05123 PSMF05 and PSMF12 . . . engineered solutions for the transient environment SUBMINATURE TVS ARRAYS APPLICATIONS ✔ Cellular Phones ✔ MP3 Players ✔ Notebooks & Handheld Devices ✔ Personal Digital Assistants (PDAs) ✔ Digital Cameras IEC COMPATIBILITY (EN61000-4) SC-70-5L ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns FEATURES ✔ ESD Protection > 25 kilovolts ✔ 100 Watts Peak Pulse Power per Line (tp=8/20µs) ✔ Low Clamping Voltage & Low Leakage Current ✔ Available in 2 Voltages: 5V & 12V ✔ Up to Four (4) Lines of Protection MECHANICAL CHARACTERISTICS ✔ Molded JEDEC SC-70-5L ✔ Weight 0.14 grams (Approximate) ✔ Flammability Rating UL 94V-0 ✔ 8mm Tape and Reel Per EIA Standard 481 ✔ Device Marking: Marking Code PIN CONFIGURATION 1 5 2 4 3 05123.R3 6/02 1 www.protekdevices.com PSMF05 and PSMF12 DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 100 Watts Operating Temperature TJ -55°C to 150°C °C Storage Temperature TSTG -55°C to 150°C °C Forward Voltage @ 1A, 8/20µs VFP 1.5 Volts PARAMETER ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER DEVICE MARKING CODE 05 12 PSMF05 PSMF12 RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE (See Note 1) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) VWM VOLTS @ 1mA V(BR) VOLTS @ IP = 1A VC VOLTS 5.0 12.0 6.0 13.3 9.5 15.0 MAXIMUM LEAKAGE CURRENT MAXIMUM CAPACITANCE @8/20µs VC @ IPP @VWM ID µA 0V @ 1 MHz C pF 12.0V @ 9.0A 22.0V @ 5.0A 10 1 60 30 Note 1: Test between pins 1 to 2, 3 to 2, 4 to 2 and 5 to 2. FIGURE 1 PEAK PULSE POWER VS PULSE TIME IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 10,000 1,000 100W, 8/20µs Waveform 100 10 0.01 05123.R3 6/02 FIGURE 2 PULSE WAVE FORM 120 tf 100 Peak Value IPP 80 e-t TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs 60 40 td = t I /2 PP 20 0 1 10 100 td - Pulse Duration - µs 1,000 10,000 2 0 5 10 15 t - Time - µs 20 25 www.protekdevices.com 30 PSMF05 and PSMF12 GRAPHS FIGURE 3 POWER DERATING CURVE 100 35 Peak Pulse Power 8/20µs 5 Volts per Division 80 % Of Rated Power FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR PSMF05 60 40 25 15 5 20 -5 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - °C ESD Test Pulse: 5 kilovolt, 1/30ns (waveform) FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT 20 VC - Clamping Voltage - Volts 150 16 PSMF05 12 8 4 0 0 4 8 12 IPP - Peak Pulse Current - Amps 16 20 FIGURE 6 TYPICAL REVERSE VOLTAGE VS CAPACITANCE 160 C - Capacitance - pF 120 80 40 PSMF05 0 0 05123.R3 6/02 1 2 3 4 VR - Reverse Voltage - Volts 3 5 6 www.protekdevices.com PSMF05 and PSMF12 APPLICATION NOTES The PSMF Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD (> 25kv) or EFT. This product provides unidirectional protection, with a surge capability of 200 Watts PPP per line for an 8/20µs waveform. UNIDIRECTIONAL COMMON MODE CONFIGURATION (Figure 1) The PSMF Series provides up to four (4) lines of protection in a common mode configuration as depicted in Figure 1. Circuit connectivity is as follows: I/O 1 is connected to Pin 1. I/O 2 is connected to Pin 3. I/O 3 is connected to Pin 4. I/O 4 is connected to Pin 5. Pin 2 is connected to ground. I/O 4 I/O 3 CIRCUIT BOARD LAYOUT RECOMMENDATIONS Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended: ¨ The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. ¨ The path length between the TVS device and the protected line should be minimized. ¨ All conductive loops including power and ground loops should be minimized. ¨ The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. ¨ Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. 05123.R3 6/02 5 1 4 2 3 I/O INTEGRATED CIRCUIT ¨ ¨ ¨ ¨ ¨ I/O 2 I/O 1 Figure 1 - Unidirectional Configuration Common-Mode I/O Port Protection 4 www.protekdevices.com PSMF05 and PSMF12 PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE SC 70-5L D E 5 4 0º - 8º K PACKAGE DIMENSIONS J 2 1 3 DIM L J V B M F A G C MOUNTING PAD 4 1 2 3 4 5 6 7 0.50 1.30 0.65 2.40 0.60 0.70 2.50 Inches 0.020 0.051 0.026 0.094 0.024 0.028 0.098 1.90 1.15 0.80 0.15 0.65 BSC 1.30 BSC 0.80 0.08 1.90 0 0.26 2.15 1.35 1.00 0.30 1.10 0.25 2.15 0.10 0.46 INCHES MIN MAX 0.074 0.045 0.031 0.006 0.0255 BSC 0.0512 BSC 0.031 0.003 0.074 0 0.010 0.084 0.055 0.040 0.012 0.043 0.010 0.084 0.004 0.018 NOTES: 1. Dimensioning and tolerances per ANSI Y14.5M, 1985. 2. Controlling Dimension: Inches 3. Dimensions are exclusive of mold flash and metal burrs. TYPICAL DIM Millimeters A B C D E F G J K L M MILLIMETERS MIN MAX 3 2 1 5 6 7 06005 Rev 0 - 11/01 PART NUMBER SUFFIXES USED FOR TAPE & REEL/BULK ORDERING: Surface mount product is taped and reeled in accordance with EIA-481. Suffix-T7 = 7 Inch Reel - 3,000 pieces per reel i.e.: PSMF05-T7 Suffix-T13 = 13 Inch Reel - 10,000 pieces per reel i.e: PSMF05-T13 ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com COPYRIGHT © ProTek Devices 2001 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. 05123.R3 6/02 5 www.protekdevices.com