ETC 1PMT5920BT3/D

1PMT5920BT3 Series
3.2 Watt Plastic
Surface Mount
POWERMITE Package
This complete new line of 3.2 Watt Zener Diodes are offered in
highly efficient micro miniature, space saving surface mount with its
unique heat sink design. The POWERMITE package has the same
thermal performance as the SMA while being 50% smaller in
footprint area and delivering one of the lowest height profiles (1.1
mm) in the industry. Because of its small size, it is ideal for use in
cellular phones, portable devices, business machines and many other
industrial/consumer applications.
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PLASTIC SURFACE MOUNT
3.2 WATT ZENER DIODES
6.2 – 47 VOLTS
Specification Features:
•
•
•
•
•
•
•
•
•
•
•
Zener Breakdown Voltage: 6.2 – 47 Volts
DC Power Dissipation: 3.2 Watts with Tab 1 (Cathode) @ 75°C
Low Leakage < 5 µA
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Low Profile – Maximum Height of 1.1 mm
Integral Heat Sink/Locking Tabs
Full Metallic Bottom Eliminates Flux Entrapment
Small Footprint – Footprint Area of 8.45 mm2
Supplied in 12 mm Tape and Reel – 12,000 Units per Reel
POWERMITE is JEDEC Registered as DO–216AA
Cathode Indicated by Polarity Band
1
2
1: CATHODE
2: ANODE
1
2
POWERMITE
CASE 457
PLASTIC
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
FINISH: All external surfaces are corrosion resistant and leads are
MARKING DIAGRAM
readily solderable
MOUNTING POSITION: Any
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
1
CATHODE
xxB
D
2
ANODE
260°C for 10 Seconds
xxB
xx
D
= Specific Device Code
= 20 – 41
= (See Table Next Page)
= Date Code
ORDERING INFORMATION
Device
Package
Shipping
1PMT59xxBT3 POWERMITE 12,000/Tape & Reel
LEAD ORIENTATION IN TAPE:
Cathode (Short) Lead to Sprocket Holes
 Semiconductor Components Industries, LLC, 2001
May, 2001 – Rev. 3
1
Publication Order Number:
1PMT5920BT3/D
1PMT5920BT3 Series
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
°PD°
RθJA
500
4.0
248
°mW
mW/°C
°C/W
Thermal Resistance from Junction to Lead (Anode)
RθJanode
35
°C/W
Maximum DC Power Dissipation (Note 2.)
Thermal Resistance from Junction to Tab (Cathode)
°PD°
RθJcathode
3.2
23
W
°C/W
TJ, Tstg
–55 to +150
°C
DC Power Dissipation @ TA = 25°C (Note 1.)
Derate above 25°C
Thermal Resistance from Junction to Ambient
Operating and Storage Temperature Range
1. Mounted with recommended minimum pad size, PC board FR–4.
2. At Tab (Cathode) temperature, Ttab = 75°C
ELECTRICAL CHARACTERISTICS (TL = 25°C unless
otherwise noted, VF = 1.5 V Max. @ IF = 200 mAdc for all types)
Symbol
I
IF
Parameter
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
VZ VR
V
IR VF
IZT
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
Zener Voltage Regulator
ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.25 Volts @ 200 mA)
Zener Voltage (Note 3.)
VZ @ IZT (Volts)
IZT
IR @ VR
VR
ZZT @ IZT
(Note 4.)
ZZK @ IZK
(Note 4.)
IZK
Device
Device
Marking
Min
Nom
Max
(mA)
(A)
(V)
()
()
(mA)
1PMT5920BT3
20B
5.89
6.2
6.51
60.5
5.0
4.0
2.0
200
1.0
1PMT5921BT3
21B
6.46
6.8
7.14
55.1
5.0
5.2
2.5
200
1.0
1PMT5922BT3
22B
7.12
7.5
7.88
50
5.0
6.0
3.0
400
0.5
1PMT5923BT3
23B
7.79
8.2
8.61
45.7
5.0
6.5
3.5
400
0.5
1PMT5924BT3
24B
8.64
9.1
9.56
41.2
5.0
7.0
4.0
500
0.5
1PMT5925BT3
25B
9.5
10
10.5
37.5
5.0
8.0
4.5
500
0.25
1PMT5927BT3
27B
11.4
12
12.6
31.2
1.0
9.1
6.5
550
0.25
1PMT5929BT3
29B
14.25
15
15.75
25
1.0
11.4
9.0
600
0.25
1PMT5930BT3
30B
15.2
16
16.8
23.4
1.0
12.2
10
600
0.25
1PMT5931BT3
31B
17.1
18
18.9
20.8
1.0
13.7
12
650
0.25
1PMT5933BT3
33B
20.9
22
23.1
17
1.0
16.7
17.5
650
0.25
1PMT5934BT3
34B
22.8
24
25.2
15.6
1.0
18.2
19
700
0.25
1PMT5935BT3
35B
25.65
27
28.35
13.9
1.0
20.6
23
700
0.25
1PMT5936BT3
36B
28.5
30
31.5
12.5
1.0
22.8
28
750
0.25
1PMT5939BT3
39B
37.05
39
40.95
9.6
1.0
29.7
45
900
0.25
1PMT5941BT3
41B
44.65
47
49.35
8.0
1.0
35.8
67
1000
0.25
3. Zener voltage is measured with the device junction in thermal equilibrium with an ambient temperature of 25°C.
4. Zener Impedance Derivation ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The
specified limits are for IZ(ac) = 0.1 IZ(dc) with the ac frequency = 60 Hz.
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2
1PMT5920BT3 Series
3.5
100
3
IZ, ZENER CURRENT (mA)
P D , MAXIMUM POWER DISSIPATION (W)
TYPICAL CHARACTERISTICS
2.5
2
TL
1.5
1
10
1
0.5
0
0.1
25
50
75
100
125
150
175
5
7
8
9
10
VZ, ZENER VOLTAGE (VOLTS)
6
T, TEMPERATURE (°C)
Figure 2. VZ to 10 Volts
IZ , ZENER CURRENT (mA)
100
50
30
20
10
5
3
2
1
0.5
0.3
0.2
0.1
0
10
20
30
40
50
60
70
80
VZ, ZENER VOLTAGE (VOLTS)
90
100
VZ, TEMPERATURE COEFFICIENT (mV/°C)
Figure 1. Steady State Power Derating
10
8
VZ @ IZT
6
4
2
0
–2
–4
2
4
200
ZZ , DYNAMIC IMPEDANCE (OHMS)
VZ, TEMPERATURE COEFFICIENT (mV/°C)
6
8
10
VZ, ZENER VOLTAGE (VOLTS)
12
Figure 4. Zener Voltage – To 12 Volts
Figure 3. VZ = 12 thru 47 Volts
VZ @ IZT
100
70
50
30
20
10
10
11
20
30
50
70
100
VZ, ZENER VOLTAGE (VOLTS)
200
IZ(dc) = 1mA
100
70
50
30
20
10
7
5
10 mA
20 mA
3
2
5
200
Figure 5. Zener Voltage – 14 To 47 Volts
7
iZ(rms) = 0.1 IZ(dc)
10
20
30
50
VZ, ZENER VOLTAGE (VOLTS)
Figure 6. Effect of Zener Voltage
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3
70
100
Z Z , DYNAMIC IMPEDANCE (OHMS)
1PMT5920BT3 Series
1k
TJ = 25°C
iZ(rms) = 0.1 IZ(dc)
500
200
100
50
20
10
5
22 V
2
12 V
1
0.5 1
6.8 V
2
5
10
20
50 100 200
500
IZ, ZENER TEST CURRENT (mA)
Figure 7. Effect of Zener Current
C, CAPACITANCE (pF)
10,000
1000
MEASURED @ 0 V BIAS
MEASURED @ 50% VR
100
10
1
10
VZ, REVERSE ZENER VOLTAGE (VOLTS)
Figure 8. Capacitance versus Reverse
Zener Voltage
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4
100
1PMT5920BT3 Series
TYPICAL SOLDER HEATING PROFILE
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 9 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems, but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
STEP 2 STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
STEP 4
HEATING
ZONES 3 & 6
SOAK"
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
STEP 6
VENT
205° TO 219°C
PEAK AT
SOLDER JOINT
170°C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
150°C
150°C
140°C
100°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 9. Typical Solder Heating Profile
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STEP 7
COOLING
1PMT5920BT3 Series
INFORMATION FOR USING THE POWERMITE SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.025
0.635
0.105
2.67
0.030
0.762
0.100
2.54
0.050
1.27
inches
mm
POWERMITE
POWERMITE POWER DISSIPATION
SOLDERING PRECAUTIONS
The power dissipation of the Powermite is a function of
the drain pad size. This can vary from the minimum pad
size for soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RθJA, the thermal resistance from
the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data
sheet for the Powermite package, PD can be calculated as
follows:
PD =
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling.
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 504 milliwatts.
PD = 150°C – 25°C = 504 milliwatts
248°C/W
The 248°C/W for the Powermite package assumes the
use of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 504
milliwatts. There are other alternatives to achieving higher
power dissipation from the Powermite package. Another
alternative would be to use a ceramic substrate or an
aluminum core board such as Thermal Clad. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
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6
1PMT5920BT3 Series
OUTLINE DIMENSIONS
1PMT5920BT3 Series – Surface Mounted
POWERMITE
CASE 457–04
ISSUE D
F
0.08 (0.003)
C
–A–
J
M
T B
S
TERM. 1
–B–
K
TERM. 2
R
L
J
D
H
–T–
0.08 (0.003)
M
T B
S
C
S
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7
S
C
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
DIM
A
B
C
D
F
H
J
K
L
R
S
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
1.75
2.05
0.069
0.081
1.75
2.18
0.069
0.086
0.85
1.15
0.033
0.045
0.40
0.69
0.016
0.027
0.70
1.00
0.028
0.039
-0.05
+0.10 -0.002 +0.004
0.10
0.25
0.004
0.010
3.60
3.90
0.142
0.154
0.50
0.80
0.020
0.031
1.20
1.50
0.047
0.059
0.50 REF
0.019 REF
1PMT5920BT3 Series
POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.
Thermal Clad is a trademark of the Bergquist Corporation.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
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Toll Free from Hong Kong & Singapore:
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Phone: 81–3–5740–2700
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EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781
*Available from Germany, France, Italy, UK, Ireland
For additional information, please contact your local
Sales Representative.
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1PMT5920BT3/D