Surface Mount Microwave Schottky Detector Diodes Technical Data HSMS-2850 Series HSMS-2860 Series Features • Surface Mount SOT-23/ SOT-143 Package • High Detection Sensitivity: up to 50 mV/µW at 915 MHz up to 35 mV/µW at 2.45 GHz up to 25 mV/µW at 5.80 GHz • Low Flicker Noise: -162 dBV/Hz at 100 Hz • Low FIT (Failure in Time) Rate* • Tape and Reel Options Available HSMS-2860 Package Lead Code Identification Description SINGLE 3 SERIES 3 1 1 #0 2 COMMON ANODE 3 1 * For more information see the Surface Mount Schottky Reliability Data Sheet. #3 #2 2 COMMON CATHODE 3 2 1 #4 2 UNCONNECTED PAIR 3 4 1 #5 2 HSMS-2850 Package Lead Code Identification SINGLE 3 SERIES 3 1 1 #0 2 #2 UNCONNECTED PAIR 3 4 1 #5 2 2 Hewlett-Packard’s HSMS-2850 family of zero bias Schottky detector diodes and the HSMS-2860 family of DC biased detector diodes have been designed and optimized for use from 915 MHz to 5.8 GHz. They are ideal for RF/ID and RF Tag applications requiring small and large signal detection, modulation, RF to DC conversion or voltage doubling. Available in various package configurations, these two families of detector diodes provide low cost solutions to a wide variety of design problems. HewlettPackard’s manufacturing techniques assure that when two diodes are mounted into a single SOT-23 or SOT-143 package, they are taken from adjacent sites on the wafer, assuring the highest possible degree of match. 2 DC Electrical Specifications, TA = +25°C, Single Diode Part Number HSMS- Package Marking Code[1] Lead Code Maximum Forward Voltage VF (mV) Configuration 2850 2852 2855 P0 P2 P5 0 2 5 Single Series Pair [2,3] Unconnected Pair [2,3] 150 250 0.30 2860 2862 2863 2864 2865 T0 T2 T3 T4 T5 0 2 3 4 5 Single Series Pair [2,3] Common Anode [2,3] Common Cathode [2,3] Unconnected Pair [2,3] 250 350 0.30 Test Conditions Typical Capacitance CT (pF) IF = 0.1 mA IF = 1.0 mA VR = –0.5 V to –1.0V f = 1 MHz Notes: 1. Package marking code is in white. 2. ∆VF for diodes in pairs is 15.0 mV maximum at 1.0 mA. 3. ∆CT for diodes in pairs is 0.05 pF maximum at –0.5 V. RF Electrical Specifications, TA = +25°C, Single Diode Part Number HSMS2850 2852 2855 Test Conditions 2860 2862 2863 2864 2865 Test Conditions Typical Tangential Sensitivity TSS (dBm) @ f = 915 MHz 2.45 GHz 5.8 GHz – 57 – 56 –55 Typical Voltage Sensitivity γ (mV/ µW) @ f = 915 MHz 2.45 GHz 5.8 GHz 40 Video Bandwidth = 2 MHz Zero Bias – 57 – 56 –55 Video Bandwidth = 2 MHz Ib = 5 µA 30 Typical Video Resistance RV (KΩ) 22 8.0 25 5.0 Power in = –40 dBm RL = 100 KΩ, Zero Bias 50 35 Power in = –40 dBm RL = 100 KΩ, Ib = 5 µA 3 Absolute Maximum Ratings, Ta = +25°C, Single Diode Symbol Absolute Maximum[1] Parameter HSMS-285x HSMS-286x 75 mW 250 mW PT Total Device Dissipation[2] PIV Peak Inverse Voltage 2.0 V 4.0 V TJ Junction Temperature 150°C 150°C TSTG Storage Temperature -65°C to 150°C -65°C to 150°C TOP Operating Temperature -65°C to 150°C -65°C to 150°C Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. CW Power Dissipation at TLEAD = +25°C. Derate linearly to zero at maximum rated temperature. ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. Equivalent Circuit Model HSMS-2850, HSMS-2860; Singles 0.08 pF Rj 2 nH SPICE Parameters Parameter Units HSMS-285X HSMS-286X BV V 3.8 7.0 CJ0 pF 0.18 0.18 EG eV 0.69 0.69 IBV A 3 x 10E-4 10E-5 IS A 3 x 10E-6 5.0 x 10E-8 1.06 1.08 N RS 0.18 pF RS = series resistance (see Table of SPICE parameters) Rj = 8.33 X 10-5 nT Ib + Is where Ib = externally applied bias current in amps Is = saturation current (see table of SPICE parameters) T = temperature, °K n = identity factor (see table of SPICE parameters) RS Ω 25 5.0 PB (VJ) V 0.35 0.65 PT (XTI) 2 2 M 0.5 0.5 4 1 0.1 TA = +85°C TA = +25°C TA = –55°C 10 1 .1 .01 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 VF – FORWARD VOLTAGE (V) 5.8 GHz -30 2.45 GHz 5.8 GHz 1 POWER IN (dBm) -40 -30 Figure 5. +25°C Expanded Output Voltage vs. Input Power. See Figure 4. 3.1 40 2.9 OUTPUT VOLTAGE (mV) 35 30 25 20 Input Power = –30 dBm @ 2.45 GHz Data taken in fixed-tuned FR4 circuit .1 1 10 FREQUENCY = 2.45 GHz PIN = -40 dBm RL = 100 KΩ 2.5 2.3 2.1 1.9 1.7 1.5 1.3 MEASUREMENTS MADE USING A RL = 100 KΩ 5 2.7 100 BIAS CURRENT (µA) Figure 7. Voltage Sensitivity as a Function of DC Bias Current, HSMS-2860. Applications Information See the HSMS-285A data sheet. 10 µA 1000 5 µA 100 Frequency = 2.45 GHz Fixed-tuned FR4 circuit 10 RL = 100 KΩ DIODES TESTED IN FIXED-TUNED FR4 MICROSTRIP CIRCUITS. POWER IN (dBm) Figure 4. +25°C Output Voltage vs. Input Power, HSMS-2850 at Zero Bias, HSMS-2860 at 3 µA Bias. OUTPUT VOLTAGE (mV) 20 µA 10 0.3 -50 0 -10 -20 1 0.25 10,000 DIODES TESTED IN FIXED-TUNED FR4 MICROSTRIP CIRCUITS. 10 0.20 Figure 3. Typical Forward Voltage Match, HSMS-2860 Pairs. VOLTAGE OUT (mV) VOLTAGE OUT (mV) VOLTAGE OUT (mV) 915 MHz 10 15 0.15 915 MHz 2.45 GHz -40 0.10 RL = 100 KΩ 1000 0.1 -50 ∆VF (right scale) FORWARD VOLTAGE (V) 30 RL = 100 KΩ 1 10 1 0.05 Figure 2. Typical Forward Current vs. Forward Voltage at Temperature, HSMS-2860 Series. 10000 10 IF (left scale) FORWARD VOLTAGE (V) Figure 1. Typical Forward Current vs. Forward Voltage, HSMS-2850 Series. 100 FORWARD CURRENT (µA) 10 0.01 100 100 FORWARD CURRENT (mA) IF – FORWARD CURRENT (mA) 100 FORWARD VOLTAGE DIFFERENCE (mV) Typical Parameters, Single Diode 1.1 FR4 MICROSTRIP CIRCUIT. 0.9 0 10 20 30 40 50 60 70 80 90 100 TEMPERATURE (°C) Figure 8. Output Voltage vs. Temperature, HSMS-2850 Series. 1 –40 –30 –20 –10 0 10 POWER IN (dBm) Figure 6. Dynamic Transfer Characteristic as a Function of DC Bias, HSMS-2860. 5 Ordering Information Profile Option Descriptions Specify part number followed by option. For example: H SMS - 285X #X XX Bulk or Tape and Reel Option Profile: Low = L Part Number Surface Mount Schottky Hewlett-Packard Package Dimensions Outline 23 (SOT-23) 1.02 (0.040) 0.89 (0.035) 0.54 (0.021) 0.37 (0.015) PACKAGE MARKING CODE 3 1.40 (0.055) 1.20 (0.047) XX 2 1 0.50 (0.024) 0.45 (0.018) 2.65 (0.104) 2.10 (0.083) 2.04 (0.080) 1.78 (0.070) TOP VIEW 0.152 (0.006) 0.066 (0.003) 3.06 (0.120) 2.80 (0.110) 1.02 (0.041) 0.85 (0.033) 0.69 (0.027) 0.45 (0.018) 0.10 (0.004) 0.013 (0.0005) SIDE VIEW END VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES) Outline 143 (SOT-143) 0.92 (0.036) 0.78 (0.031) PACKAGE MARKING CODE E C 1.40 (0.055) 1.20 (0.047) XX B 2.65 (0.104) 2.10 (0.083) E 0.60 (0.024) 0.45 (0.018) 2.04 (0.080) 1.78 (0.070) 0.54 (0.021) 0.37 (0.015) 0.15 (0.006) 0.09 (0.003) 3.06 (0.120) 2.80 (0.110) 1.02 (0.041) 0.85 (0.033) 0.10 (0.004) 0.013 (0.0005) DIMENSIONS ARE IN MILLIMETERS (INCHES) 0.69 (0.027) 0.45 (0.018) #L30 = Bulk #L31 = 3K pc. Tape and Reel, Device Orientation Figures 9, 10 Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” Package Characteristics Lead Material Alloy 42 Lead Finish Tin-Lead 85/15% Max. Soldering Temp. 260°C for 5 sec. Min. Lead Strength 2 pounds pull Typical Package Inductance 2 nH (opposite leads) Typical Package Capacitance 0.08 pF (opposite leads) Device Orientation REEL CARRIER TAPE USER FEED DIRECTION COVER TAPE TOP VIEW END VIEW 4 mm 8 mm Figure 9. Option L31 for SOT-23 Packages. 4 mm 8 mm Figure 10. Option L31 for SOT-143 Packages. www.hp.com/go/rf For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright © 1998 Hewlett-Packard Co. Obsoletes 5966-0928E, 5966-2939E Printed in U.S.A. 5966-4283E (3/98)