ETC HC05E1GRS

Freescale Semiconductor, Inc.
General Release Specification
A G R E E M E N T
68HC05E1
N O N - D I S C L O S U R E
Freescale Semiconductor, Inc...
R E Q U I R E D
HC05E1GRS/D
REV. 2.0
For More Information On This Product,
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Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
A G R E E M E N T
R E Q U I R E D
General Release Specification
N O N - D I S C L O S U R E
Motorola reserves the right to make changes without further notice to
any products herein to improve reliability, function or design. Motorola
does not assume any liability arising out of the application or use of any
product or circuit described herein; neither does it convey any license
under its patent rights nor the rights of others. Motorola products are not
designed, intended, or authorized for use as components in systems
intended for surgical implant into the body, or other applications intended
to support or sustain life, or for any other application in which the failure
of the Motorola product could create a situation where personal injury or
death may occur. Should Buyer purchase or use Motorola products for
any such unintended or unauthorized application, Buyer shall indemnify
and hold Motorola and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Motorola
was negligent regarding the design or manufacture of the part.
General Release Specification
MC68HC05E1 — Rev. 2.0
2
MOTOROLA
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Freescale Semiconductor, Inc.
General Release Specification — MC68HC05E1
Table of Contents
Freescale Semiconductor, Inc...
Section 1. General Description
1.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
1.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
1.3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
1.4
Mask Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1.5
Functional Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1.5.1
VDD and VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1.5.2
IRQ (Maskable Interrupt Request) . . . . . . . . . . . . . . . . . . . .16
1.5.3
OSC1, OSC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.5.3.1
Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.5.3.2
Ceramic Resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.5.3.3
External Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.5.4
RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
1.5.5
PA0-PA7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
1.5.6
PB0-PB7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
1.5.7
PC0-PC3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
1.5.8
XFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
1.5.9
VDDSYN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Section 2. Operating Modes
2.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
2.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
2.3
Single-Chip Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
2.4
Self-Check Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
2.4.1
Timer Test Subroutine . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
2.4.2
ROM Checksum Subroutine. . . . . . . . . . . . . . . . . . . . . . . . .24
MC68HC05E1 — Revision 2.0
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Table of Contents
2.4.3
2.4.3.1
2.4.3.2
2.4.3.3
Additional Self-Check Routines . . . . . . . . . . . . . . . . . . . . . .25
Self-Check PLL Disabled . . . . . . . . . . . . . . . . . . . . . . . . .26
Jump to RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Load RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Freescale Semiconductor, Inc...
Section 3. CPU Core
3.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
3.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
3.3
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
3.3.1
Accumulator (A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
3.3.2
Index Register (X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
3.3.3
Condition Code Register (CCR) . . . . . . . . . . . . . . . . . . . . . .29
3.3.3.1
Half Carry (H) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
3.3.3.2
Interrupt (I) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
3.3.3.3
Negative (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
3.3.3.4
Zero (Z) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
3.3.3.5
Carry/Borrow (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
3.3.4
Stack Pointer (SP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
3.3.5
Program Counter (PC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
3.4
Instruction Set. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
3.4.1
Register/Memory Instructions. . . . . . . . . . . . . . . . . . . . . . . .32
3.4.2
Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . .33
3.4.3
Branch Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
3.4.4
Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . . .35
3.4.5
Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
3.5
Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
3.5.1
Immediate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
3.5.2
Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
3.5.3
Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
3.5.4
Re;atove . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
3.5.5
Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
3.5.6
Indexed, 8-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
3.5.7
Indexed, 16-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
3.5.8
Bit Set/Clear . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
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Table of Contents
3.5.9
3.5.10
Bit Test and Branch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
3.6
Resets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
3.6.1
Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
3.6.2
RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
3.6.3
Computer Operating Properly (COP) Reset . . . . . . . . . . . . .40
3.6.4
Illegal Address Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
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3.7
Interrupts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
3.7.1
Hardware Controlled Interrupt Sequence. . . . . . . . . . . . . . .42
3.7.2
Software Interrupt (SWI). . . . . . . . . . . . . . . . . . . . . . . . . . . .44
3.7.3
External Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
3.7.4
Timer Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
3.7.5
Custom Peirodic Interrupt (CPI) . . . . . . . . . . . . . . . . . . . . . .45
3.8
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
3.8.1
STOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
3.8.2
WAIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
3.8.3
Data-Retention Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Section 4. Input/Output Ports
4.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
4.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
4.3
Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
4.4
Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
4.5
Port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
4.6
Input/Output Programmingf . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Section 5. Memory
5.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
5.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
5.3
ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
5.4
RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
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Section 6. Timer, Phase-Locked Loop,
and Custom Periodic Interrupt
6.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
6.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Freescale Semiconductor, Inc...
6.3
Timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
6.3.1
Timer Control and Status Register (TCSR) $08 . . . . . . . . . .60
6.3.2
Computer Operating Properly (COP)
Watchdog Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
6.3.3
Timer Control Register (TCR) $09 . . . . . . . . . . . . . . . . . . . .63
6.4
Phase-Locked Loop Synthesizer . . . . . . . . . . . . . . . . . . . . . . .64
6.4.1
Phase-Locked Loop Control Register (PLLCR) $07 . . . . . .66
6.4.2
Operation During STOP Mode . . . . . . . . . . . . . . . . . . . . . . .68
6.4.3
Noise Immunity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
6.5
Custom Periodic Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
6.5.1
Custom Periodic Interrupt Control
and Status Register (CPICSR) $12. . . . . . . . . . . . . . . . .70
6.6
Operation During STOP Mode . . . . . . . . . . . . . . . . . . . . . . . . .70
6.7
Operation During WAIT Mode . . . . . . . . . . . . . . . . . . . . . . . . .71
Section 7. Electrical Specifications
7.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
7.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
7.3
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
7.4
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
7.5
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
7.6
5.0-Volt DC Electrical Characteristics. . . . . . . . . . . . . . . . . . . .76
7.7
3.3-Volt DC Electrical Characteristics. . . . . . . . . . . . . . . . . . . .77
7.8
5.0-Volt Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
7.9
3.3-Volt Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
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Section 8. Mechanical Specifications
8.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
8.2
Mechnical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
Freescale Semiconductor, Inc...
8.3
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
8.3.1
P Suffix, Plastic DIP, Case # 710-02 . . . . . . . . . . . . . . . . . .82
8.3.2
DW Suffix, SOIC, Case # 751F-02. . . . . . . . . . . . . . . . . . . .83
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List of Figures
Freescale Semiconductor, Inc...
Figure
Title
1-1
1-2
Block Diagram of the MC68HC05E1 . . . . . . . . . . . . . . . . . .15
Oscillator Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
2-1
2-2
2-3
Single-Chip Mode Pinout of the MC68HC05E1 . . . . . . . . . .22
Self-Check Circuit Schematic Diagram . . . . . . . . . . . . . . . .23
Self-Check Mode Flowchart . . . . . . . . . . . . . . . . . . . . . . . . .25
3-1
3-2
3-3
Interrupt Processing Flowchart. . . . . . . . . . . . . . . . . . . . . . .43
STOP/WAIT Flowcharts . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Port I/O Circuitry. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
4-1
Port I/O Circuitry. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
5-1
5-2
The 8 Kbyte Memory Map of the MC68HC05E1 . . . . . . . . .54
Input/Output (I/O) Registers . . . . . . . . . . . . . . . . . . . . . . . . .55
6-1
6-2
6-3
6-4
6-5
6-6
Timer Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Timer Control and Status Register (TCSR) . . . . . . . . . . . . .60
Timer Counter Register . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
PLL Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
Phase-Locked Loop Control Register . . . . . . . . . . . . . . . . .66
Custom Periodic Interrupt Control
and Status Register (CPICSR) . . . . . . . . . . . . . . . . . . . .70
7-1
7-2
7-3
External Interrupt Mode Diagram . . . . . . . . . . . . . . . . . . . . .79
Stop Recovery Timing Diagram . . . . . . . . . . . . . . . . . . . . . .79
Power-On Reset and RESET. . . . . . . . . . . . . . . . . . . . . . . .80
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List of Tables
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Table
Title
2-1
2-2
Operating Mode Conditions . . . . . . . . . . . . . . . . . . . . . . . . . .21
Self-Check Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
3-1
Vector Address for Interrupts and Reset . . . . . . . . . . . . . . . .42
4-1
I/O Pin Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
6-1
6-2
6-3
6-4
RTI Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
COP Reset Times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
Loop Filter Bandwidth Control . . . . . . . . . . . . . . . . . . . . . . . .67
PS1 and PS0 Speed Selects with 32.768 kHz Crystal . . . . . .68
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Section 1. General Description
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1.1 Contents
1.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
1.3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
1.4
Mask Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1.5
Functional Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1.5.1
VDD and VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1.5.2
IRQ (Maskable Interrupt Request) . . . . . . . . . . . . . . . . . . . .16
1.5.3
OSC1, OSC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.5.3.1
Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.5.3.2
Ceramic Resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.5.3.3
External Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.5.4
RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
1.5.5
PA0-PA7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
1.5.6
PB0-PB7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
1.5.7
PC0-PC3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
1.5.8
XFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
1.5.9
VDDSYN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
1.2 Introduction
The MC68HC05E1 is a low-cost introduction to the M68HC05 Family of
microcontrollers (MCUs). The HC05 CPU core has been enhanced with
a 15-stage multi-functional timer and programmable phase-locked loop.
The MCU is available in a 28-pin package, and has two 8-bit I/O ports
and one 4-bit I/O port. The 8 Kbyte memory map includes 368 bytes of
RAM and 4096 bytes of user ROM.
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1.3 Features
Freescale Semiconductor, Inc...
Features of the MC68HC05E1 include:
•
Low cost
•
HC05 Core
•
28-pin package
•
On-Chip Oscillator (Crystal or Ceramic Resonator)
•
Phase-Locked Loop (PLL) Synthesizer with Programmable Speed
•
4112 Bytes of User ROM (including 16 Bytes of User Vectors)
•
368 Bytes of On-Chip RAM
•
15-Stage Multi-functional Timer with Programmable Input
•
Real Time Interrupt Circuit
•
COP Watchdog Timer Mask Option
•
Custom Periodic Interrupt Circuit
•
20 Bidirectional I/O Lines
•
Single-Chip Mode
•
Self-Check Mode
•
Power Saving STOP and WAIT Modes
•
Edge-Sensitive or Edge- and Level-Sensitive Interrupt Trigger
Mask Option
•
STOP Instruction Disable Mask Option
•
Illegal Address Reset
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General Description
Features
OSC2
OSC1
OSCILLATOR
VDDSYN
XFC
PLL
SYNTH.
TPLL
÷2
CLOCK
SELECT
COP
SYSTEM
TIMER
SYSTEM
VDD
VSS
INTERNAL
PROCESSOR
CLOCK
OSCOUT
CUSTOM
PERIODIC
INTERRUPT
IRQ
ALU
M68HC05 CPU
CPU REGISTERS
PA1
PA2
PORT A
CPU
CONTROL
DATA DIRECTION REGISTER
RESET
PA3
PA4
PA5
PA6
ACCUMULATOR
PA7
INDEX REGISTER
PB0
PROGRAM COUNTER
CONDITION CODE REG.
SRAM — 368 BYTES
PB1
PB2
PORT B
DATA DIRECTION REGISTER
STACK POINTER
PB3
PB4
PB5
PB6
PB7
ROM — 4112 BYTES
SELF-CHECK ROM — 240 BYTES
PC0
PORT C
DATA DIR REG
Freescale Semiconductor, Inc...
PA0
PC1
PC2
PC3
Figure 1-1. Block Diagram of the MC68HC05E1
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1.4 Mask Options
There are four mask options on the MC68HC05E1: STOP instruction
(enable/disable), IRQ (Edge-sensitive only or Edge- and level-sensitive),
COP Watchdog Timer (enable/disable), and CPI Rate (1 second, 0.5
second, or 0.25 second).
Freescale Semiconductor, Inc...
NOTE:
A line over a signal name indicates an active low signal. For example,
RESET is active low.
1.5 Functional Pin Description
1.5.1 VDD and VSS
Power is supplied to the microcontroller using these two pins. VDD is the
positive supply and VSS is ground.
1.5.2 IRQ (Maskable Interrupt Request)
This pin has a programmable option that provides two different choices
of interrupt triggering sensitivity. The options are:
1. negative edge-sensitive triggering only, or
2. both negative edge-sensitive and level-sensitive triggering.
The MCU completes the current instruction before it responds to the
interrupt request. When IRQ goes low for at least one tILIH, a logic one
is latched internally to signify an interrupt has been requested. When the
MCU completes its current instruction, the interrupt latch is tested. If the
interrupt latch contains a logic one, and the interrupt mask bit (I bit) in the
condition code register is clear, the MCU then begins the interrupt
sequence.
If the option is selected to include level-sensitive triggering, the IRQ input
requires an external resistor to VDD for “wire-OR” operation.
The IRQ pin contains an internal Schmitt trigger as part of its input to
improve noise immunity. Refer to 3.7 Interrupts for more detail.
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General Description
Functional Pin Description
NOTE:
The voltage on this pin affects the mode of operation. See
Section 2. Operating Modes.
Freescale Semiconductor, Inc...
1.5.3 OSC1, OSC2
These pins provide control input for an on-chip clock oscillator circuit
which can optionally drive a Phase-Locked Loop clock. A crystal, a
ceramic resonator, or an external signal connects to these pins providing
a system clock. The oscillator frequency is two times the internal bus
rate if the PLL is not used.
1.5.3.1 Crystal
Figure 1-2 shows the recommended circuit for using a crystal. The
crystal and components should be mounted as close as possible to the
input pins to minimize output distortion and start-up stabilization time.
1.5.3.2 Ceramic Resonator
A ceramic resonator may be used in place of the crystal in cost-sensitive
applications. Figure 1-2 shows the recommended circuit for using a
ceramic resonator. The manufacturer of the particular ceramic resonator
being considered should be consulted for specific information.
1.5.3.3 External Clock
An external clock should be applied to the OSC1 input with the OSC2 pin
not connected. See Figure 1-2. This setup can be used if the user does
not wish to run the CPU with a 32.768 KHz crystal or the PLL frequencies
are not suitable for the application.
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MCU
OSC1
MCU
OSC2
OSC1
OSC2
330 kΩ
20 MΩ
Unconnected
< External Clock
Freescale Semiconductor, Inc...
10 PF
32.768 kHz
33 pF
(a) Crystal/Ceramic Resonator
Oscillator Connections
(b) External Clock Source
Connections
Figure 1-2. Oscillator Connections
1.5.4 RESET
This active low pin is used to reset the MCU to a known start-up state by
pulling RESET low. The RESET pin contains an internal Schmitt trigger
as part of its input to improve noise immunity. See 3.6 Resets.
1.5.5 PA0-PA7
These eight I/O lines comprise port A. The state of any pin is software
programmable and all port A lines are configured as input during
power-on or reset. See 4.6 Input/Output Programmingf.
1.5.6 PB0-PB7
These eight I/O lines comprise port B. The state of any pin is software
programmable and all port B lines are configured as input during
power-on or reset. See 4.6 Input/Output Programmingf.
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Functional Pin Description
1.5.7 PC0-PC3
These four I/O lines comprise port C. The state of any pin is software
programmable and all port C lines are configured as input during
power-on or reset. See 4.6 Input/Output Programmingf.
Freescale Semiconductor, Inc...
1.5.8 XFC
This pin provides a means for connecting an external filter capacitor to
the synthesizer phase-locked loop filter. See 6.4 Phase-Locked Loop
Synthesizer for additional information concerning this capacitor.
1.5.9 VDDSYN
This pin provides a separate power connection to the PLL synthesizer
which should be at the same potential as VDD.
NOTE:
Any unused inputs and I/O ports should be tied to an appropriate logic
level (either VDD or VSS). Although the I/O ports of the MC68HC05E1 do
not require termination, it is recommended to reduce the possibility of
static damage.
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General Description
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Section 2. Operating Modes
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2.1 Contents
2.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
2.3
Single-Chip Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
2.4
Self-Check Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
2.4.1
Timer Test Subroutine . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
2.4.2
ROM Checksum Subroutine. . . . . . . . . . . . . . . . . . . . . . . . .24
2.4.3
Additional Self-Check Routines . . . . . . . . . . . . . . . . . . . . . .25
2.4.3.1
Self-Check PLL Disabled . . . . . . . . . . . . . . . . . . . . . . . . .26
2.4.3.2
Jump to RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
2.4.3.3
Load RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
2.2 Introduction
The MCU has 3 modes of operation: Single-chip mode, Self-Check
Mode, and Test Mode. Table 2-1 shows the conditions required to go
into each mode.
Table 2-1. Operating Mode Conditions
RESET
IRQ
PB1
Mode
VSS–VDD
VSS–VDD
Single Chip
VTST
VDD
Self Check
VTST
VSS
Factory Test
VTST = 2 x VDD
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2.3 Single-Chip Mode
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In single-chip mode, the address and data buses are not available
externally, but there are two 8-bit I/O ports and one 4-bit I/O port. This
mode allows the MCU to function as a self-contained microcontroller,
with maximum use of the pins for on-chip peripheral functions. All
address and data activity occurs within the MCU. Single-Chip Mode is
entered on the rising edge of RESET if the IRQ pin is within normal
operating range.
IRQ
RESET
OSC1
OSC2
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
VDD
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
XFC
VDDSYN
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PC0
PC1
PC2
PC3
Figure 2-1. Single-Chip Mode Pinout of the MC68HC05E1
2.4 Self-Check Mode
The Self-Check Mode provides an internal check to determine if the
device is functional. See Figure 2-2.
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Operating Modes
Self-Check Mode
VTST
VTST = 2 X VDD
4.7 kΩ
VDD
2N3904
VDDSYN
10 KΩ
1
1 µf
2
Freescale Semiconductor, Inc...
3
4
32.768 kHz
330 kΩ
20 MΩ
10 pf
5
6
7
10 pf
8
9
10
11
VDD
12
1 kΩ
13
0.1 µf
14
IRQ
RESET
XFC
VDDSYN
OSC1
PA0
OSC2
PA1
PB7
PA2
PB6
PA3
PB5
PA4
PB4
PA5
PB3
PA6
PB2
PA7
PB1
PC0
PB0
PC1
VDD
PC2
VSS
PC3
28
0.1 µf
27
26
25
24
23
10 kΩ
22
21
20
19
18
10 kΩ
17
16
15
Figure 2-2. Self-Check Circuit Schematic Diagram
The Self-Check Mode is entered on the rising edge of RESET if the IRQ
pin is at VTST, and the PB1 pin is at logic one. RESET must be held low
for 4064 cycles after POR, or for a time tRL for any other reset. After
reset, the PLL is turned on (fop = 1.049 MHz) and the following tests are
performed automatically:
1.
I/O – Functionally exercises ports A, B, and C
2. RAM – Counter test for each page zero RAM byte
3. Timer/CPI – Tracks counter register and checks TOF and RTIF
flags
4. ROM – Exclusive OR with odd ones parity result
5. Interrupts –Tests external interrupts, RTI and CPI
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Operating Modes
Self-check results (using the LEDs as monitors) are shown in Table 2-2.
The Self-Check program resides at ROM location $1F00 to $1FEF. The
following subroutines are available to user programs and do not require
any external hardware.
2.4.1 Timer Test Subroutine
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This subroutine returns with the Z bit cleared if any error is detected;
otherwise, the Z bit is set.
This subroutine is called at location $1F9B. Because the timer is free
running and has only a divide-by-four prescaler, each timer count cannot
be tested. The test sets RTIE and CPIE and reads the timer once every
3 counts (12 cycles) to check for correct counting. The test tracks the
counter until the timer wraps around, setting the TOF bit in the Timer
Control and Status register. The routine then waits for RTIF=1 and CPIF
= 1 before returning with the RTI and the CPI pending. RAM location
$0095 is overwritten. Upon return to the user’s program, A=0 if the test
passed.
2.4.2 ROM Checksum Subroutine
This subroutine returns with the Z bit cleared if any error is detected;
otherwise, the Z bit is set.
This subroutine is called at location $1FD1. A short routine is set up and
executed in RAM to compute a checksum of the entire ROM pattern. The
checksum byte is computed by Motorola and is located in the Self-Check
ROM. Upon return to the user’s program, X=0. If the test passed, A=0.
RAM locations $0090 through $0093 are overwritten.
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Operating Modes
Self-Check Mode
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Table 2-2. Self-Check Results
PA3
PA2
PA1
PA0
Remarks
1
0
0
1
Bad I/O
1
0
1
0
Bad RAM
1
0
1
1
Bad Timer
1
1
0
0
Bad ROM
1
1
0
1
Bad Interrupts or IRQ request
Flashing
Good Device
All Others
Bad Device
0 indicates LED is on; 1 indicates LED is off.
2.4.3 Additional Self-Check Routines
The Self-Check ROM contains additional programs to facilitate testing
and characterization of the device. Figure 2-3 shows the program flow
in the Self-Check ROM. These programs are used in Self-Check Mode
(PB1=1). On power-up, the device goes into Self-Check Mode on the
rising edge of RESET if the IRQ pin is at VTST, and the PB1 pin is at logic
one. The values of PB0:PB3 after power-up determine which routine is
executed from the Self-Check ROM. Only the Self-Check routine is
intended for customer use.
POWER-UP
IRQ = VTST
PB1=1
PB2=1?
NO
PB0=1?
YES
YES
SELF-CHECK
PLL
ENABLED
YES
LOAD RAM
& EXECUTE
NO
PB3=1?
NO
JUMP TO RAM
PLL
DISABLED
Figure 2-3. Self-Check Mode Flowchart
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2.4.3.1 Self-Check PLL Disabled
If PB2=1 and PB3=0, the self-check routine is run without turning on the
PLL. This allows the self-check program to run at any frequency, as
determined by the value of the crystal oscillator in the self-check circuit.
2.4.3.2 Jump to RAM
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This routine is executed if PB2=0, PB1=1, and PB0=0.
This routine jumps to the starting address of the RAM. This is used after
a program has been placed in the RAM. This feature is useful for
production testing where single-chip timing or port functionality is
needed.
2.4.3.3 Load RAM
This routine is entered if PB2=0, PB1=1, and PB0=1.
The ldram routine does a parallel download of a program into port A
using IRQ (data ready) and PC0 (data acknowledge) to synchronize the
download with the host system. When IRQ (data ready) goes low, PC0
(data acknowledge) is deasserted and a byte of data is loaded from port
A to RAM starting at location $100. After the byte is stored in RAM, PC0
is asserted as an active low data acknowledge signal to the host. The
first byte downloaded must contain the total number of bytes to be
downloaded (program length +1). When the download is complete, the
program in RAM is executed.
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Section 3. CPU Core
3.1 Contents
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3.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
3.3
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
3.3.1
Accumulator (A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
3.3.2
Index Register (X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
3.3.3
Condition Code Register (CCR) . . . . . . . . . . . . . . . . . . . . . .29
3.3.3.1
Half Carry (H) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
3.3.3.2
Interrupt (I) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
3.3.3.3
Negative (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
3.3.3.4
Zero (Z) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
3.3.3.5
Carry/Borrow (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
3.3.4
Stack Pointer (SP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
3.3.5
Program Counter (PC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
3.4
Instruction Set. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
3.4.1
Register/Memory Instructions. . . . . . . . . . . . . . . . . . . . . . . .32
3.4.2
Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . .33
3.4.3
Branch Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
3.4.4
Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . . .35
3.4.5
Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
3.5
Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
3.5.1
Immediate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
3.5.2
Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
3.5.3
Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
3.5.4
Re;atove . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
3.5.5
Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
3.5.6
Indexed, 8-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
3.5.7
Indexed, 16-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
3.5.8
Bit Set/Clear . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
3.5.9
Bit Test and Branch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
3.5.10 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
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3.6
Resets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
3.6.1
Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
3.6.2
RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
3.6.3
Computer Operating Properly (COP) Reset . . . . . . . . . . . . .40
3.6.4
Illegal Address Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
3.7
Interrupts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
3.7.1
Hardware Controlled Interrupt Sequence. . . . . . . . . . . . . . .42
3.7.2
Software Interrupt (SWI). . . . . . . . . . . . . . . . . . . . . . . . . . . .44
3.7.3
External Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
3.7.4
Timer Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
3.7.5
Custom Peirodic Interrupt (CPI) . . . . . . . . . . . . . . . . . . . . . .45
3.8
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
3.8.1
STOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
3.8.2
WAIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
3.8.3
Data-Retention Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
3.2 Introduction
This section describes the CPU core.
3.3 Registers
The MCU contains the registers described in the following paragraphs.
3.3.1 Accumulator (A)
The accumulator is a general purpose 8-bit register used to hold
operands and results of arithmetic calculations or data manipulations.
7
0
A
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Registers
3.3.2 Index Register (X)
The index register is an 8-bit register used for the indexed addressing
value to create an effective address. The index register may also be
used as a temporary storage area.
7
0
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X
3.3.3 Condition Code Register (CCR)
The CCR is a 5-bit register in which the H, N, Z, and C bits are used to
indicate the results of the instruction just executed, and the I bit is used
to enable interrupts. These bits can be individually tested by a program,
and specific actions can be taken as a result of their state. Each bit is
explained in the following paragraphs.
CCR
H
I
N
Z
C
3.3.3.1 Half Carry (H)
This bit is set during ADD and ADC operations to indicate that a carry
occurred between bits 3 and 4.
3.3.3.2 Interrupt (I)
When this bit is set, the timer and external interrupt is masked (disabled).
If an interrupt occurs while this bit is set, the interrupt is latched and
processed as soon as the I bit is cleared.
3.3.3.3 Negative (N)
When set, this bit indicates that the result of the last arithmetic, logical,
or data manipulation was negative.
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3.3.3.4 Zero (Z)
When set, this bit indicates that the result of the last arithmetic, logical,
or data manipulation was zero.
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3.3.3.5 Carry/Borrow (C)
When set, this bit indicates that a carry or borrow out of the arithmetic
logical unit (ALU) occurred during the last arithmetic operation. This bit
is also affected during bit test and branch instructions and during shifts
and rotates.
3.3.4 Stack Pointer (SP)
The stack pointer contains the address of the next free location on the
stack. During an MCU reset or the reset stack pointer (RSP) instruction,
the stack pointer is set to location $00FF. The stack pointer is then
decremented as data is pushed onto the stack and incremented as data
is pulled from the stack.
When accessing memory, the seven most significant bits are
permanently set to 0000011. These seven bits are appended to the six
least significant register bits to produce and address within the range of
$00FF to $00C0. Subroutines and interrupts may use up to 64 (decimal)
locations. If 64 locations are exceeded, the stack pointer wraps around
and loses the previously stored information. A subroutine call occupies
two locations on the stack; an interrupt uses five locations.
12
0
0
0
0
0
7
1
0
1
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Instruction Set
3.3.5 Program Counter (PC)
The program counter is a 13-bit register that contains the address of the
next byte to be fetched.
NOTE:
The HC05 CPU core is capable of addressing 16-bit locations. For this
implementation, however, the addressing registers are limited to an 8K
byte memory map.
12
0
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PC
3.4 Instruction Set
The MCU has a set of 62 basic instructions. They can be divided into five
different types: register/memory, read-modify-write, branch, bit
manipulation, and control. The following paragraphs briefly explain each
type. For more information on the instruction set, refer to the M6805
Family User’s Manual (M6805UM/AD2) or the MC68HC05C4 Data
Sheet (MC68HC05C4/D).
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3.4.1 Register/Memory Instructions
Most of these instructions use two operands. One operand is either the
accumulator or the index register. The other operand is obtained from
memory using one of the addressing modes. The jump unconditional
(JMP) and jump to subroutine (JSR) instructions have no register
operand. Refer to the following instruction list.
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Function
Load A from Memory
LDA
Load X from Memory
LDX
Store A in Memory
STA
Store X in Memory
STX
Add Memory to A
ADD
Add Memory and Carry to A
ADC
Subtract Memory
SUB
Subtract Memory from A with Borrow
SBC
AND Memory to A
AND
OR Memory with A
ORA
Exclusive OR Memory with A
EOR
Arithmetic compare A with Memory
CMP
Arithmetic Compare X with Memory
CPX
Bit Test Memory with A (Logical Compare)
BIT
Jump Unconditional
JMP
Jump to Subroutine
JSR
Multiply
MUL
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Instruction Set
3.4.2 Read-Modify-Write Instructions
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These instructions read a memory location or a register, modify or test
its contents, and write the modified value back to memory or to the
register. The test for negative or zero (TST) instruction is an exception
to the read-modify-write sequence since it does not modify the value. Do
not use these read-modify-write instructions on write-only locations.
Refer to the following list of instructions.
Function
Increment
INC
Decrement
DEC
Clear
CLR
Complement
COM
Negate (Twos Complement)
NEG
Rotate Left Thru Carry
ROL
Rotate Right Thru Carry
ROR
Logical Shift Left
LSL
Logical Shift Right
LSR
Arithmetic Shift Right
ASR
Test for Negative or Zero
TST
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3.4.3 Branch Instructions
This set of instruction branches if a particular condition is met; otherwise,
no operation is performed. Branch instructions are two-byte instructions.
Refer to the following list for branch instructions.
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Function
Branch Always
BRA
Branch Never
BRN
Branch if Higher
BHI
Branch if Lower or Same
BLS
Branch if Carry Clear
BCC
Branch if Higher or Same
BHS
Branch if Carry Set
BCS
Branch if Lower
BLO
Branch if Not Equal
BNE
Branch if Equal
BEQ
Branch if Half Carry Clear
BHCC
Branch if Half Carry Set
BHCS
Branch if Plus
BPL
Branch if Minus
BMI
Branch if Interrupt Mask Bit is Clear
BMC
Branch if Interrupt Mask Bit is Set
BMS
Branch if Interrupt Line is Low
BIL
Branch if Interrupt Line is High
BIH
Branch to Subroutine
BSR
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Instruction Set
3.4.4 Bit Manipulation Instructions
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The MCU is capable of setting or clearing any writable bit which resides
in the first 256 bytes of the memory space where all port registers, port
DDRs, timer, timer control, and on-chip RAM reside. An additional
feature allows the software to test and branch on the state of any bit
within these 256 locations. The bit set, bit clear and bit test, and branch
functions are all implemented with a single instruction. For test and
branch instructions, the value of the bit tested is also placed in the carry
bit of the condition code register. These instructions are also
read-modify-write instructions. Do not bit manipulate write-only
locations. Refer to the following list for bit manipulation instructions.
Function
Mnemonic
Branch if Bit n is Set
BRSET n (n = 0. . .7)
Branch if bit n is Clear
BRCLR n (n = 0. . .7)
Set Bit n
BSET n (n = 0. . .7)
Clear Bit n
BCLR n (n = 0. . .7)
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3.4.5 Control Instructions
These instructions are register reference instructions and are used to
control processor operation during program execution. Refer to the
following list for control instructions.
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Function
Transfer A to X
TAX
Transfer X to A
TXA
Set Carry Bit
SEC
Clear Carry Bit
CLC
Set Interrupt Mask Bit
SEI
Clear Interrupt Mask Bit
CLI
Software Interrupt
SWI
Return from Subroutine
RTS
Return from Interrupt
RTI
Reset Stack Pointer
RSP
No-Operation
NOP
Stop
STOP
Wait
WAIT
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Addressing Modes
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3.5 Addressing Modes
The MCU uses ten different addressing modes to provide the
programmer with an opportunity to optimize the code for all situations.
The various indexed addressing modes make it possible to locate data
tables, code conversion tables, and scaling tables anywhere in the
memory space. Short indexed accesses are single byte instructions; the
longest instructions (three bytes) permit accessing tables throughout
memory. Short and long absolute addressing is also included. One- or
two-byte direct addressing instructions access all data bytes in most
applications. Extended addressing permits jump instructions to reach all
memory.
The term “effective address” (EA) is used in describing the various
addressing modes. Effective address is defined as the address from
which the argument for an instruction is fetched or stored.
3.5.1 Immediate
In the immediate addressing mode, the operand is contained in the byte
immediately following the opcode. The immediate addressing mode is
used to access constants that do not change during program execution
(e.g., a constant used to initialize a loop counter).
3.5.2 Direct
In the direct addressing mode, the effective address of the argument is
contained in a single byte following the opcode byte. Direct addressing
allows the user to directly address the lowest 256 bytes in memory with
a single two-byte instruction.
3.5.3 Extended
In the extended addressing mode, the effective address of the argument
is contained in the two bytes following the opcode byte. Instructions with
extended addressing mode are capable of referencing arguments
anywhere in memory with a single three-byte instruction. When using the
Motorola assembler, the user need not specify whether an instruction
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uses direct or extended addressing. The assembler automatically
selects the shortest form of the instruction.
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3.5.4 Re;atove
The relative addressing mode is only used in branch instructions. In
relative addressing, the contents of the 8-bit signed offset byte (which is
the last byte of the instruction) is added to the PC if, and only if, the
branch conditions are true. Otherwise, control proceeds to the next
instruction. The span of relative addressing is from -128 to +127 from the
address of the next opcode. The programmer need not calculate the
offset when using the Motorola assembler, since it calculates the proper
offset and checks to see that it is within the span of the branch.
3.5.5 Indexed, No Offset
In the indexed, no offset addressing mode, the effective address of the
argument is contained in the 8-bit index register. This addressing mode
can access the first 256 memory locations. These instructions are only
one byte long. This mode is often used to move a pointer through a table
or to hold the address of a frequently referenced RAM or I/O location.
3.5.6 Indexed, 8-Bit Offset
In the indexed, 8-bit offset addressing mode, the effective address is the
sum of the contents of the unsigned 8-bit index register and the unsigned
byte following the opcode. The addressing mode is useful for selecting
the Kth element in an n element table. With this two-byte instruction, K
would typically be in X with the address of the beginning of the table in
the instruction. As such, tables may begin anywhere within the first 256
addressable locations and could extend as far as location 510. $1FE is
the last location which can be accessed in this way.
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Addressing Modes
3.5.7 Indexed, 16-Bit Offset
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In the indexed, 16-bit offset addressing mode, the effective address is
the sum of the contents of the unsigned 8-bit index register and the two
unsigned bytes following the opcode. This address mode can be used in
a manner similar to indexed, 8-bit offset except that this three-byte
instruction allows tables to be anywhere in memory. As with direct and
extended addressing, the Motorola assembler determines the shortest
form of indexed addressing.
3.5.8 Bit Set/Clear
In the bit set/clear addressing mode, the bit to be set or cleared is part
of the opcode, and the byte following the opcode specifies the direct
address of the byte in which the specified bit is to be set or cleared. Any
read/write bit in the first 256 locations of memory, including I/O, can be
selectively set or cleared with a single two-byte instruction.
3.5.9 Bit Test and Branch
The bit test and branch addressing mode is a combination of direct
addressing and relative addressing. The bit that is to be tested and its
condition (set or clear), is included in the opcode. The address of the
byte to be tested is in the single byte immediately following the opcode
byte. The signed relative 8-bit offset in the third byte is added to the PC
if the specified bit is set or cleared in the specified memory location. This
single three-byte instruction allows the program to branch based on the
condition of any readable bit in the first 256 locations of memory. The
span of branching is from -128 to +127 from the address of the next
opcode. The state of the tested bit is also transferred to the carry bit of
the condition code register.
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3.5.10 Inherent
In the inherent addressing mode, all the information necessary to
execute the instruction is contained in the opcode. Operations specifying
only the index register and/or accumulator as well as the control
instructions with no other arguments are included in this mode. These
instructions are one byte long.
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3.6 Resets
The MCU can be reset three ways: by the initial power-on reset function,
by an active low input to the RESET pin, by a COP watchdog-timer reset,
and by the ILADR bit being set in the test register.
3.6.1 Power-On Reset (POR)
An internal reset is generated on power-up to allow the internal clock
generator to stabilize. The power-on reset is strictly for power turn-on
conditions and should not be used to detect a drop in the power supply
voltage. There is a 4064 internal processor clock cycle (tcyc) oscillator
stabilization delay after the oscillator becomes active. If the RESET pin
is low at the end of this 4064 cycle delay, the MCU will remain in the
reset condition until RESET goes high.
3.6.2 RESET Pin
The MCU is reset when a logic zero is applied to the RESET input for a
period of one and one-half machine cycles (tcyc). RESET is an input-only
pin and will not indicate when an internal reset has occurred.
3.6.3 Computer Operating Properly (COP) Reset
The MCU contains a watchdog timer that automatically times out if not
reset (cleared) within a specific time by a program reset sequence. If the
COP watchdog timer is allowed to timeout, an internal reset is generated
to reset the MCU. Because the internal reset signal is used, the MCU
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comes out of a COP reset in the same operating mode it was in when
the COP time-out was generated.
The COP reset function is enabled or disabled by a mask option.
Refer to 6.3.2 Computer Operating Properly (COP) Watchdog Reset,
for more information on the COP Watchdog timer.
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3.6.4 Illegal Address Reset
When an opcode fetch occurs from an address which is not implemented
in the RAM ($0090–$01FF) or ROM ($0F00–$1FFF), the part is
automatically reset.
3.7 Interrupts
The MCU can be interrupted four different ways: the three maskable
hardware interrupts (IRQ, timer, and CPI) and the nonmaskable
software interrupt instruction (SWI).
Interrupts cause the processor to save register contents on the stack
and to set the interrupt mask (I bit) to prevent additional interrupts. The
RTI instruction causes the register contents to be recovered from the
stack and normal processing to resume.
Unlike RESET, hardware interrupts do not cause the current instruction
execution to be halted, but are considered pending until the current
instruction is complete.
NOTE:
The current instruction is the one already fetched and being operated on.
When the current instruction is complete, the processor checks all
pending hardware interrupts. If interrupts are not masked (CCR I bit
clear) and the corresponding interrupt enable bit is set, the processor
proceeds with interrupt processing; otherwise, the next instruction is
fetched and executed.
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If both an external interrupt and a timer interrupt are pending at the end
of an instruction execution, the external interrupt is serviced first. The
SWI is executed the same as any other instruction, regardless of the I-bit
state.
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Table 3-1. Vector Address for Interrupts and Reset
Register
Flag
Name
N/A
N/A
Reset
N/A
N/A
N/A
TCSR
CPICSR
CPU
Interrupt
Vector Address
RESET
$1FFE–$1FFF
Software
SWI
$1FFC–$1FFD
N/A
External Interrupt
RQ
$1FFA–$1FFB
TOF
Timer Overflow
TIMER
$1FF8–$1FF9
RTIF
Real Time Interrupt
IMER
$1FF8–$1FF9
CPIF
Custom Periodic Interrupt
CPI
$1FF6–$1FF7
Interrupts
3.7.1 Hardware Controlled Interrupt Sequence
The following three functions (RESET, STOP, and WAIT) are not in the
strictest sense an interrupt; however, they are acted upon in a similar
manner. See Figure 3-1 and Figure 3-2. A discussion is provided below.
1. RESET - A low input on the RESET input pin causes the program
to vector to its starting address which is specified by the contents
of memory locations $1FFE and $1FFF. The I bit in the condition
code register is also set. Much of the MCU is configured to a
known state during this type of reset as previously described in
3.6 Resets.
2. STOP - The STOP instruction causes the oscillator to be turned
off and the processor to “sleep” until an external interrupt (IRQ) or
reset occurs.
3. WAIT - The WAIT instruction causes all processor clocks to stop,
but leaves the timer clock running. This “rest” state of the
processor can be cleared by reset, an external interrupt (IRQ), or
Timer interrupt. There are no special wait vectors for these
individual interrupts.
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Interrupts
From
RESET
Y
Is
I Bit
Set
N
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IRQ
External
Interrupt
Y
Clear IRQ
Request
Latch
N
Timer
Internal
Interrupt
Y
Stack
PC, X, A, CC
N
CPI
Internal
Interrupt
Y
N
Set
I Bit
Load PC From:
SWI: $1FFC, $1FFD
IRQ: $1FFA-$1FFB
Timer: $1FF8-$1FF9
CPI: $1FF6, $1FF7
Fetch Next
Instruction
N
SWI
Instruction
?
Y
N
RTI
Instruction
?
Y
Restore Resisters
from stack
CC, A, X, PC
N
Execute
Instruction
Figure 3-1. Interrupt Processing Flowchart
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N
N
STOP
WAIT
Stop Oscillator
And All Clocks
Clear I Bit
Oscillator Active
Timer Clock Active
Processor Clocks
Stopped
Reset
Reset
Y
Y
External
Interrupt
(IRQ)
Y
N
External
Interrupt
(IRQ)
Y
Turn On Oscillator
Wait for Time
Delay to Stabilize
N
Timer
Internal
Y Interrupt
Restart
Processor Clock
Y
N
CPI
Internal
Interrupt
N
Y
1. Fetch
Reset
Vector or
2. Service
Interrupt
a. Stack
b. Set I Bit
c. Vector to
Interrupt
Routine
1. Fetch
Reset
Vector or
2. Service
Interrupt
a. Stack
b. Set I Bit
c. Vector to
Interrupt
Routine
Figure 3-2. STOP/WAIT Flowcharts
3.7.2 Software Interrupt (SWI)
The SWI is an executable instruction and a non-maskable interrupt: it is
executed regardless of the state of the I bit in the CCR. If the I bit is zero
(interrupts enabled), SWI executes after interrupts which were pending
when the SWI was fetched, but before interrupts generated after the SWI
was fetched. The interrupt service routine address is specified by the
contents of memory locations $1FFC and $1FFD.
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Interrupts
3.7.3 External Interrupt
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If the interrupt mask bit (I bit) of the CCR is set, all maskable interrupts
(internal and external) are disabled. Clearing the I bit enables interrupts.
The interrupt request is latched immediately following the falling edge of
IRQ. It is then synchronized internally and serviced by the interrupt
service routine located at the address specified by the contents of
$1FFA and $1FFB.
Either a level-sensitive and edge-sensitive trigger, or an
edge-sensitive-only trigger is available as a mask option.
NOTE:
The internal interrupt latch is cleared in the first part of the interrupt
service routine; therefore, one external interrupt pulse could be latched
and serviced as soon as the I bit is cleared.
3.7.4 Timer Interrupt
There are two different timer interrupt flags that cause a timer interrupt
whenever they are set and enabled. The interrupt flags and enable bits
are located in the Timer Control and Status Register (TCSR). Either of
these interrupts will vector to the same interrupt service routine, located
at the address specified by the contents of memory location $1FF8 and
$1FF9. See 6.3.1 Timer Control and Status Register (TCSR) $08.
3.7.5 Custom Peirodic Interrupt (CPI)
The CPI flag and enable bits are located in the CPI Control and Status
Register (CPICSR). A CPI interrupt will vector to the interrupt service
routine located at the address specified by the contents of memory
location $1FF6 and $1FF7. See 6.5 Custom Periodic Interrupt.
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3.8 Low-Power Modes
3.8.1 STOP
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The STOP instruction places the MCU in its lowest power consumption
mode. In STOP mode, the internal oscillator is turned off, halting all
internal processing, including timer (and COP Watchdog timer)
operation.
The I bit in the CCR is cleared to enable external interrupts. All other
registers, including the remaining bits in the TCSR, and memory remain
unaltered. All input/output lines remain unchanged. The processor can
be brought out of the STOP mode only by an external interrupt or
RESET.
The STOP instruction can be disabled by a mask option. When disabled,
the STOP instruction is executed as a NOP.
See 6.6 Operation During STOP Mode.
3.8.2 WAIT
The WAIT instruction places the MCU in a low-power consumption
mode, but the WAIT mode consumes more power than the STOP mode.
All CPU action is suspended, but the timer remains active. An interrupt
from the timer can cause the MCU to exit the WAIT mode.
During the WAIT mode, the I bit in the CCR is cleared to enable
interrupts. All other registers, memory, and input/output lines remain in
their previous state. The timer may be enabled to allow a periodic exit
from the WAIT mode.
See 6.7 Operation During WAIT Mode.
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Low-Power Modes
3.8.3 Data-Retention Mode
The contents of RAM and CPU registers are retained at supply voltages
as low as 2.0Vdc. This is called the data-retention mode where the data
is held, but the device is not guaranteed to operate. RESET must be held
low during data-retention mode.
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Data Direction
Register Bit
Internal
HC05
Connections
Latched Output
Data Bit
Output
I/O
Pin
Input
Register
Bit
Input
I/O
Figure 3-3. Port I/O Circuitry
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General Release Specification — MC68HC05E1
Section 4. Input/Output Ports
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4.1 Contents
4.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
4.3
Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
4.4
Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
4.5
Port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
4.6
Input/Output Programmingf . . . . . . . . . . . . . . . . . . . . . . . . . . .50
4.2 Introduction
In single-chip mode there will be 20 lines arranged as two 8-bit I/O port
and one 4-bit I/O port. These ports are programmable as either inputs or
outputs under software control of the data direction registers.
To avoid a glitch on the output pins, write data to the I/O Port Data
Register before writing a one to the corresponding Data Direction
Register.
4.3 Port A
Port A is an 8-bit bidirectional port which does not share any of its pins
with other subsystems. The port A data register is at $0000 and the data
direction register (DDR) is at $0004. Reset does not affect the data
registers, but clears the data direction registers, thereby returning the
ports to inputs. Writing a one to a DDR bit sets the corresponding port
bit to output mode.
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Input/Output Ports
4.4 Port B
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Port B is an 8-bit bidirectional port which does not share any of its pins
with other subsystems. The address of the port B data register is $0001
and the data direction register (DDR) is at address $0005. Reset does
not affect the data registers, but clears the data direction registers,
thereby returning the ports to inputs. Writing a one to a DDR bit sets the
corresponding port bit to output mode.
4.5 Port C
Port C is a 4-bit bidirectional port which does not share any of its pins
with other subsystems. The port C data register is at $0002 and the data
direction register (DDR) is at $0006. Reset does not affect the data
registers, but clears the data direction registers, thereby returning the
ports to inputs. Writing a one to a DDR bit sets the corresponding port
bit to output mode.
4.6 Input/Output Programmingf
Ports A, B and C may be programmed as an input or an output under
software control. The direction of the pins is determined by the state of
the corresponding bit in the port data direction register (DDR). Each port
has an associated DDR. Any port A, port B or port C pin is configured as
an output if its corresponding DDR bit is set to a logic one. A pin is
configured as an input if its corresponding DDR bit is cleared to a logic
zero.
At power-on or reset, all DDRs are cleared, which configures all port A,
B, and C pins as inputs. The data direction registers are capable of being
written to or read by the processor. During the programmed output state,
a read of the data register actually reads the value of the output data
latch and not the I/O pin. See Table 4-1 and Figure 4-1.
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Input/Output Ports
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Input/Output Ports
Input/Output Programmingf
Table 4-1. I/O Pin Functions
R/W*
DDR
I/O Pin Function
0
0
The I/O pin is in input mode. Data is written into the output
data latch.
0
1
Data is written into the output data latch and output of the I/O pin.
1
0
The state of the I/O pin is read.
1
1
The I/O pin is in an output jmode. The output data latch is read.
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*R/W is an internal signal.
Data Direction
Register Bit
Internal
HC05
Connections
Latched Output
Data Bit
Output
I/O
Pin
Input
Register
Bit
Input
I/O
Figure 4-1. Port I/O Circuitry
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Input/Output Ports
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General Release Specification — MC68HC05E1
Section 5. Memory
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5.1 Contents
5.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
5.3
ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
5.4
RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
5.2 Introduction
The MC68HC05E1 has an 8K byte memory map, consisting of user
ROM, user RAM, Self-Check ROM, Control Registers, and I/O. See
Figure 5-1 and Figure 5-2.
5.3 ROM
4096 bytes of user ROM are located from $0F00 to $1EFF, with 16
additional bytes of user vectors from $1FF0 to $1FFF. The Self-Check
ROM and vectors are located from $1F00 to $1FEF.
5.4 RAM
The user RAM consists of 368 bytes from location $0090 to $01FF
including the stack area. The stack begins at address $00FF. The stack
pointer can access 64 bytes of RAM from $00FF to $00C0. Using the
stack area for data storage or temporary work locations requires care to
prevent it from being overwritten due to stacking from an interrupt or
subroutine call.
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Memory
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Memory
$008F
$0090
$00BF
$00C0
$00FF
$0100
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$01FF
$0200
Unused
112 Bytes
RAM
112 Bytes
Stack
64 Bytes
RAM
256 Bytes
0000
Port A Data Register
$00
0031
0032
Port B Data Register
$01
Port C Data Register
$02
0143
0144
Unused
$03
Port A Data Direction Register
$04
0191
0192
Port B Data Direction Register
$05
Port C Data Direction Register
$06
PLL Control Register
$07
Timer Control & Status Register
$08
Timer Counter Register
$09
Unused
$0A
0255
0256
0511
0512
Unused
3328 Bytes
$0EFF
$0F00
3839
3840
User ROM
4096 Bytes
$1EFF
$1F00
$1FEF
$1FF0
$1FFF
7935
7936
Self-Check ROM
& Vectors
240 Bytes
User Vectors
16 Bytes
8175
8176
...
$001F
$0020
I/O
32 Bytes
Unused
$11
CPI Control & Status Register
$12
Unused
$13
...
$0000
Unused
$1E
Test Register
$1F
8191
$1FF0
...
Unused
Unused
$1FF5
CPI Vector (High Byte)
$1FF6
CPI Vector (Low Byte)
$1FF7
Timer Vector (High Byte)
$1FF8
Timer Vector (Low Byte)
$1FF9
IRQ Vector (High Byte)
$1FFA
IRQ Vector (Low Byte)
$1FFB
SWI Vector (High Byte)
$1FFC
SWI Vector (Low Byte)
$1FFD
Reset Vector (High Byte)
$1FFE
Reset Vector (Low Byte)
$1FFF
Figure 5-1. The 8 Kbyte Memory Map of the MC68HC05E1
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Memory
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Memory
RAM
DATA
ADDRESS
$00 TO $001F
7
6
5
4
3
2
1
0
$03 UNUSED
0
0
0
0
$04 PORT A DDR
—
—
—
—
—
—
—
—
0
BCS
AUTO
BWC
PLLON
VCOTST
PS1
PS0
TOF
RTIF
TOFE
RTIE
0
0
RT1
RT0
$0A UNUSED
—
—
—
—
—
—
—
—
$0B UNUSED
—
—
—
—
—
—
—
—
$0C UNUSED
—
—
—
—
—
—
—
—
$0D UNUSED
—
—
—
—
—
—
—
—
$0E UNUSED
—
—
—
—
—
—
—
—
$0F UNUSED
—
—
—
—
—
—
—
—
$10 UNUSED
—
—
—
—
—
—
—
—
$11 UNUSED
—
—
—
—
—
—
—
—
$12 CPI CONTROL &STATUS REG
—
CPIF
—
CPIE
—
—
—
—
$13 UNUSED
—
—
—
—
—
—
—
—
$14 UNUSED
—
—
—
—
—
—
—
—
$15 UNUSED
—
—
—
—
—
—
—
—
$16 UNUSED
—
—
—
—
—
—
—
—
$17 UNUSED
—
—
—
—
—
—
—
—
$18 UNUSED
—
—
—
—
—
—
—
—
$19 UNUSED
—
—
—
—
—
—
—
—
$1A UNUSED
—
—
—
—
—
—
—
—
$1B UNUSED
—
—
—
—
—
—
—
—
$1C UNUSED
—
—
—
—
—
—
—
—
$1D UNUSED
—
—
—
—
—
—
—
—
$1E UNUSED
—
—
—
—
—
—
—
—
$1F UNUSED
—
—
—
—
—
—
—
—
$00 PORT A DATA
$01 PORT B DATA
$02 PORT C DATA
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$05 PORT B DDR
$06 PORT C DDR
$07 PLL CONTROL REG
$08 TIMER CONTROL & STATUS REG
$09 TIMER COUNTER REG
Figure 5-2. Input/Output (I/O) Registers
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Memory
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Memory
General Release Specification
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MC68HC05E1 — Revision 2.0
Memory
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General Release Specification — MC68HC05E1
Section 6. Timer, Phase-Locked Loop,
and Custom Periodic Interrupt
6.1 Contents
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6.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
6.3
Timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
6.3.1
Timer Control and Status Register (TCSR) $08 . . . . . . . . . .60
6.3.2
Computer Operating Properly (COP) Watchdog Reset . . . .62
6.3.3
Timer Control Register (TCR) $09 . . . . . . . . . . . . . . . . . . . .63
6.4
Phase-Locked Loop Synthesizer . . . . . . . . . . . . . . . . . . . . . . .64
6.4.1
Phase-Locked Loop Control Register (PLLCR) $07 . . . . . .66
6.4.2
Operation During STOP Mode . . . . . . . . . . . . . . . . . . . . . . .68
6.4.3
Noise Immunity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
6.5
Custom Periodic Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
6.5.1
Custom Periodic Interrupt Control
and Status Register (CPICSR) $12. . . . . . . . . . . . . . . . .70
6.6
Operation During STOP Mode . . . . . . . . . . . . . . . . . . . . . . . . .70
6.7
Operation During WAIT Mode . . . . . . . . . . . . . . . . . . . . . . . . .71
6.2 Introduction
This section describes the timer, phase-locked loop (PLL), and custom
periodic interrupt (CPI).
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Timer, Phase-Locked Loop, and Custom Periodic
6.3 Timer
The Timer for this device is a 15-stage multi-functional ripple counter.
The features include Timer Over Flow, Power-On Reset (POR), Real
Time Interrupt, and COP Watchdog Timer.
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As seen in Figure 6-1, the Timer is driven by the output of the clock
select circuit (as determined by the value of BCS in the PLLCR) then a
fixed divide by four prescaler. This signal drives an 8-bit ripple counter.
The value of this 8-bit ripple counter can be read by the CPU at any time
by accessing the Timer Counter Register (TCR) at address $09. A timer
overflow function is implemented on the last stage of this counter, giving
a possible interrupt at the rate of fop/1024. Two additional stages
produce the POR function at fop/4064. The Timer Counter Bypass
circuitry (available only in Test Mode) is at this point in the timer chain.
This circuit is followed by two more stages, with the resulting clock
(fop/16384) driving the Real Time Interrupt circuit. The RTI circuit
consists of three divider stages with a 1 of 4 selector. The output of the
RTI circuit is further divided by eight to drive the mask optional COP
Watchdog Timer circuit. The RTI rate selector bits, and the RTI and TOF
enable bits and flags are located in the Timer Control and Status
Register at location $08.
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt
Timer
MC68HC05E1 Internal Bus
8
8
COP
Clear
$09 TCR
Timer Counter Register (TCR)
Internal
Processor
Clock
fop
fop/22
TCR
÷4
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fop/210
7-bit counter
POR
TCBP
RTI Select Circuit
Overflow
Detect
Circuit
fop/214 TO fop/217
$08 TCSR
Timer Control & Status Register
TCSR
TOF
RTIF TOFE RTIE
—
—
RT1
RT0
Interrupt Circuit
COP Watchdog
Timer (÷8)
To Interrupt
Logic
To Reset
Logic
Figure 6-1. Timer Block Diagram
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Timer, Phase-Locked Loop, and Custom Periodic
6.3.1 Timer Control and Status Register (TCSR) $08
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The TCSR contains the timer interrupt flag, the timer interrupt enable
bits, and the real time interrupt rate select bits. Figure 6-2 shows the
value of each bit in the TCSR when coming out of reset.
$08
TOF
RTIF
TOFE
RTIE
0
0
RT1
RT0
RESET:
0
0
0
0
0
0
1
1
Figure 6-2. Timer Control and Status Register (TCSR)
TOF — Timer Over Flow
TOF is a clearable, read-only status bit and is set when the 8-bit ripple
counter rolls over from $FF to $00. A CPU interrupt request will be
generated if TOFE is set. Clearing the TOF is done by writing a ’0’ to
it. Writing a ’1’ to TOF has no effect on the bit’s value. Reset clears
TOF.
RTIF — Real Time Interrupt Flag
The Real Time Interrupt circuit consists of a three stage divider and a
1 of 4 selector. The clock frequency that drives the RTI circuit is
fop/213 (or fop/8192) with three additional divider stages giving a
maximum interrupt period of 4 seconds at a crystal frequency of
32.768 kHz. RTIF is a clearable, read-only status bit and is set when
the output of the chosen (1 of 4 selection) stage goes active. A CPU
interrupt request will be generated if RTIE is set. Clearing the RTIF is
done by writing a ’0’ to it. Writing a ’1’ to RTIF has no effect on this bit.
Reset clears RTIF.
TOFE — Timer Over Flow Enable
When this bit is set, a CPU interrupt request is generated when the
TOF bit is set. Reset clears this bit.
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt
Timer
RTIE — Real Time Interrupt Enable
When this bit is set, a CPU interrupt request is generated when the
RTIF bit is set. Reset clears this bit.
RT1:RT0 — Real Time Interrupt Rate Select
These two bits select one of four taps from the Real Time Interrupt
circuit.Table 6-1 shows the available interrupt rates with several fop
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values. Reset sets these RT0 and RT1, selecting the lowest periodic
rate and therefore the maximum time in which to alter these bits if
necessary. Care should be taken when altering RT0 and RT1 if the
time-out period is imminent or uncertain. If the selected tap is
modified during a cycle in which the counter is switching, an RTIF
could be missed or an additional one could be generated. To avoid
problems, the COP should be cleared before changing RTI taps.
Table 6-1. RTI Rates
RTI RATES AT fOP FREQUENCY SPECIFIED:
RT1:RT0
NOTE:
524 kHz
1.049 MHz
2.097 MHz
4.194 MHz
fOP
00
1s
31.3 ms
15.6 ms
7.8 ms
3.9 ms
214 op
f
01
2s
62.5 ms
31.3 ms
15.6 ms
7.8 ms
215 fop
10
4s
125 ms
62.5 ms
31.3 ms
15.6 ms
216 fop
11
8s
250 ms
125.1 ms
62.5 ms
31.3 ms
217 fop
In rare instances, clearing any of the timer control and status register
(TCSR) flag or enable bits could result in vectoring to the reset vector
rather than the timer interrupt vector if the correct precautions are not
followed. Do not clear any of the timer flags or enable bits (i.e., TOF,
TOFE, RTI, and RTIF) with bit manipulation instructions.
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Timer, Phase-Locked Loop, and Custom Periodic
Example:
CLEARING TIMER OVERFLOW FLAG (TOF) BIT
SEI
SEI NOT REQUIRED IF USED WITHIN
TIMER INTERRUPT ROUTINE.
LDA
#$73
AND
$TCSR
OR
#$40
STA
$TCSR
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CLI
MASK RTIF BIT
DO NOT USE CLI IF THIS CODE
SEGMENT IF USED WITHIN TIMER
INTERRUPT ROUTINE
CLEARING TIMER OVERFLOW ENABLE (TOFE) BIT
SEI
LDA
#$D3
AND
$TCSR
OR
#$C0
STA
$TCSR
CLI
MASK RTIF & TOF
DO NOT USE CLI IF THIS CODE
SEGMENT IF USED WITHIN TIMER
INTERRUPT ROUTINE
6.3.2 Computer Operating Properly (COP) Watchdog Reset
The COP watchdog timer function is implemented on this device by
using the output of the RTI circuit and further dividing it by eight. The
minimum COP reset rates are listed in Table 6-2. If the COP circuit times
out, an internal reset is generated and the normal reset vector is fetched.
Preventing a COP time-out is done by writing a ’0’ to bit 0 of address
$1FF0. When the COP is cleared, only the final divide by eight stage
(output of the RTI) is cleared.
This function is a mask option.
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt
Timer
Table 6-2. COP Reset Times
RTI RATES AT fOP FREQUENCY SPECIFIED:
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RT1:RT0
16.384 kHz
524 kHz
1.049 MHz
2.097 MHz
4.194 MHz
fOP
00
7s
218.8 ms
109.4 ms
54.7 ms
27.3 ms
7 x (RTI Rate)
01
14 s
437.5 ms
218.8 ms
109.4 ms
54.7 ms
7 x (RTI Rate)
10
28 s
875.0 ms
437.5 ms
218.8 ms
109.4 ms
7 x (RTI Rate)
11
56 s
1.75 s
875.0 ms
437.5 ms
218.8 ms
7 x (RTI Rate)
6.3.3 Timer Control Register (TCR) $09
The Timer Counter Register is a read-only register which contains the
current value of the 8-bit ripple counter at the beginning of the timer
chain. This counter is clocked at fop divided by 4 and can be used for
various functions including a software input capture. Extended time
periods can be attained using the TOF function to increment a temporary
RAM storage location thereby simulating a 16-bit (or more) counter.
$09
Figure 6-3. Timer Counter Register
The power-on cycle clears the entire counter chain and begins clocking
the counter. After 4064 cycles, the power-on reset circuit is released
which again clears the counter chain and allows the device to come out
of reset. At this point, if RESET is not asserted, the timer will start
counting up from zero and normal device operation will begin. When
RESET is asserted anytime during operation (other than POR), the
counter chain will be cleared.
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Timer, Phase-Locked Loop, and Custom Periodic
6.4 Phase-Locked Loop Synthesizer
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The phase-locked loop (PLL) consists of a variable bandwidth loop filter,
a voltage controlled oscillator (VCO), a feedback frequency divider, and
a digital phase detector. The PLL requires an external loop filter
capacitor (typically 0.1 uf) connected between XFC and VDDSYN. This
capacitor should be located as close to the chip as possible to minimize
noise. VDDSYN is the supply source for the PLL and should be bypassed
to minimize noise. The VDDSYN bypass cap should be as close as
possible to the chip.
V
0.1 µF
tREF
OSC1
Crystal
Oscillator
0.1 µF
PCOMP
Phase
Detect
DDSYN
XFC
loop filter
VCO
and ÷2
PLLOUT
Clock
Select
BCS
tFB
To clock
generation
circuitry
Frequency
Divider
PS1
PS0
Figure 6-4. PLL Circuit
The phase detector compares the frequency and phase of the feedback
frequency (tFB) and the crystal oscillator reference frequency (tREF) and
generates the output, PCOMP, as shown in Figure 6-4. The output
wave-form is then integrated and amplified. The resultant dc voltage is
applied to the voltage controlled oscillator. The output of the VCO is
divided by a variable frequency divider of 256, 128, 64, or 32 to provide
the feedback frequency for the phase detector.
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt
Phase-Locked Loop Synthesizer
To change PLL frequencies, follow the procedure outlined below:
1. Clear BCS to enable the low frequency bus rate,
2. Clear PLLON to disable the PLL and select manual high
bandwidth,
3. Select the speed using PS1 and PS0,
4. Set PLLON to enable the PLL,
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5. Wait a time of 90% tPLLS for the PLL frequency to stabilize and
select manual low bandwidth, wait another 10% tPLLS,
6. Set BCS to switch to the high frequency bus rate.
The user should not switch among the high speeds with the BCS bit set.
Following the procedure above will prevent possible bursts of high
frequency operation during the re-configuration of the PLL.
The PLL loop filter has two bandwidths which are automatically selected
by the PLL if AUTO=1. Whenever the PLL is first enabled, the wide
bandwidth mode is used. This enables the PLL frequency to ramp up
quickly. When the output frequency is near the desired frequency, the
filter is switched to the narrow bandwidth mode to make the final
frequency more stable. The use of automatic bandwidth is not
recommended at this time. Manual bandwidth control can be done by
clearing AUTO in the PLLCR and setting the appropriate value for BWC.
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6.4.1 Phase-Locked Loop Control Register (PLLCR) $07
This read/write register contains the control bits select the PLL
frequency and enable/disable the synthesizer.
$07
0
BCS
AUTO
BWC
RESET:
0
0
1
0
PLLON VCOTST
1
1
PS1
PS0
0
1
Freescale Semiconductor, Inc...
Figure 6-5. Phase-Locked Loop Control Register
BCS — Bus Clock Select
When this bit is set, the output of the PLL is used to generate the
internal processor clock. When clear, the internal bus clock is driven
by the crystal (OSC1÷2). Once BCS has been changed, it may take
up to 1.5 OSC1 cycles + 1.5 PLLOUT cycles to make the transition.
During the transition, the clock select output will be held low and all
CPU and timer activity will cease until the transition is complete.
Before setting BCS, allow at least a time of tPLLS after PLLON is set.
Reset clears this bit.
AUTO
When set, this bit selects the automatic bandwidth circuitry in the
Phase detect block. When clear, manual bandwidth control is
selected. Reset sets this bit.
NOTE:
The use of automatic bandwidth is not recommended at this time.
BWC — Bandwidth Control
This bit selects high bandwidth control when set, and low bandwidth
control when clear. The low bandwidth driver is always enabled, so
this bit determines whether the high bandwidth driver is on or off.
Bandwidth control is under manual control only when the AUTO bit is
clear. When the AUTO bit is set, BWC acts as a read-only status bit
to indicate which mode has been selected by the internal circuit. On
PLL start-up in automatic mode (AUTO=1), the high bandwidth driver
is enabled (BWC=1) by internal circuitry until the PLL has locked onto
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt
Phase-Locked Loop Synthesizer
the specified frequency. The high bandwidth driver is then disabled
and BWC is cleared by internal circuitry. Reset clears this bit.
Table 6-3
Freescale Semiconductor, Inc...
Table 6-3. Loop Filter Bandwidth Control
AUTO
BWC
VCOTST
HIGH BANDWIDTH
LOW BANDWIDTH
0
0
0
OFF
OFF
0
0
1
OFF
ON
0
1
0
ON
OFF
0
1
1
ON
ON
1
X
1
AUTO
ON
PLLON — PLL On
This bit activates the synthesizer circuit without connecting it to the
control circuit. This allows the synthesizer to stabilize before it can
drive the CPU clocks. When this bit is cleared, the PLL is shut off.
Reset sets this bit.
NOTE:
PLLON should not be cleared while using the PLL to drive the internal
processor clock, i.e. when BCS is high. If the internal processor clock is
driven by the PLL, clearing the PLLON bit would cause the internal
processor clock to stop. Exercise caution when using these bits.
VCOTST — VCO Test
This bit is used to isolate the loop filter from the VCO in order to
facilitate testing. When clear, the low bandwidth mode of the PLL filter
is disabled. When set, the loop filter operates as indicated by the
values of AUTO and BWC. This bit is always set when AUTO=1 as
security when running in automatic mode. Reset sets this bit.
NOTE:
This bit is intended for use by Motorola to test and characterize the PLL.
The user should always have this bit set to 1.
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Timer, Phase-Locked Loop, and Custom Periodic
PS1:PS0 — PLL Synthesizer Speed Select
These two bits select one of four taps from the PLL to drive the CPU
clocks. These bits are used in conjunction with PLLON and BCS bits
in the PLL Control Register. These bits should not be written if BCS
in the PLLCR is at a logic high. Reset clears PS1 and sets PS0,
choosing a bus clock frequency of 1.049 MHz.
Freescale Semiconductor, Inc...
Table 6-4. PS1 and PS0 Speed Selects
with 32.768 kHz Crystal
PA1:PS0
NOTE:
CPU BUS CLOCK FREQUENCY (fOP)
0 0
524 kHz
0 1
1.049 MHz
Reset Condition
1 0
2.097 MHz
See Note below
1 1
4.194 MHz
See Note below
For the standard MC68HC05E1, the 4.194 MHz bus clock frequency
should never be selected, and the 2.097 MHz bus clock frequency
should not be selected when running the part below VDD = 4.5 V. For the
high speed MC68HSC05E1, the 4.194 MHz bus clock frequency should
not be selected when running the part below VDD = 4.5 V.
6.4.2 Operation During STOP Mode
The PLL is switched to low frequency bus rate and is temporarily turned
off when STOP is executed. Coming out of STOP mode with an external
IRQ, the PLL is turned on with the same configuration it had before going
into STOP with the exception of BCS which is reset. Otherwise, the PLL
control register is in the reset condition.
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt
Custom Periodic Interrupt
6.4.3 Noise Immunity
The MCU should be insulated as much as possible from noise in the
system. We recommend the following steps be taken to help prevent
problems due to noise injection.
1. The application environment should be designed so that the MCU
is not near signal traces which switch often, such as a clock signal,
Freescale Semiconductor, Inc...
2. The oscillator circuit for the MCU should be placed as close as
possible to the OSC1 and OSC2 pins on the MCU, and
3. All power pins should be filtered (to minimize noise on these
signals) by using bypass capacitors placed as close as possible to
the MCU.
See the Application Note Designing for Electromagnetic Compatibility
(EMC) with HCMOS Microcontrollers, available through the Motorola
Literature Distribution Center, document number AN1050/D.
6.5 Custom Periodic Interrupt
The custom periodic interrupt is mask programmable to a 0.25 second,
0.5 second, or 1 second interrupt. The interrupt is generated from the 32
kHz OSC1 input by a 15-bit counter. This interrupt is under the control of
the Custom Periodic Interrupt Control and Status Register located at
$12.
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6.5.1 Custom Periodic Interrupt Control and Status Register (CPICSR) $12
Freescale Semiconductor, Inc...
The CPICSR contains the CPI flag and enable bits. Figure 6-6 shows
the location of these bits and their values after reset.
$12
0
CPIF
0
CPIE
0
0
0
0
RESET:
0
0
0
0
0
0
0
0
Figure 6-6. Custom Periodic Interrupt Control
and Status Register (CPICSR)
CPIF — Custom Periodic Interrupt Flag
CPIF is a clearable, read-only status bit and is set when the 15-bit
counter changes from $7FFF to $0000. A CPU interrupt request will
be generated if CPIE is set. Clearing the CPIF is done by writing a ’0’
to it. Writing a ’1’ to CPIF has no effect on the bit’s value. Reset clears
CPIF.
CPIE — Custom Periodic Interrupt Enable
When this bit is cleared, the counter is cleared and CPI interrupts are
disabled. When this bit is set, the counter starts from $0000 and a
CPU interrupt request is generated when the CPIF bit is set. Reset
clears this bit.
6.6 Operation During STOP Mode
The timer system is cleared and the CPI counter is halted when going
into STOP mode. When STOP is exited by an external interrupt or an
external RESET, the internal oscillator will resume, followed by a 4064
internal processor oscillator stabilization delay. The timer system
counter is then cleared and operation resumes. The CPI will continue
counting once the oscillator resumes and does not wait for the oscillator
to stabilize.
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt
Operation During WAIT Mode
6.7 Operation During WAIT Mode
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The CPU clock halts during the WAIT mode, but the timer and CPI
remain active. If interrupts are enabled, a timer interrupt or custom
periodic interrupt will cause the processor to exit the WAIT mode.
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Timer, Phase-Locked Loop, and Custom Periodic
General Release Specification
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Section 7. Electrical Specifications
Freescale Semiconductor, Inc...
7.1 Contents
7.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
7.3
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
7.4
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
7.5
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
7.6
5.0-Volt DC Electrical Characteristics. . . . . . . . . . . . . . . . . . . .76
7.7
3.3-Volt DC Electrical Characteristics. . . . . . . . . . . . . . . . . . . .77
7.8
5.0-Volt Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
7.9
3.3-Volt Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
7.2 Introduction
This section provides parametric information for the MC68HC05E1.
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Electrical Specifications
7.3 Maximum Ratings
Maximum ratings are the extreme limits to which the MCU can be
exposed without permanently damaging it.
Freescale Semiconductor, Inc...
The MCU contains circuitry to protect the inputs against damage from
high static voltages; however, do not apply voltages higher than those
shown in the table below. Keep VIN and VOUT within the range
VSS ≤ (VIN or VOUT) ≤ VDD. Connect unused inputs to the appropriate
voltage level, either VSS or VDD
Rating
Symbol
Value
Unit
Supply Voltage
VDD
–0.3 to + 7.0
V
Input Voltage
VIN
VSS –0.3 to
VDD +0.3
V
Self-Check Mode (IRQ Pin Only)
VIN
VSS –0.3 to
2 x VDD +0.3
V
I
25
mA
Tstg
–65 to + 150
°C
Current Drain per Pin
Excluding VDD and VSS
Storage Temperature Range
NOTE:
This device is not guaranteed to operate properly at the maximum
ratings. Refer to 7.6 5.0-Volt DC Electrical Characteristics and
7.7 3.3-Volt DC Electrical Characteristics for guaranteed operating
conditions.
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Electrical Specifications
Operating Range
7.4 Operating Range
Characteristic
Symbol
Value
Unit
TA
TL to TH
0 to +70
–40 to +85
–40 to +125
°C
Symbol
Value
Unit
θJA
60
60
°C/W
Freescale Semiconductor, Inc...
Operating Temperature Range
MC68HC05E1P (Standard)
MC68HC05E1CP (Extended)
MC68HC05E1MP (Automotive)
7.5 Thermal Characteristics
Characteristic
Thermal Resistance
Plastic DIP
SOIC
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7.6 5.0-Volt DC Electrical Characteristics
Characteristic
Symbol
Min
Typ
Max
Unit
VOL
VOH
—
VDD –0.1
—
—
0.1
—
V
Output High Voltage
(ILoad = –0.8 mA) PA0–PA7, PB0–PB7, PC0–PC3
VOH
VDD –0.8
—
—
V
Output Low Voltage
(ILoad = 1.6 mA) PA0–PA7, PB0–PB7, PC0–PC3
VOL
—
—
0.40
V
Input High Voltage
PA0–PA7, PB0–PB7, PD0–PD3, IRQ, RESET, OSC1
VIH
0.7 x VDD
—
VDD
V
Input Low Voltage
PA0–PA7, PB0–PB7, PD0–PD3, IRQ, RESET, OSC1
VIL
VSS
—
0.3 x VDD
V
XFC Wide Bandwidth
Source
Sink
IOH
IOL
–50
50
–100
100
—
—
µA
XFC Narrow Bandwidth
Source
Sink
IOH
IOL
–1
1
–2
2
—
—
µA
—
—
100
3.5
160
5.0
µA
mA
—
—
60
0.8
100
1.2
µA
mA
—
—
2
—
50
180
µA
µA
Freescale Semiconductor, Inc...
Output Voltage
ILoad = 10.0 µA
ILoad = –10.0 µA
Supply Current (see Notes)
Run
fosc = 32.768 kHz, fOP =16.384 kHz
fosc = 4.2 MHz, fOP = 2.1 MHz
Wait
fosc = 32.768 kHz, fOP =16.384 kHz
fosc = 4.2 MHz, fOP = 2.1 MHz
Stop (PLL off)
25 °C
–40 °C to +85 °C (Extended)
IDD
I/O Ports Hi-Z Leakage Current
PB0–PB7, PC0–PC3, PA0–PA7
IOZ
—
—
10
µA
Input Current
RESET, IRQ, OSC1
IIN
—
—
1
µA
COUT
CIN
—
—
—
—
12
8
pF
Capacitance
Ports (As Input or Output)
RESET, IRQ
NOTES:
1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = 0 °C to 70 °C, unless otherwise noted
2. All values shown reflect average measurements at midpoint of voltage range at 25 °C.
3. Wait IDD: Only timer and CPI systems active
4. Run (Operating) IDD, Wait IDD: Measured using external square wave clock source, all inputs 0.2 V from rail; no dc
loads, less than 50 pF on all outputs, CL = 20 pF on OSC2.
5. Wait, Stop IDD: All ports configured as inputs, VIL = 0.2 Vdc, VIH = VDD –0.2 Vdc.
6. Stop IDD is measured with OSC1 = VSS.
7. Standard temperature range is 0 °C to 70 °C. Extended temperature range (–40 °C to 85 °C) is available.
8. Wait IDD is affected linearly by the OSC2 capacitance.
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Electrical Specifications
3.3-Volt DC Electrical Characteristics
7.7 3.3-Volt DC Electrical Characteristics
Characteristic
Symbol
Min
Typ
Max
Unit
VOL
VOH
—
VDD –0.1
—
—
0.1
—
V
Output High Voltage
(ILoad = –0.2 mA) PA0–PA7, PB0–PB7, PC0–PC3
VOH
VDD –0.3
—
—
V
Output Low Voltage
(ILoad = 0.4 mA) PA0–PA7, PB0–PB7, PC0–PC3
VOL
—
—
0.30
V
Input High Voltage
PA0–PA7, PB0–PB7, PD0–PD3, IRQ, RESET, OSC1
VIH
0.7 x VDD
—
VDD
V
Input Low Voltage
PA0–PA7, PB0–PB7, PD0–PD3, IRQ, RESET, OSC1
VIL
VSS
—
0.3 x VDD
V
XFC Wide Bandwidth
Source
Sink
IOH
IOL
–25
25
–50
50
—
—
µA
XFC Narrow Bandwidth
Source
Sink
IOH
IOL
–-0.5
0.5
–1
1
—
—
µA
—
—
60
1.5
90
2.0
µA
mA
—
—
30
0.3
50
0.3
µA
mA
—
—
1
—
30
120
µA
µA
Freescale Semiconductor, Inc...
Output Voltage
ILoad = 10.0 µA
ILoad = –10.0 µA
Supply Current (see Notes)
Run
fosc = 32.768 kHz, fOP =16.384 kHz
fosc = 2.1 MHz, fOP = 1.0 MHz
Wait
fosc = 32.768 kHz, fOP =16.384 kHz
fosc = 2.1 MHz, fOP = 1.0 MHz
Stop (PLL off)
25 °C
–40 °C to +85 °C (Extended)
IDD
I/O Ports Hi-Z Leakage Current
PB0–PB7, PC0–PC3, PA0–PA7
IOZ
—
—
10
µA
Input Current
RESET, IRQ, OSC1
IIN
—
—
1
µA
COUT
CIN
—
—
—
—
12
8
pF
Capacitance
Ports (As Input or Output)
RESET, IRQ
NOTES:
1. VDD = 3.3 Vdc ± 10%, VSS = 0 Vdc, TA = 0 °C to 70 °C, unless otherwise noted
2. All values shown reflect average measurements at midpoint of voltage range at 25 °C.
3. Wait IDD: Only timer and CPI systems active
4. Run (Operating) IDD, Wait IDD: Measured using external square wave clock source, all inputs 0.2 V from rail; no dc
loads, less than 50 pF on all outputs, CL = 20 pF on OSC2.
5. Wait, Stop IDD: All ports configured as inputs, VIL = 0.2 Vdc, VIH = VDD –0.2 Vdc.
6. Stop IDD is measured with OSC1 = VSS.
7. Standard temperature range is 0 °C to 70 °C. Extended temperature range (–40 °C to 85 °C) is available.
8. Wait IDD is affected linearly by the OSC2 capacitance.
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7.8 5.0-Volt Control Timing
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Characteristic
Symbol
Min
Max
Unit
Frequency of Operation
Crystal Oscillator Option
External Clock Option
fosc
—
DC
32.768
4.2
kHz
MHz
Internal Operating Frequency
Crystal Oscillator (fOSC ÷ 2)
External Clock (fOSC ÷ 2)
fop
—
DC
16.384
2.1
kHz
MHz
Cycle Time
tcyc
480
—
ns
RESET Pulse Width
tRL
1.5
—
tcyc
Interrupt Pulse Width Low (Edge-Triggered) (see Figure 7-1)
tILIH
125
—
ns
Interrupt Pulse Period (see Figure 7-1)
tILIL
Note 2
—
tcyc
tOH, tOL
90
—
ns
tPLLS
50
—
ms
OSC1 Pulse Width
PLL Startup Stabilization Time
NOTES:
1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = 0 °C to 70 °C, unless otherwise note
2. The minimum period, tILIL, should not be less than the number of cycles it takes to execute the interrupt service routine
plus 19 tcyc.
7.9 3.3-Volt Control Timing
Characteristic
Symbol
Min
Max
Unit
Frequency of Operation
Crystal Oscillator Option
External Clock Option
fosc
—
DC
32.768
2.1
kHz
MHz
Internal Operating Frequency
Crystal Oscillator (fOSC ÷ 2)
External Clock (fOSC ÷ 2)
fop
—
DC
16.384
1.0
kHz
MHz
Cycle Time
tcyc
1000
—
ns
RESET Pulse Width
tRL
1.5
—
tcyc
Interrupt Pulse Width Low (Edge-Triggered) (see Figure 7-1)
tILIH
250
—
ns
Interrupt Pulse Period (see Figure 7-1)
tILIL
Note 2
—
tcyc
tOH, tOL
200
—
ns
tPLLS
100
—
ms
OSC1 Pulse Width
PLL Startup Stabilization Time
NOTES:
1. VDD = 3.3 Vdc ± 10%, VSS = 0 Vdc, TA = 0 °C to 70 °C, unless otherwise note
2. The minimum period, tILIL, should not be less than the number of cycles it takes to execute the interrupt service routine
plus 19 tcyc.
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3.3-Volt Control Timing
IRQ
tILIH
tILIL
IRQ1
tILIH
.
.
.
NORMALLY USED
WITH WIRE-ORED
CONNECTION
Freescale Semiconductor, Inc...
IRQn
IRQ
(MCU)
Figure 7-1. External Interrupt Mode Diagram
OSC11
tRL
RESET
tILIH
IRQ2
4064 tcyc
IRQ3
Internal
Clock
Internal
Address
Bus
1FFE
1FFE
1FFE
1FFE
NOTES:
1. Represents the internal gating of the OSC1 pin
2. IRQ pin edge-sensitive mask option.
3. IRQ pin level and edge-sensitive mask option.
4. RESET vector address shown for timing example.
1FFF4
RESET or Interrupt
Vector Fetch
Figure 7-2. Stop Recovery Timing Diagram
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80
NEW
PCH
INTERNAL
DATA
BUS 1
NEW
PCL
1FFF
tcyc
NEW PC
OP
CODE
NEW PC
3
tRL
1FFE
1FFE
1FFE
PCH
1FFE
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Figure 7-3. Power-On Reset and RESET
NOTES:
1. Internal timing signal and bus information not available externally.
2. OSC1 line is not meant to represent frequency. It is only used to represent time.
3. The next rising edge of the internal processor clock following the rising edge of RESET initiates the reset sequence.
RESET
1FFE
4064 tcyc
VDD Threshold (1-2 V Typical)
INTERNAL
ADDRESS
BUS 1
INTERNAL
PROCESSOR
CLOCK 1
2
OSC1
V
DD
tVDDR
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PCL
1FFF
NEW PC
OP
CODE
NEW PC
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Electrical Specifications
MC68HC05E1 — Revision 2.0
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Section 8. Mechanical Specifications
8.1 Contents
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8.2
Mechnical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
8.3
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
8.3.1
P Suffix, Plastic DIP, Case # 710-02 . . . . . . . . . . . . . . . . . .82
8.3.2
DW Suffix, SOIC, Case # 751F-02. . . . . . . . . . . . . . . . . . . .83
8.2 Mechnical Data
IRQ
1
28
XFC
RESET
2
27
VDDSYN
OSC1
3
26
PA0
OSC2
4
25
PA1
PB7
5
24
PA2
PB6
6
23
PA3
PB5
7
22
PA4
PB4
8
21
PA5
PB3
9
20
PA6
PB2
10
19
PA7
PB1
11
18
PC0
PB0
12
17
PC1
VDD
13
16
PC2
VSS
14
15
PC3
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Mechanical Specifications
8.3 Package Dimensions
8.3.1 P Suffix, Plastic DIP, Case # 710-02
-A28
15
Freescale Semiconductor, Inc...
B
1
14
C
-TSEATING
PLANE
H
G
D 20 PL N
F
L
J 20 PL
K
M
0.25(0.010)
0.25(0.010)
NOTES
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE
WITHIN 0.25mm (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE AND
EACH OTHER.
2. DIMENSION "L" TO CENTER OF LEADS WHEN FORMED
PARALLEL.
3. DIMENSION "B" DOES NOT INCLUDE MOLD FLASH.
M
T A
T B
M
M
DIM
MILLIMETERS
MIN
MAX
INCHES
MIN
MAX
A
B
C
D
F
G
H
J
K
L
M
N
36.45
37.21
13.72
14.2
3.94
5.08
0.36
0.56
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.38
2.92
3.43
15.24 BSC
0°
15°
0.51
1.02
1.435
1.465
0.540
0.560
0.155
0.200
0.014
0.022
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.015
0.115
0.135
0.600 BSC
0°
15°
0.020
0.040
General Release Specification
82
M
MC68HC05E1 — Revision 2.0
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Mechanical Specifications
Package Dimensions
8.3.2 DW Suffix, SOIC, Case # 751F-02
-A-
28
15
-B- P
Freescale Semiconductor, Inc...
1
0.25(0.010)
M
B
M
14 PL
14
G
R X 45°
J
C
-TSEATING
PLANE
K
D 20 PL
NOTES
1. DIMENSIONS "A" AND "B" ARE DATUMS AND
"T" IS A DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
3. CONTROLLING DIM; MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
6. 751F-01 OBSOLETE, NEW STANDARD
751F-02.
M
DIM
MILLIMETERS
MIN
MAX
INCHES
MIN
MAX
A
B
C
D
F
G
J
K
M
P
R
17.80
18.05
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0°
7°
10.05
10.55
0.25
0.75
0.701
0.710
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050BSC
0010
0.012
0.004
0.009
0°
7°
0.395
0.415
0.010
0.029
MC68HC05E1 — Revision 2.0
MOTOROLA
F
General Release Specification
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
83
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
Mechanical Specifications
General Release Specification
84
MC68HC05E1 — Revision 2.0
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc...
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc...
Freescale Semiconductor, Inc.
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