IGBT-Modules
%60*$/'1%60*$5'1
Gehäusemaße / Schaltbild
Package outline / Circuit diagram
PIN 6 and 7
GAL type
only
PIN 4 and 5
GAR type
only
GAL type
GAR type
Update of Drawing Sep-21-98