Power Transistors 2SB1553 Silicon PNP epitaxial planar type Unit: mm 18.0±0.5 Solder Dip Symbol Rating Unit Collector to base voltage VCBO −60 V Collector to emitter voltage VCEO −60 V Emitter to base voltage VEBO −6 V Peak collector current ICP −6 A Collector current IC −3 A Base current IB −1 A PC 15 W Collector power dissipation TC = 25°C Ta = 25°C 1.2±0.1 C 1.0 1.48±0.2 ■ Absolute Maximum Ratings TC = 25°C Parameter 2.5±0.1 • High forward current transfer ratio hFE • Satisfactory linearity of forward current transfer ratio hFE • Allowing automatic insertion with radial taping 5.0±0.1 1.0±0.2 13.0±0.2 ■ Features 10.0±0.2 90˚ 4.2±0.2 For power amplification 2.25±0.2 0.65±0.1 0.65±0.1 0.35±0.1 1.05±0.1 0.55±0.1 0.55±0.1 2.5±0.2 2.5±0.2 1 2 3 1 : Base 2 : Collector 3 : Emitter MT-4 (MT4 Type Package) 2 Junction temperature Tj 150 °C Storage temperature Tstg −55 to +150 °C ■ Electrical Characteristics TC = 25°C Parameter Symbol Collector cutoff current Max Unit ICBO VCB = −60 V, IE = 0 Conditions Min Typ −100 µA ICEO VCE = −40 V, IB = 0 −100 µA Emitter cutoff current IEBO VEB = −6 V, IC = 0 −100 µA Collector to emitter voltage VCEO Forward current transfer ratio * Collector to emitter saturation voltage Transition frequency IC = −25 mA, IB = 0 −60 hFE VCE = −4 V, IC = − 0.5 A 300 VCE(sat) IC = −2 A, IB = − 0.05 A fT VCE = −12 V, IC = − 0.2 A, f = 10 MHz V 700 −1 30 V MHz Note) *: Rank classification Rank Q P hFE 300 to 500 400 to 700 1 2SB1553 Power Transistors PC T a IC VCE –6 TC=25˚C (1) TC=Ta (2) Without heat sink (PC=2.0W) (1) 5 –5 IB=–100mA –80mA –60mA –4 –40mA –3 –20mA –2 –10mA –5mA –1 40 –3 –2 25˚C TC=125˚C –25˚C –2mA 0 20 –4 –1 (2) 60 80 100 120 140 160 0 0 Ambient temperature Ta (˚C) –2 –4 –6 –8 –10 –12 – 0.8 Transition frequency fT (MHz) Forward current transfer ratio hFE TC=100˚C –1 –25˚C – 0.1 – 0.03 –1 –3 25˚C 1000 25˚C –3 – 0.3 TC=100˚C –25˚C 300 100 30 10 – 0.01 – 0.03 – 0.1 – 0.3 –10 Collector current IC (A) Cob VCB –1 –3 300 100 30 10 3 1 – 0.01 – 0.03 – 0.1 – 0.3 –10 ton, tstg, tf IC 30 10 3 –3 Collector current IC (A) Switching time ton,tstg,tf (µs) 100 Pulsed tw=1ms Duty cycle=1% IC/IB=40 (–IB1=IB2) VCC=–50V TC=25˚C 10 –3 –10 Area of safe operation (ASO) –10 30 –1 Collector current IC (A) 100 IE=0 f=1MHz TC=25˚C –2.0 VCE=–12V f=10MHz TC=25˚C Collector current IC (A) 1000 –1.6 fT I C 3000 –10 –1.2 1000 VCE=–4V IC/IB=40 –30 300 – 0.4 Base to emitter voltage VBE (V) hFE IC 10000 – 0.01 – 0.01 – 0.03 – 0.1 – 0.3 0 Collector to emitter voltage VCE (V) VCE(sat) IC –100 Collector to emitter saturation voltage VCE(sat) (V) Collector current IC (A) 10 0 Collector output capacitance Cob (pF) VCE=–4V –5 15 0 3 tf 1 ICP Non repetitive pulse TC=25˚C t=10ms IC 1ms DC –1 – 0.3 ton tstg 0.3 – 0.1 0.1 – 0.03 0.03 1 –1 0.01 –3 –10 –30 –100 Collector to base voltage VCB (V) 2 IC VBE –6 Collector current IC (A) Collector power dissipation PC (W) 20 0 –2 –4 –6 Collector current IC (A) –8 – 0.01 0.1 0.3 1 3 10 30 100 Collector to emitter voltage VCE (V) Power Transistors 2SB1553 Rth(t) t Thermal resistance Rth(t) (˚C/W) 10000 Note: Rth was measured at Ta=25˚C and under natural convection. (1) Without heat sink (2) With a 50 × 50 × 2mm Al heat sink 1000 100 (1) (2) 10 1 0.1 10–4 10–3 10–2 10–1 1 10 102 103 104 Time t (s) 3 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company. Please read the following notes before using the datasheets A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited. 2001 MAR