ETC PI74LVTCH244

PI74LVTCH244
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3.3V 8-Bit Buffers/Line Drivers
with 3-State Outputs
Product Features
Product Description
• Advanced low power CMOS design for 2.7V to 3.6V
Vcc operation
Pericom Semiconductor’s PI74LVTC series of logic circuits are
produced using the Company’s advanced CMOS technology,
achieving industry leading speed.
• Supports 5V input/output tolerance in mixed signal mode
operation
The PI74LVTCH244 is a non-inverting 8-bit buffer and line driver
designed for low-voltage 2.7V to 3.6V VCC operation, with the
capability of interfacing to the 5V system environment. With its
balanced drive characteristics, this high-speed, low power device
provides low ground bounce and transmission line impedance
matching. This makes it ideal for driving on board buses and
transmission lines. The device can be used as two 4-bit buffers with
separate output enable (OE) inputs.
• Function compatible with LVT family of products
• Balanced ±24mA output drive
• Typical VOLP (Output Ground Bounce) <0.8V at VCC=3.3V,
TA=25°C
• Ioff and Power Up/Down 3-State support live insertion
• Latch-up performance exceeds 200mA Per JESD78
• Bus Hold on data inputs eliminates the need for external
pull-up/down resistors
The PI74LVTCH244 has "Bus Hold" which retains the data input's
last valid logic state whenever the data input goes to high-impedance, preventing "floating" inputs and eliminating the need for pulup/down resistors.
• ESD protection exceeds JESD 22
- 2000V Human-Body Model (A114-B)
- 200V Machine Model (A115-A)
• Packages(Pb-free Available):
- 20-pin 209-mil wide plastic SSOP (H20)
- 20-pin 173-mil wide plastic TSSOP (L20)
- 20-pin 300-mil wide plastic SOIC (S20)
When Vcc is between 0 to 1.5V during power up or power down, the
outputs of the device are in the high-impedance state.
To ensure the high-impedance state above 1.5V, OE should be tied
to Vcc through a pullup resistor; the minimum value of the resistor
is determined by the current sinking capability of the driver.
The device fully supports live-insertion with its Ioff and power-up/
down 3-state. The Ioff circuitry disables the outputs when the
power is off, preventing the backflow of damaging current through
the device. Power-up/down 3-state places the outputs in the
high-impedance state during power up or power down, preventing
driver conflict.
Logic Block Diagram
1OE
1A1
1A2
1A3
1A4
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
1
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
PS8692
07/01/03
PI74LVTCH244
8-Bit Buffers/Line Drivers
with 3-State Outputs
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Maximum Ratings
(Above which the useful life may be impaired.
For user guidelines, not tested.)
Product Pin Description
Supply voltage range, VCC .............................. –0.5V to +6.5V
Input voltage range, VI(1) ................................. –0.5V to +6.5V
Voltage range applied to any output in the
high-impedance or power-off state, VO(1) ........ –0.5V to +6.5V
Voltage range applied to any output in the
active state, VO(1), (2) .................................. –0.5V to VCC +0.5V
Input clamp current, IIK (VI <0) ..................................... –50mA
Output clamp current, IOK (VO <0) ............................... –50mA
Continous Output Current IO ....................................... ±50mA
Continous Current through each VCC or GND pin ............... ±100mA
Package thermal impedance, θJA(2): package H ............ 81°C/W
package L ............ 84°C/W
package S ............ 84°C/W
Storage Temperature range, Tstg ..................... –65°C to 150°C
Pin Name
De s cription
xOE
3- State Output Enable Inputs (Active LOW)
xAx
Inputs
xYx
3- State Outputs
GND
Ground
VC C
Power
Product Pin Configuration
Notes:
Stresses greater than those listed under MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
1. Input negative-voltage and output voltage ratings may be exceeded if the
input and output clamp current ratings are observed.
2. This value is limited to 6.5V maximum.
3. The package thermal impedance is calculated in accordance with
JESD 51.
1OE
1
20
VCC
1A1
2
19
2OE
2Y4
3
18
1Y1
1A2
4
17
2A4
2Y3
5
16
1Y2
1A3
6
15
2A3
2Y2
7
14
1Y3
1A4
8
13
2A2
2Y1
9
12
1Y4
GND
10
11
2A1
20-Pin
H, L, S
Truth Table(4)
Inputs
Outputs
xOE
xAx
xYx
L
H
H
L
L
L
H
X
Z
Notes:
4. H = High Signal Level
L = Low Signal Level
X = Don’t Care or Irrelevant
Z = High Impedance
2
PS8692
07/01/03
PI74LVTCH244
3.3V 8-Bit Buffers/Line Drivers
with 3-State Outputs
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Recommended Operating Conditions(5)
VCC
Supply Voltage
M in.
M a x.
Operating
2.7
3.6
2.0
VIH
High- level Input Voltage
VCC = 2.7V to 3.6V
VIL
Low- level Input Voltage
VCC = 2.7V to 3.6V
VI
Input Voltage
VO
Output Voltage
IOH High- level output current
IOL Low- level output current
0.8
0
5.5
High or Low State
0
VCC
3- State
0
5.5
VCC = 2.7V
–12
VCC = 3.0V to 3.6V
– 24
VCC = 2.7V
12
VCC = 3.0V to 3.6V
24
∆t/∆V Input transition rise or fall rate
10
∆t/∆VCC Power- up ramp rate
150
TA
– 40
Operating free- air temperature
Units
V
mA
ns/V
µs/V
85
°C
Notes: 5.All unused inputs must be held at VCC or GND to ensure proper device operation.
3
PS8692
07/01/03
PI74LVTCH244
8-Bit Buffers/Line Drivers
with 3-State Outputs
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DC Electrical Characteristics (Over the Operating Range, TA = –40°C +85°C)
Parame te rs
VIK
VOH
De s cription
Clamp Diode Voltage
Output High Voltage
Te s t Conditions
VCC = 2.7V
II = –18mA
VCC = 2.7V to 3.6V
IOH = –100µA
VCC
–0.2V
VCC = 2.7V
IOH = –12mA
2.2
IOH = –12mA
2.4
IOH = –24mA
2.2
VCC = 3V
VOL
Output Low Voltage
II
Input Leakage
Current
Data
Inputs
M a x.
V
IOL = 100µA
0 .2
VCC = 2.7V
IOL = 12mA
0.4
IOL = 12mA
0.4
IOL = 24mA
0.55
VCC = 0V to 3.6V
Units
–1.2V
VCC = 2.7V to 3.6V
VCC = 3V
Control
Inputs
M in.
VI = 0V to5.5V
±5
VI = 5.5V
VCC = 3.6V
VI = VCC
±5
VI = GND
II(HOLD)
Data Input Hold Current
VCC = 3V
VCC =
3.6V(6)
VI = 0.8V
75
VI = 2V
–7 5
VI = 0 to 3.6V
± 500
IOFF
Power Off Output
Leakage Current
VCC = 0V
VI or VO = 0V to 5.5V
±5
IOZ
3- State Output Leakage
Current
VCC = 2.7V to 3.6V
VO = 0V to 5.5V
±5
IOZPU
Power- Up 3- State
Current
VCC = 0V to 1.5V
VO = 0.5V to 5.5V,
OE = don't care
±5
IOZPD
Power- Down 3- State
Current
VCC = 1.5V to 0V
VO = 0.5V to 5.5V,
OE = don't care
±5
Quiescent Power Supply
Current
VCC = 2.7V to 3.6V
Increase in ICC
VCC = 3V to 3.6V
ICC
∆ICC
VI = VCC or GND
3.6V ≤ VI ≤ 5.5V
IO = 0
One input at VCC - 0.6V(7)
Other inputs at VCC or GND
µA
100
200
Notes: 6. This is the maximum bus-hold dynamic current. It is the minimum overdrive current required to switch the input from one
state to another.
7. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
4
PS8692
07/01/03
PI74LVTCH244
3.3V 8-Bit Buffers/Line Drivers
with 3-State Outputs
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Capacitance
Parame te rs
De s cription
Typ.(8)
Te s t Conditions
CIN
Input Capacitance
VCC = 3.3V, VI = VCC or GND
3.0
COUT
Output Capacitance
VCC = 3.3V, VO = VCC or GND
6.2
Power Dissipation Capacitance (9)
VCC = 3.3V, VI = 0V or VCC, f =10 MHz
28
C PD
Units
pF
Notes:
8. All typical values are measured at VCC = 3.3V, TA = 25°C.
9. CPD is defined as the value of the internal equivalent capacitance withic is derived from dynamic operating current consumption (ICCD) at no
output loading and operating at 50% duty cycle, CPD is related to ICCD dynamic operating current by the expression: ICCD =
(CPD)(VCC)(fIN)+(ICCstatic).
Switching Characteristics Over Operating Range
Parame te rs
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
tSK(O)
De s cription
From
(Input)
To
(Output)
Propagation Delay
A
Y
Output Enable Time
OE
Y
Output Disable Time
OE
VCC = 3.3V ±0.3V
VCC = 2.7V
CL = 50pF, RL = 500Ohm
CL = 50pF, RL = 500Ohm
Y
Output to Output
Skew(10)
M in.
M a x.
M in.
M a x.
1.0
5.2
1. 0
5.8
1.0
5.2
1. 0
5.8
1.0
5.8
1.0
6.8
1.0
5.8
1. 0
6.8
1.0
4.6
1. 0
4.8
1.0
4.6
1. 0
4.8
Units
ns
0.5
Notes:
10.Skew between any two outputs, switching in the same direction.
5
PS8692
07/01/03
PI74LVTCH244
8-Bit Buffers/Line Drivers
with 3-State Outputs
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PARAMETER MEASUREMENT INFORMATION
VCC = 2.7V and 3.3V ±0.3V
6V
S1
500ohm
From Output
Under Test
CL = 50pF
Open
GND
500ohm
(See Note A)
Te s t
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
Load Circuit
tW
2.7V
1.5V
Input
1.5V
0V
Voltage Waveforms
Pulse Duration
Output
Control
(Low Level
Enabling)
2.7V
Input
1.5V
0V
tPHL
VOH
Output
1.5V
1.5V
Output
Waveform 2
S1 at GND
(see Note B)
1.5V
VOL
Voltage Waveforms
Propagation Delay Times
1.5V
tPZL
Output
Waveform 1
S1 at 6V
(see Note B) t
PZH
1.5V
tPLH
2.7V
0V
tPLZ
3V
1.5V
VOL +0.3V
VOL
tPHZ
1.5V
VOH –0.3V
VOH
0V
Voltage Waveforms
Enable and Disable Times
Figure 1. Load Circuit and Voltage Waveforms
Notes:
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input impulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50ohm, tR ≤ 2.5ns, tF ≤ 2.5ns.
D. The outputs are measured one at a time with one transition per measurement.
6
PS8692
07/01/03
PI74LVTCH244
3.3V 8-Bit Buffers/Line Drivers
with 3-State Outputs
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Packaging Mechanical: 20-pin SSOP (H)
20
.197
.220
5.00
5.60
1
.004
.009
.272
.295
6.90
7.50
0.55 .022
0.95 .037
.078
2.00 Max
.291
.322
7.40
8.20
SEATING
PLANE
.002
Min
0.050
.0098
Max.
0.25
.0256
BSC
0.65
0.09
0.25
X.XX DENOTES DIMENSIONS
X.XX IN MILLIMETERS
Packaging Mechanical: 20-pin TSSOP (L)
20
.169
.177
4.3
4.5
1
.252
.260
6.4
6.6
.0256
BSC
0.65
.004 0.09
.008 0.20
.047
1.20
Max
.007
.012
0.19
0.30
0.45
0.75
SEATING
PLANE
.018
.030
.238
.269
6.1
6.7
.002 0.05
.006 0.15
X.XX
X.XX
7
DENOTES CONTROLLING
DIMENSIONS IN MILLIMETERS
PS8692
07/01/03
PI74LVTCH244
8-Bit Buffers/Line Drivers
with 3-State Outputs
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20-pin SOIC (S) Package
20
.2914
.2992
7.40
7.60
.010
.029
0.254
x 45˚
0.737
1
.496 12.60
.511 12.99
.020 0.508
REF
.030 0.762
.013
.020
0.33
0.51
0.23
0.32
0.41 .016
1.27 .050
.0926
.1043
2.35
2.65
SEATING
PLANE
.050
BSC
1.27
.0091
.0125
0-8˚
.0040
.0118
.394
.419
10.00
10.65
0.10
0.30
X.XX DENOTES CONTROLLING
X.XX DIMENSIONS IN MILLIMETERS
Ordering Information
Orde ring Data
De s cription
PI74LVTCH244H
20- pin, 209- mil wide plastic SSOP
PI74LVTCH244L
20- pin, 173- mil wide plastic TSSOP
PI74LVTCH244S
20- pin, 300- mil wide plastic SOIC
Notes:
1. Thermal characteristics can be found on the company web site at http://www.pericom.com/packaging/mechanicals.php
Pericom Semiconductor Corporation
2380 Bering Drive • San Jose, CA 95131 • 1-800-435-2336 • Fax (408) 435-1100 • http://www.pericom.com
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PS8692
07/01/03