ON Semiconductor 2SA1774 PNP Silicon General Purpose Amplifier Transistor This PNP transistor is designed for general purpose amplifier applications. This device is housed in the SOT–416/SC–90 package which is designed for low power surface mount applications, where board space is at a premium. • Reduces Board Space • High hFE, 210–460 (typical) • Low VCE(sat), < 0.5 V • Available in 8 mm, 7–inch/3000 Unit Tape and Reel PNP GENERAL PURPOSE AMPLIFIER TRANSISTORS SURFACE MOUNT 3 2 1 MAXIMUM RATINGS (TA = 25°C) Symbol Value Unit Collector–Base Voltage V(BR)CBO –60 Vdc Collector–Emitter Voltage V(BR)CEO –50 Vdc Emitter–Base Voltage V(BR)EBO –6.0 Vdc IC –100 mAdc Symbol Max Unit Rating Collector Current — Continuous CASE 463–01, STYLE 1 SOT–416/SC–90 COLLECTOR 3 DEVICE MARKING 2SA1774 = F9 THERMAL CHARACTERISTICS Rating Power Dissipation(1) PD 150 mW Junction Temperature TJ 150 °C Storage Temperature Range Tstg –55 ~ +150 °C 1 BASE 2 EMITTER ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Symbol Min Typ Max Unit Collector–Base Breakdown Voltage (IC = –50 µAdc, IE = 0) V(BR)CBO –60 — — Vdc Collector–Emitter Breakdown Voltage (IC = –1.0 mAdc, IB = 0) V(BR)CEO –50 — — Vdc Emitter–Base Breakdown Voltage (IE = –50 µAdc, IE = 0) V(BR)EBO –6.0 — — Vdc ICBO — — –0.5 nA IEBO — — –0.5 Collector–Base Cutoff Current (VCB = –30 Vdc, IE = 0) Emitter–Base Cutoff Current (VEB = –5.0 Vdc, IB = 0) Collector–Emitter Saturation Voltage(2) (IC = –50 mAdc, IB = –5.0 mAdc) VCE(sat) Gain(2) DC Current (VCE = –6.0 Vdc, IC = –1.0 mAdc) — — –0.5 120 — 560 — 140 — — 3.5 — hFE Transition Frequency (VCE = –12 Vdc, IC = –2.0 mAdc, f = 30 MHz) — fT Output Capacitance (VCB = –12 Vdc, IE = 0 Adc, f = 1 MHz) COB µA Vdc MHz pF 1. Device mounted on a FR–4 glass epoxy printed circuit board using the minimum recommended footprint. 2. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%. Semiconductor Components Industries, LLC, 2001 May, 2001 – Rev. 3 1 Publication Order Number: 2SA1774/D 2SA1774 TYPICAL ELECTRICAL CHARACTERISTICS 1000 VCE , COLLECTOREMITTER VOLTAGE (V) 300 µA 250 200 60 150 IB = 50 µA 0 3 6 12 9 10 0.1 15 1 10 100 VCE, COLLECTOR VOLTAGE (V) IC, COLLECTOR CURRENT (mA) Figure 1. IC – VCE Figure 2. DC Current Gain 2 900 TA = 25°C 800 1.5 1 0.5 700 600 500 400 300 TA = 25°C VCE = 5 V 200 100 0 0.01 0.1 1 10 0 0.2 100 1 5 10 20 40 60 80 IC, COLLECTOR CURRENT (mA) Figure 3. Collector Saturation Region Figure 4. On Voltage 13 14 12 12 11 10 9 8 7 6 0.5 IB, BASE CURRENT (mA) Cob, CAPACITANCE (pF) Cib, INPUT CAPACITANCE (pF) TA = -25°C 100 100 30 0 DC CURRENT GAIN 90 VCE = 10 V TA = 25°C TA = 75°C COLLECTOR VOLTAGE (mV) IC, COLLECTOR CURRENT (mA) TA = 25°C 120 100 150 200 10 8 6 4 2 0 1 2 3 0 4 0 VEB (V) 10 20 VCB (V) Figure 5. Capacitance Figure 6. Capacitance http://onsemi.com 2 30 40 2SA1774 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.5 min. (3x) Unit: mm 0.5 min. (3x) 0.5 ÉÉÉ ÉÉÉ ÉÉÉ 1.4 1 TYPICAL SOLDERING PATTERN ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ SOT–416/SC–90 POWER DISSIPATION the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 125 milliwatts. The power dissipation of the SOT–416/SC–90 is a function of the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows. PD = PD = 150°C – 25°C 833°C/W = 150 milliwatts The 833°C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 150 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, a higher power dissipation can be achieved using the same footprint. TJ(max) – TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into SOLDERING PRECAUTIONS • The soldering temperature and time should not exceed The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C. • • • 260°C for more than 10 seconds. When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less. After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. http://onsemi.com 3 2SA1774 SOLDER STENCIL GUIDELINES The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. TYPICAL SOLDER HEATING PROFILE graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177–189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 7 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the STEP 1 PREHEAT ZONE 1 RAMP" 200°C 150°C STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 SPIKE" SOAK" STEP 2 STEP 3 VENT HEATING SOAK" ZONES 2 & 5 RAMP" DESIRED CURVE FOR HIGH MASS ASSEMBLIES 205° TO 219°C PEAK AT SOLDER JOINT 170°C 160°C 150°C 140°C 100°C 100°C 50°C STEP 6 STEP 7 VENT COOLING SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 7. Typical Solder Heating Profile http://onsemi.com 4 2SA1774 PACKAGE DIMENSIONS SC–75 (SC–90, SOT–416) CASE 463–01 ISSUE B –A– S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 2 3 D 3 PL 0.20 (0.008) G –B– 1 M B K J DIM A B C D G H J K L S 0.20 (0.008) A C L H STYLE 1: PIN 1. BASE 2. EMITTER 3. COLLECTOR http://onsemi.com 5 MILLIMETERS MIN MAX 0.70 0.80 1.40 1.80 0.60 0.90 0.15 0.30 1.00 BSC --0.10 0.10 0.25 1.45 1.75 0.10 0.20 0.50 BSC INCHES MIN MAX 0.028 0.031 0.055 0.071 0.024 0.035 0.006 0.012 0.039 BSC --0.004 0.004 0.010 0.057 0.069 0.004 0.008 0.020 BSC 2SA1774 Notes http://onsemi.com 6 2SA1774 Notes http://onsemi.com 7 2SA1774 Thermal Clad is a trademark of the Bergquist Company ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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