Surface Mount RF PIN Diodes in SOT-363 (SC-70, 6 Lead) Technical Data HSMP-389L / T / U Features • Diodes Optimized for: Ultra-Low Distortion Switching Microwave Frequency Operation • Surface Mount SOT-363 (SC-70)Package Single, Pair, and Trio Versions Tape and Reel Options Available * For more information see the Surface Mount PIN Reliability Data Sheet. LOW INDUCTANCE SINGLE UNCONNECTED TRIO 6 5 1 2 Description/Applications 4 6 5 3 1 2 L 4 3 T If Piv TJ TSTG θjc Pin Connections and Package Marking SERIES– SHUNT PAIR 6 5 4 1 2 3 1 2 3 U Absolute Maximum Ratings [1], TC = + 25°C Symbol Parameter The HSMP-389L/T/U is optimized for switching applications where low resistance at low current, and low capacitance are required. Unit Absolute Maximum Forward Current (1 µs Pulse) Amp Peak Inverse Voltage V Junction Temperature °C Storage Temperature °C [2] Thermal Resistance °C/W 1 Same as VBR 150 -65 to 150 140 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = 25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. GU • Low Failure in Time (FIT) Rate* Package Lead Code Identification (Top View) 6 5 4 Notes: 1. Package marking provides orientation and identification. 2. See “Electrical Specifications” for appropriate package marking. 2 Electrical Specifications, TC = +25°C, each diode PIN Switching Diodes Part Number HSMP- Package Marking Code[1] Lead Code 389L 389T 389U GL GT GU L T U Configuration Unconnected Trio Low Inductance Single Series-Shunt Pair Test Conditions Minimum Breakdown Voltage VBR (V) Maximum Total Resistance RT (Ω) Maximum Total Capacitance CT (pF) 100 2.5 0.30 VR = VBR Measure IR ≤ 10 µA IF = 5 mA f = 100 MHz VR = 5 V f = 1 MHz Typical Parameters at TC = +25°C Part Number HSMP- Total Resistance Carrier Lifetime RT (Ω) τ (ns) Reverse Recovery Time Trr (ns) Total Capacitance (pF) 389A Series 3.8 200 — — Test Conditions IF = 1 mA f = 100 MHz IF = 10 mA IR = 6 mA VR = 10 V IF = 20 mA 90% Recovery 50 V Note: 1. Package marking code is laser marked. 3 HSMP-389A Series Typical Performance, TC = 25°C, each diode 1.4 1000 100 10 1 1.2 1 0.8 0.6 0.4 0.2 0.1 0.01 0.1 1 10 100 IF – FORWARD BIAS CURRENT (mA) 0 10 20 30 40 50 IF – FORWARD CURRENT (mA) 100 160 VR = –2V 120 80 VR = –5V 40 VR = –10V 15 20 25 30 FORWARD CURRENT (mA) Figure 4. Typical Reverse Recovery Time vs. Reverse Voltage. 10 1 0.1 0.01 125°C 25°C –50°C 0 0.2 0.4 0.6 0.8 1.0 Diode Mounted as a 115 Series Switch in a 50Ω Microstrip and 110 Tested at 123 MHz 105 HSMP-3880 100 95 90 85 1 10 30 IF – FORWARD BIAS CURRENT (mA) Figure 2. Capacitance vs. Reverse Voltage at 1 MHz. 200 0 10 0 VR – REVERSE VOLTAGE (V) Figure 1. Total RF Resistance at 25° C vs. Forward Bias Current. Trr – REVERSE RECOVERY TIME (nS) 120 INPUT INTERCEPT POINT (dBm) CT – CAPACITANCE (pF) RF RESISTANCE (OHMS) 10000 1.2 VF – FORWARD VOLTAGE (V) Figure 5. Forward Current vs. Forward Voltage. Figure 3. 2nd Harmonic Input Intercept Point vs. Forward Bias Current. 4 Typical Applications for Multiple Diode Products 2 “ON” “OFF” 1 2 1 0 0 2 +V –V 3 3 2 1 1 4 0 5 3 2 1 4 5 6 1 6 b1 b2 b3 RF in Figure 7. HSMP-389L Unconnected Trio used in a Dual Voltage, High Isolation Switch. Figure 6. HSMP-389L used in a SP3T Switch. “ON” “OFF” 1 1 +V 0 2 0 +V 1 6 5 4 1 2 3 RF out RF in RF out 2 Figure 8. HSMP-389L Unconnected Trio used in a Positive Voltage, High Isolation Switch. 5 Typical Applications for Multiple Diode Products (continued) Bias λ 4 Ant RF out Xmtr 6 5 4 Rcvr Bias Antenna 1 2 3 Xmtr 1 6 2 5 3 4 RF in λ 4 Rcvr Figure 9. HSMP-389T used in a Low Inductance Shunt Mounted Switch. bias PA LNA HSMP-389U Figure 11. Tx/Rx Switch Configuration. Figure 10. HSMP-389U Series/Shunt Pair used in a Transmit/ Receive Switch. 6 Assembly Information SOT-363 PCB Footprint A recommended PCB pad layout for the miniature SOT-363 (SC-70, 6 lead) package is shown in Figure 12 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair performance. 0.026 SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT-363 package, will reach solder reflow temperatures faster than those with a greater mass. 0.075 0.016 Figure 12. PCB Pad Layout (dimensions in inches). HP’s SOT-363 diodes have been qualified to the time-temperature profile shown in Figure 13. This profile is representative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 235 °C. These parameters are typical for a surface mount assembly process for HP SOT-363 diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. 250 TMAX 200 TEMPERATURE (°C) 0.035 passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. 150 Reflow Zone 100 Preheat Zone Cool Down Zone 50 0 0 60 120 180 TIME (seconds) Figure 13. Surface Mount Assembly Profile. 240 300 7 Device Orientation REEL TOP VIEW END VIEW 4 mm 8 mm CARRIER TAPE USER FEED DIRECTION ## ## ## ## Note: “##” represents Package Marking Code. Package marking is right side up with carrier tape perforations at top. Conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” Standard Quantity is 3,000 Devices per Reel. COVER TAPE Tape Dimensions For Outline SOT-363 (SC-70, 6 Lead) P P2 D P0 E F W C D1 t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) K0 8° MAX. A0 DESCRIPTION 5° MAX. B0 SYMBOL SIZE (mm) SIZE (INCHES) CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 2.24 ± 0.10 2.34 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.088 ± 0.004 0.092 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 + 0.010 PERFORATION DIAMETER PITCH POSITION D P0 E 1.55 ± 0.05 4.00 ± 0.10 1.75 ± 0.10 0.061 ± 0.002 0.157 ± 0.004 0.069 ± 0.004 CARRIER TAPE WIDTH THICKNESS W t1 8.00 ± 0.30 0.255 ± 0.013 0.315 ± 0.012 0.010 ± 0.0005 COVER TAPE WIDTH TAPE THICKNESS C Tt 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025 ± 0.00004 DISTANCE CAVITY TO PERFORATION (WIDTH DIRECTION) F 3.50 ± 0.05 0.138 ± 0.002 CAVITY TO PERFORATION (LENGTH DIRECTION) P2 2.00 ± 0.05 0.079 ± 0.002 Package Dimensions Outline SOT-363 (SC-70, 6 Lead) 1.30 (0.051) REF. 2.20 (0.087) 2.00 (0.079) XX PACKAGE MARKING CODE 1.35 (0.053) 1.15 (0.045) 0.650 BSC (0.025) 0.425 (0.017) TYP. 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.30 REF. 1.00 (0.039) 0.80 (0.031) 0.25 (0.010) 0.15 (0.006) 10° 0.30 (0.012) 0.10 (0.004) 0.20 (0.008) 0.10 (0.004) DIMENSIONS ARE IN MILLIMETERS (INCHES) Package Characteristics Lead Material ........................................................................................ Copper Lead Finish............................................................................. Tin-Lead 85/15% Maximum Soldering Temperature ............................... 260°C for 5 seconds Minimum Lead Strength ........................................................... 2 pounds pull Typical Package Inductance ................................................................... 2 nH Typical Package Capacitance .............................. 0.08 pF (opposite leads) Part Number Ordering Information Part Number HSMP-389A-TR1* HSMP-389A-BLK* * where A = L, T or U No. of Devices 3000 100 Container 7" Reel antistatic bag For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright © 1997 Hewlett-Packard Co. Printed in U.S.A. 5966-2028E (10/97)