REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED 02-06-25 R. MONNIN Make correction to the HFE test as specified under table I. - ro THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY CHARLES E. BESORE STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil CHECKED BY RAY MONNIN APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, HIGH CURRENT, NPN TRANSISTOR ARRAY, MONOLITHIC SILICON DRAWING APPROVAL DATE 89-01-13 REVISION LEVEL A SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 5962-88664 8 5962-E454-02 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88664 01 E X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function SG3081 High current NPN transistor array 01 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter E Descriptive designator Terminals GDIP1-T16 or CDIP2-T16 16 Package style Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Collector-to-emitter voltage (VCEO) .................................................. 16 V dc Collector-to-base voltage (VCBO) ..................................................... 20 V dc Collector-to-substrate voltage (VCSO) .............................................. 20 V dc Emitter-to-base voltage (VEBO) ........................................................ 5.0 V dc Collector current (IC) ........................................................................ 100 mA Base emitter (IB) ............................................................................... 20 mA Power dissipation (PD): Any one transistor ......................................................................... Total package ............................................................................... Junction temperature (TJ) ................................................................ Storage temperature range .............................................................. Lead temperature (soldering, 10 seconds) ...................................... Thermal resistance, junction-to-case (θJC) ...................................... 500 mW 750 mW 2/ +150°C -65°C to +150°C +300°C See MIL-STD-1835 1.4 Recommended operating conditions. Ambient operating temperature range (TA) ...................................... -55°C to +125°C ____ 1/ Voltage and current ratings applies to each transistor in the array. 2/ Derate above TA = +25°C at 6.67 mW/°C. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88664 A REVISION LEVEL A SHEET 2 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 -- Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 -- List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88664 A REVISION LEVEL A SHEET 3 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max Collector-to-base breakdown voltage BVCBO IC = 500 µA, IE = 0 mA 1,2,3 01 20 V Collector-to-emitter breakdown voltage BVCEO IC = 500 µA, IB = 0 mA 1,2,3 01 16 V Collector-to-substrate breakdown voltage BVCSO IC = 500 µA, IE = 0 mA, 1,2,3 01 20 V Emitter-to-base breakdown voltage BVEBO IC = 500 µA 1,2,3 01 5.0 V DC forward current transfer ratio HFE VCE = 5.0 V, IC = 30 mA, 1 01 50 IB = 0 mA TA = +25°C 40 VCE = 5.0 V, IC = 50 mA, TA = +25°C Base-to-emitter saturation voltage VBE 1 IC = 30 mA, IB = 1.0 mA 01 1.0 (sat) 2,3 Collector-to-emitter saturation voltage VCE 1 IC = 30 mA, IB = 1.0 mA ICEO 01 0.5 2,3 0.9 1 0.7 2,3 1.1 1 VCE = 10 V, IB = 0 mA VCB = 10 V, IE = 0 mA 1/ 1.2 V (sat) IC = 50 mA, IB = 5.0 mA Collector cutoff current V 01 10 2,3 70 1,2,3 6.0 µA Parameters apply to each transistor in the array. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88664 A REVISION LEVEL A SHEET 4 Device type 01 Case outline E Terminal number 1 Terminal symbol 2 COLLECTOR 2 3 BASE 2 4 COLLECTOR 3 5 SUBSTRATE (see note 1 ) 6 BASE 3 7 COLLECTOR 4 8 BASE 4 9 COLLECTOR 5 10 BASE 5 11 BASE 6 12 COLLECTOR 6 13 BASE 7 14 COLLECTOR 7 15 EMITTER (see note 2) 16 BASE 1 COLLECTOR 1 NOTES: 1. The substrate pin must be connected to the most negative dc potential, which should also be a good ac ground, for proper isolation between transistors. 2. The emitter is common to all seven transistors in the array. FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88664 A REVISION LEVEL A SHEET 5 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88664 A REVISION LEVEL A SHEET 6 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) Subgroups (in accordance with MIL-STD-883, method 5005, table I) 1 1*,2,3 1,2,3 1 * PDA applies to subgroup 1. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA = +125°C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88664 A REVISION LEVEL A SHEET 7 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88664 A REVISION LEVEL A SHEET 8 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 02-06-25 Approved sources of supply for SMD 5962-88664 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ 5962-8866401EA Vendor CAGE number 34333 Vendor similar PIN 2/ SG3081J/883B 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 34333 Vendor name and address Microsemi Integrated Products 11861 Western Avenue Garden Grove, CA 92641-1816 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.