ETC BT137X_SERIES_E

Philips Semiconductors
Product specification
Triacs
sensitive gate
GENERAL DESCRIPTION
Passivated, sensitive gate triacs in a
full pack, plastic envelope, intended
for use in general purpose
bidirectional switching and phase
control applications, where high
sensitivity is required in all four
quadrants.
PINNING - SOT186A
PIN
BT137X series E
QUICK REFERENCE DATA
SYMBOL
VDRM
IT(RMS)
ITSM
PARAMETER
MAX.
MAX.
UNIT
BT137XRepetitive peak off-state
voltages
RMS on-state current
Non-repetitive peak on-state
current
600E
600
800E
800
V
8
65
8
65
A
A
PIN CONFIGURATION
SYMBOL
DESCRIPTION
case
1
main terminal 1
2
main terminal 2
3
gate
T2
T1
G
1 2 3
case isolated
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
VDRM
Repetitive peak off-state
voltages
IT(RMS)
ITSM
RMS on-state current
Non-repetitive peak
on-state current
I2t
dIT/dt
IGM
VGM
PGM
PG(AV)
Tstg
Tj
I2t for fusing
Repetitive rate of rise of
on-state current after
triggering
Peak gate current
Peak gate voltage
Peak gate power
Average gate power
Storage temperature
Operating junction
temperature
CONDITIONS
MIN.
-
full sine wave; Ths ≤ 73 ˚C
full sine wave; Tj = 25 ˚C prior to
surge
t = 20 ms
t = 16.7 ms
t = 10 ms
ITM = 12 A; IG = 0.2 A;
dIG/dt = 0.2 A/µs
T2+ G+
T2+ GT2- GT2- G+
over any 20 ms period
MAX.
-600
6001
UNIT
-800
800
V
-
8
A
-
65
71
21
A
A
A2s
-40
-
50
50
50
10
2
5
5
0.5
150
125
A/µs
A/µs
A/µs
A/µs
A
V
W
W
˚C
˚C
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 6 A/µs.
June 2001
1
Rev 1.400
Philips Semiconductors
Product specification
Triacs
sensitive gate
BT137X series E
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Visol
R.M.S. isolation voltage from all
three terminals to external
heatsink
f = 50-60 Hz; sinusoidal
waveform;
R.H. ≤ 65% ; clean and dustfree
-
-
2500
V
Cisol
Capacitance from T2 to external f = 1 MHz
heatsink
-
10
-
pF
MIN.
TYP.
MAX.
UNIT
-
55
4.5
6.5
-
K/W
K/W
K/W
MIN.
TYP.
MAX.
UNIT
T2+ G+
T2+ GT2- GT2- G+
-
2.5
4.0
5.0
11
10
10
10
25
mA
mA
mA
mA
T2+ G+
T2+ GT2- GT2- G+
VD = 12 V; IGT = 0.1 A
IT = 10 A
VD = 12 V; IT = 0.1 A
VD = 400 V; IT = 0.1 A; Tj = 125 ˚C
VD = VDRM(max); Tj = 125 ˚C
0.25
-
3.0
14
3.0
4.0
2.5
1.3
0.7
0.4
0.1
25
35
25
35
20
1.65
1.5
0.5
mA
mA
mA
mA
mA
V
V
V
mA
MIN.
TYP.
MAX.
UNIT
-
50
-
V/µs
-
2
-
µs
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
Rth j-hs
Thermal resistance
junction to heatsink
Rth j-a
Thermal resistance
junction to ambient
full or half cycle
with heatsink compound
without heatsink compound
in free air
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
IGT
Gate trigger current
VD = 12 V; IT = 0.1 A
IL
Latching current
IH
VT
VGT
Holding current
On-state voltage
Gate trigger voltage
ID
Off-state leakage current
VD = 12 V; IGT = 0.1 A
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
dVD/dt
Critical rate of rise of
off-state voltage
Gate controlled turn-on
time
VDM = 67% VDRM(max); Tj = 125 ˚C;
exponential waveform; gate open circuit
VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/µs;
ITM = 12 A
tgt
June 2001
2
Rev 1.400
Philips Semiconductors
Product specification
Triacs
sensitive gate
12
BT137X series E
Ths(max) / C
71
= 180
Ptot / W
120
10
10
80
8
73 C
89
60
6
30
6
BT137X
8
90
1
IT(RMS) / A
98
4
4
107
2
116
0
0
2
4
6
IT(RMS) / A
2
125
10
8
0
-50
Fig.1. Maximum on-state dissipation, Ptot, versus rms
on-state current, IT(RMS), where α = conduction angle.
1000
50
Ths / C
100
150
Fig.4. Maximum permissible rms current IT(RMS) ,
versus heatsink temperature Ths.
ITSM / A
IT
0
I TSM
25
time
20
IT(RMS) / A
Tj initial = 25 C max
15
100
dI T /dt limit
10
T2- G+ quadrant
5
10
10us
100us
1ms
T/s
10ms
0
0.01
100ms
Fig.2. Maximum permissible non-repetitive peak
on-state current ITSM, versus pulse width tp, for
sinusoidal currents, tp ≤ 20ms.
80
60
50
1.6
ITSM
IT
T
10
Fig.5. Maximum permissible repetitive rms on-state
current IT(RMS), versus surge duration, for sinusoidal
currents, f = 50 Hz; Ths ≤ 73˚C.
ITSM / A
70
0.1
1
surge duration / s
VGT(Tj)
VGT(25 C)
1.4
time
Tj initial = 25 C max
1.2
40
1
30
0.8
20
0.6
10
0
1
10
100
Number of cycles at 50Hz
0.4
-50
1000
Fig.3. Maximum permissible non-repetitive peak
on-state current ITSM, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
June 2001
0
50
Tj / C
100
150
Fig.6. Normalised gate trigger voltage
VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.
3
Rev 1.400
Philips Semiconductors
Product specification
Triacs
sensitive gate
3
BT137X series E
IGT(Tj)
IGT(25 C)
25
Tj = 125 C
Tj = 25 C
T2+ G+
T2+ GT2- GT2- G+
2.5
IT / A
2
max
typ
20
Vo = 1.264 V
Rs = 0.0378 Ohms
15
1.5
10
1
5
0.5
0
-50
0
50
Tj / C
100
0
150
0.5
1
1.5
VT / V
2
2.5
3
Fig.10. Typical and maximum on-state characteristic.
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.
3
0
IL(Tj)
IL(25 C)
10
Zth j-hs (K/W)
with heatsink compound
without heatsink compound
2.5
unidirectional
1
2
bidirectional
1.5
0.1
1
P
D
tp
t
0.5
0
-50
0
50
Tj / C
100
0.01
10us
150
1ms
10ms
0.1s
1s
10s
tp / s
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature Tj.
3
0.1ms
Fig.11. Transient thermal impedance Zth j-hs, versus
pulse width tp.
IH(Tj)
IH(25C)
1000
dVD/dt (V/us)
2.5
100
2
1.5
10
1
0.5
0
-50
0
50
Tj / C
100
1
150
50
100
150
Tj / C
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature Tj.
June 2001
0
Fig.12. Typical, critical rate of rise of off-state voltage,
dVD/dt versus junction temperature Tj.
4
Rev 1.400
Philips Semiconductors
Product specification
Triacs
sensitive gate
BT137X series E
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
10.3
max
4.6
max
3.2
3.0
2.9 max
2.8
Recesses (2x)
2.5
0.8 max. depth
6.4
15.8
max.
19
max.
15.8
max
seating
plane
3 max.
not tinned
3
2.5
13.5
min.
1
0.4
2
3
M
1.0 (2x)
0.6
2.54
0.9
0.7
0.5
2.5
5.08
1.3
Fig.13. SOT186A; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
June 2001
5
Rev 1.400
Philips Semiconductors
Product specification
Triacs
sensitive gate
BT137X series E
DEFINITIONS
DATA SHEET STATUS
DATA SHEET
STATUS2
PRODUCT
STATUS3
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for
product development. Philips Semiconductors reserves the right to
change the specification in any manner without notice
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in ordere to improve the design and supply the best possible
product
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in
order to improve the design, manufacturing and supply. Changes will
be communicated according to the Customer Product/Process
Change Notification (CPCN) procedure SNW-SQ-650A
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 2001
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The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
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LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
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from such improper use or sale.
2 Please consult the most recently issued datasheet before initiating or completing a design.
3 The product status of the device(s) described in this datasheet may have changed since this datasheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
June 2001
6
Rev 1.400