ETC STD616AT4

STD616A

HIGH VOLTAGE NPN POWER TRANSISTOR
■
■
■
■
■
■
REVERSE PINS OUT Vs STANDARD IPAK
(TO-251) / DPAK (TO-252) PACKAGES
HIGH VOLTAGE CAPABILITY
HIGH DC CURRENT GAIN
THROUGH-HOLE IPAK (TO-251) POWER
PACKAGE IN TUBE (SUFFIX ”-1”)
SURFACE-MOUNTING DPAK (TO-252)
POWER PACKAGE IN TAPE & REEL
(SUFFIX ”T4”)
MINIMUM LOT-TO-LOT SPREAD FOR
RELIABLE OPERATION
APPLICATIONS:
■
SWITCH MODE POWER SUPPLIES
DESCRIPTION
The STD616A is manufactured using High
Voltage Multi Epitaxial Planar technology for high
switching speeds and high voltage withstand
capability.
1
1
2
3
IPAK
TO-251
(Suffix ”-1”)
3
DPAK
TO-252
(Suffix ”T4”)
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
1000
V
Collector-Emitter Voltage (IB = 0)
450
V
Emitter-Base Voltage (IC = 0)
12
V
Collector Current
1.6
A
Collector Peak Current (tp < 5 ms)
2.4
A
Base Current
0.8
A
V CES
Collector-Emitter Voltage (V BE = 0)
V CEO
V EBO
IC
I CM
IB
I BM
Base Peak Current (tp < 5 ms)
P t ot
Total Dissipation at Tc = 25 C
T stg
St orage Temperature
Tj
o
Max. Operating Junction Temperature
September 2001
1.2
A
20
W
-65 to 150
o
C
150
o
C
1/6
STD616A
THERMAL DATA
R t hj-ca se
Thermal Resistance Junction-case
Max
o
6.25
C/W
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
Symb ol
I CES
Parameter
Collector Cut-off
Current (V BE = 0 V)
V CEO(sus )∗ Collector-Emitter
Sustaining Voltage
(I B = 0)
V EBO
Test Cond ition s
V CE = 1000 V
V CE = 1000 V
I C = 100 mA
Min.
o
T j = 125 C
L = 25 mH
Typ .
Max.
Un it
50
0.5
µA
mA
450
V
12
V
Emitter-Base Voltage
(I C = 0)
I E = 1 mA
V CE(sat )∗
Collector-Emitter
Saturation Voltage
I C = 250 mA
I C = 0.8 A
I B = 65 mA
I B = 250 mA
0.3
0.5
V
V
V BE(s at)∗
Base-Emitt er
Saturation Voltage
I C = 250 mA
I C = 0.8 A
I B = 65 mA
I B = 250 mA
1
1.2
V
V
DC Current Gain
IC
IC
IC
IC
t on
ts
tf
RESISTIVE LO AD
Turn O n Time
Storage Time
Fall Time
V CC = 250 V
I B1 = 65 mA
I C = 250 mA
IB2 = -130 mA
0.2
5
0.65
µs
µs
µs
t on
ts
tf
RESISTIVE LO AD
Turn O n Time
Storage Time
Fall Time
V CC = 250 V
I B1 = 160 mA
I C = 0.8 A
I B2 = -0.4 A
1
2.5
0.35
µs
µs
µs
ts
tf
INDUCTIVE LO AD
Storage Time
Fall Time
V c l = 300 V
I B1 = 65 mA
L = 200 µH
IC = 250 mA
IB2 = -130 mA
5
0.5
µs
µs
ts
tf
INDUCTIVE LO AD
Storage Time
Fall Time
V c l = 300 V
I B1 = 160 mA
L = 200 µH
IC = 0.8 A
I B2 = -0.4 A
2.5
0.25
µs
µs
h F E∗
∗ Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
2/6
=
=
=
=
200 µA
300 mA
480 mA
1.6 A
V CE = 5 V
V CE = 5 V
V CE = 5 V
V CE = 5 V
17
25
12
4
STD616A
Safe Operating Area
Derating Curve
Reverse Biased SOA
3/6
STD616A
TO-251 (IPAK) MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
2.20
2.40
0.087
0.094
A1
0.90
1.10
0.035
0.043
A3
0.70
1.30
0.028
0.051
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.213
B3
0.85
B5
B6
C
0.033
0.30
0.012
0.95
0.037
0.45
0.60
0.018
0.024
C2
0.48
0.60
0.019
0.024
D
6.00
6.20
0.237
0.244
E
6.40
6.60
0.252
0.260
0.181
G
4.40
4.60
0.173
H
15.90
16.30
0.626
0.642
L
9.00
9.40
0.354
0.370
L1
0.80
1.20
0.031
L2
0.80
V1
10o
1.00
0.047
0.031
0.039
10o
P032NR/E
4/6
STD616A
TO-252 (DPAK) MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
2.20
2.40
0.087
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.213
C
0.45
0.60
0.018
0.024
C2
0.48
0.60
0.019
0.024
D
6.00
6.20
0.236
0.244
E
6.40
6.60
0.252
0.260
G
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.398
L2
L4
V2
0.8
0.60
0
o
0.031
1.00
o
8
0.024
0
o
0.039
0o
P032P_B
5/6
STD616A
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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