AC INPUT/PHOTOTRANSISTOR OPTOCOUPLERS H11AA1 H11AA3 H11AA2 H11AA4 DESCRIPTION The H11AAX series consists of two gallium-arsenide infrared emitting diodes connected in inverse parallel driving a single silicon phototransistor output. 6 1 FEATURES • • • • 6 SCHEMATIC Bi-polar emitter input Built-in reverse polarity input protection Underwriters Laboratory (UL) recognized File #E90700 VDE approved File #E94766 (ordering option ‘300’) 1 6 APPLICATIONS 6 BASE 2 5 COLL 3 4 EMITTER 1 • AC line monitor • Unknown polarity DC sensor • Telephone line interface Parameter 1 Symbol Device Value Units TSTG All -55 to +150 °C Operating Temperature TOPR All -55 to +100 °C Lead Solder Temperature TSOL All 260 for 10 sec °C 350 mW 4.6 mW/°C TOTAL DEVICE Storage Temperature Total Device Power Dissipation Derate Linearly From 25°C EMITTER Continuous Forward Current Forward Current - Peak (1 µs pulse, 300 pps) LED Power Dissipation Derate Linearly From 25°C PD All IF All 100 mA IF(pk) All ±1.0 A PD All PD All 200 mW 2.6 mW/°C 300 mW 4.0 mW/°C DETECTOR Detector Power Dissipation Derate above 25°C 2001 Fairchild Semiconductor Corporation DS300212 12/12/01 1 OF 7 www.fairchildsemi.com AC INPUT/PHOTOTRANSISTOR OPTOCOUPLERS H11AA1 H11AA3 ELECTRICAL CHARACTERISTICS H11AA2 H11AA4 (TA = 25°C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Device Min Typ Max Unit IF = ±10 mA VF = 0 V, f = 1.0 MHz VF All 1.2 80 1.5 V pF CJ All IC = 1.0 mA, IF = 0 BVCEO All 30 Collector to Base IC = 100 µA, IF = 0 BVCBO All 70 V V Emitter to Base IE = 100 µA, IF = 0 BVEBO All 5 V Emitter to Collector IE = 100 µA, IF = 0 BVECO All 7 V VCE = 10 V, IF = 0 ICEO VCE = 0, f = 1 MHz CCE All 10 pF Collector to Base VCE = 0, f = 1 MHz CCB All 80 Emitter to Base VCE = 0, f = 1 MHz CEB All 15 pF pF EMITTER Input Forward Voltage Capacitance DETECTOR Breakdown Voltage Collector to Emitter Leakage Current Collector to Emitter H11AA1,3,4 50 H11AA2 200 nA Capacitance Collector to Emitter TRANSFER CHARACTERISTICS Characteristics Current Transfer Ratio, Collector to Emitter Current Transfer Ratio, Symmetry Saturation Voltage Collector to Emitter (TA = 25°C Unless otherwise specified.) Test Conditions IF = ±10 mA, VCE = 10 V Symbol CTRCE Device Min H11AA4 100 H11AA3 50 H11AA1 20 H11AA2 10 All .33 IF = ±10 mA, VCE = 10 V (Figure.8) IF = ±10 mA, ICE = 0.5 mA VCE(SAT) Typ Max Units % All 3.0 % .40 V Max Units ISOLATION CHARACTERISTICS Characteristic Test Conditions Symbol Package Capacitance input/output VI-O = 0, f = 1 MHz CI-O Isolation Voltage f = 60 Hz, t = 1 min. VISO 5300 V VI-O = 500 VDC RISO 1011 Ω Isolation Resistance www.fairchildsemi.com 2 OF 7 Min Typ 0.7 pF 12/12/01 DS300212 AC INPUT/PHOTOTRANSISTOR OPTOCOUPLERS H11AA1 H11AA3 H11AA2 H11AA4 Fig. 2 Normalized CTR vs. Forward Current Fig. 1 Input Voltage vs. Input Current 100 1.4 VCE = 5.0V TA = 25˚C 80 Normalized to IF = 10 mA 1.2 I F - INPUT CURRENT (mA) 60 40 NORMALIZED CTR 1.0 20 0 -20 -40 0.8 0.6 0.4 -60 0.2 -80 -100 -2.0 0.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0 5 NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) NORMALIZED CTR IF = 5 mA 1.2 IF = 10 mA 1.0 0.8 0.6 Normalized to IF = 10 mA TA = 25˚C 0.4 -75 IF = 20 mA 0.9 VCE= 5.0 V 0.8 IF = 20 mA 0.7 0.6 IF = 10 mA 0.5 0.4 IF = 5 mA 0.3 0.2 0.1 0.0 -50 -25 0 25 50 75 100 125 10 0.9 VCE= 0.3 V 0.8 IF = 20 mA 0.7 IF = 10 mA 0.5 0.4 IF = 5 mA 0.2 0.1 10 100 RBE- BASE RESISTANCE (k W ) 12/12/01 1000 VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) 1.0 0.3 1000 Fig. 6 Collector-Emitter Saturation Voltage vs Collector Current Fig. 5 CTR vs. RBE (Saturated) 0.6 100 RBE- BASE RESISTANCE (kW ) TA - AMBIENT TEMPERATURE (˚C) NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) 20 1.0 1.4 DS300212 15 Fig. 4 CTR vs. RBE (Unsaturated) Fig. 3 Normalized CTR vs. Ambient Temperature 1.6 0.0 10 IF - FORWARD CURRENT (mA) VF - INPUT VOLTAGE (V) 100 10 1 IF = 2.5 mA 0.1 IF = 10 mA 0.01 IF = 20 mA IF = 5 mA TA = 25˚C 0.001 0.01 3 OF 7 0.1 1 10 IC - COLLECTOR CURRENT (mA) www.fairchildsemi.com AC INPUT/PHOTOTRANSISTOR OPTOCOUPLERS H11AA1 H11AA3 H11AA2 H11AA4 Fig. 7 Switching Speed vs. Load Resistor Fig. 8 Normalized ton vs. RBE 1000 5.0 NORMALIZED ton - (ton(RBE) / ton(open)) SWITCHING SPEED - (µs) IF = 10 mA VCC = 10 V TA = 25˚C 100 Toff 10 Tf Ton 1 Tr VCC = 10 V IC = 2 mA RL = 100 W 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.1 0.1 1 10 100 10 100 R-LOAD RESISTOR (kW ) 100000 Fig. 10 Dark Current vs. Ambient Temperature Fig. 9 Normalized toff vs. RBE 10000 1.2 1.1 1.0 0.9 0.8 0.7 0.6 VCC = 10 V IC = 2 mA RL = 100 W 0.5 0.4 0.3 0.2 10 100 1000 10000 100000 ICEO - COLLECTOR -EMITTER DARK CURRENT (nA) 1.3 NORMALIZED toff - (toff(RBE) / toff(open)) 10000 RBE- BASE RESISTANCE (k W ) 1.4 0.1 1000 VCE = 10 V TA = 25˚C 1000 100 10 1 0.1 0.01 0.001 RBE- BASE RESISTANCE (k W ) 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE (˚C) Fig. 11 Output Symmetry Characteristics 10 NORMALIZED OUTPUT CURRENT 5 1 IF = I - 10mA I IF = I 10mA I .5 NORMALIZED TO: VCE = 10 V IF = 10 mA .1 .05 THE MAXIMUM PEAK OUTPUT CURRENT WILL BE NO MORE THAN THREE TIMES THE MINIMUM PEAK OUTPUT CURRENT AT IF = ±10 mA .01 .005 .01 .05 .1 .5 1 5 10 VCE- COLLECTOR TO EMITTER VOLTAGE (V) www.fairchildsemi.com 4 OF 7 12/12/01 DS300212 AC INPUT/PHOTOTRANSISTOR OPTOCOUPLERS H11AA1 H11AA3 H11AA2 Package Dimensions (Through Hole) H11AA4 Package Dimensions (Surface Mount) PIN 1 ID. 0.350 (8.89) 0.330 (8.38) 0.270 (6.86) 0.240 (6.10) 3 2 PIN 1 ID. 1 SEATING PLANE 0.270 (6.86) 0.240 (6.10) 0.350 (8.89) 0.330 (8.38) 5 4 0.070 (1.78) 0.045 (1.14) 6 0.300 (7.62) TYP 0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.135 (3.43) 0.200 (5.08) 0.165 (4.18) 0.016 (0.41) 0.008 (0.20) 0.020 (0.51) MIN 0.154 (3.90) 0.100 (2.54) 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0° to 15° 0.020 (0.51) MIN 0.022 (0.56) 0.016 (0.41) 0.300 (7.62) TYP 0.100 (2.54) TYP 0.016 (0.40) MIN 0.315 (8.00) MIN 0.405 (10.30) MAX 0.100 (2.54) TYP Lead Coplanarity : 0.004 (0.10) MAX Package Dimensions (0.4”Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.070 (1.78) 0.270 (6.86) 0.240 (6.10) 0.060 (1.52) SEATING PLANE 0.350 (8.89) 0.330 (8.38) 0.415 (10.54) 0.070 (1.78) 0.045 (1.14) 0.100 (2.54) 0.295 (7.49) 0.200 (5.08) 0.135 (3.43) 0.154 (3.90) 0.100 (2.54) 0.004 (0.10) MIN 0.030 (0.76) 0.016 (0.40) 0.008 (0.20) 0° to 15° 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0.400 (10.16) TYP NOTE All dimensions are in inches (millimeters) DS300212 12/12/01 5 OF 7 www.fairchildsemi.com AC INPUT/PHOTOTRANSISTOR OPTOCOUPLERS H11AA1 H11AA3 H11AA2 H11AA4 ORDERING INFORMATION Order Entry Identifier Option S .S Description Surface Mount Lead Bend SD .SD Surface Mount; Tape and Reel W .W 0.4” Lead Spacing 300 .300 VDE 0884 300W .300W VDE 0884, 0.4” Lead Spacing 3S .3S VDE 0884, Surface Mount 3SD .3SD VDE 0884, Surface Mount, Tape and Reel Carrier Tape Specifications (“D” Taping Orientation) 12.0 ± 0.1 4.85 ± 0.20 4.0 ± 0.1 0.30 ± 0.05 4.0 ± 0.1 Ø1.55 ± 0.05 1.75 ± 0.10 7.5 ± 0.1 16.0 ± 0.3 13.2 ± 0.2 9.55 ± 0.20 0.1 MAX 10.30 ± 0.20 Ø1.6 ± 0.1 User Direction of Feed NOTE All dimensions are millimeters www.fairchildsemi.com 6 OF 7 12/12/01 DS300212 AC INPUT/PHOTOTRANSISTOR OPTOCOUPLERS H11AA1 H11AA3 H11AA2 H11AA4 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in labeling, can be reasonably expected to result in a significant injury of the user. DS300212 12/12/01 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 7 OF 7 www.fairchildsemi.com