Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT ADG936/ADG936-R FEATURES FUNCTIONAL BLOCK DIAGRAMS Wideband switch: −3 dB @ 4 GHz ADG936 absorptive dual SPDT ADG936-R reflective dual SPDT High off isolation (36 dB @ 1 GHz) Low insertion loss (0.9 dB dc to 1 GHz) Single 1.65 to 2.75 V power supply CMOS/LVTTL control logic 20-lead TSSOP and 4 mm × 4 mm LFCSP package Low power consumption (1 µA max) RF1A RF1A RFCA RFCA 50Ω RF2A RF2A INA INA ADG936-R 50Ω ADG936 RF1B RF1B RFCB RFCB APPLICATIONS 50Ω Wireless communications General-purpose RF switching Dual-band applications High speed filter selection Digital transceiver front end switch IF switching Tuner modules Antenna diversity switching RF2B RF2B INB 04503-0-001 04503-0-012 INB 50Ω Figure 1. Figure 2. GENERAL DESCRIPTION LVTTL compatible. The low power consumption of these CMOS devices makes them ideally suited for wireless applications and general-purpose high frequency switching. PRODUCT HIGHLIGHTS 1. –36 dB off isolation @ 1 GHz. 2. 0.9 dB insertion loss @ 1 GHz. 3. –10 –20 VDD = 2.5V TA = 25°C INSERTION LOSS (dB) –40 –50 S21 –60 S12 –70 –80 10k 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G 04503-0-019 OFF ISOLATION (dB) –30 Figure 3. Off Isolation vs. Frequency 20-lead TSSOP and 4 mm × 4 mm LFCSP package. –0.3 –0.4 –0.5 –0.6 –0.7 –0.8 –0.9 –1.0 –1.1 –1.2 –1.3 –1.4 –1.5 –1.6 –1.7 –1.8 –1.9 –2.0 –2.1 –2.2 –2.3 –2.4 –2.5 –2.6 –2.7 –2.8 –2.9 TA = 25°C –3.0 10k 100k VDD = 2.5V 1M 10M 100M FREQUENCY (Hz) 1G 10G 04503-0-015 The ADG936/ADG936-R are wideband analog switches that comprise two independently selectable SPDT switches using a CMOS process to provide high isolation and low insertion loss to 1 GHz. The ADG936 is an absorptive/matched dual SPDT with 50 Ω terminated shunt legs; the ADG936-R is a reflective dual SPDT. These devices are designed such that the isolation is high over the dc to 1 GHz frequency range. They have on-board CMOS control logic, eliminating the need for external controlling circuitry. The control inputs are both CMOS and Figure 4. Insertion Loss vs. Frequency Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved. ADG936/ADG936-R TABLE OF CONTENTS Specifications..................................................................................... 3 Absorptive vs. Reflective ........................................................... 11 Absolute Maximum Ratings............................................................ 4 Filter Selection ............................................................................ 11 Pin Configurations and Function Descriptions ........................... 5 Tx/Rx Switching ......................................................................... 11 Terminology ...................................................................................... 6 Antenna Diversity Switch.......................................................... 11 Typical Performance Characteristics ............................................. 7 Evaluation Board ............................................................................ 12 Test Circuits....................................................................................... 9 Outline Dimensions ....................................................................... 13 Applications..................................................................................... 11 Ordering Guide .......................................................................... 14 REVISION HISTORY 7/04—Revision 0: Initial Version Rev. 0 | Page 2 of 16 ADG936/ADG936-R SPECIFICATIONS VDD = 1.65 V to 2.75 V, GND = 0 V, Input Power = 0 dBm, all specifications TMIN to TMAX, unless otherwise noted.1 Table 1. Parameter AC ELECTRICAL CHARACTERISTICS Operating Frequency3 3 dB Frequency4 Input Power4 Symbol tON tOFF tRISE tFALL P–1 dB IP3 0 V dc bias 0.5 V dc bias DC to 100 MHz; VDD = 2.5 V ± 10% 500 MHz; VDD = 2.5 V ± 10% 1000 MHz; VDD = 2.5 V ± 10% 100 MHz 500 MHz 1000 MHz 100 MHz 500 MHz 1000 MHz DC to 100 MHz 500 MHz 1000 MHz DC to 100 MHz 500 MHz 1000 MHz 50% CTRL to 90% RF 50% CTRL to 10% RF 10% to 90% RF 90% to 10% RF 1000 MHz 900 MHz/901 MHz, 4 dBm VINH VINH VINL VINL II VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V 0 ≤ VIN ≤ 2.75 V CRF ON CDIG f = 1 MHz f = 1 MHz IDD Digital inputs = 0 V or VDD S21, S12 Isolation—RFCx to RF1x/RF2x S21, S12 Crosstalk—RF1x to RF2x S21, S12 Return Loss (On Channel)4 S11, S22 Return Loss (Off Channel)4 S11, S22 Input Low Voltage Input Leakage Current CAPACITANCE RF Port On Capacitance Digital Input Capacitance POWER REQUIREMENTS VDD Quiescent Power Supply Current Min B Version Typ2 Max DC Insertion Loss On Switching Time4 Off Switching Time4 Rise Time4 Fall Time4 1 dB Compression4 Third-Order Intermodulation Intercept Video Feedthrough5 DC ELECTRICAL CHARACTERISTICS Input High Voltage Conditions 52 40 31 53 42 34 20 19 16 18 17 16 29 0.4 0.6 0.9 60 47 36 69 45 37 25 23 24 24 23 21 11 10 6.1 6 16 32 3 2 4 7 16 0.5 0.8 1.25 14 13 8 8 1.7 0.65 VCC ± 0.1 0.7 0.35 VCC ±1 Unit GHz GHz dBm dBm dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB ns ns ns ns dBm dBm mV p-p V V V V µA 4 2.5 2 1.65 1 0.1 pF pF 2.75 1 V µA Temperature range B Version: −40°C to +85°C. Typical values are at VDD = 2.5 V and 25°C, unless otherwise noted. Operating frequency is the point at which insertion loss degrades by 1 dB. 4 Guaranteed by design, not subject to production test. 5 Video feedthrough is the dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns rise time pulses and 500 MHz bandwidth. 2 3 Rev. 0 | Page 3 of 16 ADG936/ADG936-R ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 2. Parameter VDD to GND Inputs to GND Continuous Current Input Power Operating Temperature Range Industrial (B Version) Storage Temperature Range Junction Temperature TSSOP Package θJA Thermal Impedance LFCSP Package θJA Thermal Impedance (4-layer board) Lead Temperature, Soldering (10 s) IR Reflow, Peak Temperature (<20 s) ESD Rating –0.5 V to +4 V –0.5 V to VDD + 0.3 V1 30 mA 18 dBm –40°C to +85°C –65°C to +150°C 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. Table 3. Truth Table 143°C/W 30.4°C/W 300°C 235°C 1 kV INx 0 1 1 RF1x Off On RF2x On Off RF1x/RF2x Off Port Inputs to Ground = –0.5 V to VDD – 0.5 V. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. 0 | Page 4 of 16 ADG936/ADG936-R RF2B GND 8 13 GND GND 9 12 INB RFCB 10 11 GND GND 4 RF1B 5 ADG936 ADG936-R TOP VIEW (Not to Scale) Figure 5. 20-Lead TSSOP (RU-20) 14 RF2A 13 GND 12 GND 11 RF2B 04503-0-003 14 RF1A 2 GND 3 GND 6 RF1B 7 15 GND GND 1 16 GND TOP VIEW (Not to Scale) 15 GND 04503-0-002 GND 6 16 INA RF2A GND 5 17 GND GND 17 RF1A 4 ADG936 ADG936-R 18 RFCA INA 18 GND 3 GND 9 INB 10 GND 19 19 VDD 20 VDD 2 GND 7 RFCB 8 RFCA 1 20 GND PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS Figure 6. 20-Lead 4 mm × 4 mm LFCSP (CP-20) Table 4. Pin Function Descriptions Pin No. 20-Lead 20-Lead TSSOP LFCSP 1 18 2 19 3, 5, 6, 8, 9, 11,13, 15, 16, 18, 20 4 7 10 12 14 17 19 1, 3, 4, 6, 7, 9, 12,13, 15, 17, 20 2 5 8 10 11 14 16 Mnemonic RFCA VDD GND Function Common RF Port for Switch A. Power Supply Input. These parts can be operated from 1.65 V to 2.75 V. VDD should be decoupled to GND. Ground Reference Point for All Circuitry on the Part. RF1A RF1B RFCB INB RF2B RF2A INA RF1A Port. RF1B Port. Common RF Port for Switch B. Logic Control Input. RF2B Port. RF2A Port. Logic Control Input. Rev. 0 | Page 5 of 16 ADG936/ADG936-R TERMINOLOGY Table 5. Parameter VDD IDD GND INx VINL VINH IINL (IINH) CIN tON tOFF tRISE tFALL Off Isolation Insertion Loss Crosstalk P–1 dB IP3 Return Loss Video Feedthrough Description Most Positive Power Supply Potential. Positive Supply Current. Ground (0 V) Reference. Logic Control Input. Maximum Input Voltage for Logic 0. Minimum Input Voltage for Logic 1. Input Current of the Digital Input. Digital Input Capacitance. Delay between Applying the Digital Control Input and the Output Switching On. Delay between Applying the Digital Control Input and the Output Switching Off. Rise Time. Time for the RF signal to rise from 10% of the On level to 90% of the On level. Fall Time. Time for the RF signal to fall from 90% of the On level to 10% of the On level. The Attenuation between Input and Output Ports of the Switch when the Switch Control Voltage Is in the Off Condition. The Attenuation between Input and Output Ports of the Switch when the Switch Control Voltage Is in the On Condition. Measure of Unwanted Signal Coupled through from One Channel to Another as a Result of Parasitic Capacitance. 1 dB Compression Point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level value. P–1 dB is a measure of how much power the On switch can handle before the insertion loss increases by 1 dB. Third-Order Intermodulation Intercept. This is a measure of the power in false tones that occurs when closely spaced tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated. The Amount of Reflected Power Relative to the Incident Power at a Port. Large return loss indicates good matching. By measuring return loss, the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio) indicates the degree of matching present at a switch RF port. Spurious Signals Present at the RF Ports of the Switch when the Control Voltage Is Switched from High to Low or Low to High without an RF Signal Present. Rev. 0 | Page 6 of 16 ADG936/ADG936-R VDD = 2.50V VDD = 2.25V 1M 10M 100M FREQUENCY (Hz) 1G 10G –0.3 –0.4 –0.5 –0.6 –0.7 –0.8 –0.9 –1.0 –1.1 –1.2 –1.3 –1.4 –1.5 –1.6 –1.7 –1.8 –1.9 –2.0 –2.1 –2.2 –2.3 –2.4 –2.5 –2.6 –2.7 –2.8 –2.9 VDD = 2.5V –3.0 10k 100k Figure 7. Insertion Loss vs. Frequency over Supplies (S12 and S21) TA = +85°C 1M 10M 100M FREQUENCY (Hz) 1G 10G –10 –0.4 –20 –0.5 VDD = 1.65V TO 2.75V TA = 25°C –30 VDD = 2.50V –0.7 VDD = 2.25V –0.8 –0.9 –40 –50 S21 –60 S12 T = 25°C –1.0 A 10k 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G 04503-0-016 –70 –80 10k Figure 8. Insertion Loss vs. Frequency over Supplies (S12 and S21)(Zoomed Figure 7) 1M 10M 100M FREQUENCY (Hz) 1G 10G 10G Figure 11. Isolation vs. Frequency over Supplies –10 VDD = 2.5V –20 –30 OFF ISOLATION (dB) VDD = 1.95V VDD = 1.80V VDD = 1.65V –40 –50 TA = +85°C –60 –70 TA = +25°C –80 –90 –100 1M 10M 100M FREQUENCY (Hz) 1G 10G 04503-0-017 –0.3 –0.4 –0.5 –0.6 –0.7 –0.8 –0.9 –1.0 –1.1 –1.2 –1.3 –1.4 –1.5 –1.6 –1.7 –1.8 –1.9 –2.0 –2.1 –2.2 –2.3 –2.4 –2.5 –2.6 –2.7 –2.8 –2.9 TA = 25°C –3.0 10k 100k 100k 04503-0-019 –0.6 04503-0-020 VDD = 2.75V OFF ISOLATION (dB) INSERTION LOSS (dB) TA = +25°C Figure 10. Insertion Loss vs. Frequency over Temperature ( S12 and S21) –0.3 INSERTION LOSS (dB) TA = –40°C 04503-0-018 VDD = 2.75V INSERTION LOSS (dB) –0.3 –0.4 –0.5 –0.6 –0.7 –0.8 –0.9 –1.0 –1.1 –1.2 –1.3 –1.4 –1.5 –1.6 –1.7 –1.8 –1.9 –2.0 –2.1 –2.2 –2.3 –2.4 –2.5 –2.6 –2.7 –2.8 –2.9 TA = 25°C –3.0 10k 100k 04503-0-015 INSERTION LOSS (dB) TYPICAL PERFORMANCE CHARACTERISTICS –110 10k TA = –40°C 100k 1M 10M 100M FREQUENCY (Hz) 1G Figure 12. Isolation vs. Frequency over Temperature Figure 9. Insertion Loss vs. Frequency over Supplies (S12 and S21) Rev. 0 | Page 7 of 16 ADG936/ADG936-R 0 [T] TEK RUN VDD = 2.5V TA = 25°C TRIG'D ∆ : 2.20mV T –5 RETURN LOSS (dB) INx –10 1 –15 –20 3 OFF SWITCH RFCx –25 1M 10M 100M FREQUENCY (Hz) 1G 10G CH1 1.00VΩ CH3 1.00mVΩ Figure 13. Return Loss vs. Frequency ( S11) 20.0ns Figure 16. Video Feedthrough –10 35 –20 30 –30 25 –40 IP3 (dB) –50 20 15 –60 10 –70 5 –80 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G 0 100 200 400 500 600 FREQUENCY (MHz) 700 800 900 1500 Figure 17. IP3 vs. Frequency Figure 14. Crosstalk vs. Frequency (S12 and S21) TEK RUN: 5.00GS/s ET ENVELOPE [ 300 04504-0-019 –90 10k VDD = 2.5V TA = 25°C 04503-0-022 VDD = 2.5V TA = 25°C 04503-0-025 CROSSTALK (dB) 04503-0-024 100k 04503-0-021 ON SWITCH –30 10k 18 ] T 16 INx 14 P–1dB (dBm) 12 1 3 10 8 6 RFx 4 2 VDD = 2.5V TA = 25°C 0 1.00V 100mV CH2 100mV 5.00ns 04503-0-023 CH1 CH3 0 Figure 15. Switch Timing 250 500 750 1000 FREQUENCY (MHz) Figure 18. P–1 dB vs. Frequency Rev. 0 | Page 8 of 16 1250 ADG936/ADG936-R TEST CIRCUITS Similar setup for the ADG936. Additional pins omitted for clarity. VDD 10µF VDD VOUT VDD VDD RF1x 50% RL 50Ω INx 50% VINx VOUT GND RF2x INx 90% 50Ω VS 10% tON 04503-0-004 VS NETWORK ANALYZER 50Ω RFCx VOUT RFx RFCx RL 50Ω ADG936-R tOFF GND VINx INSERTION LOSS = 20log Figure 19. Switch Timing: tON, tOFF 04503-0-007 10µF VOUT VS Figure 22. Insertion Loss VDD 10µF VDD VDD 10µF NETWORK ANALYZER ADG936-R RF1x VDD VOUT RL 50Ω INx 50Ω 50% 50% VINx VOUT RF2x INx 90% 10% 90% VOUT 10% VINx GND tRISE RL 50Ω VS tFALL GND CROSSTALK = 20log Figure 20. Switch Timing: tRISE, tFALL 04503-0-008 VS RFx 04503-0-005 RFCx 50Ω RFCx VOUT VS Figure 23. Crosstalk VDD VDD 10µF 10µF 50Ω ADG936-R VS VDD RF1x RL 50Ω RFC RF1x VINx 50Ω GND V OFF ISOLATION = 20log OUT VS NETWORK ANALYZER RF2x INx 04503-0-006 RF2x Figure 21. Off Isolation NC VINx GND Figure 24. Video Feedthrough Rev. 0 | Page 9 of 16 NC RFCx OSCILLOSCOPE INx ADG936-R VOUT 04503-0-009 VDD ADG936/ADG936-R VDD VDD 10µF 10µF ADG936-R RF1x SPECTRUM RFCx ANALYZER 50Ω RF1x RF SOURCE SPECTRUM ANALYZER RF2x 04503-0-010 GND RF2x INx RF SOURCE VINx GND Figure 26. P–1 dB Figure 25. IP3 Rev. 0 | Page 10 of 16 50Ω RFCx COMBINER INx VINx ADG936-R VDD RF SOURCE VS 04503-0-011 VDD ADG936/ADG936-R APPLICATIONS ABSORPTIVE VS. REFLECTIVE The ADG936 is an absorptive (matched) switch with 50 Ω terminated shunt legs; the ADG936-R is a reflective switch with 0 Ω terminated shunts to ground. The ADG936 absorptive switch has a good VSWR on each port, regardless of the switch mode. An absorptive switch should be used when there is a need for a good VSWR that is looking into the port but not passing the through-signal to the common port. The ADG936 is, therefore, ideal for applications that require minimum reflections back to the RF source. It also ensures that the maximum power is transferred to the load. The ADG936-R reflective switch is suitable for applications in which high off-port VSWR does not matter, and the switch has some other desired performance features. It can be used in many applications, including high speed filter selection. In most cases, an absorptive switch can be used instead of a reflective switch, but not vice versa. The ADG936 and ADG936-R can be used to switch high frequency signals between different filters, and to multiplex the signal to the output. These dual SPDT switches are also ideal for high speed signal routing and for switching high speed differential signals. RFIN RFIN RFCA RFCB RF1A RF1A RF2A RF2A ADG936 ADG936 RF1B RF1B RF2B RF2B RFCA RFCB RFOUT RFOUT 04504-0-013 The ADG9xx family of wideband switches is designed to meet the demands of devices transmitting at ISM band frequencies to 1 GHz and higher. The low insertion loss, high isolation between ports, single pin control interface, no requirement for dc blocking capacitors, and TTL interface compatibility make them cost-effective and easy-to-integrate switching solutions for many high frequency switching and low power applications, because the parts can handle up to 16 dBm of power. FILTER SELECTION Figure 27. Filter Selection Tx/Rx SWITCHING The low insertion loss and high isolation between ports ensure that the ADG936/ADG936-R are suitable transmit/receive switches for all ISM band and Wireless LAN applications, providing the required isolation between the transmit and receive signals. LNA ANTENNA PA RFCA ADG936 RFCB RF1B RF1B RF2B RF2B 04504-0-014 The ADG936/ADG936-R are ideal solutions for low power, high frequency applications. The low insertion loss, high isolation between ports, low distortion, and low current consumption of these parts make them excellent solutions for many high frequency switching applications. They can be used in applications such as switchable filters, transmitters and receivers for radar systems, and communication systems from base stations to cell phones. Figure 28. Tx/Rx Switching ANTENNA DIVERSITY SWITCH The ADG936/ADG936-R are ideal for use as antenna diversity switches, switching in different antennas to the tuner. The low insertion loss, which ensures minimum signal loss and high isolation between channels, makes these dual SPDT switches suitable for switching applications in tuner modules and set-top boxes. Rev. 0 | Page 11 of 16 ADG936/ADG936-R EVALUATION BOARD The ADG936 and ADG936-R evaluation board allows designers to evaluate these high performance wideband switches with minimal effort. To prove that these devices meet the user’s requirements, only a power supply and a network analyzer, along with the evaluation board, are required. An application note available with the evaluation board gives complete information on operating the evaluation board. The RFCA port is connected through a 50 Ω transmission line to SMA connector J3. The RFCB port is connected through a 50 Ω transmission line to SMA connector J4. RF1A, RF2A, RF1B, and RF2B are connected through 50 Ω transmission lines to SMA connectors J5, J6, J7, and J8, respectively. A through transmission line connects J9 and J10; this transmission line is used to estimate the loss of the PCB over the environmental conditions being evaluated. The board is constructed of a four-layer, FR4 material with a dielectric constant of 4.3 and an overall thickness of 0.062 in. Two ground layers with grounded planes provide ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 0.024 in, clearance to ground plane of 0.008 in, dielectric thickness of 0.02 in, and a metal thickness of 0.0021 in. Rev. 0 | Page 12 of 16 Figure 29. ADG936 and ADG936-R Evaluation Board Top View ADG936/ADG936-R OUTLINE DIMENSIONS 6.60 6.50 6.40 20 11 4.50 4.40 4.30 6.40 BSC 1 10 PIN 1 0.65 BSC 1.20 MAX 0.15 0.05 0.30 0.19 COPLANARITY 0.10 0.20 0.09 0.75 0.60 0.45 8° 0° SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-153AC Figure 30. 20-Lead Thin Shrink Small Outline Package [TSSOP] (RU-20) Dimensions shown in millimeters 0.60 MAX 4.00 BSC SQ 0.60 MAX PIN 1 INDICATOR TOP VIEW 11 10 0.20 REF 6 5 0.25 MIN 0.30 0.23 0.18 0.05 MAX 0.02 NOM 0.50 BSC 2.25 2.10 SQ 1.95 (BOTTOM VIEW) 0.80 MAX 0.65 TYP 12° MAX 20 1 EXPOSED PAD 3.75 BCS SQ 0.75 0.55 0.35 1.00 0.85 0.80 SEATING PLANE 16 15 COPLANARITY 0.08 COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1 Figure 31. 20-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body (CP-20-1) Dimensions shown in millimeters Rev. 0 | Page 13 of 16 ADG936/ADG936-R ORDERING GUIDE Model ADG936BRU ADG936BRU-500RL7 ADG936BRU-REEL ADG936BRU-REEL7 ADG936BCP ADG936BCP-500RL7 ADG936BCP-REEL ADG936BCP-REEL7 ADG936BRU-R ADG936BRU-R-500RL7 ADG936BRU-R-REEL ADG936BRU-R-REEL7 ADG936BCP-R ADG936BCP-R-500RL7 ADG936BCP-R-REEL ADG936BCP-R-REEL7 EVAL-ADG936EB EVAL-ADG936-REB Temperature Range –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C Package Description Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Thin Shrink Small Outline Package (TSSOP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Lead Frame Chip Scale Package (LFCSP) Evaluation Board Evaluation Board Rev. 0 | Page 14 of 16 Package Option RU-20 RU-20 RU-20 RU-20 CP-20-1 CP-20-1 CP-20-1 CP-20-1 RU-20 RU-20 RU-20 RU-20 CP-20-1 CP-20-1 CP-20-1 CP-20-1 RU-20 RU-20 ADG936/ADG936-R NOTES Rev. 0 | Page 15 of 16 ADG936/ADG936-R NOTES © 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04503–0–7/04(0) Rev. 0 | Page 16 of 16