CXA1875AP/AM 8-bit D/A Converter Compatible with I2C Bus Description The CXA1875AP/AM is developed as a 8-bit 5 ch D/A converter compatible with I2C bus. Features • Serial control through I2C bus • 5 channels of 8-bit D/A converter • 4 built-in general purpose I/O ports (Digital I/O) • I/O can be specified to respective ports independently • Selection of 8 slave addresses possible through address select pins (3 pins) Applications I2C bus can control ICs that do not correspond to I2C bus by connecting the DC control pins of them. Structure Bipolar silicon monolithic IC 16 pin DIP (Plastic) 16 pin SOP (Plastic) Absolute Maximum Ratings (Ta=25°C) • Supply voltage VCC 7 • Operating temperature Topr –20 to +75 • Storage temperature Tstg –65 to +150 • Allowable power dissipation 960 PD Operating Conditions • Supply voltage VCC • Operating temperature Topr 5±0.5 –20 to +75 V °C °C mW V °C Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E94X27C1Y-TE CXA1875AP/AM Pin Configuration (Top View) I2C bus Slave address select pin SW I/O VCC SCL SDA SAD2 SAD1 SAD0 SW3 SW2 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 SW1 SW0 DAC3 DAC2 DAC1 DAC0 GND DAC4 SW I/O DAC output Block Diagram SAD2 SAD1 SAD0 SW0-3 Open collector Level Conversion Level Conversion LATCH I2C BUS SDA SCL Level Conversion I2C Decoder Power on Reset VCC REG GND LATCH LATCH LATCH LATCH LATCH DAC DAC DAC DAC DAC AMP AMP AMP AMP AMP DAC4 DAC3 DAC2 DAC1 DAC0 VCC —2— CXA1875AP/AM Pin Description No. 1 2 9 10 Symbol SW1 SW0 SW2 SW3 14 15 SDA SCL Equivalent circuit Description I/O pin for general purpose I/O port VILmax: 1.5 V VIHmin: 3 V VOLmax: 0.4 V VCC 150 SDA I/O pin for I2C bus 4.5k VCC 3 4 5 6 7 DAC4 DAC3 DAC2 DAC1 DAC0 8 GND VCC 56 22k D/A converter output pin 20k 20k GND pin VCC 11 12 13 SAD0 SAD1 SAD2 Slave address input pin Input at positive logic VILmax: 1.5 V VIHmin: 3 V VCC 150 4.5k 16 Power supply pin VCC Electrical Characteristics (Ta=25 °C, VCC=5 V) D/A Converter Block Test No. Item Symbol Test contents circuit 1 Circuit current ICC 1 DAC 0 to 4=127 2 3 4 Differential linearity Minimum output voltage Maximum output voltage 5 Output current 6 Output impedance Min. Typ. Max. Unit 6 9 12 mA –1 0 +1 LSB DLE 1 V(DAC0 to 4=n+1)–V(DAC0 to 4=N) ×128–1 V(DAC0 to 4=191)–V(DAC0 to 4=63) n=0 to 127 Vmin 1 DAC 0 to 4=0 0.1 0.4 0.7 V Vmax 1 DAC 0 to 4=255 4.3 4.6 4.9 V Iout 2 +1 mA Z0 2 6 Ω Current that can be flowed from Pins 3 to 7 V(–1 mA) –V(1 mA) DAC 0 to 4=127, 2 mA —3— –1 0 3 CXA1875AP/AM SW, SAD Pins No. 7 8 9 10 11 Item Low level input voltage High level input voltage Low level input current High level input current Low level input voltage Symbol Text circuit Test contents VIL 3 ST 0 to 3 an input voltage that turns to ‘0’ — — 1.5 V VIH 3 ST 0 to 3 an input voltage that turns to ‘1’ 3.0 — — V IIL 3 Input current when 0.4 V is applied –10 0 +10 µA IIH 3 Input current when 4.5 V is applied –10 0 +10 µA VOL 4 SW 0 to 3=1, Output voltage when 1 mA flows in 0 0.2 0.4 V Min. Typ. Max. Unit I2C Bus Block Items (SDA, SCL) No. 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 Item High level input voltage Low level input voltage High level input current Low level input current Low level output voltage At 3 mA flow to SDA (Pin 14) Maximum flowing current Input capacitance Maximum clock frequency Data change minimum waiting time Data transfer start minimum waiting time Low level clock pulse width High level clock pulse width Minimum start preparation waiting time Minimum data hold time Minimum data preparation time Rise time Fall time Minimum stop preparation waiting time Symbol Min. Typ. Max. Unit VIH VIL IIH IIL 3.0 0 — — — — — — 5.0 1.5 10 10 V V µA µA VOL 0 — 0.4 V 3 — 0 4.7 4.0 4.7 4.0 4.7 5 250 — — 4.7 — — — — — — — — — — — — — — 10 100 — — — — — — — 1 300 — mA pF kHz µs µs µs µs µs µs ns µs ns µs IOL CI fSCL tBUF tHD:STA tLOW tHIGH tSU:STA tHD:DAT tSU:DAT tR tF tSU:STO I2C bus load conditions: Pull up resistance 4 kΩ (Connected to +5 V) Load capacitance 200 pF (Connected to GND) —4— CXA1875AP/AM I2C Bus Control Signal SDA tR tBUF tHD:STA tF SCL tHD:STA tLOW tHD:DAT S P tSU:STO tSU:STA tHIGH tSU:DAT P Sr Electrical Characteristics Test Circuit Test circuit 1 Test circuit 2 I2C BUS +5V A 10µ I2C BUS 5V 0.022µ +5V A 10µ 0.022µ 16 15 14 13 12 11 10 9 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 100p 100p 100p 100p 100p 100p 100p 100p 100p V Test circuit 4 I2C BUS +5V ±1mA V Test circuit 3 100p I2C BUS 0.022µ A 10µ V4 16 1 15 2 14 3 13 4 12 5 11 6 V4= 10 7 9 +5V 0.022µ 1mA 10µ 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 8 1.5 V (No. 7) 3.0 V (No. 8) 0.4 V (No. 9) 4.5 V (No. 10) —5— V CXA1875AP/AM Definition of I2C Register <Slave address> MSB 0 LSB 1 0 0 SAD2 SAD1 SAD0 R/W 0: SLAVE RECEIVER R/W 1: SLAVE TRANSMITTER SAD 0 to 2: 11 to 13 pin 0: "LOW" 1: "HIGH" <Register table> • With the IC reset all registers are reset to 0 • ∗: Not defined • ×: Don’t care • Sub address is auto incremented • It can be used as a 6-bit D/A converter by setting the lower two bits of DAC 0-4 registors to 0, but take care that the max. voltage of DA output will lower about 100 mV compared with the use of 8 bits. Control Register Sub address BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 × × × × × 000 REF ∗ ∗ ∗ SW3 SW2 SW1 SW0 × × × × × 001 DAC0 (8) × × × × × 010 DAC1 (8) × × × × × 011 DAC2 (8) × × × × × 100 DAC3 (8) × × × × × 101 DAC4 (8) Status Register BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0 PONRES 0 0 0 ST3 ST2 ST1 ST0 —6— CXA1875AP/AM <Registers> REF (1): In brackets ( ) number of bits Switches D/A converter reference voltage 0:Standardizes the inner regulator 1:Standardizes voltage resistance divided from VCC SW0 to 3 (1): Selects ON/OFF of Pins 1, 2, 9 and 10 (Each pin is the open collector output of NPN transistor) 0:OFF 1:ON DAC0 to 4 (8): Digital data input register of D/A converter 0:Output voltage turns to minimum 255:Output voltage turns to maximum PONRES (1): Detects POWER ON RESET 0:Master passes from the bus and is reset to 0 after having read this status 1:Set to 1 when power supply is turned on or when there has been a power dip ST0 to 3 Detects and registers the voltage condition of Pins 1, 2, 9 and 10 0:1.5 V and below 1:3.0 V and above Note) SW0 to 3 effective during 0 (1): I2C Bus Signal There are 2 signals in I2C bus. SDA (Serial DAta) and SCL (Serial Clock). SDA is double-way. • As SDA is double-way it has 3 state outputs, H, L and HIZ. H L HIZ L • I2C transfer begins with Start Condition and ends with Stop Condition. Stop Condition P Start Condition S SDA SCL —7— CXA1875AP/AM • I2C data write (Write from I2C controller to IC) AT L during write MSB MSB HIZ LSB HIZ SDA SCL 1 2 3 4 5 6 7 8 9 1 8 9 S Address MSB LSB 1 8 DATA (n) HIZ 9 1 ACK 9 8 ACK 9 DATA (n+1) ACK DATA (n+2) HIZ 1 8 ∗ The number of data that can be transferred at a time is confined to units of 8-bit that can be set as required. Sub Address is incremented automatically. 9 P DATA Sub Address HIZ HIZ 8 ACK ACK DATA ACK • I2C data read (Read from IC to I2C controller) At H during read HIZ SDA SCL 1 6 7 8 9 7 1 8 9 P S Address ACK DATA ACK • Read timing MSB LSB IC output SDA SCL 9 1 2 3 4 5 6 7 8 9 Read timing ACK DATA ACK ∗ Data read is performed with SCL rise. —8— CXA1875AP/AM Application Circuit I2C BUS 0.022µ +5V 10k 10k 10µ General purpose output port 16 15 14 13 12 11 10 9 6 7 8 CXA1875AP/AM 1 2 3 4 5 10k 10k 2SC2785 D/A converter output 10k General purpose input port 10k 10k 2SC2785 Slave address for 4 CH and 4 DH 10k Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. —9— CXA1875AP/AM Package Outline Unit : mm CXA1875AP 16 + 0.3 6.4 – 0.1 + 0.4 19.2 – 0.1 + 0.1 0.05 0.25 – 16PIN DIP (PLASTIC) 7.62 9 1 0˚ to 15˚ 8 + 0.4 3.7 – 0.1 Two kinds of package surface: 1.All mat surface type. 3.0 MIN 0.5 MIN 2.54 0.5 ± 0.1 2.All mirror surface type. 1.2 ± 0.15 PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN DIP-16P-01 LEAD TREATMENT SOLDER PLATING EIAJ CODE DIP016-P-0300 LEAD MATERIAL COPPER ALLOY JEDEC CODE Similar to MO-001-AE PACKAGE MASS 1.0 g SONY CODE CXA1875AP Kokubu Ass'y 16 + 0.3 6.4 – 0.1 + 0.4 19.2 – 0.1 + 0.1 0.05 0.25 – 16PIN DIP (PLASTIC) 7.62 9 1 0˚ to 15˚ 8 Two kinds of package surface: 1.All mat surface type. 2.All mirror surface type. 3.0 MIN 0.5 MIN + 0.4 3.7 – 0.1 2.54 0.5 ± 0.1 1.2 ± 0.15 PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN DIP-16P-01 LEAD TREATMENT SOLDER PLATING EIAJ CODE DIP016-P-0300 LEAD MATERIAL COPPER ALLOY JEDEC CODE Similar to MO-001-AE PACKAGE MASS 1.0 g SONY CODE —10— CXA1875AP/AM Package Outline Unit : mm CXA1875AM 16PIN SOP (PLASTIC) + 0.4 1.85 – 0.15 + 0.4 9.9 – 0.1 16 9 8 0.45 ± 0.1 + 0.1 0.2 – 0.05 1.27 0.5 ± 0.2 6.9 + 0.3 5.3 – 0.1 1 7.9 ± 0.4 0.15 + 0.2 0.1 – 0.05 0.24 M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE SOP-16P-L01 EIAJ CODE SOP016-P-0300 SOLDER PLATING LEAD MATERIAL COPPER ALLOY PACKAGE MASS 0.2g JEDEC CODE CXA1875AM SCT Ass'y EPOXY RESIN LEAD TREATMENT 16PIN SOP (PLASTIC) + 0.4 1.85 – 0.15 + 0.4 9.9 – 0.1 16 9 6.9 8 0.45 ± 0.1 + 0.1 0.2 – 0.05 1.27 0.5 ± 0.2 1 7.9 ± 0.4 + 0.3 5.3 – 0.1 0.15 + 0.2 0.1 – 0.05 0.24 M PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE SOP-16P-L01 EIAJ CODE SOP016-P-0300 EPOXY RESIN LEAD TREATMENT SOLDER PLATING LEAD MATERIAL COPPER ALLOY PACKAGE MASS 0.2g JEDEC CODE LEAD PLATING SPECIFICATIONS ITEM SPEC. LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18µm Purchase of Sony’s I2C components conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips. —11— Sony Corporation