ETC 2SC3795/2SC3795A

Power Transistors
2SC3795, 2SC3795A
Silicon NPN triple diffusion planar type
For high breakdown voltage high-speed switching
Unit: mm
10.0±0.2
4.2±0.2
5.5±0.2
4.2±0.2
2.7±0.2
7.5±0.2
16.7±0.3
• High-speed switching
• High collector to base voltage VCBO
• Low collector to emitter saturation voltage VCE(sat)
• Full-pack package which can be installed to the heat sink with one
screw
0.7±0.1
■ Features
φ 3.1±0.1
Collector to base
voltage
2SC3795
Collector to
emitter voltage
2SC3795
Symbol
Rating
Unit
VCBO
800
V
2SC3795A
0.5+0.2
–0.1
0.8±0.1
900
VCES
800
2SC3795A
2.54±0.3
V
5.08±0.5
900
Collector to emitter voltage
VCEO
500
V
Emitter to base voltage
VEBO
8
V
Peak collector current
ICP
10
A
Collector current
IC
5
A
Base current
IB
3
A
PC
40
W
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
Collector power
dissipation
1.3±0.2
1.4±0.1
Solder Dip
(4.0)
Parameter
14.0±0.5
■ Absolute Maximum Ratings TC = 25°C
TC = 25°C
Ta = 25°C
1 : Base
2 : Collector
3 : Emitter
EIAJ : SC-67
TO-220F Package
1 2 3
2
■ Electrical Characteristics TC = 25°C
Parameter
Collector cutoff
current
Symbol
2SC3795
Collector to emitter voltage
*
Forward current transfer ratio
Unit
100
µA
VCB = 900 V, IE = 0
100
100
VCEO(sus)
IC = 0.2 A, L = 25 mH
500
hFE1
VCE = 5 V, IC = 0.1 A
15
8
hFE2
VCE = 5 V, IC = 3 A
IC = 3 A, IB = 0.6 A
Base to emitter saturation voltage
VBE(sat)
IC = 3 A, IB = 0.6 A
Transition frequency
2SC3795
fT
VCE = 10 V, IC = 0.5 A, f = 1 MHz
ton
IC = 3 A, IB1 = 0.6 A, IB2 = − 0.6 A,
2SC3795A
Storage time
2SC3795
VCC = 200 V
µA
V
1
1.5
8
V
V
MHz
1
µs
1.2
tstg
3
µs
tf
1
µs
2SC3795A
Note) *: VCEO(sus) Test circuit
Max
VEB = 5 V, IC = 0
VCE(sat)
Fall time
Typ
IEBO
Collector to emitter saturation voltage
Turn-on time
Min
VCB = 800 V, IE = 0
2SC3795A
Emitter cutoff current
Conditions
ICBO
1.2
50/60Hz
mercury relay
X
L 25mH
Y
120Ω
6V
1Ω
15V
G
1
2SC3795, 2SC3795A
Power Transistors
PC  T a
IC  VCE
VCE(sat)  IC
TC=25˚C
(1) TC=Ta
(2) With a 100 × 100 × 2mm
Al heat sink
(3) Without heat sink
(PC=2.0W)
70
60
7
50
(1)
30
20
(2)
10
IB=1200mA
6
1000mA
800mA
5
600mA
4
400mA
300mA
3
200mA
150mA
2
100mA
50mA
20mA
1
(3)
0
0
20
40
60
80 100 120 140 160
0
Ambient temperature Ta (˚C)
2
4
TC=–25˚C
100˚C
0.3
0.1
0.03
0.3
1
TC=100˚C
1
0.3
–25˚C
0.1
0.03
0.01
0.01 0.03
3
0.1
0.3
1
10
fT  I C
300
100
TC=100˚C
25˚C
30
–25˚C
10
3
1
0.3
VCE=10V
f=1MHz
TC=25˚C
300
100
30
10
3
1
0.3
0.1
0.01 0.03
10
3
Collector current IC (A)
Transition frequency fT (MHz)
3
0.1
25˚C
3
VCE=5V
10
1
10
1000
IC/IB=5
30
25˚C
30
hFE  IC
Forward current transfer ratio hFE
Base to emitter saturation voltage VBE(sat) (V)
10
1000
0.01
0.01 0.03
Collector current IC (A)
0.1
0.3
1
3
0.1
0.01 0.03
10
0.1
0.3
1
3
10
Collector current IC (A)
Collector current IC (A)
ton, tstg, tf  IC
Area of safe operation (ASO)
Cob  VCB
100
10000
Collector output capacitance Cob (pF)
8
IC/IB=5
Collector to emitter voltage VCE (V)
VBE(sat)  IC
100
IE=0
f=1MHz
TC=25˚C
1000
300
100
30
10
10
1
tf
0.1
0.01
3
10
30
100
ICP
t=0.5ms
IC
3
1ms
10ms
1
DC
0.3
0.1
0.03
0.01
1
0.1
1
ton
0.3
0.03
Collector to base voltage VCB (V)
10
tstg
3
3
0.3
Pulsed tw=1ms
Duty cycle=1%
IC/IB=5
(IB1=–IB2)
VCC=200V
TC=25˚C
30
Switching time ton,tstg,tf (µs)
3000
2
6
Collector current IC (A)
0
100
2SC3795/2SC3795A
40
Collector to emitter saturation voltage VCE(sat) (V)
8
Collector current IC (A)
Collector power dissipation PC (W)
80
Non repetitive pulse
0.003 TC=25˚C
0
1
2
3
4
5
6
7
Collector current IC (A)
8
1
3
10
30
100
300
1000
Collector to emitter voltage VCE (V)
Power Transistors
2SC3795, 2SC3795A
Area of safe operation, reverse bias ASO
Reverse bias ASO measuring circuit
8
Lcoil=50µH
IC/IB=5
(IB1=–IB2)
TC=100˚C
L coil
6
IB1
5
T.U.T
–IB2
Vin
4
IC
VCC
3
2SC3795A
2
2SC3795
Collector current IC (A)
7
1
0
0
Vclamp
tW
100 200 300 400 500 600 700 800
Collector to emitter voltage VCE (V)
Rth(t)  t
Thermal resistance Rth(t) (˚C/W)
1000
(1) PT=10V × 0.2A (2W) and without heat sink
(2) PT=10V × 1.0A (10W) and with a 100 × 100 × 2mm Al heat sink
100
(1)
10
(2)
1
0.1
10–4
10–3
10–2
10–1
1
10
102
103
104
Time t (s)
3
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the
"Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial
property, the granting of relative rights, or the granting of any license.
(3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(4) The products and product specifications described in this material are subject to change without
notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to
make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, redundant design is recommended,
so that such equipment may not violate relevant laws or regulations because of the function of our
products.
(6) When using products for which dry packing is required, observe the conditions (including shelf life
and after-unpacking standby time) agreed upon when specification sheets are individually exchanged.
(7) No part of this material may be reprinted or reproduced by any means without written permission
from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic
semiconductor products best suited to their applications.
Due to modification or other reasons, any information contained in this material, such as available
product types, technical data, and so on, is subject to change without notice.
Customers are advised to contact our semiconductor sales office and obtain the latest information
before starting precise technical research and/or purchasing activities.
B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but
there is always the possibility that further rectifications will be required in the future. Therefore,
Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material.
C. These materials are solely intended for a customer's individual use.
Therefore, without the prior written approval of Panasonic, any other use such as reproducing,
selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR