MICROSEMI LX7206

LX7206
Integrated EMI Filter & ESD Protection for
Earpiece Speaker & Microphone Ports
®
TM
P RODUCTION D ATA S HEET
Proliferation of digital portable
electronic equipment has created a
noisy environment in which all
devices become susceptible to
Electromagnetic Interference (EMI).
Interference
form
cell
phone
frequencies of 800-900 MHz and
1.9GHz as well as the growing
wireless LAN frequencies of 2.46GHz can couple into the audio port
of a handheld device and adversely
affect its performance. FCC Part 15
sets maximum allowable emission and
immunity levels for all digital devices.
LX7206 is an integrated low pass
filter with ESD protection that filters
out the undesired frequencies as well as
protecting the port against both positive
and negative ESD voltages. The device
is a 3x2 array flip chip and measures
1.5 x 1.0 x 0.65 mm. The small size
and profile of this device is ideally
suited for portable applications. The
absence of leadframe and bondwires
minimizes inductance and optimizes the
high frequency filter performance.
LX7206 exceeds the requirements of
IEC61000-4-2 (15KV air discharge and
8KV contact discharge).
ƒ Flip Chip construction
ƒ Bi-directional EMI/RFI low-pass
filter
ƒ ESD protection with integrated
line termination resistor
ƒ Bi-directional TVS protects
against negative ESD voltages
in audio applications
ƒ Low TVS operating voltage
(5.0V)
ƒ Low leakage current
ƒ 0.5mm Pitch Chip Scale
Package designed for direct
assembly on FR4 PCB using
conventional assembly
techniques
WWW . Microsemi .C OM
KEY FEATURES
DESCRIPTION
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPLICATIONS
BENEFITS
ƒ
ƒ
ƒ
ƒ
ƒ Cell phones and Accessories
ƒ Personal Digital Assistants
(PDA’s)
ƒ Pagers
ƒ MP3 Players
ƒ Desktops and Notebook
Computers
ƒ Digital Camcorders
Filter response characterized up to 6 GHz
Low insertion loss in the pass band
>20dB attenuation in the 800-900 MHz range
>15dB attenuation in the WLAN frequencies of 2.4GHz and 5.0-6.0 GHz
PRODUCT HIGHLIGHT
Device Schematic
A1
Earpiece
Input
C
GND
A3
Microphone
Input
B1
10 Ω
A2, B2
B3
68 Ω
C
A
Microphone
Output
C
1
2
3
LX7206
GND
B
Earpiece
Output
C
A2, B2
PACKAGE ORDER INFO
TJ (°C)
-40 to 125
SP
0.5mm Pitch
Chip Scale Package (CSP)
LX7206ISP
Note: Available in Tape & Reel. Append the letters “TR” to the part
number. (i.e. LX7206ISP-TR)
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
LX7206
®
TM
Integrated EMI Filter & ESD Protection for
Earpiece Speaker & Microphone Ports
P RODUCTION D ATA S HEET
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN OUT
WWW . Microsemi .C OM
Peak Pulse Power (tp = 8/20 µs ) IEC61000-4-5 .......................................... 250W
Peak Pulse Current (tp = 8/20 µs ) IEC61000-4-5 ...........................................26A
ESD Air Discharge per IEC61000-4-2 ......................................................... 30KV
ESD Contact Discharge per IEC61000-4-2 .................................................. 30KV
Operating Temperature ................................................................-40°C to +125°C
Storage Temperature Range.........................................................-55°C to +150°C
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
SP PACKAGE
(Top View)
FUNCTIONAL PIN DESCRIPTION
Name
Description
A1
Line 1 input
B1
Line 1 output
A2 & B2
Ground
A3
Line 2 input
B3
Line 2 output
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C ≤ TA
otherwise noted.
y
Parameter
`
Symbol
Test Conditions
Min
≤
70°C except where
LX7206
Typ
Max
Units
SECTION HEADER
Copyright © 2004
Rev. 1.0, 2004-10-05
VRWM
VBR
IR
RS
RS
TCOEFF
C
C
5.0
IR = 1mA
VRWM = + -5.0V, T = 25°C
Each Line
VR = 2.5V, f = 1 MHz
VR = 2.5V, f = 1 MHz
6
-1
9
61
115
115
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
10
68
200
145
145
1
11
75
175
175
V
V
µA
Ω
Ω
ppm
pF
pF
Page 2
ELECTRICALS
Stand-Off Voltage
Breakdown Voltage
Leakage Current
Series Resistance, A1 to B1
Series Resistance, A3 to B3
Temperature Coefficient of RS
Capacitor, A1 or B1 to GND
Capacitor, A3 or B3 to GND
LX7206
®
TM
Integrated EMI Filter & ESD Protection for
Earpiece Speaker & Microphone Ports
P RODUCTION D ATA S HEET
RECOMMENDED PCB PARAMETERS
WWW . Microsemi .C OM
Parameter
Value
Cu pad size
0.275 +0.0/-0.025 mm
Pad Pitch
0.5mm
Pad Definition
Non-Solder Mask Defined
Solder Mask Opening
0.325 ± 0.025 mm
0.25 x 0.25 mm square,
0.125 mm thick, laser cut, electro-polished
OSP (Organic Surface Preservative)
Solder Stencil
Pad Protective Finish
Non-Solder Mask Defined Cu
Pad (OSP finish)
0.275 mm dia.
Solder Mask Opening
0.325 mm dia.
Figure 1 – Recommended Non-Solder Mask Defined Pad
Temperature (oC)
240 oC max
183 oC
150 oC
~ 1min
Flux Activation
Zone
~2 min
Solder Reflow
Zone
~ 1min
PACKAGE DATA
Preheat Zone
Cooling Zone
Time (s)
Figure 2 – Solder Reflow Profile. Maximum temperature is 240°C and maximum time above liquidous (183°C) is 60
seconds.
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 3
LX7206
Integrated EMI Filter & ESD Protection for
Earpiece Speaker & Microphone Ports
®
TM
P RODUCTION D ATA S HEET
TEK Stopped Single Seq
0 Acqs
1Acqs
WWW . Microsemi .C OM
TEK Preview Single Seq
8KV Contact ESD
M 40.0ns
5.0V
Ch1 5.0V
Chart 1 – 8KV ESD input pulse as per IEC61000-4-2. Vertical scale is
equivalent to 5A/div.
log 5dB/
REF 0dB
S21
0 dB
0 dB
-10 dB
-10 dB
Insertion Loss
Insertion Loss
S21
M 40.0ns
Chart 2 – Clamping characteristics when device subjected to an 8KV ESD pulse.
-20 dB
-30 dB
log 5dB/
REF 0dB
-20 dB
-30 dB
-40 dB
-40 dB
0.3
1
10
1000
100
6000
0.3
1
10
100
1000
6000
Frequency (MHz)
Frequency (MHz)
Chart 3 – Typical frequency response curce of the EMI filter (A1-B1)
Chart 4 – Typical frequency response curve of the EMI filter (A3-B3)
12
10
8
CHARTS
Clamping Voltage VC(V)
14
6
Line To GND
4
GND to Line
2
0
0
5
10
15
20
Peak Pulse Current IPP(A)
25
30
Chart 5 – Clamping voltage versus Peak Pulse Current. Waveform parameters: tr = 8µs, td = 20µs. Per IEC61000-4-5
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 4
LX7206
Integrated EMI Filter & ESD Protection for
Earpiece Speaker & Microphone Ports
®
TM
P RODUCTION D ATA S HEET
PACKAGE DIMENSIONS
WWW . Microsemi .C OM
SP
0.5mm Chip Scale Package
1.5mm
0.25mm dia. 63/37 Sn/Pb
Eutectic Solder Bumps
0.5mm
Pin A1 Identification Mark
B
0.5mm
06
YWWA
1.0 mm
A
2
1
3
Y = Year | WW = Work Week | A = Lot Code
SP Package – Bumps Up
SP Package – Bump Side Down
06
YWWA
06
YWWA
06
YWWA
Device Orientation in Tape
MECHANICALS
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 5
LX7206
Integrated EMI Filter & ESD Protection for
Earpiece Speaker & Microphone Ports
®
TM
P RODUCTION D ATA S HEET
A
B
C
J
L
P
D
H
K
E
5°M A X
F
G
Dim
A
B
C
D
E
F
G
H
J
K
L
WWW . Microsemi .C OM
TAPE SPECIFICATIONS
MILLIMETERS
MIN
MAX
3.90
4.10
1.95
2.05
1.65
1.85
3.45
3.55
1.90
2.10
0.67
0.77
1.03
1.13
1.75
1.85
1.40
1.60
0.45
0.55
0.252 0.256
MECHANICALS
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 6
LX7206
TM
®
Integrated EMI Filter & ESD Protection for
Earpiece Speaker & Microphone Ports
P RODUCTION D ATA S HEET
NOTES
WWW . Microsemi .C OM
NOTES
PRODUCTION DATA – Information contained in this document is proprietary to
Microsemi and is current as of publication date. This document may not be modified in
any way without the express written consent of Microsemi. Product processing does not
necessarily include testing of all parameters. Microsemi reserves the right to change the
configuration and performance of the product and to discontinue product at any time.
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 7