ETC AT49LD3200-10TC

Features
• 3.0V to 3.6V Read/Write
• Burst Read Performance
•
•
•
•
•
•
•
•
•
•
– <100 MHz (RAS Latency = 2, CAS Latency = 6), 10 ns Cycle Time
tSAC = 7 ns
– <75 MHz (RAS Latency = 2, CAS Latency = 5), 13 ns Cycle Time
tSAC = 8 ns
– <50 MHz (RAS Latency = 1, CAS Latency = 4), 20 ns Cycle Time
tSAC = 9 ns
MRS Cycle with Address Key Programs
– RAS Latency (1 and 2)
– CAS Latency (2 ~ 8)
– Burst Length: 4, 8
– Burst Type: Sequential and Interleaved
Word Selectable Organization
– 16 (Word Mode)/x 32 (Double Word Mode)
Sector Erase Architecture
– Eight 256K Word or 128K Double Word (4-Mbit) Sectors
Independent Asynchronous Boot Block
– 8K x 16 Bits with Hardware Lockout
Fast Program Time
– 3-volt, 100 µs per Word/Double Word Typical
– 12-volt, 30 µs per Word/Double Word Typical
Fast Sector Erase Time
– 2.5 Seconds at 3 Volts
– 1.6 Seconds at 12 Volts
Low-power Operation
– ICC Read = 75 mA Typical
Input and Output Pin Continuity Test Mode Optimizes Off-board Programming
Package:
– 86-pin TSOP Type II with Off-center Parting Line (OCPL) for Improved Reliability
LVTTL-compatible Inputs and Outputs
32-megabit
(1M x 32 or
2M x 16)
High-speed
Synchronous
Flash Memory
AT49LD3200
AT49LD3200B
SFlash™
Description
The AT49LD3200 or AT49LD3200B SFlash™ is a synchronous, high-bandwidth Flash
memory fabricated with Atmel’s high-performance CMOS process technology and is
organized either as 2,097,152 x 16 bits (word mode) or as 1,048,576 x 32 bits (double
word mode), depending on the polarity of the WORD pin (see Pin Function Description Table). Synchronous design allows precise cycle control. I/O transactions are
possible on every clock cycle. All operations are synchronized to the rising edge of the
system clock. The range of operating frequencies, programmable burst length and
programmable latencies allow the same device to be useful for a variety of high-bandwidth, high-performance memory system applications.
The AT49LD3200B will automatically activate the Asynchronous Boot Block after
power-up, whereas with the AT49LD3200, the Asynchronous Boot Block can be activated through Mode Register Set.
The synchronous DRAM interface allows designers to maximize system performance
while eliminating the need to shadow slow asynchronous Flash memory into highspeed RAM.
The 32-megabit SFlash device is designed to sit on the synchronous memory bus and
operate alongside SDRAM.
Rev. 1940B–11/01
1
To maximize system manufacturing throughput the AT49LD3200(B) features highspeed 12-volt program and erase options. Additionally, stand-alone programming cycle
time of individual devices or modules is optimized with Atmel’s unique input and output
pin continuity test mode.
Pin Configuration
TSOP (Type II)
Top View
VCC
DQ0
VCCQ
DQ16
DQ1
VSSQ
DQ17
DQ2
VCCQ
DQ18
DQ3
VSSQ
DQ19
MR
VCC
DQM
NC
CAS
RAS
CS
WORD
A12
A11
A10
A0
A1
A2
NC
VCC
NC
DQ4
VSSQ
DQ20
DQ5
VCCQ
DQ21
DQ6
VSSQ
DQ22
DQ7
VCCQ
DQ23
VCC
2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
VSS
DQ31
VSSQ
DQ15
DQ30
VCCQ
DQ14
DQ29
VSSQ
DQ13
DQ28
VCCQ
DQ12
NC
VSS
NC
VPP
WE
CLK
CKE
A9
A8
A7
A6
A5
A4
A3
NC
VSS
NC
DQ27
VCCQ
DQ11
DQ26
VSSQ
DQ10
DQ25
VCCQ
DQ9
DQ24
VSSQ
DQ8
VSS
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Pin Function Description
Pin
Name
Input Function
CLK
System Clock
Active on the rising edge to sample all inputs.
CS
Chip Select
Disables or enables device operation by masking or enabling all inputs except
CLK and CKE.
CKE
Clock Enable
Masks system clock to freeze operation from the next clock cycle. CKE should be
enabled at least one cycle prior to new command. Disables input buffers for powerdown in standby mode.
A0 - A12
Address
Row/column addresses are multiplexed on the same pins.
Row address: RA0 ~ RA12, Column address: CA0 ~ CA6 (x32), CA0 ~ CA7 (x16)
RAS
Row Address Strobe
Latches row addresses on the rising edge of the CLK with RAS low.
Enables row access.
CAS
Column Address Strobe
Latches column addresses on the rising edge of the CLK with CAS low.
Enables column access.
MR
Mode Register Set
Enables mode register set with MR low. (Simultaneously CS, RAS and CAS are low).
DQ0 - DQ31
Data Input/Output
Data input for program/erase. Data output for read.
VCC/VSS
Power Supply/Ground
Power and ground for the input buffers and the core logic.
VCCQ/VSSQ
Data Output Power/Ground
Power and ground for the output buffers.
WORD
x32/x16 Mode Selection
Double word mode/word mode, depending on polarity of WORD pin (WORD = high,
double word mode; WORD = low, word mode).
Should be set to the desired state during power-up and prior to any device operation.
DQM
Data-out Masking
Masks output operation when a complete burst is not required.
NC
No Connection
Not connected
WE
Write Enable
Enables the chip to be written.
VPP
Program/Erase Pin Supply
Program/Erase power supply.
3
1940B–11/01
Absolute Maximum Ratings*
*NOTICE:
Temperature under Bias ................................ -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground .....................................-0.6V to +4.6V
All Output Voltages
with Respect to Ground .............................-0.6V to VCC + 0.6V
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Voltage on VPP
with Respect to Ground ...................................-0.6V to +13.5V
Power Dissipation .............................................................. 1 W
Functional Block Diagram
DQ0
WE
VPP
DQ16
DQ15
DQ31
IO Buffer
Program/
Erase
Logic
ADD
1M x 32
Cell Array
LRAS
Column Decoder
Column Buffer
LCKE
LRAS
Sense AMP
Row Decoder
Row Buffer
ADD
Address Register
CLK
8K x 16 Boot Block
Latency & Burst Length
Programming Register
LMR
LCAS
Timing Register
CLK
4
CKE
MR
RAS
CAS
CS
DQM
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
DC and AC Operating Range
Operating Temperature
(Case)
Commercial
Industrial
VCC, VCCQ Power Supply
AT49LD3200(B)-10
AT49LD3200(B)-13
AT49LD3200(B)-20
0°C - 70°C
0°C - 70°C
0°C - 70°C
-40°C - 85°C
-40°C - 85°C
-40°C - 85°C
3.0V to 3.6V
3.0V to 3.6V
3.0V to 3.6V
DC Characteristics
Symbol
Parameter
Condition
ISB1
VCC Standby Current CMOS
ISB2
Max
Units
CKE = 0, tCC = Min
20
mA
VCC Standby Current TTL
CKE ≤=VIL (Max), tCC = Min
20
mA
ISB3
VCC Active Standby Current
CS ≥ VIH (Min), tCC = Min
50
mA
ICC
VCC Active Current
tCC = Min, All Outputs Open
150
mA
IIL
Input Leakage Current
0V ≤ VIN ≤ VDD + 0.3V
Pins not under test = 0V
-10
10
µA
IOL
Output Leakage Current (IOOUT
Disabled)
(0V ≤ VOUT ≤ VDD Max)
All Outputs in High-Z
-10
10
µA
VIH
Input High Voltage, All Inputs
Note(1)
2.0
VDD + 0.3
V
VIL
Input Low Voltage, All Inputs
Note(2)
-0.3
0.8
V
VOH
Output High Voltage Level (Logic 1)
IOH = -2 mA
2.4
VOL
Output Low Voltage Level (Logic 0)
IOL = 2 mA
Notes:
Min
V
0.4
V
1. VIH (max) = 4.6V for pulse width <10 ns acceptable, pulse width measured at 50% of pulse amplitude.
2. VIL (min) = -1.5V for pulse width <10 ns acceptable, pulse width measured at 50% of pulse amplitude.
AC Operating Test Conditions
TA = 0 to 70°C, VCC = 3.3V ± 0.3V, unless otherwise noted.
Parameter(1)
Value
Timing Reference Levels of Input/Output Signals
1.4V
Input Signal Levels
Transition Time (Rise & Fall) of Input Signals
Output Load
Note:
VIH/VIL = 2.4V/0.4V
tr/tf = 1 ns/1 ns
LVTTL
1. If CLK transition time is longer than 1 ns, timing parameters should be compensated. Add [(tr + tf)/2-1] ns for transition time
longer than 1 ns. Transition time is measured between VIL (max) and VIH (min).
5
1940B–11/01
Figure 1. DC Output Load Circuit
3.3V
1200W
V OH (DC) = 2.4V, I OH= -2 mA
V OL (DC) = 0.4V, I OL= 2 mA
Output
870W
50 pF
Figure 2. AC Output Load Circuit
Vtt = 1.4V
50W
Output
Z0 = 50W
50pF
Pin Capacitance(1)
f = 1 MHz, T = 25°C
Symbol
CIN
COUT
(2)
Notes:
6
Typ
Max
Units
Conditions
4
6
pF
VIN = 0V
8
12
pF
VOUT = 0V
1. This parameter is characterized and is not 100% tested.
2. VPP behaves as an output pin.
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
AC Read Characteristics
AC operating conditions unless otherwise noted.
<100 MHz
Min
Max
<75 MHz
Min
Max
<50 MHz
Min
Max
Units
Symbol
Parameter
tCC
CLK Cycle Time
tSAC
CLK to Valid Output Delay
tOH
Data Output Hold Time
3
4
4
ns
tCH
CLK High Pulse Width
3
4
6.5
ns
tCL
CLK Low Pulse Width
3
4
6.5
ns
11
10
9
clks
10
(1)
13
7
20
8
ns
9
ns
tRC
Row-active to Row-active
tSS
Input Setup Time
2
4
4
ns
tSH
Input Hold Time
1
2
2
ns
tSLZ
CLK to Output in Low-Z
0
0
0
ns
tSHZ
CLK to Output in High-Z
tT
Transition Time
tVCVC
Valid CAS Enable to Valid CAS Enable(2)
Notes:
7
0.1
9
10
10
0.1
8
10
0.1
7
15
ns
10
ns
clks
1. These tRC values are for BL = 8. For BL = 4, tRC = 7 CLKs for up to 100 MHz, tRC = 6 CLKs for up to 75 MHz, tRC = 5 CLKs for
up to 50 MHz. RAS latency increase means a simultaneous tRC increase in the same number of cycles. (If RAS latency is
3 CLKs, tRC is 12 CLKs for BL = 8.) Refer to page 27 for gapless operation.
2. These tVCVC values are for BL = 8. For BL = 4, tVCVC = 5 CLKs for up to 100 MHz, tVCVC = 4 CLKs for up to 75 MHz,
tVCVC = 3 CLKs for up to 50 MHz. Refer to page 27 for gapless operation.
7
1940B–11/01
Function Truth Table
(V = Valid, X = Don’t Care, H = Logic High, L = Logic Low)
Abbreviations (RA: Row Address, CA: Column Address, NOP: No Operation Command, DWM: Double Word Mode, WM:
Word Mode)
CKEn-1
CKEn
CS
RAS
CAS
MR(9)
DQM
Add.
WORD
VPP
WE
Mode Register Set
H
X
L
L
L
L
X
Code
X
X
X
Row Active
Row Access
& Latch
H
X
L
L
H
H
X
RA
X
X
X
Read
Column Access
& Latch
H
X
L
H
L
H
X
CA
X
X
H
H
X
L
H
H
L
X
X
X
X
X
H
X
L
L
H
L
X
X
X
X
X
Entry
H
L
X
X
X
X
X
X
X
X
X
Exit
L
H
X
X
X
X
X
X
X
X
X
H
X
X
X
X
X
V
X
X
X
X
H
X
H
X
X
X
X
X
X
X
X
H
X
L
H
H
H
X
X
X
X
X
H
X
L
H
L
H
X
CA
X
H
Command
Register
(1)
Burst Stop
Power-down
and Clock
Suspend(2)
(Precharge on
Synch. DRAM)
Two
Standby
Mode
DQM(3)
No Operation Command(4)
H
Organization Control(5)
L
Program/Erase(6)
H
X
L
H
L
X
X
CA
X
X
L
(6)
H
X
L
H
L
X
X
CA
X
12V
L
Program/Erase Inhibit
H
X
H
X
X
X
X
X
X
X
X
Mode Register Set
H
X
L
L
L
L
X
A7 = H
X
X
X
Read
H
X
L
H
L
H
X
L
X
X
H
H
X
L
H
L
X
X
CA
X
X
L
X
X
X
Fast Program/Erase
Product
Identification(7)
Entry
Continuity Test Mode
Exit
Notes:
8
X
X
X
X
X
X
X
Code
(8)
1. A0 ~ A6: Program keys (@MRS). After power-up, mode register set can be set before issuing other input command. After the
Mode Register Set command is completed, no new commands can be issued for 3 CLK Cycles, and CS or MR state must
be defined “H” within 3 CLK cycles. Refer to the Mode Register Control Table.
2. In the case CKE is low, two standby modes are possible. Those are standby mode in power-down, and active standby mode
in clock suspend (non-power-down).
Power-down: CKE = “L” (after no command is issued for 60 µs)
Clock Suspend: CKE = “L” (at the range of Row Active, Read and Data Out)
3. DQM sampled at rising edge of a CLK makes a high-Z state the data-out state, delayed by 2 CLK cycles.
4. Precharge command on Synch. DRAM can be used for Burst Stop operation during burst read operation only.
5. Mode selection is controlled by the polarity of WORD pin, “H” state is DWM, “L” state is WM. WORD should be set to the
desired state during power-up and prior to any device operation.
6. Data is provided through DQ0 ~ DQ31. Refer to AC programming and erasing waveforms.
7. DQ0 ~ DQ31 will output Manufacturer Code/Device Code.
8. A0 = A2 = A11 = “H”, A1 = A10 = A12 = “L”
9. The user can tie MR and WE together to simplify the interface of the AT49LD3200(B) onto the standard SDRAM bus.
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Asynchronous Boot Block Function Truth Table
Command
Read
Output Disable
CLK(2)
CKE(2)
CS
RAS
CAS
MR
DQM
Add.
WORD
VPP
WE
X
X
L
X
X
X
L
Add
X
X
X
X
X
L
X
X
X
H
X
X
X
X
(1)
Program/Erase
H
L
H
L
X
X
Add
X
X
L
(1)
H
L
H
L
X
X
Add
X
12V
L
Program/Erase Inhibit
H
H
X
X
X
X
X
X
X
X
Fast Program/Erase
Notes:
1. Program/Erase is performed through the synchronous bus cycle operation after the boot block is activated through either
power-up or Mode Register Set.
2. It is recommended to hold CKE Low if CLK is running during asynchronous boot block mode except for synchronous command cycle and MRS operations.
Mode Register Control Table(1)
Register Programmed with MRS
Address
A7
A6
Function
Product ID
RAS Latency
Product ID
A5
RAS Latency
A4
A3
A2
CAS Latency
A1
Burst Type
CAS Latency
A0
Burst Length
Burst Type
Burst Length
A7
“Read”
A6
Type
A5
A4
A3
Length
A2
Type
A1
A0
Length
0
Array
0
1
0
0
0
Reserved
0
Sequential
0
0
Reserved
1
ID
1
2
0
0
1
2
1
Interleave
0
1
4
0
1
0
3
1
0
8
0
1
1
4
1
1
Boot Block
1
0
0
5
1
0
1
6
1
1
0
7
1
1
1
8
Note:
1. After power-up, when the user wants to change Mode Register Set, the user must exit from power-down mode and start
Mode Register Set before entering normal operation mode. Reserved modes are not to be used; device function in these
modes is not guaranteed.
9
1940B–11/01
Addressing Map
WORD = “H”: x32 Organization(1)
Function
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
Row Address
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RA7
RA8
RA9
RA10
RA11
RA12
X
X
X
X
X
X
Column Address
Note:
CA0
CA1
CA2
CA3
CA4
CA5
CA6
(1)
1. Column Address MSB (at x32 organization) (X = Don’t Care)
WORD = “L”: x16 Organization(1)
Function
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
Row Address
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RA7
RA8
RA9
RA10
RA11
RA12
X
X
X
X
X
Column Address
Note:
CA0
CA1
CA2
CA3
CA4
CA5
CA6
CA7
(1)
1. Column Address MSB (at x16 organization) (X = Don’t Care)
Each Address is Arranged as Follows(1)(2)
For X32 operation,
MSB
LSB
Address Register
AR19
AR18
AR17
...
AR8
AR7
AR6
...
AR3
AR2
AR1
AR0
Address
RA12
RA11
RA10
...
RA1
RA0
CA6
...
CA3
CA2
CA1
CA0
BL = 4
* Initial Address
Notes:
10
BL = 8
1. For X16 operation, when CA0 is set to Low, data belonging to 0 ~ 15th registers are output to DQ0 ~ DQ15 pins, and when
CA0 is set to High, data belonging to 16 ~ 31th registers are output to DQ0 ~ DQ15 pins.
2. Asynchronous Boot Block uses x16 operation and A0 ~ A12 as address inputs.
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Burst Sequence (Burst Length = 4)
Initial Address
A1
A0
Sequential
Interleave
0
0
0
1
2
3
0
1
2
3
0
1
1
2
3
0
1
0
3
2
1
0
2
3
0
1
2
3
0
1
1
1
3
0
1
2
3
2
1
0
Burst Sequence (Burst Length = 8)
Initial Address
A2
A1
A0
Sequential
Interleave
0
0
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
0
1
1
2
3
4
5
6
7
0
1
0
3
2
5
4
7
6
0
1
0
2
3
4
5
6
7
0
1
2
3
0
1
6
7
4
5
0
1
1
3
4
5
6
7
0
1
2
3
2
1
0
7
6
5
4
1
0
0
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
1
0
1
5
6
7
0
1
2
3
4
5
4
7
6
1
0
3
2
1
1
0
6
7
0
1
2
3
4
5
6
7
4
5
2
3
0
1
1
1
1
7
0
1
2
3
4
5
6
7
6
5
4
3
2
1
0
Device Operations
Clock (CLK)
A square wave signal (CLK) must be applied externally at cycle time tCC. All operations
are synchronized to the rising edge of the clock. The clock transitions must be monotonic between VIL and VIH. During operation with CKE high, all inputs are assumed to be
in valid state (low or high) for the duration of setup and hold time around the positive
edge of the clock for proper functionality and ICC specifications.
Clock Enable (CKE)
The clock enable (CKE) gates the clock into the AT49LD3200(B) and is asserted high
during all cycles, except for power-down, standby and clock suspend mode. If CKE goes
low synchronously with clock (setup and hold time same as other inputs), the internal
clock is suspended from the next clock cycle and the state of output and burst address
is frozen for as long as the CKE remains low. All other inputs are ignored from the next
clock cycle after CKE goes low. The AT49LD3200(B) remains in the power-down mode,
ignoring other inputs for as long as CKE remains low. The power-down exit is synchronous as the internal clock is suspended. When CKE goes high at least “1 CLK + tSS”
before the rising edge of the clock, then the AT49LD3200 becomes active from the
same clock edge accepting all the input commands.
NOP and Device
Deselect
When RAS, CAS and MR are high, the AT49LD3200(B) performs no operation (NOP).
NOP does not initiate any new operation. Device deselect is also a NOP and is entered
by asserting CS high. CS high disables the command decoder so that RAS, CAS, MR
11
1940B–11/01
and all the address inputs are ignored. In addition, entering a Mode Register Set command in the middle of a normal operation results in an illegal state in the
AT49LD3200(B).
Power-up
The following power-up sequence is recommended.
1. Apply power and start clock. Hold the MR, CKE and DQM inputs high; all other
pins are a NOP condition at the inputs before or along with VCC (and VCCQ)
supply.
2. Set WORD to the desired state (prior to any device operation).
3. To change the default Mode Register Set values, perform a Mode Register Set
cycle to program the RAS latency, CAS latency, burst length and burst type.
4. At the end of three clock cycles after the mode register set cycle, the device is
ready for operation.
When the above sequence is used for power-up, all outputs will be in high impedance
state. The high impedance of outputs is not guaranteed in any other power-up
sequence.
For AT49LD3200B, Asynchronous Boot Block will be selected after power-up.
Mode Selection Control
Mode selection is controlled by the polarity of WORD pin. WORD should be set to the
desired state during power-up and prior to any device operation. The AT49LD3200(B)
can be organized as either double word wide (x32) or word wide (x16). The organization
is selected via the WORD pin. When WORD is asserted high (VIH), the double wordwide organization is selected. When WORD is asserted low (VIL), the word-wide organization is selected.
Address Decoding
The address bits required to decode one of the available cell locations out of the total
depth are multiplexed onto the address select pins and latched by externally applying
two commands. The first command, RAS asserted low, latches the row address into the
device. A second command, CAS asserted low, subsequently latches the column
address.
Mode Register Set (MRS) The mode register stores the data for controlling the various operating modes of
AT49LD3200(B). It programs the RAS latency, CAS latency, burst length, burst type,
s e l e c t s p r o d u c t ID R e a d o r ac ti v a te s t h e A s y n c h r on o u s B o o t B l o c k . Fo r
AT49LD3200(B), the default value of the mode register is defined as array read with
RAS latency = 2, CAS latency = 5, burst length = 4, sequential burst type. When and if
the user wants to change its values, the user must exit from power-down mode and start
Mode Register Set before entering normal operation mode. The mode register is reprogrammed by asserting low on CS, RAS, CAS and MR (the AT49LD3200(B) should be in
active mode with CKE already high prior to writing the mode register). The state of
address pins A0 ~ A7 in the same cycle as CS, RAS, CAS and MR going low is the data
written in the mode register. Three clock cycles are required to complete the program in
the mode register, therefore after a Mode Register Set command is completed, no new
commands can be issued for 3 clock cycles and CS or MR must be high within 3 clock
cycles. The mode register is divided into various fields, depending on functionality. The
burst length field uses A0 ~ A1, burst type uses A2, CAS latency (read latency from column address) uses A3 ~ A5, RAS latency uses A6 (RAS to CAS delay), array read or
product ID read uses A7. Refer to Mode Register Control Table for specific codes for
various burst lengths, burst types, CAS latencies, RAS latencies, and read modes.
12
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Latency
There are latencies between the issuance of a Row Active command and when data is
available on the I/O buffers. The RAS to CAS delay is defined as the RAS latency. The
CAS to data out delay is the CAS latency. The CAS and RAS latencies are programmable through the mode register. RAS latencies of 1 and 2, and CAS latencies of 2 through
6 are supported. It is understood that some RAS and CAS latency values are reserved
for future use, and are not available in this generation of synchronous Flash. The following are the supported minimum values: RAS latency = 2, and CAS latency = 6 for 100
MHz operation, and RAS latency = 2, and CAS latency = 5 for 66 MHz operation, and
RAS latency = 1, and CAS latency = 4 for 50 MHz operation, and RAS latency = 1, and
CAS latency = 3 for 33 MHz operation.
DQM Operation
The DQM is used to mask output operations when a complete burst read is not required.
It works similar to OE during a read operation. The read latency is two cycles from DQM,
which means DQM masking occurs two cycles later in the read cycle. DQM operation is
synchronous with the clock. The masking occurs for a complete cycle. (Also refer to the
DQM timing diagram.)
Burst Read
The Burst Read command is used to access a burst of data on consecutive clock cycles
from an active row state. The Burst Read command is issued by asserting low CS and
CAS with MR being high on the rising edge of the clock. The first output appears in CAS
latency number of clock cycles after the issuance of the Burst Read command. The
burst length, burst sequence and latency from the Burst Read command are determined
by the mode register, which is already programmed. Burst read can be initiated on any
column address of the active row. The output goes into high-impedance at the end of
the burst, unless a new burst read is initiated to keep the data output gapless. The burst
read can be terminated by issuing another burst read.
Sector Erase
Before a word/double word can be reprogrammed, it must be erased. The erased state
of the memory bits is a logical “1”. The AT49LD3200(B) is organized into eight uniform
four megabit sectors (SA0 - SA7) that can be individually erased. The Sector Erase
command is a synchronous six-bus cycle operation (refer to the Command Definition
table and Program Cycle and Erase Cycle waveforms). The erase code consists of 6byte (DQ8 - DQ31 are Don’t Care inputs for the command) load commands to specific
address locations with a specific data pattern. The sector address and 30H data input
are latched in the sixth cycle. The sector erase starts at the following rising edge of CLK
after the sixth cycle. The erase operation is internally controlled; it will automatically time
to completion.
Any commands written to the device during the erase cycle will be ignored. The maximum time needed to erase one sector is tEC.
Word/Double Word
Programming
Once a sector is erased, it is programmed (to a logical “0”) on a word-by-word/doubleword-by-double-word basis. Programming is accomplished via the internal device command register and is synchronous four-bus cycle operation (refer to the Command
Definition table and Program Cycle and Erase Cycle waveforms). The programming
operation starts at the following rising edge of CLK after the fourth cycle. The device will
automatically generate the required internal program pulses.
Any commands written to the device during the embedded programming cycle will be
ignored. Please note that a data “0” cannot be programmed back to a “1”; only erase
operations can convert “0”s to “1”s. Programming is completed after the specified tPGM
cycle time. The DATA polling feature may also be used to indicate the end of a program
cycle.
13
1940B–11/01
Product Identification
The product identification mode identifies the device and manufacturer as Atmel. This
mode can be used by an on-board controller or external programmer to identify the correct programming algorithm for the Atmel product.
DATA Polling
The AT49LD3200(B) features DATA polling to indicate the end of a program or sector
erase cycle. DATA polling may begin at any time during the program or sector erase
cycle.
During a program cycle, an attempted read of the last word/double word loaded will
result in the complement of the loaded data in DQ7. Once the program cycle has completed, true valid data can be read on all outputs and the next cycle may begin.
During a sector erase operation, an attempt to read the device will give a “0” on DQ7.
Once the sector erase cycle has completed, logical “1” data can be read on all outputs
from the device.
Hardware Data
Protection
Hardware features protect against inadvertent programming or erasure to the
AT49LD3200(B) in the following way: VCC sense: if VCC is below 2.3V (typical), the program or erase function is inhibited; but if VCC dips below 2.3V during program or erase
cycle, the respective function will be interrupted and the data at the location being programmed may be corrupted.
Continuity Test Mode
The AT49LD3200(B) has built-in circuitries to make input and output pin continuity
check simple and easy. This mode can be activated via the internal device command
register and is a synchronous five-bus cycle operation (refer to the Command Definition
Table and Continuity Test Mode Entry Waveforms). After the bus cycle operation, keep
DQM high (VIH) and allow 5 µsec for circuit setup time or until data is no longer asserted
at DQ0 - DQ7, whichever takes longer. This will keep DQ0 - DQ7 from contention since
data is asserted at DQ0 - DQ7 during the mode entry sequence. Then DQM can be
asserted low (VIL) to enable DQ0 - DQ7 for test. Once in this asynchronous mode, input
pins are virtually tied to output pins internally forming input - output pin pairs. The output
pin of the pair will follow the logic state of the input pin of the pair (refer to the Input Output Pin Pairs table). To exit the mode, A0, A2 and AII are asserted high (VIH) and A1,
A10 and A12 are asserted low (VIL), allow 5 µsec for circuit recovery time before returning
the device for normal operation.
14
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Input - Output Pin Pairs
Asynchronous Boot
Block
Input
Output
MR
DQ0, DQ16
RAS
DQ1, DQ17
CAS
DQ2
DQM
DQ18
CS
DQ3
WORD
DQ19
A12
DQ4
A11
DQ20
A10
DQ5
A0
DQ21
A1
DQ6, DQ22
A2
DQ7, DQ23
A3
DQ8, DQ24
A4
DQ9, DQ25
A5
DQ10
A6
DQ26
A7
DQ11
A8
DQ27
A9
DQ12
CKE
DQ28
CLK
DQ13, DQ29
WE
DQ14, DQ30
VPP
DQ15, DQ31
The AT49LD3200B will automatically activate the Asynchronous Boot Block after
power-up and the AT49LD3200 can activate the Asynchronous Boot Block through the
Mode Register Set. The size of the boot block is 8K x 16 bits with addresses A0 ~ A12
and outputs DQ0 ~ DQ15. The contents of the boot block are accessed asynchronously,
meaning the data at outputs will change according to the address inputs after tACC, without any external clocking signals.
Programs and erases are performed using the synchronous bus cycle operation (refer
to Command Definitions table and Program Cycle and Erase Cycle waveforms) after the
boot block is activated either through power-up or Mode Register Set. Programming of
the boot block is set up for x16 mode.
This Asynchronous Boot Block has a lockout feature that prevents programming or
erasing of data in this boot block once the feature has been enabled. This feature does
not have to be activated; the boot block’s usage as a protected region is optional to the
user. Once this feature is enabled, the data in the boot block can no longer be erased or
programmed when input levels of 3.6V or less are used. To activate the lockout feature,
15
1940B–11/01
Boot Block Lockout command, which is a synchronous five-bus cycle operation, must be
performed (refer to Command Definitions table and Program Cycle Waveforms).
A software method is available to determine if programming or erasing of the boot block
is locked out. Issue Boot Block Lockout Verify command and observe DQ0 ~ DQ7. If the
data show 00H/02H, the boot block can be programmed or erased; if the data show
01H/03H, the lockout feature has been enabled and the boot block cannot be programmed or erased. The Boot Block Lockout Verify Exit command should be used to
return to standard operation (refer to Command Definition table and Boot Block Lockout
Verify Waveforms).
The user can override the boot block lockout by taking the MR pin to 12 volts after the
boot block is activated. When the MR pin is brought back to TTL levels, the boot block
lockout feature is again active.
16
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Command Definition in Hex(1)
Command
Sequence
1st Bus Cycle
2nd Bus Cycle
3rd Bus Cycle
4th Bus Cycle
Bus
Cycles
RA
CA
Data
RA
CA
Data
RA
CA
Data
RA
CA
Data
Word/
Double
Word
Program
4
AA
55
AA
55
2A
55
AA
55
A0
RA
CA
DIN
Sector
Erase
6
AA
55
AA
55
2A
55
AA
55
80
AA
55
Continuity
Test Mode
Entry
5
AA
55
AA
55
2A
55
AA
55
80
AA
Boot Block
Lockout
5
AA
55
AA
55
2A
55
AA
55
80
Boot Block
Lockout
Verify
5
AA
55
AA
55
2A
55
AA
55
Boot Block
Lockout
Verify Exit
5
AA
55
AA
55
2A
55
AA
55
Notes:
5th Bus Cycle
6th Bus Cycle
RA
CA
Data
RA
CA
Data
AA
55
2A
55
SA(2)
X
30
55
AA
AA
55
70
AA
55
AA
AA
55
40
80
AA
55
AA
AA
55
90
80
AA
55
AA
AA
55
F0
1. The DATA FORMAT in each bus cycle is as follows: DQ31 - DQ8 (Don’t Care); DQ7 - DQ0 (Hex).
2. SA = Sector Addresses: Any word/double word address within a sector can be used to designate the sector address.
See Sector Address Mapping table below.
3. Allow minimum 200 ns after Boot Block Lockout Verify command and before Read.
4. Allow minimum 10 µs after Boot Block Lockout Verify Exit command for the device to return to standard operation.
Sector Address Mapping
x16
Address Range
x32
Address Range
Sector
Size (Word/Double Word)
CA7-0
RA12-0
CA6-0
RA12-0
SA0
256K/128K
X
00XX
03XX
X
00XX
03XX
SA1
256K/128K
X
04XX
07XX
X
04XX
07XX
SA2
256K/128K
X
08XX
0BXX
X
08XX
0BXX
SA3
256K/128K
X
0CXX
0FXX
X
0CXX
0FXX
SA4
256K/128K
X
10XX
13XX
X
10XX
13XX
SA5
256K/128K
X
14XX
17XX
X
14XX
17XX
SA6
256K/128K
X
18XX
1BXX
X
18XX
1BXX
SA7
256K/128K
X
1CXX
1FXX
X
1CXX
1FXX
17
1940B–11/01
Basic Feature and Function Descriptions
MRS
Mode Register Set
CLK
CMD
MRS
ACT
(1)
3CLK
Clock Suspend
Clock Suspended During Burst Read (BL=4)
CLK
CMD
RD
CKE
Masked by CKE
Internal
CLK
Data
DQ0
D0 1
DQ
DQ 2
DQ 3
: This command cannot be activated.
Suspended Dout
Clock Suspend Exit and Power-down Exit
1) Clock Suspend Exit
2) Power Down
CLK
CKE
CLK
tSS
CKE
Internal
CLK
CMD
Note:
18
t SS
Internal
CLK
RD
CMD
NOP ACT
After Mode Register Set command is completed, no new commands can be issued for 3 clock cycles, and MR or CS should be
fixed “H” within a minimum of 3 clock cycles.
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
DQM Operation
1) Read Mask (BL=4)
CLK
CMD
RD
DQM
Data(CL2)
DQ0
DQ1
DQ0
Data(CL3)
Masked by DQM
High-Z
DQ3
High-Z
High-Z
Data(CL4)
DQ2
DQ 3
DQ1
DQ2
DQ3
DQM to Data-out Mask = 2CLKs
2) DQM with Clock Suspended (BL=8)
CLK
CMD
RD
CKE
DQM
(1)
Data(CL2)
Data(CL3)
Data(CL4)
Note:
DQ0
D1DQ1
DQ0
High-Z
High-Z
High-Z
DQ 3
DQ2
DQ 1
High-Z
High-Z
High-Z
DQ 5
DQ4
DQ 3
High-Z
High-Z
High-Z
DQ7
DQ 6 DQ7
DQ 5
DQ 6 DQ7
DQM makes data out high-Z after 2 CLKs, which should be masked by CKE “L”.
19
1940B–11/01
Read Cycle I: Normal @RAS Latency = 2, CAS Latency = 5, Burst Length = 4
tCH
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLK
tCL
tCC
HIGH
CKE
tRC
tSH
CS
tSS
RAS
Latency
tSH
RAS
tSS
CAS
tSH
ADDR
RAa
CAa
RAb
CAb
tSS
tRC=6 clocks at BL=4
(1)
tOH
DQa0 DQa1 DQa2 DQa3
Data
tSAC
DQb0 DQb1 DQb2 DQb3
tSHZ
MR
Row Active
Note:
20
Read
Row Active
Read
: Don't Care
When the burst length is 4 at 66 MHz, tRC is equal to 6 clock cycles.
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Read Cycle II: Consecutive Column Access @RAS Latency = 2, CAS Latency = 5, Burst Length = 4
tCH
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLK
tCL
tCC
HIGH
CKE
tSH
CS
t SS
RAS
Latency
tSH
RAS
tSS
CAS
tSH
ADDR
RAa
CAa
CAb
tSS
t VCVC=4 clocks at BL=4
tOH
Data
Burst Length=4
DQa0 DQa1 DQa2 DQa3 DQb0 DQb1 DQb2 DQb3
tSAC
tSHZ
MR
Row Active
Read
Read
: Don't Care
Note:
When column access is initiated beyond tVCVC, at BL = 4, CAa access read is completed, CAb access read begins.
21
1940B–11/01
Read Cycle III: Clock Suspend @RAS Latency = 2, CAS Latency = 5, Burst Length = 4
0
1
2
3
tCH
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLK
tCL
t CC
CKE
(1)
Internal
CLK
CS
RAS
Latency
tSH
RAS
t SS
CAS
t SH
ADDR
RAa
t SS
CAa
tVCVC= 4 clocks at BL=4
(2)
Data
Burst Length=4
DQa0
DQa1
DQa2 DQa3
MR
Row Active
Read
Clock Suspend Resume
: Don't Care
Notes:
22
1. From next clock after CKE goes low, clock suspension begins.
2. For clock suspension, data output state is held and maintained.
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Read Interrupted by Precharge Command and Burst Read Stop Cycle @Burst Length = 8
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLK
HIGH
CKE
CS
RAS
CAS
ADDR
RAa
CAa
CAb
(1)
(1)
CL=2
DQa0 DQa1 DQa2 DQa3 DQa4
Data
DQb0 DQb1 DQb2 DQb3 DQb4 DQb5
(2)
(2)
CL=3
DQa0 DQa1 DQa2 DQa3 DQa4
DQb0 DQb1 DQb2 DQb3 DQb4 DQb5
MR
DQM
(1)(2)
Row Active
Read
Burst Stop
Read
Precharge
: Don't Care
Notes:
1. The Burst Stop command is valid at every page burst length. The data bus goes to high-Z after the CAS latency from the
Burst Stop command is issued.
2. The interval between Read command (column address presented) and Burst Stop command is 1 cycle (min).
23
1940B–11/01
Power-down and Clock Suspend Cycle: @RAS Latency = 2, CAS Latency = 5, Burst Length = 4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
tSS
CKE
(1)
(1)
Power Down
Clock Suspend
(3)
CLK
(internal)
CS
RAS
CAS
(2)
ADDR
t SH
NOP RAa
CAa
tSS
Data
MR
Data High-Z State
DQa0 DQa1
DQa2
DQa3
(High)
Row Active
Power-down
Entry
Power-down
Exit
Read
Clock Suspend
Entry
Clock Suspend
Exit
: Don't Care
Notes:
24
1. From next clock after CKE goes low, clock suspend and power-down begins.
2. After power-down exit, NOP should be issued and new command can be issued after 1 clock.
3. Clock suspend is in active standby mode.
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Mode Register Set: @RAS Latency = 2, CAS Latency = 5, Burst Length = 4
tCH
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLK
tCC
tCL
HIGH
CKE
tSH
CS
t SS
RAS
CAS
ADDR
Code
RAa
CAa
Data High-Z State
Data
DQa0 DQa1 DQa2 DQa3
MR
MRS
Row Active
: Don't Care
Notes:
1. After the Mode Register Set is completed, no new commands can be issued for 3 CLK cycles.
2. After power-up, necessarily Mode Register Set should be completed at least one time and CS or MR must be fixed “H” within
3 clock cycles, and when user wants to change Mode Register Set, user must exit from power-down mode and start Mode
Register Set before chip enters normal operation mode.
25
1940B–11/01
Detailed Functional Truth Table
Input Signal
Current
State
After
Power-up(1)
Row Active
CKE
CS
RAS
CAS
MR
Add.
L
X
X
X
X
X
H
L
L
H
H
RA
H
L
L
L
L
Code
H
L
L
H
H
RA
If consecutive row access is issued within tRC (min.)
without CAS enabling, only the final RA is valid.
H
L
H
L
H
CA
Begin READ; latch CA
H
L
L
L
L
Code
L
X
X
X
X
X
H
L
L
H
H
Next State Operation
Power-down
Row Active; latch RA
Mode Register Set
Illegal(1)
Clock Suspend
RA
Row Access in Read State, within the tRC, previous
read is ignored and new row is activated. Beyond the
tRC, previous read is completed and new read
begins.
Consecutive Column Access, within the tVCVC, only
the final CA is valid and the previous burst read is
ignored. Beyond the tVCVC, the previous read is
completed and new read begins.
H
L
H
L
H
CA
H
L
L
H
L
X
NOP (after Burst Read)/Read Interrupt
H
L
H
H
L
X
NOP (after Burst Read)/Read Interrupt
H
L
L
L
L
Code
L
X
X
X
X
X
Clock Suspend/Power-down
Any State
L
L
L
L
H
X
Low Power Consumption Mode
Any State
H
L
H
H
H
X
NOP
H
L
L
L
H
X
Illegal
H
L
H
L
L
CA
Illegal
READ
Illegal(1)
Any State
Note:
26
1. After the power-up, when user wants to change MR Set, user must exit from power-down mode and start MR Set before chip
enters normal operation mode.
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Technical Notes
Frequency vs. AC Parameter Relationship Table(1)
<100 MHz
Burst Length
RAS Latency
4
2
8
CAS Latency
tRC (min)
tVCVC (min)
6
7
5(2)
7
8
6
6
11
9(2)
7
12
10
CAS Latency
tRC (min)
tVCVC (min)
5
6
4(2)
6
7
5
5
10
8(2)
6
11
9
CAS Latency
tRC (min)
tVCVC (min)
2
<75 MHz
Burst Length
RAS Latency
4
2
8
2
<50 MHz
Burst Length
RAS Latency
4
4
8
Notes:
1
1
(2)
4
3/4(2)
5
5
4(2)
6
6
5
4
8(2)
7/8(2)
5
9
8(2)
6
10
9
1. Above tables are not specifications values, but rather the actual number of clock cycles. There are no gapless operations for
CAS latency 7 and 8.
2. Minimum clocks for gapless operation.
3. tRC (max) = tVCVC (max) = 50 µs. If tRC (max) or tVCVC (max) has been reached, a new “ACTIVE” command is necessary for
new access.
27
1940B–11/01
CAS Interrupt
Read interrupted by Read (BL=4) (1)
CLK
CMD
RD
RD
ADD
A
B
Data(CL2)
DQB0 DQB1 DQB2 DQB3
Data(CL3)
DQB0 DQB1 DQB2 DQB3
Data(CL4)
DQB 0 DQB1 DQB2 DQB3
(2)
Notes:
1. By “Interrupt”, it is meant to stop Burst Read by external command before the end of burst. By “CAS Interrupt”, to stop Burst
Read by CAS access.
2. CAS to CAS delay (=1 CLK).
Read Interrupt Operation by Issuing the Precharge of Burst Stop Command
CASE I ) Issued read Interrupt command during burst read operation period.
CLK
CMD
CLK
RD
PRE
CMD
RD
STOP
(1)
Data(CL2)
DQ 0
DQ1
DQ 0
Data(CL3)
(1)
Data(CL4)
DQ 0
Data(CL2)
DQ1
DQ0
DQ 0
Data(CL3)
DQ1
DQ1
DQ1
DQ0 DQ1
Data(CL4)
CASE II ) Issued read Interrupt command between read command and data out.
CLK
CMD
CLK
RD
PRE
CMD
(2)
Data(CL2)
Data(CL3)
28
STOP
(2)
DQ 0
Data(CL2)
DQ 0
Data(CL4)
Notes:
RD
Data(CL3)
DQ0
Data(CL4)
DQ 0
DQ 0
DQ0
1. The data bus goes to high-Z after CAS latency from the Burst Stop (or precharge) command.
2. Valid output data will last up to CL-1 clock cycle from PRE command.
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Read Cycle Depending on tRC
@RL = 2, CL = 6, BL = 4; 100 MHz
CLK
tRC(min)=7
CMD
ACT
tCC=10ns
RDa
ACT
RDb
ACT
CASE I )
RDb
ACT
CASE II )
RDb
CASE III )
High-Z
CASE I )
DQb0 DQb1 DQb2 DQb3
CASE II )
DQa 0 DQa1 DQa 2 DQa 3
CASE III )
DQa0 DQa1 DQa 2 DQa 3
DQb0 DQb1 DQb2 DQb3
DQb0 DQb1 DQb2 DQb3
@RL = 2, CL = 5, BL = 4; 75 MHz
CLK
tRC(min)=6
CMD
ACT
tCC=15ns
RDa
ACT
RDb
ACT
CASE I )
RDb
ACT
CASE II )
RDb
CASE III )
High-Z
CASE I )
DQb0 DQb1 DQb2 DQb3
CASE II )
DQa 0 DQa1 DQa 2 DQa 3
CASE III )
DQa0 DQa1 DQa 2 DQa 3
DQb0 DQb1 DQb2 DQb3
DQb0 DQb1 DQb2 DQb3
@RL = 1, CL = 4, BL = 4; 50 MHz
CLK
tRC(min)=4
CMD
ACT
RDa
tCC=20ns
ACT RDb
CASE I )
ACT RDb
CASE II)
ACT RDb
CASE I )
CASE III)
DQb0 DQb1 DQb2 DQb3
CASE II )
DQa0 DQa1 DQa 2 DQa3 DQb0 DQb1 DQb2 DQb3
CASE III )
DQa0 DQa1 DQa 2 DQa3
(Gapless Operation)
DQb0 DQb1 DQb2 DQb3
29
1940B–11/01
Read Cycle Depending on tVCVC
@RL = 2, CL = 6, BL = 4; 100 MHz
CLK
tVCVC=5
CMD
tCC=10ns
RDa
ACT
RDb
CASE I)
RDb
CASE II)
RDb
CASE III)
CASE I )
DQb0 DQb1 DQb2 DQb3
(Gapless Operation)
CASE II )
DQa0 DQa1 DQa 2 DQa3 DQb0 DQb1 DQb2 DQb3
CASE III )
DQa0 DQa1 DQa 2 DQa3
DQb0 DQb1 DQb2 DQb3
@RL = 2, CL = 5, BL = 4; 75 MHz
CLK
tVCVC=4
CMD
RDa
ACT
tCC=15ns
RDb
CASE I)
RDb
CASE II)
RDb
CASE I )
CASE III)
DQb0 DQb1 DQb2 DQb3
(Gapless Operation)
CASE II )
DQa0 DQa1 DQa 2 DQa3 DQb0 DQb1 DQb2 DQb3
CASE III )
DQa0 DQa1 DQa 2 DQa3
DQb0 DQb1 DQb2 DQb3
@RL = 1, CL = 4, BL = 4; 50 MHz
CLK
tVCVC=3
CMD
ACT
RDa
RDb
tCC=20ns
CASE I)
RDb
CASE II)
RDb
CASE I )
CASE III)
DQb0 DQb1 DQb2 DQb3
CASE II )
DQa0 DQa1 DQa 2
CASE III )
DQa0 DQa1 DQa 2 DQa 3 DQb0 DQb1 DQb2 DQb3
DQb1 DQb2 DQb3
(Gapless Operation)
: Invalid Data
30
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
AC Characteristics for Boot Block Read Operation
Symbol
Parameter
Condition
tACC
Address to Output Delay
tOE
DQM to Output Delay
tDF
DQM High to Output Float
tOH
Output Hold from Address
Min
Max
Units
CS = DQM
= VIL
170
ns
CS = VIL
60
ns
40
ns
0
ns
AC Waveforms for Boot Block Read Operation
ADDRESS
ADDRESS VALID
CS
tOE
DQM
tDF
tACC
OUTPUT
HIGH-Z
tOH
OUTPUT VALID
31
1940B–11/01
l
3-volt Program and Erase Cycle Characteristics
Symbol
Parameter
Typ
Max
Units
tPGM
Word/Double Word Programming Time
50
600
µs
tEC
Sector/Boot Block Erase Cycle Time
2.0/300
seconds/ms
tBBL
Boot Block Lockout Enable Time
10
ms
ICC2
VCC Current during Program and Erase Cycle
150
mA
High-speed 12-volt Program and Erase Cycle Characteristics
Symbol
Parameter
Typ
Max
Units
tPGM
Word/Double Word Programming Time
15
200
µs
tEC
Sector/Boot Block Erase Cycle Time
1.2/200
seconds/ms
ICC3
VCC Current During Program and Erase Cycle
75
mA
IPP3
VPP Current During Program and Erase Cycle
75
mA
Program Cycle Waveforms
PROGRAM CYCLE
CLK
CS
tPGM
WE
RAS
CAS
ADDR
AA
55
AA
DATA
55
PRECHARGE COMMAND
AA
2A
55
PRECHARGE COMMAND
RA
55
A0
PRECHARGE COMMAND
CA
DIN
PRECHARGE COMMAND
Sector Erase Cycle Waveforms
SECTOR ERASE CYCLE
CLK
CS
tEC
WE
RAS
CAS
ADDR
DATA
Notes:
32
AA
55
AA
55
PRECHARGE
COMMAND
2A
55
AA
PRECHARGE
COMMAND
55
80
AA
PRECHARGE
COMMAND
55
AA
55
PRECHARGE
COMMAND
2A
55
SA
PRECHARGE
COMMAND
X
30
PRECHARGE
COMMAND
1. The Precharge command is optional. A Precharge command (CS, RAS, MR = L) during Program and Sector Erase cycles
(WE = L) will be treated as NOP, and the number of clock cycles between the bus cycle and the Precharge command or vice
versa should be “Don’t Care”.
2. For boot block programming, RA = CA = A0 ~ A12 and be held valid throughout program cycle; DQM should be held “H” during the four-bus cycle command operation.
3. For boot block erasing, SA = X; DQM should be held “H” during the six-bus cycle command operation.
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Data Polling Waveforms
tPGM/tEC
CLK
DQM
CS
WE
RAS
CAS
ADDR
DQ7
(RL2, CL5, BL4)
Note:
RA
RA
CA
READ
(DATA POLLING)
DATA
CA
READ
DATA
During Program cycle, DATA = complement of loaded DQ7.
After Program cycle, DATA = same state as loaded DQ7.
During Sector Erase cycle, DATA = “0”; after Sector Erase cycle, DATA = “1”.
Data Polling Waveforms for Boot Block
tPGM/tEC
CLK
DQM
CS
WE
RAS
CAS
ADDR
DQ7
(RL2, CL5, BL4)
Note:
VALID ADDRESS
READ
(DATA POLLING)
DATA
READ
DATA
During Program cycle, DATA = complement of loaded DQ7.
After Program cycle, DATA = same state as loaded DQ7.
During Sector Erase cycle, DATA = “0”; after Sector Erase cycle, DATA = “1”.
33
1940B–11/01
Product ID Cycle Waveforms
PRODUCT ID CYCLE
CLK
DQM
CS
WE
RAS
CAS
ADDR
A7
DATA
(CL5, BL4, X16)
MC DC
DATA
(CL5, BL4, X32)
C
MR
READ
MRS
Note:
For x16 Mode, Manufacturer Code, MC = 001F(HEX), Device Code, DC = 32C2 (HEX).
For x32 Mode, Code, C = 32C2001F (HEX).
Continuity Test Mode Entry Waveforms
CLK
DQM
CS
WE
RAS
CAS
ADDR
DATA
34
AA
55
AA
55
PRECHARGE
COMMAND
2A
55
AA
PRECHARGE
COMMAND
55
80
AA
PRECHARGE
COMMAND
55
AA
AA
PRECHARGE
COMMAND
55
70
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Boot Block Lockout Cycle Waveforms
BOOT BLOCK LOCKOUT CYCLE
CLK
CS
tBBL
WE
RAS
CAS
AA
ADDR
55
AA
DATA
55
PRECHARGE
COMMAND
AA
2A
55
PRECHARGE
COMMAND
AA
55
80
PRECHARGE
COMMAND
AA
55
AA
PRECHARGE
COMMAND
55
40
PRECHARGE
COMMAND
Boot Block Lockout Verify Cycle Waveforms
BOOT BLOCK LOCKOUT VERIFY CYCLE
CLK
200 ns
CS
WE
RAS
CAS
AA
ADDR
DATA
(CL5, BL4)
Note:
55
AA
55
PRECHARGE
COMMAND
2A
55
AA
PRECHARGE
COMMAND
55
80
AA
PRECHARGE
COMMAND
55
AA
AA
PRECHARGE
COMMAND
55
90
PRECHARGE
COMMAND
READ
DQ
DQ = XX00 (Hex) implies Boot Block not activated and Lockout not enabled.
DQ = XX01 (Hex) implies Boot Block not activated and Lockout enabled.
DQ = XX02 (Hex) implies Boot Block activated and Lockout not enabled.
DQ = XX03 (Hex) implies Boot Block activated and Lockout enabled.
35
1940B–11/01
Boot Block Lockout Verify Exit Cycle Waveforms
BOOT BLOCK LOCKOUT VERIFY EXIT CYCLE
CLK
CS
10 µs
WE
RAS
CAS
ADDR
DATA
36
AA
55
AA
55
PRECHARGE
COMMAND
2A
55
AA
PRECHARGE
COMMAND
55
80
AA
PRECHARGE
COMMAND
55
AA
AA
PRECHARGE
COMMAND
55
F0
PRECHARGE
COMMAND
AT49LD3200(B)
1940B–11/01
AT49LD3200(B)
Ordering Information
ICC (mA)
Max Freq
(MHz)
Active
Standby
100
150
0.05
150
75
50
Ordering Code
Package
Operation Range
AT49LD3200-10TC
86T
Commercial
(0° to 70°C)
0.05
AT49LD3200-10TI
86T
Industrial
(-40° to 85°C)
150
0.05
AT49LD3200-13TC
86T
Commercial
(0° to 70°C)
150
0.05
AT49LD3200-13TI
86T
Industrial
(-40° to 85°C)
150
0.05
AT49LD3200-20TC
86T
Commercial
(0° to 70°C)
150
0.05
AT49LD3200-20TI
86T
Industrial
(-40° to 85°C)
Package Type
86T
86-lead, Thin Small Outline Package (TSOP Type II)
37
1940B–11/01
Packaging Information
86T – TSOP Type II
0˚ ~ 8˚
c
E1
E
L
PIN 1 Identifier
L1
b
PIN 1
GAGE PLANE
SEATING PLANE
D
A
e
A1
A2
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MO-142, Variation EC.
2. Dimensions D and E1 do not include mold protrusion. Allowable
protrusion on E1 is 0.25 mm per side and on D is 0.15 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
SYMBOL
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.95
1.00
1.05
D
22.12
22.22
22.32
E
11.56
11.76
11.96
E1
10.06
10.16
10.26
L
0.40
0.50
0.60
L1
Note 2
Note 2
0.25 BASIC
b
0.17
c
0.12
e
NOTE
0.22
0.27
–
0.21
0.50 BASIC
10/18/01
R
38
2325 Orchard Parkway
San Jose, CA 95131
TITLE
86T, 86-lead (10.16 mm Body Width) Thin Small Outline Package
(TSOP Type ll)
DRAWING NO.
REV.
86T
B
AT49LD3200(B)
1940B–11/01
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© Atmel Corporation 2001.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty
which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does
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1940B–11/01/xM