ETC FM2G75US60

IGBT
FM2G75US60
Molding Type Module
General Description
Fairchild IGBT Power Module provides low conduction and
switching losses as well as short circuit ruggedness. It’s
designed for the applications such as motor control, UPS
and general inverters where short-circuit ruggedness is
required.
Features
•
•
•
•
•
Short Circuit rated 10us @ TC = 100°C, VGE = 15V
High Speed Switching
Low Saturation Voltage : VCE(sat) = 2.2 V @ IC = 75A
High Input Impedance
Fast & Soft Anti-Parallel FWD
Package Code : 7PM-AA
Application
•
•
•
•
•
E1/C2
AC & DC Motor Controls
General Purpose Inverters
Robotics
Servo Controls
UPS
C1
E2
G1
E1
G2
E2
Internal Circuit Diagram
Absolute Maximum Ratings
Symbol
VCES
VGES
IC
ICM (1)
IF
IFM
TSC
PD
TJ
Tstg
Viso
Mounting
Torque
TC = 25°C unless otherwise noted
Description
Collector-Emitter Voltage
Gate-Emitter Voltage
Collector Curent
Pulsed Collector Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Short Circuit Withstand Time
Maximum Power Dissipation
Operating Junction Temperature
Storage Temperature Range
Isolation Voltage
Power Terminals Screw : M5
Mounting Screw : M5
@ TC = 25°C
@ TC = 100°C
@ TC = 100°C
@ TC = 25°C
@ AC 1minute
FM2G75US60
600
± 20
75
150
75
150
10
310
-40 to +150
-40 to +125
2500
2.0
2.0
Units
V
V
A
A
A
A
us
W
°C
°C
V
N.m
N.m
Notes :
(1) Repetitive rating : Pulse width limited by max. junction temperature
©2000 Fairchild Semiconductor International
FM2G75US60 Rev. A
FM2G75US60
September 2000
Symbol
Parameter
C
= 25°C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Units
600
--
--
V
VGE = 0V, IC = 1mA
--
0.6
--
V/°C
VCE = VCES, VGE = 0V
VGE = VGES, VCE = 0V
---
---
250
± 100
uA
nA
5.0
--
8.5
V
IC = 75A, VGE = 15V
--
2.2
2.8
V
VCE = 30V, VGE = 0V,
f = 1MHz
----
7056
672
180
----
pF
pF
pF
---------------
24
41
120
87
2.4
1.8
4.2
27
43
175
124
2.6
2.7
5.3
--150
200
-----------
ns
ns
ns
ns
mJ
mJ
mJ
ns
ns
ns
ns
mJ
mJ
mJ
VCC = 300 V, VGE = 15V
100°C
10
--
--
us
VCE = 300 V, IC = 75A,
VGE = 15V
----
310
62
130
350
---
nC
nC
nC
Off Characteristics
BVCES
∆BVCES/
∆TJ
ICES
IGES
Collector-Emitter Breakdown Voltage
Temperature Coeff. of Breakdown
Voltage
Collector Cut-Off Current
G-E Leakage Current
VGE = 0V, IC = 250uA
On Characteristics
VGE(th)
VCE(sat)
G-E Threshold Voltage
Collector to Emitter
Saturation Voltage
IC = 0V, IC = 75mA
Dynamic Characteristics
Cies
Coes
Cres
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Tsc
Short Circuit Withstand Time
Qg
Qge
Qgc
Total Gate Charge
Gate-Emitter Charge
Gate-Collector Charge
©2000 Fairchild Semiconductor International
VCC = 300 V, IC = 75A,
RG = 3.3Ω, VGE = 15V
Inductive Load, TC = 25°C
VCC = 300 V, IC = 75A,
RG = 3.3Ω, VGE = 15V
Inductive Load, TC = 125°C
@ TC =
FM2G75US60 Rev. A
FM2G75US60
Electrical Characteristics of IGBT T
C
Symbol
Parameter
VFM
Diode Forward Voltage
trr
Diode Reverse Recovery Time
Irr
Diode Peak Reverse Recovery
Current
Qrr
Diode Reverse Recovery Charge
= 25°C unless otherwise noted
Test Conditions
TC = 25°C
IF = 75A
TC = 100°C
IF = 75A
di / dt = 150 A/us
Min.
--
Typ.
1.9
Max.
2.8
--
1.8
--
TC = 25°C
--
90
130
TC = 100°C
--
130
--
TC = 25°C
--
7
9
TC = 100°C
--
10
--
TC = 25°C
--
315
590
TC = 100°C
--
650
--
Units
V
ns
A
nC
Thermal Characteristics
Symbol
RθJC
RθJC
RθCS
Weight
Parameter
Junction-to-Case (IGBT Part, per 1/2 Module)
Junction-to-Case (DIODE Part, per 1/2 Module)
Case-to-Sink
(Conductive grease applied)
Weight of Module
©2000 Fairchild Semiconductor International
Typ.
--0.05
--
Max.
0.4
0.9
-190
Units
°C/W
°C/W
°C/W
g
FM2G75US60 Rev. A
FM2G75US60
Electrical Characteristics of DIODE T
200
Common Emitter
TC = 25℃
180
20V
15V
Common Emitter
V GE = 15V
T C = 25℃
T C = 125℃
12V
Collector Current, I C [A]
160
Collector Current, I C [A]
FM2G75US60
200
140
120
Vge = 10V
100
80
60
40
160
120
80
40
20
0
0
0
2
4
6
8
0.3
Collector - Emitter Voltage, VCE [V]
20
Fig 2. Typical Saturation Voltage Characteristics
5
100
V CC = 300V
Load Current : peak of square wave
Common Emitter
V GE = 15V
4
80
Load Current [A]
150A
3
75A
2
IC = 40A
1
60
40
20
0
Duty cycle : 50%
Tc = 100℃
Power Dissipation = 100W
0
0
30
60
90
120
150
0.1
1
10
Case Temperature, Tc [℃]
100
1000
Frequency [Khz]
Fig 3. Saturation Voltage vs. Case
Temperature at Variant Current Level
Fig 4. Load Current vs. Frequency
20
20
Common Emitter
TC = 125℃
Collector - Emitter Voltage, V CE [V]
Common Emitter
TC = 25℃
Collector - Emitter Voltage, V CE [V]
10
Collector - Emitter Voltage, V CE [V]
Fig 1. Typical Output Characteristics
Collector - Emitter Voltage, V CE [V]
1
16
12
8
150A
4
75A
Ic = 40A
0
16
12
8
150A
75A
4
Ic = 40A
0
0
4
8
12
16
Gate - Emitter Voltage, VGE [V]
Fig 5. Saturation Voltage vs. VGE
©2000 Fairchild Semiconductor International
20
0
4
8
12
16
20
Gate - Emitter Voltage, V GE [V]
Fig 6. Saturation Voltage vs. VGE
FM2G75US60 Rev. A
1000
Common Emitter
V GE = 0V, f = 1MHz
T C = 25℃
14000
Common Emitter
V CC = 300V, VGE = ± 15V
IC = 75A
T C = 25℃
T C = 125℃
Switching Time [ns]
Capacitance [pF]
12000
Cies
10000
8000
6000
Coes
4000
FM2G75US60
16000
Ton
Tr
100
Cres
2000
10
0
1
1
10
10
100
Gate Resistance, R G [Ω ]
Collector - Emitter Voltage, V CE [V]
Fig 7. Capacitance Characteristics
Fig 8. Turn-On Characteristics vs.
Gate Resistance
1000
10000
Toff
100
Common Emitter
VCC = 300V, V GE = ± 15V
IC = 75A
TC = 25℃
TC = 125℃
Eon
Switching Loss [uJ]
Switching Time [ns]
20000
Common Emitter
V CC = 300V, VGE = ± 15V
IC = 75A
T C = 25℃
T C = 125℃
Eoff
Tf
1000
10
1
100
10
Fig 9. Turn-Off Characteristics vs.
Gate Resistance
Fig 10. Switching Loss vs. Gate Resistance
300
1000
Common Emitter
V CC = 300V, V GE = ± 15V
RG = 3.3Ω
T C = 25℃
T C = 125℃
100
Common Emitter
V CC = 300V, V GE = ± 15V
RG = 3.3Ω
T C = 25℃
T C = 125℃
Switching Time [ns]
Switching Time [ns]
100
Gate Resistance, Rg [Ω ]
Gate Resistance, RG [Ω ]
Ton
Tr
Toff
100
Tf
10
20
30
40
50
60
Collector Current, IC [A]
Fig 11. Turn-On Characteristics vs.
Collector Current
©2000 Fairchild Semiconductor International
70
75
20
30
40
50
60
70
75
Collector Current, IC [A]
Fig 12. Turn-Off Characteristics vs.
Collector Current
FM2G75US60 Rev. A
Gate - Emitter Voltage, V GE [ V ]
Switching Loss [uJ]
15
Common Emitter
V CC = 300V, V GE = ± 15V
RG = 3.3 Ω
T C = 25℃
T C = 125℃
Eoff
1000
FM2G75US60
10000
Eoff
Eon
Eon
Common Emitter
RL = 4 Ω
T C = 25℃
12
300 V
9
200 V
V CC = 100 V
6
3
0
100
20
30
40
50
60
70
75
0
50
100
Collector Current, IC [A]
150
200
250
300
350
Gate Charge, Qg [ nC ]
Fig 13. Switching Loss vs. Collector Current
Fig 14. Gate Charge Characteristics
500
IC MAX. (Pulsed)
IC MAX. (Continuous)
100
50us
100us
Collector Current, I C [A]
Collector Current, I C [A]
100
1㎳
10
DC Operation
Single Nonrepetitive
Pulse TC = 25℃
Curves must be derated
linerarly with increase
in temperature
1
0.1
10
Safe Operating Area
o
V GE = 20V, TC = 100 C
1
0.3
1
10
100
1000
1
10
100
1000
Collector-Emitter Voltage, V CE [V]
Collector-Emitter Voltage, VCE [V]
Fig 15. SOA Characteristics
Fig 16. Turn-Off SOA Characteristics
500
Thermal Response, Zthjc [℃/W]
1
Collector Current, I C [A]
100
10
1
0.1
Single Nonrepetitive
Pulse TJ ≤ 125℃
V GE = 15V
RG = 3.3 Ω
0
100
200
300
400
500
Collector-Emitter Voltage, VCE [V]
Fig 17. RBSOA Characteristics
©2000 Fairchild Semiconductor International
600
700
0.1
0.01
T C = 25℃
IGBT :
DIODE :
1E-3
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
Rectangular Pulse Duration [sec]
Fig 18. Transient Thermal Impedance
FM2G75US60 Rev. A
Peak Reverse Recovery Current I rr [A]
Reverse Recovery Time Trr [x10ns]
Common Cathode
VGE = 0V
TC = 25℃
TC = 125℃
160
Forward Current, I F [A]
FM2G75US60
20
200
120
80
40
0
0
1
2
Forward Voltage, V F [V]
Fig 19. Forward Characteristics
©2000 Fairchild Semiconductor International
3
4
T rr
10
Irr
5
Common Cathode
di/dt = 150A/㎲
T C = 25℃
T C = 100℃
2
0
10
20
30
40
50
60
70
80
Forward Current, IF [A]
Fig 20. Reverse Recovery Characteristics
FM2G75US60 Rev. A
FM2G75US60
Package Dimension
30$$)63.*&2'(%'
12
E2
23
4
E1
E2
34
4
G2
17
C1
C2E1
G1
23
2-∅5.4 Mounting Hole
6.5
80±0.1
3-M5 DP8.5
93
7
16
TAP Terminal
-110(t0.5)
Max.
31.0
16
23.5
7
23
16
Dimensions in Millimeters
©2000 Fairchild Semiconductor International
FM2G75US60 Rev. A
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
INTERNATIONAL.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
©2000 Fairchild Semiconductor International
Rev. F1