Bussmann® SMT Chip Fuse 3216FF Subminiature Surface Mount Fuses R R Dimensional Data mm (inches) 3.20 ± 0.2 (0.126 ± 0.008) 1A 0.50 ± 0.25 (0.020 ± 0.010) Catalog Symbol: 3216FF Voltage Rating: 32 Volt AC, 63 Volt DC (250mA-3A) 32 Volt AC, 32 Volt DC (4-6.5A) Interrupting Rating: 50 Amp AC/DC Physical Size: EIA SOCM-3216AC (Equivalent to 1206) 3.2 ≈ 1.6 ≈ 0.90mm 0.126 ≈ 0.063 ≈ 0.035 in. Agency Approvals: UL Recognized, Std. 248-14 All Ratings - File E19180, Guide JDYX2 CSA Certified: 1.5-3A - File 53787, Class 1422-01 CSA Component Acceptance 250mA,1A, 4-6.5A - File 53787, Class 1422-30 0.90 + 0.20, -0.15 (0.035 + 0.008, -0.006) EIA-RS481 (equivalent to IEC 286, Part 3). • Fuses are orientated in embossed pockets with ceramic side facing up to facilitate proper mounting (see “Electrical Characteristics”, General Note 4.) 3216FF (See Table) Product Symbol Rated Current Package Code TR/ 3,000 pcs., on a 178mm reel, 8mm tape width SP/ 50 pcs. on tape in a plastic box TR1/ 15,000 pcs., on a 330mm reel, 8mm tape width 1.60 ± 0.2 (0.063 ± 0.008) General Information: • Bussmann SMT Chip Fuses utilize metal film and ultrasonic wire bond technologies for superior fusing action and enhanced reliability. • The fuse element is bonded to a ceramic substrate and encapsulated with green-colored glass, providing excellent short-circuit performance and environmental integrity. • Substrate and coating thermal expansion coefficients are closely matched to that of FR-4 epoxy-glass circuit board for superior joint reliability. • The end terminations are over-plated with nickel and tinlead. Time-Current Characteristics • Fast acting fuse: Will carry 100% of rated current for a minimum of 4 hours, and will open within 5 seconds at 250% of rated current (250mA-3A). • The 4-6.5A fuses will open within 1 second at 350% of rated current. Packaging & Ordering Information: • Tape and Reel: Standard 8mm tape, in compliance with CE logo denotes compliance with European Union Low Voltage Directive (50-1000 VAC, 75-1500 VDC). Refer to BIF document #8002 or contact Bussmann Application Engineering at 636-527-1270 for more information. Electrical Characteristics Part Number Current Rating (Ampere) Mark Appearing On Part Typical Melting Integral @ 50A (A2 * sec) Typical Total Clearing Integral @ 50A (A2 * sec) (XX=Package Code) AC DC AC DC XX/3216FF-250mA .250 .25 .00016 .000084 .00017 .0001 XX/3216FF-375mA .375 White Dot .001 .0002 .0010 .0009 XX/3216FF-500mA .500 0.5 .0014 .0019 .0016 .0026 XX/3216FF-750mA .750 .75 .0033 .00095 .0033 .0042 XX/3216FF-1A 1 1 .012 .007 .014 .009 XX/3216FF-1.5A 1.5 1.5 .047 .029 .048 .034 XX/3216FF-2A 2 2 .116 .081 .136 .092 XX/3216FF-2.5A 2.5 2.5 .208 .171 .210 .198 XX/3216FF-3A 3 3 .426 .359 .507 .369 XX/3216FF-4A 4 4 .187 .164 .208 .168 XX/3216FF-4.5A 4.5 4.5 .546 .463 .550 .47 XX/3216FF-5A 5 5 .663 .619 .668 .623 XX/3216FF-6.5A 6.5 6.5 2.18 3.21 2.21 3.23 General Notes: 1. AC interrupting rating, melting integral and total clearing integral measured at 32V, unity power factor. 2. DC interrupting rating, melting integral and total clearing integral measured at 63V (250mA-3A) and 32V (4-6.5A), with a battery source. 3. Voltage drop measured at 23 ± 3°C ambient temperature with the device mounted on a suitable circuit board trace. 4. It is recommended that fuses be mounted with ceramic (white) side facing up. 5. Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended, with further derating required at elevated ambient temperatures. 6. Contact Bussmann if higher ampere ratings are needed. 9-7-99 E99039 Rev. A Typ. Resistance @ ≤10% Rated Current (Ohms) 4.50 1.80 1.15 .75 .168 .098 .063 .046 .037 .019 .014 .013 .0085 Typ. Voltage Drop @ Rated Current (Volts) 1.4 .73 .66 .63 .20 .18 .16 .14 .13 .11 .10 .09 .076 Form No. 3216FF Page 1 of 2 BIF Doc #3001 Bussmann® SMT Chip Fuse 3216FF Subminiature Surface Mount Fuses R R Construction Time-Current Characteristic Curve 1.5A 2A 2.5A 3A 250mA (Full Size Curves Available) 375mA 500mA 750mA 1A Construction: Metal Film Fusible Element (250mA - 6.5A) CURRENT RATING 10 1 1. 2. 3. 4. 2 3 4 8 5 6 7 Ceramic Substrate 5. Silver End Termination Glass Cover (Green) 6. Nickel Barrier (3.88 - 4.3 µm) Termination Pad 7. 90/10 Tin-lead Plating (7.6 - 12.7 µm) Metal Film Element 8. Marking Drawing is not to scale. 1 2.50 (0.10) 1.80 (0.07) 1.00 (0.04) TIME IN SECONDS Recommended Land Pattern - mm (inches) 4A 4.5A .1 5A .01 NOTE: Trace geometry may affect fuse performance (time-current characteristics ≤ 300% of rated current and voltage drop at rated current). D0 40 10 .1 .001 1 E CURRENT IN AMPERES A0 F W B0 P1 P2 Carrier Dimensions - mm W F E P2 P0 P1 A0 B0 D0 8.0 + 0.3 / -0.1 3.5 ± 0.05 1.75 ± 0.1 2.0 ± 0.05 4.0 ± 0.1 4.0 ± 0.1 1.73 ± 0.2 3.56 ± 0.2 1.5 + 0.1 / -0.0 9-7-99 E99039 Rev. A P0 Environmental Specifications Operating Temperature Range: -55 to +125°C, with proper derating. Thermal Shock: MIL-STD-202, Method 107, Test Condition B (-65 to 125°C). Vibration: MIL-STD-202, Method 204, Test Condition C (55 to 2000 HZ, 10G). Solderability: Withstands 60 seconds above 200°C, 260°C maximum. Moisture Resistance: MIL-STD-202, Method 106, 10 day cycle. Solder Leach Resistance & Terminal Adhesion: EIA-576. Form No. 3216FF Page 2 of 2 BIF Doc #3001