ETC 74LVTH16835MTDX

Revised March 2001
74LVTH16835
Low Voltage 18-Bit Universal Bus Driver
with Bushold and 3-STATE Outputs
General Description
Features
The LVTH16835 is an 18-bit universal bus driver that combines D-type latches and D-type flip-flops to allow data flow
in transparent, latched and clocked modes.
■ Input and output interface capability to systems at
5V VCC
Data flow is controlled by output-enable (OE), latch-enable
(LE), and clock (CLK) inputs. The device operates in
Transparent Mode when LE is held HIGH. The device
operates in clocked mode when LE is LOW and CLK is toggled. Data transfers from the Inputs (An) to Outputs (Yn) on
a Positive Edge Transition of the Clock. When OE is LOW,
the output data is enabled. When OE is HIGH the output
port is in a high impedance state.
The LVTH16835 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs
■ Live insertion/extraction permitted
■ Power up/down high impedance provides glitch-free bus
loading
■ Outputs source/sink −32 mA/+64 mA
■ ESD Performance:
Human-Body Model > 2000V
Machine Model > 200V
Charged-Device Model > 1000V
The bus driver is designed for low voltage (3.3V) VCC applications, but with the capability to provide a TTL interface to
a 5V environment. The LVTH16835 is fabricated with an
advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining low power dissipation.
Ordering Code:
Order Number
Package Number
74LVTH16835MEA
MS56A
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
Package Description
74LVTH16835MTD
MTD56
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
© 2001 Fairchild Semiconductor Corporation
DS500102
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74LVTH16835 Low Voltage 18-Bit Universal Bus Driver
March 2001
74LVTH16835
Connection Diagram
Pin Descriptions
Pin Names
Description
A1–A18
Data Register Inputs
Y1–Y18
3-STATE Outputs
CLK
Clock Pulse Input
OE
Output Enable Input
LE
Latch Enable Input
Function Table
Inputs
Output
OE
LE
CLK
An
Yn
H
X
X
X
Z
L
H
X
L
L
L
H
X
H
H
L
L
↑
L
L
L
L
↑
H
H
L
L
H
X
Y0 (Note 1)
L
L
L
X
Y0 (Note 2)
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
↑ = HIGH-to-LOW Clock Transition
Note 1: Output level before the indicated steady-state input conditions
were established, provided that CLK was HIGH before LE went LOW.
Note 2: Output level before the indicated steady-state input conditions
were established.
Logic Diagram
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Symbol
Parameter
Value
Conditions
Units
VCC
Supply Voltage
−0.5 to +4.6
VI
DC Input Voltage
−0.5 to +7.0
VO
DC Output Voltage
−0.5 to +7.0
Output in 3-STATE
V
−0.5 to +7.0
Output in HIGH or LOW State (Note 4)
V
V
V
IIK
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
IO
DC Output Current
64
VO > VCC
Output at HIGH State
128
VO > VCC
Output at LOW State
mA
ICC
DC Supply Current per Supply Pin
±64
mA
IGND
DC Ground Current per Ground Pin
±128
mA
TSTG
Storage Temperature
−65 to +150
°C
Recommended Operating Conditions
Symbol
Parameter
VCC
Supply Voltage
VI
Input Voltage
IOH
HIGH-Level Output Current
IOL
LOW-Level Output Current
TA
Free-Air Operating Temperature
∆t/∆V
Input Edge Rate, VIN = 0.8V–2.0V, VCC = 3.0V
Min
Max
Units
2.7
3.6
V
0
5.5
V
−32
mA
64
mA
−40
85
°C
0
10
ns/V
Note 3: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.
Note 4: IO Absolute Maximum Rating must be observed.
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74LVTH16835
Absolute Maximum Ratings(Note 3)
74LVTH16835
DC Electrical Characteristics
Symbol
VIK
Input Clamp Diode Voltage
T A = −40°C to +85°C
VCC
Parameter
(V)
Min
Max
Units
−1.2
2.7
V
VO ≤ 0.1V or
VIH
Input HIGH Voltage
2.7–3.6
VIL
Input LOW Voltage
2.7–3.6
VOH
Output HIGH Voltage
2.7–3.6
VCC − 0.2
V
IOH = −100 µA
2.7
2.4
V
IOH = −8 mA
3.0
2.0
V
IOH = −32 mA
VOL
II(HOLD)
II(OD)
Output LOW Voltage
Bushold Input Minimum Drive
Bushold Input Over-Drive
Control Pins
Data Pins
IOFF
Power Off Leakage Current
IPU/PD
Power Up/Down 3-STATE
VO ≥ VCC − 0.1V
2.7
0.2
V
IOL = 100 µA
2.7
0.5
V
IOL = 24 mA
3.0
0.4
V
IOL = 16 mA
3.0
0.5
V
IOL = 32 mA
3.0
0.55
V
IOL = 64 mA
3.0
Input Current
V
0.8
3.0
Current to Change State
II
2.0
Conditions
II = −18 mA
75
µA
VI = 0.8V
−75
µA
VI = 2.0V
500
µA
(Note 5)
−500
µA
(Note 6)
µA
VI = 5.5V
3.6
10
3.6
±1
µA
VI = 0V or VCC
−5
µA
VI = 0V
1
µA
VI = VCC
±100
µA
3.6
0
0V ≤ VI or VO ≤ 5.5V
VO = 0.5V to 3.0V
0–1.5V
±100
µA
IOZL
3-STATE Output Leakage Current
3.6
−5
µA
VO = 0.5V
IOZH
3-STATE Output Leakage Current
3.6
5
µA
VO = 3.0V
IOZH+
3-STATE Output Leakage Current
3.6
10
µA
VCC < VO ≤ 5.5V
ICCH
Power Supply Current
3.6
0.19
mA
Outputs HIGH
ICCL
Power Supply Current
3.6
5
mA
Outputs LOW
ICCZ
Power Supply Current
3.6
0.19
mA
Outputs Disabled
ICCZ+
Power Supply Current
3.6
0.19
mA
VCC ≤ VO ≤ 5.5V,
∆ICC
Increase in Power Supply Current
3.6
0.2
mA
One Input at VCC − 0.6V
Output Current
VI = GND or VCC
Outputs Disabled
Other Inputs at VCC or GND
(Note 7)
Note 5: An external driver must source at least the specified current to switch from LOW-to-HIGH.
Note 6: An external driver must sink at least the specified current to switch from HIGH-to-LOW.
Note 7: This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND.
Dynamic Switching Characteristics
Symbol
Parameter
(Note 8)
TA = 25°C
VCC
(V)
Min
Typ
Conditions
Max
Units
CL = 50 pF, RL = 500Ω
VOLP
Quiet Output Maximum Dynamic VOL
3.3
0.8
V
(Note 9)
VOLV
Quiet Output Minimum Dynamic VOL
3.3
−0.8
V
(Note 9)
Note 8: Characterized in SSOP package. Guaranteed parameter, but not tested.
Note 9: Max number of outputs defined as (n). n−1 data inputs are driven 0V to 3V. Output under test held LOW.
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TA = −40°C to +85°C, CL = 50 pF, RL = 500 Ω
Symbol
VCC = 3.3 ± 0.3V
Parameter
Min
Max
VCC = 2.7V
Min
fMAX
CLK to Y
150
tPLH
Propagation Delay
1.3
5.1
1.3
5.5
tPHL
A to Y
1.2
4.7
1.3
5.2
150
MHz
tPLH
Propagation Delay
1.5
5.4
1.5
6.0
tPHL
LE to Y
1.4
5.1
1.5
5.7
tPLH
Propagation Delay
1.5
5.5
1.5
6.1
tPHL
CLK to Y
1.4
5.1
1.5
5.7
tPZH
Output Enable Time
0.9
4.7
1.3
5.5
1.3
5.2
1.3
6.4
1.7
5.8
1.7
6.3
1.6
5.8
1.7
6.3
tPZL
tPHZ
Output Disable Time
tPLZ
tS
tH
tW
Setup Time
A before CLK
2.1
A before LE, CLK HIGH
2.3
1.5
A before LE, CLK LOW
1.5
1.5
Hold Time
ns
ns
ns
ns
ns
2.4
A after CLK
1.0
1.0
A after LE
0.8
1.0
LE HIGH
3.3
3.3
CLK HIGH or LOW
3.3
3.3
Pulse Duration
Units
Max
ns
ns
ns
tOSLH
Output to Output Skew
1.0
1.0
tOSHL
(Note 10)
1.0
1.0
ns
Note 10: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
Capacitance (Note 11)
Typical
Units
CIN
Symbol
Input Capacitance
Parameter
VCC = 0V, VI = 0V or VCC
Conditions
4
pF
COUT
Output Capacitance
VCC = 3.0V, VO = 0V or VCC
8
pF
Note 11: Capacitance is measured at frequency f = 1 MHz, per MIL-STD-883, Method 3012.
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74LVTH16835
AC Electrical Characteristics
74LVTH16835
Physical Dimensions inches (millimeters) unless otherwise noted
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
Package Number MS56A
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6
74LVTH16835 Low Voltage 18-Bit Universal Bus Driver
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD56
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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