ETC 2SA1774/D

ON Semiconductor
2SA1774
PNP Silicon General Purpose
Amplifier Transistor
This PNP transistor is designed for general purpose amplifier
applications. This device is housed in the SOT–416/SC–90 package
which is designed for low power surface mount applications, where
board space is at a premium.
• Reduces Board Space
• High hFE, 210–460 (typical)
• Low VCE(sat), < 0.5 V
• Available in 8 mm, 7–inch/3000 Unit Tape and Reel
PNP GENERAL
PURPOSE AMPLIFIER
TRANSISTORS
SURFACE MOUNT
3
2
1
MAXIMUM RATINGS (TA = 25°C)
Symbol
Value
Unit
Collector–Base Voltage
V(BR)CBO
–60
Vdc
Collector–Emitter Voltage
V(BR)CEO
–50
Vdc
Emitter–Base Voltage
V(BR)EBO
–6.0
Vdc
IC
–100
mAdc
Symbol
Max
Unit
Rating
Collector Current — Continuous
CASE 463–01, STYLE 1
SOT–416/SC–90
COLLECTOR
3
DEVICE MARKING
2SA1774 = F9
THERMAL CHARACTERISTICS
Rating
Power
Dissipation(1)
PD
150
mW
Junction Temperature
TJ
150
°C
Storage Temperature Range
Tstg
–55 ~ +150
°C
1
BASE
2
EMITTER
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Symbol
Min
Typ
Max
Unit
Collector–Base Breakdown Voltage (IC = –50 µAdc, IE = 0)
V(BR)CBO
–60
—
—
Vdc
Collector–Emitter Breakdown Voltage (IC = –1.0 mAdc, IB = 0)
V(BR)CEO
–50
—
—
Vdc
Emitter–Base Breakdown Voltage (IE = –50 µAdc, IE = 0)
V(BR)EBO
–6.0
—
—
Vdc
ICBO
—
—
–0.5
nA
IEBO
—
—
–0.5
Collector–Base Cutoff Current (VCB = –30 Vdc, IE = 0)
Emitter–Base Cutoff Current (VEB = –5.0 Vdc, IB = 0)
Collector–Emitter Saturation Voltage(2)
(IC = –50 mAdc, IB = –5.0 mAdc)
VCE(sat)
Gain(2)
DC Current
(VCE = –6.0 Vdc, IC = –1.0 mAdc)
—
—
–0.5
120
—
560
—
140
—
—
3.5
—
hFE
Transition Frequency
(VCE = –12 Vdc, IC = –2.0 mAdc, f = 30 MHz)
—
fT
Output Capacitance (VCB = –12 Vdc, IE = 0 Adc, f = 1 MHz)
COB
µA
Vdc
MHz
pF
1. Device mounted on a FR–4 glass epoxy printed circuit board using the minimum recommended footprint.
2. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%.
 Semiconductor Components Industries, LLC, 2001
May, 2001 – Rev. 3
1
Publication Order Number:
2SA1774/D
2SA1774
TYPICAL ELECTRICAL CHARACTERISTICS
1000
VCE , COLLECTOREMITTER VOLTAGE (V)
300 µA
250
200
60
150
IB = 50 µA
0
3
6
12
9
10
0.1
15
1
10
100
VCE, COLLECTOR VOLTAGE (V)
IC, COLLECTOR CURRENT (mA)
Figure 1. IC – VCE
Figure 2. DC Current Gain
2
900
TA = 25°C
800
1.5
1
0.5
700
600
500
400
300
TA = 25°C
VCE = 5 V
200
100
0
0.01
0.1
1
10
0
0.2
100
1
5
10
20
40
60
80
IC, COLLECTOR CURRENT (mA)
Figure 3. Collector Saturation Region
Figure 4. On Voltage
13
14
12
12
11
10
9
8
7
6
0.5
IB, BASE CURRENT (mA)
Cob, CAPACITANCE (pF)
Cib, INPUT CAPACITANCE (pF)
TA = -25°C
100
100
30
0
DC CURRENT GAIN
90
VCE = 10 V
TA = 25°C
TA = 75°C
COLLECTOR VOLTAGE (mV)
IC, COLLECTOR CURRENT (mA)
TA = 25°C
120
100
150 200
10
8
6
4
2
0
1
2
3
0
4
0
VEB (V)
10
20
VCB (V)
Figure 5. Capacitance
Figure 6. Capacitance
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30
40
2SA1774
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.5 min. (3x)
Unit: mm
0.5 min. (3x)
0.5
ÉÉÉ
ÉÉÉ
ÉÉÉ
1.4
1
TYPICAL
SOLDERING PATTERN
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
SOT–416/SC–90 POWER DISSIPATION
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this
case is 125 milliwatts.
The power dissipation of the SOT–416/SC–90 is a
function of the pad size. This can vary from the minimum
pad size for soldering to the pad size given for maximum
power dissipation. Power dissipation for a surface mount
device is determined by TJ(max), the maximum rated
junction temperature of the die, RθJA, the thermal resistance
from the device junction to ambient; and the operating
temperature, TA. Using the values provided on the data
sheet, PD can be calculated as follows.
PD =
PD =
150°C – 25°C
833°C/W
= 150 milliwatts
The 833°C/W assumes the use of the recommended
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 150 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad. Using a board material such
as Thermal Clad, a higher power dissipation can be achieved
using the same footprint.
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
SOLDERING PRECAUTIONS
• The soldering temperature and time should not exceed
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10°C.
•
•
•
260°C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied
during cooling
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
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2SA1774
SOLDER STENCIL GUIDELINES
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
TYPICAL SOLDER HEATING PROFILE
graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a low density board. The Vitronics SMD310
convection/infrared reflow soldering system was used to
generate this profile. The type of solder used was 62/36/2
Tin Lead Silver with a melting point between 177–189°C.
When this type of furnace is used for solder reflow work, the
circuit boards and solder joints tend to heat first. The
components on the board are then heated by conduction. The
circuit board, because it has a large surface area, absorbs the
thermal energy more efficiently, then distributes this energy
to the components. Because of this effect, the main body of
a component may be up to 30 degrees cooler than the
adjacent solder joints.
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 7 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can affect
the profile include the type of soldering system in use,
density and types of components on the board, type of solder
used, and the type of board or substrate material being used.
This profile shows temperature versus time. The line on the
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
150°C
STEP 5
STEP 4
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
SPIKE"
SOAK"
STEP 2
STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
205° TO 219°C
PEAK AT
SOLDER JOINT
170°C
160°C
150°C
140°C
100°C
100°C
50°C
STEP 6 STEP 7
VENT COOLING
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 7. Typical Solder Heating Profile
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2SA1774
PACKAGE DIMENSIONS
SC–75 (SC–90, SOT–416)
CASE 463–01
ISSUE B
–A–
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
2
3
D 3 PL
0.20 (0.008)
G –B–
1
M
B
K
J
DIM
A
B
C
D
G
H
J
K
L
S
0.20 (0.008) A
C
L
H
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
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MILLIMETERS
MIN
MAX
0.70
0.80
1.40
1.80
0.60
0.90
0.15
0.30
1.00 BSC
--0.10
0.10
0.25
1.45
1.75
0.10
0.20
0.50 BSC
INCHES
MIN
MAX
0.028
0.031
0.055
0.071
0.024
0.035
0.006
0.012
0.039 BSC
--0.004
0.004
0.010
0.057
0.069
0.004
0.008
0.020 BSC
2SA1774
Notes
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2SA1774
Notes
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2SA1774
Thermal Clad is a trademark of the Bergquist Company
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
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2SA1774/D