ETC GTLP6C816AMTCX

Revised December 2000
GTLP6C816A
GTLP/LVTTL 1:6 Clock Driver
General Description
Features
The GTLP6C816A is a clock driver that provides LVTTL to
GTLP signal level translation (and vice versa). The device
provides a high speed interface between cards operating at
LVTTL logic levels and a backplane operating at GTL(P)
logic levels. High speed backplane operation is a direct
result of GTLP’s reduced output swing (<1V), reduced input
threshold levels and output edge rate control. The edge
rate control minimizes bus settling time. GTLP is a Fairchild
Semiconductor derivative of the Gunning Transceiver logic
(GTL) JEDEC standard JESD8-3.
■ Interface between LVTTL and GTLP logic levels
Fairchild’s GTL(P) has internal edge-rate control and is
process, voltage, and temperature (PVT) compensated. Its
function is similar to BTL and GTL but with different output
levels and receiver threshold. GTLP output LOW level is
typically less than 0.5V, the output level HIGH is 1.5V and
the receiver threshold is 1.0V.
■ Designed with edge rate control circuitry to reduce output noise on the GTLP port
■ VREF pin provides external supply reference voltage for
receiver threshold adjustibility
■ Special PVT compensation circuitry to provide consistent performance over variations of process, supply voltage and temperature
■ TTL compatible driver and control inputs
■ Designed using Fairchild advanced BiCMOS technology
■ Bushold data inputs on A port to eliminate the need for
external pull-up resistors for unused inputs
■ Power up/down and power off high impedance for live
insertion
■ Open drain on GTLP to support wired-or connection
■ A Port source/sink −24mA/+24mA
■ B Port sink +50mA
■ 1:6 fanout clock driver for TTL port
■ 1:2 fanout clock driver for GTLP port
■ Low voltage version of GTLP6C816
Ordering Code:
Order Number
Package Number
Package Description
GTLP6C816AMTC
MTC24
24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Device is also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pin Descriptions
Pin Names
Connection Diagram
Description
TTLIN, GTLPIN Clock Inputs
(LVTTL and GTLP respectively)
OEB
Output Enable (Active LOW)
GTLP Port (LVTTL Levels)
OEA
Output Enable (Active LOW)
TTL Port (LVTTL Levels)
VCCT.GNDT
TTL Output Supplies
VCC
Internal Circuitry VCC
GNDG
OBn GTLP Output Grounds
VREF
Voltage Reference Input
OA0–OA5
TTL Buffered Clock Outputs
OB0–OB1
GTLP Buffered Clock Outputs
© 2000 Fairchild Semiconductor Corporation
DS500179
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GTLP6C816A GTLP/LVTTL 1:6 Clock Driver
August 1998
GTLP6C816A
Functional Description
The GTLP6C816A is a clock driver providing LVTTL-to-GTLP clock translation, and GTLP-to-LVTTL clock translation in the
same package. The LVTTL-to-GTLP direction is a 1:2 clock driver path with a single Enable pin (OEB). For the
GTLP-to-LVTTL direction the clock receiver path is a 1:6 buffer with a single Enable control (OEA). Data polarity is inverting
for both directions.
Truth Tables
Inputs
Outputs
OBn
TTLIN
OEB
H
L
L
L
L
H
X
H
High Z
Inputs
Outputs
OAn
GTLPIN
OEA
H
L
L
L
L
H
X
H
High Z
Logic Diagram
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2
Supply Voltage (VCC)
−0.5V to +4.6V
DC Input Voltage (VI)
−0.5V to +4.6V
Recommended Operating
Conditions (Note 3)
3.15V to 3.45V
Supply Voltage VCC
DC Output Voltage (VO)
Bus Termination Voltage (VTT)
Outputs 3-STATE
−0.5V to +4.6V
GTLP
Outputs Active (Note 2)
−0.5V to +4.6V
GTL
1.14V to 1.26V
VREF
0.98V to 1.02V
DC Output Sink Current into
48 mA
OA Port IOL
Input Voltage (VI) on INA-Port
DC Output Source Current
and Control Pins
from OA Port IOH
0.0V to 3.45V
−48 mA
HIGH Level Output Current (IOH)
100 mA
LOW Level Output Current (IOL)
DC Output Sink Current into
−24 mA
OA Port
OB Port in the LOW State IOL
DC Input Diode Current (IIK)
+24 mA
OA Port
VI < 0V
−50 mA
+50 mA
OB Port
DC Output Diode Current (IOK)
−40°C to +85°C
Operating Temperature (TA)
VO < 0V
−50 mA
VO > VCC
+50 mA
Note 1: Absolute Maximum continuous ratings are those values beyond
which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability.
Functional operation under absolute maximum rated conditions is not
implied.
> 2000V
ESD Rating
Storage Temperature (TSTG)
1.47V to 1.53V
−65°C to +150°C
Note 2: Io Absolute Maximum Rating must be observed.
Note 3: Unused inputs must be held HIGH or LOW.
DC Electrical Characteristics
Over Recommended Operating Free-Air Temperature Range, VREF = 1.0V (unless otherwise noted).
Symbol
VIH
VIL
Test Conditions
Min
Typ
VREF +0.05
GTLPIN
Max
(Note 4)
Others
2.0
GTLPIN
0.0
VTT
Units
V
V
Others
VREF −0.05
V
0.8
V
VREF (Note 5) GTLP
1.0
V
VTT (Note 5)
1.5
V
GTLP
VIK
VOH
VOL
VOL
II
OAn Port
OAn Port
OBn Port
TTLIN/
VCC = 3.15V
II = −18 mA
VCC = 3.15V
IOH = −100 µA
VCC−0.2
IOH = −18 mA
2.4
IOH = −24 mA
2.2
VCC = 3.15V
VCC = 3.15V
VCC = 3.45V
Control Pins
GTLPIN
VCC = 3.45V
−1.2
V
V
IOL = 100 µA
0.2
IOL = 18 mA
0.4
IOL = 24 mA
0.5
IOL = 100 µA
0.2
IOL = 40 mA
0.4
IOL = 50 mA
0.55
VI = 3.45V
5
VI = 0V
−5
VI = VTT
5
VI = 0
−5
V
V
µA
µA
TTLIN
VCC = 0
VI or VO = 0V to 3.45V
30
µA
GTLPIN
VCC = 0
VI or VO = 0V to VTT
30
µA
IPU/PD
OAn or OBn Ports
VCC = 0 to 1.5V
OE = Don’t Care
30
µA
IOZH
OAn-Port
VCC = 3.45V
VO =3.45V
5
VO = 1.5V
5
IOFF
OBn-Port
IOZL
OAn-Port
VCC = 3.45V
VO = 0
ICC
OAn or
VCC = 3.45V
Outputs HIGH
VI = VCC or GND
Outputs Disabled
OBn Ports
Outputs LOW
3
−5
5.5
µA
µA
10
5
10
5.5
10
mA
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GTLP6C816A
Absolute Maximum Ratings(Note 1)
GTLP6C816A
DC Electrical Characteristics
Symbol
(Continued)
Min
Test Conditions
VCC = 3.45V
Typ
Max
(Note 4)
∆ICC
TTLIN
CI
Control Pins/GTLPIN/TTLIN
VI = VCC−0.6
VI = VCC or 0
4.5
CO
OAn Port
VI = VCC or 0
6.0
OBn Port
VI = VCC or 0
8.0
2
Units
mA
pF
Note 4: All typical values are at VCC = 3.3V and TA = 25°C.
Note 5: GTLP VREF and VTT are specified to 2% tolerance since signal integrity and noise margin can be significantly degraded if these supplies are noisy.
In addition, VTT and RTERM can be adjusted to accommodate backplane impedances other than 50Ω, within the boundaries of not exceeding the DC Absolute IOL ratings. Similarly VREF can be adjusted to compensate for changes in V TT.
AC Electrical Characteristics
Over recommended range of supply voltage and operating free air temperature. VREF = 1.0V (unless otherwise noted).
CL = 30 pF for OBn-Port and CL = 50 pF for OAn-Port.
From
To
(Input)
(Output)
Min
Typ
Max
Symbol
fTOGGLE
tPLH
Units
(Note 6)
TTLIN
OBn
175
GTLPIN
OAn
175
TTLIN
OBn
1.3
2.3
4.0
0.9
2.6
4.3
1.5
2.6
4.1
1.2
2.5
4.1
ns
tPHL
tPLH
MHz
OEB
OBn
ns
tPHL
tRISE
Transition Time, OB Outputs (20% to 80%)
1.3
tFALL
Transition Time, OB outputs (20% to 80%)
1.3
tRISE
Transition Time, OA outputs (10% to 90%)
1.2
tFALL
Transition Time, OA outputs (10% to 90%)
2.0
tPZH, tPZL
OEA
OAn
GTLPIN
OAn
0.5
2.9
4.8
0.5
2.4
4.4
1.9
3.6
5.7
2.1
3.5
5.3
ns
tPHL
Note 6: All typical values are at VCC = 3.3 V and TA = 25°C.
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ns
ns
tPLZ, tPHZ
tPLH
ns
4
Over recommended ranges of supply voltage and operating free-air temperature VREF = 1.0V (unless otherwise noted).
CL = 30 pF for B Port and CL = 50 pF for A Port
From
To
(Input)
(Output)
(Note 7)
tOSLH (Note 8)
A
B
0.1
0.2
tOSHL (Note 8)
A
B
0.1
0.6
0.3
Symbol
Min
Typ
Max
Units
ns
tPS (Note 9)
A
B
tPV(HL) (Note 10)(Note 11)
A
B
1.0
ns
1.3
ns
tOSLH (Note 8)
B
A
0.1
0.7
tOSHL (Note 8)
B
A
0.1
0.4
tOST (Note 8)
B
A
0.2
1.1
ns
tPS (Note 9)
B
A
0.1
1.0
ns
tPV (Note 10)
B
A
2.4
ns
ns
Note 7: All typical values are at VCC = 3.3 V and TA = 25°C.
Note 8: tOSHL/tOSLH and tOST – Output-to-Output skew is defined as the absolute value of the difference between the actual propagation delay for all outputs
within the same packaged device. The specifications are given for specific worst case VCC and temperature and apply to any outputs switching in the same
direction dither HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH) or in opposite directions both HL and LH (tOST). This parameter is guaranteed by design and
statistical process distribution. Actual skew values between the GTLP outputs could vary on the backplane due to the loading and impedance seen by the
device.
Note 9: tPS – Pin or Transition skew is defined as the difference between the LOW-to-HIGH transition and the HIGH-to-LOW transition on the same pin. The
parameter is measured across all the outputs of the same chip is specified for a specific worst case VCC and temperature. This parameter is guaranteed by
design and statistical process distribution. Actual skew values between the GTLP outputs could vary on the backplane due to the loading and impedance
seen by the device.
Note 10: tPV – Part-to-Part skew is defined as the absolute value of the difference between the actual propagation delay for all outputs from device-to-device.
The parameter is specified for a specific worst case VCC and temperature. This parameter is guaranteed by design and statistical process distribution. Actual
skew values between the GTLP output could vary on the backplane due to the loading and impedance seen by the device.
Note 11: Due to the open drain structure on GTLP outputs tOST and tPV(LH) in the A-to-B direction are not specified. Skew on these paths is dependent on the
VTT and RT values on the backplane.
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GTLP6C816A
Extended Electrical Characteristics
GTLP6C816A
Test Circuit and Timing Waveforms
Test Circuit for A Outputs
Test Circuit for B Outputs
Note A: CL includes probes and jig capacitance.
Note A: C L includes probes and jig capacitance.
Note B: For B Port C L = 30 pF is used for worst case.
Voltage Waveform - Propagation Delay Times
Voltage Waveform - Enable and Disable Times
Output Waveform 1 is for an output with internal conditions such that the
output is LOW except when disabled by the control output
Output Waveforms 2 is for an output with internal conditions such that the
output is HIGH except when disabled by the control output
Input and Measure Conditions
A or LVTTL
Pins
B or GTLP
Pins
VinHIGH
3.0
1.5
VinLOW
0.0
0.0
VM
1.5
1.0
VX
VOL + 0.3V
N/A
VY
VOH + 0.3V
N/A
All input pulses have the following characteristics: Frequency = 10MHz, tRISE = tFALL = 2 ns, ZO = 50Ω.
The outputs are measured one at a time with one transition per measurement.
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GTLP6C816A GTLP/LVTTL 1:6 Clock Driver
Physical Dimensions inches (millimeters) unless otherwise noted
24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC24
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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