ETC FAN1117AD

www.fairchildsemi.com
FAN1117A
1A Adjustable/Fixed Low Dropout Linear Regulator
Features
Description
•
•
•
•
•
•
The FAN1117A and FAN1117A-1.8, -2.5, -2.85, -3.3 and -5
are low dropout three-terminal regulators with 1A output
current capability. These devices have been optimized for low
voltage where transient response and minimum input voltage
are critical. The 2.85V version is designed specifically to be
used in Active Terminators for SCSI bus.
Low dropout voltage
Load regulation: 0.05% typical
Trimmed current limit
On-chip thermal limiting
Standard SOT-223 and TO-252 packages
Three-terminal adjustable or fixed 1.8V, 2.5V, 2.85V,
3.3V, 5V
Current limit is trimmed to ensure specified output current
and controlled short-circuit current. On-chip thermal limiting
provides protection against any combination of overload and
ambient temperatures that would create excessive junction
temperatures.
Applications
•
•
•
•
•
•
Active SCSI terminators
High efficiency linear regulators
Post regulators for switching supplies
Battery chargers
12V to 5V linear regulators
Motherboard clock supplies
Unlike PNP type regulators where up to 10% of the output
current is wasted as quiescent current, the quiescent current
of the FAN1117A flows into the load, increasing efficiency.
The FAN1117A series regulators are available in the
industry-standard SOT-223 and TO-252 (DPAK) power
packages.
Typical Applications
FAN1117A
VIN = 12V
VIN
+
VOUT
9V at 1A
+
10µF
22µF
124Ω
ADJ
768Ω
FAN1117A-2.85
VIN = 12V
+
VIN
VOUT
10µF
5V at 1A
+
22µF
GND
REV. 1.0.2 4/27/01
PRODUCT SPECIFICATION
FAN1117A
Pin Assignments
Tab is
VOUT
Front View
Tab is
VOUT
3
IN
2
OUT
1
ADJ/GND
1
2
3
4-Lead Plastic SOT-223
ΘJC = 15°C/W*
ADJ/ OUT
GND
IN
3-Lead Plastic TO-252
ΘJC = 3°C/W*
*With package soldered to 0.5 square inch copper area over backside ground plane or internal power plane., ΘJA can vary from
30°C/W to more than 50°C/W. Other mounting techniques may provide better thermal resistance than 30°C/W.
Absolute Maximum Ratings
Parameter
Min.
VIN
(VIN – VOUT) * IOUT
Max.
Unit
18
V
See Figure 1
Operating Junction Temperature Range
Storage Temperature Range
0
125
°C
-65
150
°C
300
°C
Lead Temperature (Soldering, 10 sec.)
1.2
IOUT (A)
1.0
0.8
0.6
0.4
0.2
0
0
2
4
6
8
10
12
14
16
18
20
VIN – VOUT (V)
Figure 1. Absolute Maximum Safe Operating Area
2
REV. 1.0.2 4/27/01
FAN1117A
PRODUCT SPECIFICATION
Electrical Characteristics
Operating Conditions: VIN ≤ 7V, TJ = 25°C unless otherwise specified.
The • denotes specifications which apply over the specified operating temperature range.
Parameter
Reference
Voltage3
Output Voltage4
Line Regulation1,2
Load
Regulation1,2
Conditions
Min.
Typ.
Max.
Units
•
1.225
(-2%)
1.250
1.275
(+2%)
V
10mA ≤ IOUT ≤ 1A
FAN1117A-1.8, 3.3V ≤ VIN ≤ 8.8V
FAN1117A-2.5, 4V ≤ VIN ≤ 9.5V
FAN1117A-2.85, 4.35V ≤ VIN ≤ 9.85V
FAN1117A-3.3, 4.8V ≤ VIN ≤ 10.3V
FAN1117A-5, 6.5V ≤ VIN ≤ 12V
•
•
•
•
•
1.764
2.450
2.793
3.234
4.900
1.8
2.5
2.85
3.3
5.0
1.836
2.550
2.907
3.366
5.100
V
V
V
V
V
(VOUT + 1.5V) ≤ VIN ≤ 12V, IOUT = 10mA
•
0.005
0.2
%
(VIN – VOUT) = 2V, 10mA ≤ IOUT ≤ 1A
•
0.05
0.5
%
1.100
1.200
1.5V ≤ (VIN – VOUT) ≤ 7V,
10mA ≤ IOUT ≤ 1A
Dropout Voltage
∆VREF = 1%, IOUT = 1A
•
Current Limit
(VIN – VOUT) = 2V
•
Adjust Pin Current3
1.1
1.5
V
A
•
35
120
µA
1.5V ≤ (VIN – VOUT) ≤ 7V,
10mA ≤ IOUT ≤ 1A
•
0.2
5
µA
Minimum Load Current
1.5V ≤ (VIN – VOUT) ≤ 15V
•
Quiescent Current
VIN = VOUT + 1.25V
•
4
13
Ripple Rejection
f = 120Hz, COUT = 22µF Tantalum,
(VIN – VOUT) = 3V, IOUT = 1A
Thermal Regulation
TA = 25°C, 30ms pulse
Adjust Pin Current
Change3,4
60
mA
72
0.004
•
Temperature Stability
10
mA
dB
0.02
0.5
%/W
%
Long-Term Stability
TA = 125°C, 1000hrs.
0.03
RMS Output Noise
(% of VOUT)
TA = 25°C, 10Hz ≤ f ≤ 10kHz
0.003
%
Thermal Resistance, Junction SOT-223
to Case
TO-252
15
°C/W
3
°C/W
Thermal Shutdown
155
°C
10
°C
Thermal Shutdown
Hysteresis
Junction Temperature
1.0
%
Notes:
1. See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulation are
measured at a constant junction temperature by low duty cycle pulse testing.
2. Line and load regulation are guaranteed up to the maximum power dissipation (18W). Power dissipation is determined by
input/output differential and the output current. Guaranteed maximum output power will not be available over the full input/
output voltage range.
3. FAN1117A only.
4. Output current must be limited to meet the absolute maximum ratings of the part.
REV. 1.0.2 4/27/01
3
PRODUCT SPECIFICATION
FAN1117A
Typical Performance Characteristics
0.10
DROPOUT VOLTAGE DEVIATION (%)
DROPOUT VOLTAGE (V)
1.5
1.4
1.3
1.2
1.1
TJ = 0°C
1.0
0.9
TJ = 25°C
0.8
TJ = 125°C
0.7
0.6
0.5
0
0
0.2
0.4
0.6
0.8
0.05
0
-0.05
-0.10
-0.15
-0.20
-75 -50 -25 0
1.0
OUTPUT CURRENT (A)
3.70
1.255
3.65
REFERENCE VOLTAGE (V)
REFERENCE VOLTAGE (V)
Figure 3. Load Regulation vs. Temperature
1.260
1.245
1.240
1.235
1.230
1.225
1.220
1.215
VOUT = 3.6V1
3.60
3.55
3.50
3.45
3.40
3.35
VOUT = 3.3V
3.30
Note:
1. FAN1117A Only
3.20
-75 -50 -25 0 25 50 75 100 125 150 175
25 50 75 100 125 150 175
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Figure 4. Reference Voltage vs. Temperature
Figure 5. Output Voltage vs. Temperature
5
100
Note:
1. FAN1117A Only
90
ADJUST PIN CURRENT (µA)
MINIMUM LOAD CURRENT (mA)
VOUT SET WITH 1% RESISTORS
3.25
1.210
-75 -50 -25 0
4
3
2
1
80
70
60
50
40
30
20
10
0
-75 -50 -25 0
25 50 75 100 125 150 175
JUNCTION TEMPERATURE (°C)
Figure 6. Minimum Load Current vs. Temperature
4
25 50 75 100 125 150 175
JUNCTION TEMPERATURE (°C)
Figure 2. Dropout Voltage vs. Output Current
1.250
∆I = 1A
0
-75 -50 -25 0
25 50 75 100 125 150 175
JUNCTION TEMPERATURE (°C)
Figure 7. Adjust Pin Current vs. Temperature
REV. 1.0.2 4/27/01
FAN1117A
PRODUCT SPECIFICATION
Typical Performance Characteristics (continued)
90
80
RIPPLE REJECTION (dB)
SHORT-CIRCUIT CURRENT (A)
2.0
1.75
1.5
1.25
70
60
50
40
30
20
10
1.0
-75 -50 -25 0
(VIN - VOUT) = 3V
0.5 < VRIPPLE < 2V
IOUT = 1A
0
10
25 50 75 100 125 150 175
100
JUNCTION TEMPERATURE (°C)
1K
10K
100K
FREQUENCY (Hz)
Figure 8. Short-Circuit Current vs. Temperature
Figure 9. Ripple Rejection vs. Frequency
10
POWER (W)
7.5
TO-252
5
SOT-223
2.5
0
25
45
65
85
105
125
CASE TEMPERATURE (°C)
Figure 10. Maximum Power Dissipation
REV. 1.0.2 4/27/01
5
PRODUCT SPECIFICATION
FAN1117A
Mechanical Dimensions
4-Lead SOT-223 Package
Inches
Symbol
Millimeters
Min.
Max.
Min.
Max.
A
A1
B
c
D
—
—
.025
—
.248
.071
.181
1.80
4.80
E
e
F
H
I
J
K
L
M
N
.130
.148
—
—
.640
—
6.30
3.30
.840
2.29
6.71
3.71
.115
.033
.264
.012
—
10°
.0008
10°
.010
.124
.041
.287
—
10°
16°
.0040
16°
.014
2.95
.840
6.71
.310
—
10°
.0203
10°
.250
3.15
1.04
7.29
—
10°
16°
.1018
16°
.360
.033
.090
.264
Notes
D
e
K
A
H
E
N
J
M
B
I
L
A1
c
6
F
REV. 1.0.2 4/27/01
FAN1117A
PRODUCT SPECIFICATION
Mechanical Dimensions
3-Lead TO-252 Package
Symbol
Inches
Millimeters
Notes:
Notes
Min.
Max.
Min.
Max.
A
b
b2
b3
c
c2
.086
.025
.030
.205
.018
.018
.094
.035
2.19
0.64
0.76
5.21
0.46
0.46
2.39
0.89
D
E
e
H
5.33
6.22
6.35
6.73
2.29 BSC
9.40
10.41
1.40
1.78
2.74 REF
1
L
L1
.210
.245
.250
.265
.090 BSC
.370
.410
.055
.070
.108 REF
L3
L4
.035
.025
0.89
0.64
4
.045
.215
.024
.023
.080
.040
1.14
5.46
0.61
0.58
2.03
1.02
E
@PKG/
@HEATSINK
b3
4
1
1.
Dimensions are exclusive of mold flash, metal burrs or interlead
protrusion.
2.
Stand off-height is measured from lead tip with ref. to Datum -B-.
3.
Foot length is measured with ref. to Datum -A- with lead surface.
4.
Thermal pad contour optional within dimension b3 and L3.
5.
Formed leads to be planar with respect to one another at seating
place -C-.
6.
Dimensions and tolerances per ASME Y14.5M-1994.
3
L3
c2
D
E-PIN
H
L4
b2
L1
L
b
e
-B-
α = 0° – 10°
-A-
A
-C-
REV. 1.0.2 4/27/01
7
PRODUCT SPECIFICATION
FAN1117A
Ordering Information
Product Number
Package
FAN1117AD
TO-252
FAN1117AS
SOT-223
FAN1117AD-1.8
TO-252
FAN1117AS-1.8
SOT-223
FAN1117AD-2.5
TO-252
FAN1117AS-2.5
SOT-223
FAN1117AD-2.85
TO-252
FAN1117AS-2.85
SOT-223
FAN1117AD-3.3
TO-252
FAN1117AS-3.3
SOT-223
FAN1117AD-5
TO-252
FAN1117AS-5
SOT-223
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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