ETC BSP52T1/D

BSP52T1
Preferred Device
NPN Small-Signal
Darlington Transistor
This NPN small signal darlington transistor is designed for use in
switching applications, such as print hammer, relay, solenoid and lamp
drivers. The device is housed in the SOT-223 package, which is
designed for medium power surface mount applications.
• The SOT-223 Package can be soldered using wave or reflow. The
•
•
formed leads absorb thermal stress during soldering, eliminating the
possibility of damage to the die
Available in 12 mm Tape and Reel
Use BSP52T1 to order the 7 inch/1000 unit reel
PNP Complement is BSP62T1
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MEDIUM POWER
NPN SILICON
SURFACE MOUNT
DARLINGTON TRANSISTOR
COLLECTOR 2,4
BASE
1
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Max
Unit
Collector-Emitter Voltage
VCES
80
Vdc
Collector-Base Voltage
VCBO
90
Vdc
Emitter-Base Voltage
VEBO
5.0
Vdc
Collector Current
IC
1.0
Adc
Total Power Dissipation
@ TA = 25°C (Note 1.)
Derate above 25°C
PD
0.8
Watts
6.4
mW/°C
Total Power Dissipation
@ TA = 25°C (Note 2.)
Derate above 25°C
Operating and Storage
Temperature Range
PD
TJ, Tstg
1.25
Watts
10
mW/°C
–65 to 150
°C
EMITTER 3
4
1
2
3
SOT–223
CASE 318E
STYLE 1
DEVICE MARKING
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance –
Junction-to-Ambient (Note 1.)
RθJA
156
°C/W
Thermal Resistance –
Junction-to-Ambient (Note 2.)
RθJA
100
°C/W
TL
260
°C
10
Sec
Maximum Temperature for
Soldering Purposes
Time in Solder Bath
LWW
AS3
L
WW
AS3
1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum
recommended footprint.
2. Device mounted on a FR-4 glass epoxy printed circuit board using 1 cm2 pad.
= Assembly Location
= Date Code
= Specific Device Code
ORDERING INFORMATION
Device
BSP52T1
Package
Shipping
SOT–223
1000/Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
 Semiconductor Components Industries, LLC, 2001
January, 2001 – Rev. 2
1
Publication Order Number:
BSP52T1/D
BSP52T1
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Characteristics
Min
Max
90
–
5.0
–
–
10
–
10
1000
2000
–
–
–
1.3
–
1.9
Unit
OFF CHARACTERISTICS
Collector-Base Breakdown Voltage
(IC = 100 µAdc, IE = 0)
V(BR)CBO
Emitter-Base Breakdown Voltage
(IE = 10 µAdc, IC = 0)
V(BR)EBO
Collector-Emitter Cutoff Current
(VCE = 80 Vdc, VBE = 0)
ICES
Emitter-Base Cutoff Current
(VEB = 4.0 Vdc, IC = 0)
IEBO
Vdc
Vdc
µAdc
µAdc
ON CHARACTERISTICS (Note 3.)
hFE
DC Current Gain
(IC = 150 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 10 Vdc)
Collector-Emitter Saturation Voltage
(IC = 500 mAdc, IB = 0.5 mAdc)
VCE(sat)
Base-Emitter On Voltage
(IC = 500 mAdc, IB = 0.5 mAdc)
VBE(on)
3. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
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2
–
Vdc
Vdc
BSP52T1
INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.15
3.8
0.079
2.0
0.091
2.3
0.248
6.3
0.091
2.3
0.079
2.0
0.059
1.5
0.059
1.5
0.059
1.5
inches
mm
SOT-223
SOT-223 POWER DISSIPATION
Although the power dissipation can almost be doubled with
this method, area is taken up on the printed circuit board
which can defeat the purpose of using surface mount
technology. A graph of RθJA versus collector pad area is
shown in Figure 1.
The power dissipation of the SOT-223 is a function of the
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RθJA, the thermal resistance from
the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data
sheet for the SOT-223 package, PD can be calculated as
follows:
R
JA , Thermal Resistance, Junction
to Ambient (C/W)
PD =
160
Board Material = 0.0625″
G10/FR4, 2 oz Copper
140
TJ(max) – TA
TA = 25°C
0.8 Watts
° 120
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 0.8 watts.
1.25 Watts*
1.5 Watts
100
θ
80
0.0
PD = 150°C – 25°C = 0.8 watts
156°C/W
*Mounted on the DPAK footprint
0.2
0.4
0.6
A, Area (square inches)
0.8
1.0
Figure 1. Thermal Resistance versus Collector
Pad Area for the SOT-223 Package (Typical)
The 156°C/W for the SOT-223 package assumes the use
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 0.8 watts.
There are other alternatives to achieving higher power
dissipation from the SOT-223 package. One is to increase
the area of the collector pad. By increasing the area of the
collector pad, the power dissipation can be increased.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
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3
BSP52T1
SOLDER STENCIL GUIDELINES
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the SOT-223 package should
be the same as the pad size on the printed circuit board, i.e.,
a 1:1 registration.
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
SOLDERING PRECAUTIONS
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10°C.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
TYPICAL SOLDER HEATING PROFILE
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 2 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
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4
BSP52T1
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
STEP 2
STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150°C
STEP 5
STEP 6 STEP 7
STEP 4
HEATING
VENT COOLING
HEATING
ZONES 3 & 6 ZONES 4 & 7
205° TO
SPIKE"
SOAK"
219°C
170°C
PEAK AT
SOLDER
160°C
JOINT
150°C
100°C
140°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TMAX
TIME (3 TO 7 MINUTES TOTAL)
Figure 2. Typical Solder Heating Profile
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5
BSP52T1
PACKAGE DIMENSIONS
SOT–223
CASE 318E–04
ISSUE K
A
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
S
1
2
3
B
D
L
G
J
C
0.08 (0003)
H
M
K
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6
INCHES
DIM MIN
MAX
A
0.249
0.263
B
0.130
0.145
C
0.060
0.068
D
0.024
0.035
F
0.115
0.126
G
0.087
0.094
H 0.0008 0.0040
J
0.009
0.014
K
0.060
0.078
L
0.033
0.041
M
0
10 S
0.264
0.287
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
MILLIMETERS
MIN
MAX
6.30
6.70
3.30
3.70
1.50
1.75
0.60
0.89
2.90
3.20
2.20
2.40
0.020
0.100
0.24
0.35
1.50
2.00
0.85
1.05
0
10 6.70
7.30
BSP52T1
Notes
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BSP52T1
Thermal Clad is a trademark of the Bergquist Company
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
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For additional information, please contact your local
Sales Representative.
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BSP52T1/D